CN102289263A - Multi-air-channel heat-dissipating cabinet of advanced telecom computing architecture (ATCA) computer resisting severe environments - Google Patents
Multi-air-channel heat-dissipating cabinet of advanced telecom computing architecture (ATCA) computer resisting severe environments Download PDFInfo
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- CN102289263A CN102289263A CN 201110209169 CN201110209169A CN102289263A CN 102289263 A CN102289263 A CN 102289263A CN 201110209169 CN201110209169 CN 201110209169 CN 201110209169 A CN201110209169 A CN 201110209169A CN 102289263 A CN102289263 A CN 102289263A
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Abstract
The invention discloses a multi-air-channel heat-dissipating cabinet of an advanced telecom computing architecture (ATCA) computer resisting severe environments. The cabinet has five independent air channels which are communicated with air inlets and air outlets, wherein heat-conducting corrugated plates are arranged in the air channels; and the side walls of the air channels are tightly attached to a cover plate of a main module through a high-efficiency flexible heat-conducting rubber pad, so that the heat-dissipating area of each heat-dissipating channel is effectively enlarged, a heat-dissipating path is effectively shortened, the heat resistance of the heat-dissipating channel is reduced, high-power-consumption heat on the main module is more uniformly distributed in the air channels and more quickly transferred, the heat in the air channels is transferred outside the cabinet through the corrugated plates which are arranged in the air channels, and a fan, the air inlets and the air outlets in the cabinet, the operating heat of the main module in the cabinet is effectively dissipated, and the main module can normally operate in a reinforced and closed cabinet and under a high-temperature environment.
Description
Technical field
The present invention is the multiple duct cooling cabinet of anti-adverse environment ATCA computing machine, belongs to the severe environment computer technical field.
Background technology
Development along with electronic information, requirement to the anti-adverse environment computing power is more and more higher, require severe environment computer employing high bandwidth Computer Architecture such as ATCA primary module with integrated polylith parallel processing, and primary module often adopts the high-performance polycaryon processor, the high-performance polycaryon processor often has high power consumption characteristics, power consumption of processing unit is not less than 40 watts, and the demand that bulk density increases often needs integrated at least 2 polycaryon processors of primary module, a severe environment computer often needs integrated at least 3 primary modules, makes the power consumption of anti-adverse environment ATCA computing machine be not less than 200 watts.Because the singularity of using, anti-adverse environment ATCA computing machine must adopt all-sealed cabinet, takes into account again simultaneously and satisfies noise criteria, and it is great unfavorable that this has brought to heat radiation.
At present, in commercial kitchen area, often by open forced air cooling mode and add the refrigerating environment mode to the computer-implemented heat radiation of high-performance ATCA, and adopt and often do not take into account noise criteria when air-cooled, when reality is used, often high-performance ATCA computing machine is placed in the specific environment with refrigerating capacity, realize the isolation of operating personnel and computing machine by remote operation method, make the people away from noise source, guarantee this high-performance ATCA computing machine operate as normal again.But the particular space that this method needs can't well be used as the supporting condition that uses.
Traditional severe environment computer often is made up of primary module and several functional modules of a medium-performance, its Overall Power Consumption is about 50 watts, adopted the anti-adverse environment heat dissipating method of forced air cooling and wall rail conduction cooling, can be good at solving heat dissipation problem, noise can be well controlled simultaneously.And the power consumption of anti-adverse environment ATCA computing machine is not less than 200 watts, how can be good at dispelling the heat, and makes the anti-adverse environment ATCA computing machine can operate as normal, is the problem that presses for solution.At this problem,, still there is not good actual solution at present in the severe environment computer field.
Summary of the invention
Technical matters solved by the invention is to solve the high power consumption heat dissipation problem that high-performance computer is used in anti-adverse environment, and a kind of multiple duct cooling cabinet that significantly improves the anti-adverse environment ATCA computing machine of heat-sinking capability is provided.
The technical solution that realizes the object of the invention is: a kind of multiple duct cooling cabinet of anti-adverse environment ATCA computing machine, comprise casing, air inlet, blower fan and air outlet, described air inlet and air outlet are positioned at the both sides of casing, position near air outlet in the casing is provided with blower fan, some air channels are set in this cabinet, described air channel is connected with air inlet and air outlet, and the sidewall in each air channel posts primary module.
The present invention compared with prior art, its remarkable advantage is: in the multiple duct cooling cabinet of anti-adverse environment ATCA computing machine of the present invention, the large cover that anti-adverse environment ATCA primary module forms by aluminum, with dynamical temperature conductivity 15 flexible heat sink material DT-E, as middle heat transferred bridge, form heat dissipation channel with the device such as the processor that need in the electric composition of primary module to dispel the heat, the directly surperficial and heat dissipation wind channel of this Aluminum cover is adjacent to comprehensively simultaneously, when work in the air channel, the heat transferred function in air channel can derive the cabinet outside to the heat of Aluminum cover in the primary module, also can evenly disperse the heat centrostigma of primary module simultaneously, reduce heat dissipation path and increase area of dissipation, the work calories of the electric composition device of primary module is effectively dispelled the heat, compare with traditional anti-adverse environment conduction cooling cabinet, single groove heat radiation and complete machine heat-sinking capability are largely increased, heat-sinking capability promotes above 1 times, solved the high power consumption heat dissipation problem of high-performance anti-adverse environment ATCA computing machine, overcome the difficulty that the high power consumption polycaryon processor of high-performance is used in severe environment computer, bigger raising severe environment computer performance.
Below in conjunction with accompanying drawing the present invention is described in further detail.
Description of drawings
Fig. 1 is the multiple duct cooling cabinet structural representation of anti-adverse environment ATCA computing machine of the present invention.
Fig. 2 is the air outlet synoptic diagram of anti-adverse environment ATCA computing machine of the present invention.
Fig. 3 is the heat radiation synoptic diagram of primary module in the anti-adverse environment ATCA computing machine of the present invention.
Fig. 4 is the adherent heat loss through conduction equivalent thermal resistance schematic layout pattern based on the air channel.
Embodiment
In conjunction with Fig. 1, the multiple duct cooling cabinet of a kind of anti-adverse environment ATCA computing machine of the present invention, comprise casing, air inlet 3, blower fan 4 and air outlet 5, described air inlet 3 and air outlet 5 are positioned at the both sides of casing, position near air outlet 5 in the casing is provided with blower fan 4, some air channels 2 are set in this cabinet, and described air channel 2 is connected with air inlet 3 and air outlet 5, and the sidewall in each air channel posts primary module 6.
The quantity in air channel can be provided with as required, and the quantity in air channel described in the present invention 2 is preferably five, and these five air channels are parallel to each other.
2 inboards, described air channel are provided with some corrugated plates 7, and the projection of corrugated plate is connected mutually with the inwall in air channel, and the axis in corrugated plate wave bearing of trend and air channel is perpendicular.Described primary module 6 comprises baffle plate 8, printed board 9, euthermic chip 10, heat conduction rubber cushion 11 and cover plate 12, described euthermic chip 10 is fixed on the cabinet by baffle plate 8, the one side of this euthermic chip 10 is connected with printed board 9, the another side of euthermic chip 10 is connected with cover plate 12 by heat conduction rubber cushion 11, and the another side of this cover plate 12 is connected by the sidewall of heat conduction rubber cushion 11 with air channel 2.
The present invention is on the basis of traditional severe environment computer heat dissipation technology, by realizing suitable heat dissipating method, reduce heat dissipation path and increase area of dissipation, a kind of multiple duct cooling cabinet of anti-adverse environment ATCA computing machine of suitable high-performance anti-adverse environment is provided, and assurance possesses the operate as normal and the application of the anti-adverse environment ATCA computing machine of a plurality of high-performance primary modules.
Below in conjunction with embodiment the present invention is done further detailed description:
Because the singularity of applied environment, anti-adverse environment ATCA computing machine must adopt all-sealed cabinet, takes into account again simultaneously and satisfies noise criteria, and it is great unfavorable that this has brought to heat radiation.For the high-performance of anti-adverse environment ATCA computer-internal, the server level primary module of big power consumption, must adopt forced air cooling and the big adherent heat dissipating method of cold drawing promptly based on the adherent heat loss through conduction in air channel, could solve the heat dissipation problem of computing machine, guarantee that it can work normally in rugged surroundings.In Fig. 1 and Fig. 2, the corrugated plate of raising radiating efficiency in 5 parallel air channels that cabinet inside is provided with and the air channel, be welded in the cabinet by vacuum brazing technique, guaranteed that components and parts such as the module of external air channel and cabinet inside and base plate isolate fully, by the high-power blower exhausting in the blower fan chamber, guarantee that each primary module all can be by independently big cold drawing adherent (wind path wall) heat radiation of air channel warp separately again.The path of all not turning, all 5 air channels, air is smooth and easy at the air channel internal circulation, and heat dissipation is more much better than the common anti-adverse environment air channels that 2 90 degree detours must occur.Also much smaller by the form overall thermal resistance of the adherent heat radiation of big cold drawing simultaneously than traditional form of passing through the heat radiation of both sides locking wall.The thermal resistance largest portion of this kind heat dissipating method is the surface of contact between big cold drawing and the cabinet wind path wall, in order to reduce thermal resistance, needs at the cold drawing outside surface flexible heat sink material to be installed.At present the thermal conductivity of the flexible heat sink material of usefulness is between 1～2, and on the market in the new product nominal of temperature conductivity maximum can reach more than 10, the flexible heat sink material that adopts in this heat dissipating method is DT-E(1mm), temperature conductivity is 15.
The feature of air channel layout in the anti-adverse environment ATCA cabinet of the present invention is described below in conjunction with Fig. 1.In anti-adverse environment ATCA cabinet, each independent air channel of anti-adverse environment ATCA primary module configuration, this air channel and anti-adverse environment ATCA primary module are by adherent heat loss through conduction mode, and the heat that primary module is distributed exports to the cabinet outside by air cooling way.Cabinet adopts left and right sides ventilation slot version, and the cabinet right side is that air outlet is installed blower fan, and the left side is an air inlet.
The feature of anti-adverse environment ATCA cabinet air outlet is described below in conjunction with Fig. 2.In anti-adverse environment ATCA cabinet, each ATCA computing machine air channel possesses independently heat conduction corrugated plate, by corrugated plate, the heat delivered of cabinet cell wall to cabinet space on every side, is realized that each cabinet cell wall all has independently heat conduction channel, improves radiating efficiency.
The feature of the adherent heat loss through conduction based on the air channel of the present invention is described below in conjunction with Fig. 3.The large cover that anti-adverse environment ATCA primary module forms by aluminum, with dynamical flexible heat sink material is DT-E(1mm), temperature conductivity is 15, as middle heat transferred bridge, form the passage that dispels the heat with device that needs in the electric composition of primary module to dispel the heat such as processor, the directly surperficial and heat dissipation wind channel of this Aluminum cover is adjacent to comprehensively simultaneously.When work in the air channel, the heat transferred function in air channel can export to the cabinet outside to the heat of Aluminum cover in the primary module, also can evenly disperse the heat of the heat centrostigma of primary module simultaneously, the work calories of the electric composition device of primary module is effectively dispelled the heat, guarantee its operate as normal.
The feature of the adherent heat loss through conduction equivalent thermal resistance based on the air channel of the present invention is described below in conjunction with Fig. 4.Thermal resistance is the comprehensive parameter that reflection stops the ability of heat transferred, and unit be ℃/W, when promptly the lasting heat transfer power of object is 1W, and the temperature difference at thermally conductive pathways two ends.Thermal resistance is big more, and heat-conductive characteristic is poor more, and under certain environment temperature and mainboard power, the conducting path that thermal resistance is little can allow each chip surface temperature of mainboard lower, and its performance is also better.The cover plate of ATCA primary module is an Aluminum cover, and the heat of each chip reaches the air channel by path shown in Figure 3 on the mainboard, will run into various thermal resistances, and its process can be analyzed with the method for electric analogy.Suppose:
(1) ignores the heat conduction and the radiation of air-gap;
(2) thermal resistance of heat conduction rubber cushion equals the thermal resistance of heat conduction rubber cushion between CPU and the cover plate between each chip and the Aluminum cover.Heat conduction rubber cushion size between the CPU is 28mmX28mmX1mm.The coefficient of heat conductivity K=15W/ of heat conduction rubber cushion (m ℃);
(3), the coefficient of heat conductivity K=204W/ of Aluminum cover (m ℃).
Wherein
Thermal resistance for heat conduction rubber cushion between chip and the Aluminum cover;
According to formula
Calculate:
1. the thermal resistance of heat conduction rubber cushion between chip and the Aluminum cover
2. the thermal resistance of Aluminum cover
In adherent cooling cabinet based on the air channel, entire thermal resistance in the heat conduction path of primary module chip
And traditional thermal resistance is about 6 ℃/W, obviously, in the anti-adverse environment cabinet, adopt the heat conduction thermal resistance that has obviously reduced the primary module chip based on the adherent heat dissipating method in air channel, strengthened the external heat dispersion of primary module greatly, solved the heat dissipation problem of high power consumption sealed cabinet.
The following describes the feature of the adherent heat loss through conduction effect based on the air channel of the present invention.On the basis that theory is analyzed, utilize Ice-Pak software that the primary module based on the adherent anti-adverse environment ATCA computer cabinet in air channel is carried out simulation analysis in working order down, obtain the temperature profile data of primary module, learn from temperature profile data, effect based on the adherent heat loss through conduction in air channel is better, the temperature of highest temperature region satisfies the device job requirement below 70 degree.
Claims (4)
1. the multiple duct cooling cabinet of an anti-adverse environment ATCA computing machine, it is characterized in that, comprise casing, air inlet [3], blower fan [4] and air outlet [5], described air inlet [3] and air outlet [5] are positioned at the both sides of casing, position near air outlet [5] in the casing is provided with blower fan [4], some air channels [2] are set in this cabinet, and described air channel [2] are connected with air inlet [3] and air outlet [5], and the sidewall in each air channel posts primary module [6].
2. the multiple duct cooling cabinet of anti-adverse environment ATCA computing machine according to claim 1 is characterized in that, the quantity of described air channel [2] is five, and these five air channels are parallel to each other.
3. the multiple duct cooling cabinet of anti-adverse environment ATCA computing machine according to claim 1 and 2, it is characterized in that, inboard, described air channel [2] is provided with some corrugated plates [7], and the projection of corrugated plate is connected mutually with the inwall in air channel, and the axis in corrugated plate wave bearing of trend and air channel is perpendicular.
4. the multiple duct cooling cabinet of anti-adverse environment ATCA computing machine according to claim 1 and 2, it is characterized in that, described primary module [6] comprises baffle plate [8], printed board [9], euthermic chip [10], heat conduction rubber cushion [11] and cover plate [12], described euthermic chip [10] is fixed on the cabinet by baffle plate [8], the one side of this euthermic chip [10] is connected with printed board [9], the another side of euthermic chip [10] is connected with cover plate [12] by heat conduction rubber cushion [11], and this cover plate [12] another side is connected by the sidewall of heat conduction rubber cushion [11] with air channel [2].
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028759A (en) * | 2016-07-13 | 2016-10-12 | 西安电子工程研究所 | Sealing-type heat radiating cold plate with screw pair contact stroke and local high heat density |
| CN106659063A (en) * | 2016-10-31 | 2017-05-10 | 中国电子科技集团公司第二十九研究所 | Built-in air channel type sealing cabinet |
| CN109222899A (en) * | 2018-08-09 | 2019-01-18 | 深圳迈瑞生物医疗电子股份有限公司 | Patient monitor |
| CN110225689A (en) * | 2018-03-01 | 2019-09-10 | 许继电气股份有限公司 | The radiator structure of electric component box |
| CN111447786A (en) * | 2020-03-17 | 2020-07-24 | 中国电子科技集团公司第二十九研究所 | Air-cooled case heat radiation structure applied to ASAAC module |
| CN112328021A (en) * | 2020-11-06 | 2021-02-05 | 浪潮电子信息产业股份有限公司 | Server and internal exposure heat dissipation structure thereof |
| CN113556921A (en) * | 2021-06-30 | 2021-10-26 | 郑州森源新能源科技有限公司 | Heat radiation structure of APF device |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028759A (en) * | 2016-07-13 | 2016-10-12 | 西安电子工程研究所 | Sealing-type heat radiating cold plate with screw pair contact stroke and local high heat density |
| CN106659063A (en) * | 2016-10-31 | 2017-05-10 | 中国电子科技集团公司第二十九研究所 | Built-in air channel type sealing cabinet |
| CN110225689A (en) * | 2018-03-01 | 2019-09-10 | 许继电气股份有限公司 | The radiator structure of electric component box |
| CN109222899A (en) * | 2018-08-09 | 2019-01-18 | 深圳迈瑞生物医疗电子股份有限公司 | Patient monitor |
| CN111447786A (en) * | 2020-03-17 | 2020-07-24 | 中国电子科技集团公司第二十九研究所 | Air-cooled case heat radiation structure applied to ASAAC module |
| CN111447786B (en) * | 2020-03-17 | 2022-02-01 | 中国电子科技集团公司第二十九研究所 | Air-cooled case heat radiation structure applied to ASAAC module |
| CN112328021A (en) * | 2020-11-06 | 2021-02-05 | 浪潮电子信息产业股份有限公司 | Server and internal exposure heat dissipation structure thereof |
| CN113556921A (en) * | 2021-06-30 | 2021-10-26 | 郑州森源新能源科技有限公司 | Heat radiation structure of APF device |
| CN113556921B (en) * | 2021-06-30 | 2023-03-24 | 郑州森源新能源科技有限公司 | Heat radiation structure of APF device |
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Application publication date: 20111221 |