CN111447786B

CN111447786B - Air-cooled case heat radiation structure applied to ASAAC module

Info

Publication number: CN111447786B
Application number: CN202010185920.0A
Authority: CN
Inventors: 赖天华; 彭晋红; 何著; 刘芬芬; 高大泉
Original assignee: CETC 29 Research Institute
Current assignee: CETC 29 Research Institute
Priority date: 2020-03-17
Filing date: 2020-03-17
Publication date: 2022-02-01
Anticipated expiration: 2040-03-17
Also published as: CN111447786A

Abstract

The invention relates to the technical field of thermal design of electronic equipment, and discloses an air-cooled chassis heat dissipation structure applied to an ASAAC module, which comprises a chassis framework, a shunting and air collecting cover, a front panel and a rear panel, wherein the chassis framework is used for installing the ASAAC module and dissipating heat of the ASAAC module; the shunting and air collecting cover is arranged on the side surface of the chassis framework and used for shunting airflow in the chassis framework and providing cooling air for the ASAAC module; the front panel and the rear panel are respectively arranged on the front end face and the rear end face of the chassis framework and are used for sealing the chassis framework and carrying out electromagnetic shielding. The chassis framework comprises a left side plate, a right side plate, an upper cover plate, a bottom plate and at least one air cooling cold plate, wherein guide fins and air duct interfaces are symmetrically arranged on the inner sides of the left side plate and the right side plate. The heat dissipation structure of the air cooling chassis can improve the heat dissipation capability of the chassis, reduce the limit requirement on the heat power consumption of the ASAAC module, further improve the integration level of the module and meet the individualized heat dissipation requirements of the ASAAC module with different heat power consumption in the chassis.

Description

Air-cooled case heat radiation structure applied to ASAAC module

Technical Field

The invention relates to the technical field of electronic equipment thermal design, in particular to an air cooling cabinet heat dissipation structure applied to an ASAAC module.

Background

In recent years, the ASAAC modular standard meeting the requirements of the framework standard of the joint standardized avionics system is rapidly applied to the industries such as communication, radar and the like, and the modular structure meeting the standard becomes one of typical modular structures in part of industries.

As shown in fig. 1, the ASAAC module is composed of a locking bar 51, a box 52, a cover 55, an electrical connector 56, a puller 57, and the like, and is installed and fixed in the chassis through the locking bar 51.

The case provides a heat dissipation condition for the ASAAC module: the heat generated when the ASAAC module works is taken away by the cooling medium flowing in the cold plate of the case, so that the electronic device can work stably and reliably.

The heat dissipation structure of the standard ASAAC module in the chassis is shown in fig. 2, and the heat dissipation path is as follows:

the heat generated by the electronic device 53 in the ASAAC module during operation is conducted to the box body 52 through the heat conducting grease or the heat conducting pad 54, conducted to the upper guide rib 03 of the upper cold plate 01 and the lower guide rib 04 of the lower cold plate 02 of the chassis by the box body 52, transmitted to the upper cold plate 01 and the lower cold plate 03 through the heat conducting interface 06, and transmitted to the cooling medium 07 through the heat convection with the heat radiating fins in the cold plates, and taken away by the flowing cooling medium 07.

Because the standard ASAAC module has long heat transfer path and limited heat dissipation capacity: when liquid cooling heat dissipation is carried out, the heat dissipation capacity of each slot position is generally not more than 80W; when air-cooled heat dissipation is performed, the heat dissipation capacity of each slot position is generally not more than 60W, and the air-cooled heat dissipation requirement that a part of ASAAC modules in the equipment exceed 80W cannot be met.

The retrieval result shows that the research data of the air-cooled heat dissipation technology of the ASAAC module with larger power in China is relatively less, for example:

the patent with the patent number of CN208113186U provides a scheme of a fully-sealed air-cooled low-air-pressure working case, an ASAAC module in the case adopts an air-cooled heat dissipation scheme, and the problem of air duct sealing is solved emphatically, but the scheme is difficult to solve the air-cooled heat dissipation problem of the ASAAC module with the heat power consumption more than 80W; patent No. CN208706634U proposes a high-performance heat dissipation structure of a standard ASAAC module, which adopts a scheme of integrating a temperature equalization plate and a heat dissipation fin in the ASAAC module to improve the heat dissipation capability of the module, but the scheme integrates the temperature equalization plate and the heat dissipation fin in the ASAAC module, so as to reduce the available space of electronic devices in the module, and is greatly limited in engineering application.

Patent No. CN110198619A proposes a module heat dissipation and chassis sealing structure with an air duct, which is used to solve the sealing problem of chassis air cooling heat dissipation; the patent with the patent number CN109917837A proposes a sheet-metal chassis structure with an external plug-in heat dissipation module, which is used for solving the problem of air-cooling heat dissipation of a specific large heat dissipation module in the chassis; patent No. CN109661157A proposes a liquid cooling heat dissipation case for solving the problem of liquid cooling heat dissipation of a module. The technical schemes of the three patents are not the ASAAC module heat dissipation problem with large heat power consumption, and are not comparable.

The patent with the patent number of CN110012647A proposes an air-cooled chassis structure with increased heat dissipation in a modularized manner, which improves the local heat dissipation capability of the chassis by adding a reinforced heat dissipation module, and is limited by the structural layout and air distribution of the chassis, so that it is difficult to meet the layout and heat dissipation requirements of a plurality of ASAAC modules with larger heat power consumption in the chassis; according to the scheme, the fan is arranged on the back of the motherboard of the case, and great influence is also brought to debugging and maintenance of the motherboard of the case.

Therefore, in a specific application field, higher and more urgent needs are provided for a heat dissipation structure integrally installed with a plurality of air-cooled cabinets with ASAAC modules with heat power consumption not lower than 80W.

Disclosure of Invention

In order to provide a heat dissipation structure for an air-cooled chassis for an ASAAC module, improve the heat dissipation capacity of the chassis, reduce the limit requirement on the thermal power consumption of the ASAAC module, and meet the individualized heat dissipation requirement of the ASAAC module with different thermal power consumption in the chassis, the invention provides the heat dissipation structure for the air-cooled chassis applied to the ASAAC module, which comprises the following components:

the system comprises a chassis framework, a heat exchanger and a controller, wherein the chassis framework is used for installing an ASAAC module and an air cooling cold plate and dissipating heat of the ASAAC module through the air cooling cold plate;

the flow distribution and collection cover is arranged on the side surface of the case framework and used for performing flow resistance matching and flow distribution on airflow in the case framework and providing cooling air for the ASAAC module;

the front panel and the rear panel are respectively arranged on the front end face and the rear end face of the chassis framework and are used for sealing the chassis framework and carrying out electromagnetic shielding;

the case framework comprises a left side plate, a right side plate, an upper cover plate and a bottom plate, the left side plate, the upper cover plate, the right side plate and the bottom plate are sequentially connected to form a quadrilateral frame, the air cooling plate is arranged in the frame and parallel to the bottom plate, and the ASAAC module is arranged on the air cooling plate; guide ribs are symmetrically arranged on the inner sides of the left side plate and the right side plate and used for mounting the air cooling plate and the ASAAC module; an air duct interface is penetratingly arranged between the guide fins on the left side plate and the right side plate and used for communicating an air cooling heat dissipation air flow channel of the air cooling plate.

Further, reposition of redundant personnel and air collecting cover are including the cover body, flow distribution plate, sealing washer and fan unit, the cover body passes through the sealing washer set up in on quick-witted case skeleton's the left side board or the right side board, the flow distribution plate set up aslope in with cover body homonymy on quick-witted case skeleton's the left side board or the right side board, through the adjustment the inclination of flow distribution plate carries out the flow resistance and matches, in order to adjust the air feed flow of forced air cooling cold plate, the fan unit set up in on the cover body.

Furthermore, reposition of redundant personnel and air collection cover are including the cover body, flow distribution plate, sealing washer and ventilation interface, the cover body passes through the sealing washer set up in on the left side board or the right side board of chassis skeleton, the flow distribution plate set up aslope in on the left side board or the right side board of chassis skeleton, through the adjustment the inclination of flow distribution plate carries out the flow resistance and matches, in order to adjust air-cooled cold plate air feed flow, the ventilation interface set up in on the cover body, for the ASAAC module provides cooling air.

Further, the ventilation interface interfaces with an on-board ram air line.

Furthermore, heat radiating fins are arranged in the air cooling plate to form an air cooling heat radiating airflow channel, and meanwhile, the air cooling heat radiating airflow channel plays a strengthening role in the chassis framework.

Furthermore, the bottom surface of the ASAAC module is attached to the upper surface of the air cooling cold plate through tensioning of a locking strip, so that the heat conduction area is increased, and the heat conduction capacity is improved.

Furthermore, the air duct interface on the left side plate or the right side plate and the motherboard of the case are arranged in a staggered manner and form an included angle of 90 degrees.

Furthermore, an external electric connector is arranged on the front panel.

In summary, the heat dissipation structure of the air-cooled chassis applied to the ASAAC module provided by the present invention mainly includes the following 5 aspects:

a) independent air-cooled cold plate heat radiation structure of ASAAC module: each ASAAC module in the case is provided with an independent air-cooled heat dissipation cold plate, so that a heat transfer path is shortened, the cross section area of a heat conduction through flow is increased, and the heat dissipation capability is improved;

b) the ASAAC module air-cooled heat dissipation cold plate can be configured as follows: the thermal design parameters of the air cooling cold plate can be configured according to the heat dissipation requirement of the ASAAC module;

c) the case is internally provided with a plurality of cold plates in parallel connection: the ventilation of the heat dissipation cold plate of each ASAAC module in the case adopts a parallel structure;

d) parallel/perpendicular arrangement of cooling air flow: the air flow direction in the air cooling plate of the case is parallel to the bottom surface of the ASAAC module and is vertical to the plugging direction of the ASAAC module;

e) a flow dividing and sealing structure: the air distribution structure is used for carrying out flow resistance matching according to the air supply requirement of the ASAAC module for heat dissipation and the flow resistance characteristic of the cold plate, and the structure for sealing the air channel interfaces of the cold plates in the chassis is also used.

Compared with a standard ASAAC module cooling structure, the invention has the beneficial effects that:

1) the heat dissipation capacity of each slot position of the chassis is improved to 120-150W from 60W under the air cooling heat dissipation condition, the requirement on the limit of the heat power consumption of the ASAAC module is reduced, and the integration level of the ASAAC module can be further improved;

2) each independent air cooling plate can be designed with a precise heat dissipation structure according to the thermal characteristics of electronic devices in the modules, so that the utilization efficiency of cooling air is improved, and the individualized heat dissipation requirements of different ASAAC modules are met;

3) the multi-cold-plate ventilation parallel structure in the case eliminates the heat superposition effect, ensures the inlet air temperature of each air cooling cold plate to be consistent, reduces the temperature gradient among modules and can ensure the consistency of the performance of electronic devices;

4) the cooling air flow is distributed in parallel/vertical mode, the ventilation interface of the air cooling cold plate and the motherboard of the case are physically staggered to form an included angle of 90 degrees, and the ventilation interface and the motherboard are maintained without interference and influence;

5) the flow dividing and sealing structure provides and distributes more accurate cooling air for each module air-cooled cold plate, reduces the leakage of the cooling air, improves the utilization efficiency of the cooling air and can ensure the cooling effect;

6) the chassis and the air cooling cold plate have the advantages of simple structure, mature process, low cost, short manufacturing period, flexible and convenient use and great advantage in irregular installation space.

Drawings

Fig. 1 is a schematic view of the ASAAC modular structure;

fig. 2 is a schematic diagram of a standard ASAAC module heat dissipation structure;

fig. 3 is one of schematic views of the heat dissipation structure of the air-cooled cabinet applied to the ASAAC module of the present invention;

fig. 4 is a second schematic view of the heat dissipation structure of the air-cooled chassis applied to the ASAAC module according to the present invention;

FIG. 5 is a schematic diagram of a chassis skeleton;

FIG. 6 is a second schematic diagram of the framework of the chassis;

FIG. 7 is an elevation view of an air cooled cold plate;

FIG. 8 is a top view of an air cooled cold plate;

FIG. 9 is a schematic view of an ASAAC module in a mounted position relative to an air cooled cold plate;

fig. 10 is a second schematic view of the installation position relationship between the ASAAC module and the air-cooled cold plate;

FIG. 11 is a schematic view of a flow splitting and gas collection hood configuration;

FIG. 12 is a front view of a structural layout of an air-cooled cabinet;

FIG. 13 is a left side view of the structural layout of the air-cooled cabinet;

reference numerals: 01-upper cold plate, 02-lower cold plate, 03-upper guide fin, 04-lower guide fin, 05-heat conduction interface, 06-heat conduction path, 07-cooling medium; 1-rear panel, 2-shunting and air-collecting cover, 3-chassis frame, 4-front panel, 5-ASAAC module, 6-mother board and 7-electric connector; 21-cover body, 22-flow distribution plate, 23-sealing ring, and 24-fan unit; 31-bottom plate, 32-air cooling plate, 33-left side plate, 34-upper cover plate, 35-right side plate, 36-guide rib and 37-air duct interface; 51-locking strip, 52-box, 53-electronic device, 54-heat conducting grease or pad, 55-cover plate, 56-connector, 57-extractor.

Detailed Description

In order to more clearly understand the technical features, objects, and effects of the present invention, specific embodiments of the present invention will now be described. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

The present embodiment provides an air-cooled chassis heat dissipation structure applied to an ASAAC module, as shown in fig. 3 and 4, including a rear panel 1, a flow distribution and collection cover 2, a chassis frame 3, and a front panel 4, wherein:

the chassis framework 3 is used for installing the ASAAC module 5 and the plurality of air-cooled cold plates 32, and dissipates heat to the ASAAC module 5 through the air-cooled cold plates 32, specifically, as shown in fig. 5, the chassis framework 3 includes a bottom plate 31, a left side plate 33, an upper cover plate 34 and a right side plate 35, the bottom plate 31, the left side plate 33, the upper cover plate 34 and the right side plate 35 are sequentially connected to form a quadrilateral frame, the air-cooled cold plates 32 are arranged in the frame and are parallel to the bottom plate 31, and the ASAAC module 5 is arranged on the air-cooled cold plates 32. As shown in fig. 6, guide fins 36 are symmetrically arranged on the inner sides of the left side plate 33 and the right side plate 35, the guide fins 36 are used for mounting the air-cooled cooling plate 32 and the ASAAC module 5, an air duct interface 37 is penetratingly arranged between the guide fins 36 on the left side plate 33 and the right side plate 35, the air duct interface 37 is used for conducting an air-cooled heat dissipation air flow passage of the air-cooled cooling plate 32, and the air duct interface 37 on the left side plate 33 or the right side plate 35 is staggered from the motherboard 6 of the chassis and forms an included angle of 90 °. As shown in fig. 7 and 8, the air-cooled cooling plate 32 is provided with cooling fins therein to form an air-cooled cooling airflow channel and to reinforce the chassis frame 3. As shown in fig. 9 and 10, the surface of the ASAAC module 5 is attached to the surface of the air-cooled cooling plate 32 by the tension of the locking strip 51, so as to increase the heat conduction area and improve the heat conduction capability.

The flow distribution and collection cover 2 is arranged on the side face of the chassis framework 3, and is used for carrying out flow resistance matching and flow distribution on air flow according to the air supply requirements of the air cooling cold plates 32 and providing cooling air for the ASAAC module 5. Specifically, as shown in fig. 11, the flow dividing and air collecting cover 2 includes a cover body 21, a flow dividing plate 22, a sealing ring 23 and a fan unit 24, the cover body 21 is disposed on a left side plate 33 or a right side plate 35 of the chassis frame 3 through the sealing ring 23, the flow dividing plate 22 is obliquely disposed on the left side plate 33 or the right side plate 35 of the chassis frame 3 on the same side as the cover body 21, flow resistance matching is performed by adjusting an inclination angle of the flow dividing plate 22 to adjust an air supply flow rate of the air cooling plate 32, and the fan unit 24 is disposed in the cover body 21. More specifically, as shown in fig. 12, the cover 21 is provided on the left side plate 33 of the chassis frame 3 via the seal ring 23, the flow distribution plate 22 is provided obliquely on the left side plate 33 of the chassis frame 3, and the fan unit 24 discharges air to the outside.

The front panel 4 and the rear panel 1 are respectively arranged on the front end face and the rear end face of the case framework 3 and used for sealing the case framework 3 and performing electromagnetic shielding, and the rear panel 1 is a maintenance opening face of the ASAAC module 5 in the case. Specifically, as shown in fig. 13, the front panel 4 is provided with an external electrical connector 7.

The functional scheme design implementation flow of the air-cooled case heat dissipation structure applied to the ASAAC module provided by the invention is as follows:

the first step is as follows: according to the installation environment and design boundary conditions of the case, the external envelope size of the case is preliminarily determined, the air-cooled radiating airflow of the ASAAC module 5 adopts parallel/vertical layout, the air intake and exhaust directions are ensured to be parallel to the bottom surface of the ASAAC module 5 and vertical to the module plugging and unplugging directions, and then the structural layout scheme of the case is preliminarily determined by combining the number of the ASAAC modules 5 in the case, as shown in FIGS. 12 and 13.

The second step is that: according to the heat dissipation requirement of the ASAAC module 5 and the thermal characteristic conditions of electronic devices, the thermal design parameters of each air-cooled cold plate 32 are preliminarily determined by combining the size of the ASAAC module 5, such as: the ASAAC module 5 is configured to integrate the heat transfer area with the air-cooled cold plate 32, the fin height in the cold plate, the fin thickness, the fin pitch, the fin length, the fin layout, and the like, and to integrate the overall dimensions of the air-cooled cold plate 32, as shown in fig. 7 and 8.

The air-cooled cold plate 32 has the following overall dimensions:

w: the width dimension of the air-cooled cold plate 32;

l: the air-cooled cold plate 32 length dimension;

h: the air-cooled cold plate 32 has a height dimension.

The third step: preliminarily determining the installation and interface sizes of each ASAAC module 5 and the air-cooled cooling plate 32 in the chassis, and the position parameters and the like between each other, as shown in fig. 9 and 10, proposing the installation and ventilation opening position and size requirements on the left side plate 33 and the right side plate 35 on the chassis framework 3, wherein:

c: the center distance between the air-cooled cold plate 32 and the ASAAC module 5 in the depth direction of the ASAAC module 5;

a: the ASAAC module 5 has the requirement on the lowest spacing of the guide ribs of the side plate of the case;

b: the distance between the center of height of the air-cooled cold plate 32 and the boundary of the tightening state of the locking strip of the ASAAC module 5.

The fourth step: preliminarily determining the positions of guide ribs 36 arranged on each ASAAC module 5 on a left side plate 33 and a right side plate 35 on the chassis framework 3 according to the relevant sizes determined in the second step and the third step and the layout requirements of the ASAAC modules 5; and determining the mounting and positioning structures of the air cooling plates 32 on the left side plate 33 and the right side plate 35 of the case framework 3 by combining the position of the motherboard 6 determined in the first step, as shown in fig. 6.

The fifth step: the sealing measure and the related structure size between each air cooling plate 32 and the left side plate 33 and the right side plate 35 are determined.

And a sixth step: and preliminarily determining the air supply requirements of the case according to the heat dissipation and air supply requirements of the ASAAC modules 5 calculated in the second step and the flow resistance characteristics of the air cooling cold plates 32. On the basis, an airflow splitting structure in the air splitting and air collecting cover 2 is designed and adjusted to ensure that cooling air split of each air cooling plate 32 meets the heat dissipation requirement of the ASAAC module 5, and the structure of the air splitting and air collecting cover 2 is shown in FIG. 11.

The seventh step: and rechecking whether the flow resistance, air supply and flow distribution of each air cooling cold plate 32 are reasonable or not according to the design parameters preliminarily determined in the steps, and whether the heat dissipation requirements of the ASAAC module 5 are met or not. Whether the sealing structure and the size of the air cooling plate 32 are proper or not, whether the installation and positioning sizes of the air cooling plate 32 and the ASAAC module 5 are reasonable or not and necessary adjustment are carried out are checked, and finally the implementation scheme is determined.

Example 2

This example is based on example 1:

in this embodiment, the flow dividing and air collecting cover 2 includes a cover body 21, a flow dividing plate 22, a sealing ring 23, and a ventilation interface, the cover body 21 is disposed on the left side plate 33 or the right side plate 35 of the chassis framework 3 through the sealing ring 23, the flow dividing plate 22 is obliquely disposed on the left side plate 33 or the right side plate 35 of the chassis framework 3 on the same side as the cover body, and the ventilation interface is in butt joint with the on-board ram air pipeline to provide cooling air for the ASAAC module 5.

The foregoing is illustrative of the preferred embodiments of this invention, and it is to be understood that the invention is not limited to the precise form disclosed herein and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the concept as disclosed herein, either as described above or as apparent to those skilled in the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally placed when the present invention is used, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either a wired or wireless connection.

Claims

1. An air-cooled case heat radiation structure for ASAAC module, its characterized in that includes:

the case framework comprises a left side plate, a right side plate, an upper cover plate and a bottom plate, the left side plate, the upper cover plate, the right side plate and the bottom plate are sequentially connected to form a quadrilateral frame, the air cooling plate is arranged in the frame and parallel to the bottom plate, and the ASAAC module is arranged on the air cooling plate; guide ribs are symmetrically arranged on the inner sides of the left side plate and the right side plate and used for mounting the air cooling plate and the ASAAC module; an air duct interface is penetratingly arranged between the guide fins on the left side plate and the right side plate and is used for communicating an air cooling heat dissipation air flow channel of the air cooling plate; the air duct interface on the left side plate or the right side plate is staggered with the motherboard of the case and forms an included angle of 90 degrees;

the flow distribution and collection cover comprises a cover body, a flow distribution plate and a sealing ring, the cover body is arranged on a left side plate or a right side plate of the chassis framework through the sealing ring, the flow distribution plate is obliquely arranged on the left side plate or the right side plate of the chassis framework on the same side with the cover body, and flow resistance matching is carried out by adjusting the inclination angle of the flow distribution plate so as to adjust the air supply flow of the air cooling plate; the flow distribution and collection hood further comprises a fan unit or a ventilation interface, the fan unit is arranged in the hood body, and the ventilation interface is arranged on the hood body and provides cooling air for the ASAAC module.

2. The air-cooled chassis heat dissipation structure as defined in claim 1, wherein the ventilation interface interfaces with an on-board ram air line.

3. The air-cooled chassis heat dissipation structure applied to the ASAAC module, according to claim 1, wherein heat dissipation fins are arranged in the air-cooled cold plate to form an air-cooled heat dissipation airflow channel.

4. The air-cooled chassis heat dissipation structure applied to the ASAAC module, according to claim 1, wherein the bottom surface of the ASAAC module is attached to the upper surface of the air-cooled cold plate through tensioning of a locking strip.

5. The air-cooled chassis heat dissipation structure applied to the ASAAC module, according to claim 1, wherein the front panel is provided with an external electrical connector.