CN209248389U - Circuit board and supercomputer server - Google Patents

Abstract

The utility model provides a kind of circuit board and supercomputer server, belong to circuit board technology field, the circuit board includes substrate and at least one chipset for being arranged on the first face of substrate, it include the multiple chips being sequentially connected in series in each chipset, and the spacing in each chipset between each chip is gradually increased, in which: the first radiator is provided at the top of each chip；In each chipset, the second radiator is provided between at least two chips being serially connected；Spacing size between the size of second radiator and its locating two chip is directly proportional.Circuit board and supercomputer server provided by the utility model while cooling using the second radiator to substrate, is also reduced the temperature difference positioned at circuit board ends chip, promotes the calculated performance of supercomputer server apparatus.

Description

Circuit board and supercomputer server

Technical field

The utility model relates to circuit board technology field more particularly to a kind of circuit boards and supercomputer server.

Background technique

Currently, in order to promote the calculated performance that supercomputer server etc. calculates equipment, it will usually in the operation of supercomputer server Multiple chips are uniformly arranged on plate, and the heat that chip generates will affect the operation of the even entire supercomputer server of chip Can, therefore, it is necessary to radiate to the chip on operation board.

Existing major part supercomputer server is all by the way of wind-cooling heat dissipating, that is, multiple and core is arranged on operation board A radiator is arranged in the top of the one-to-one radiator of piece, each chip, and the heat that chip is generated is quick It is transferred to radiator, and takes away the heat on radiator via fan bring cold wind, realizes the heat dissipation to chip.

But although the utility model inventors have found that the radiator being arranged at the top of chip can be in time by chip Partial heat disperse, but heat dissipation effect is general, may still will affect the calculated performance of supercomputer server.

Above-mentioned background technique content be only used for help understand the utility model, and do not represent recognize or approve mentioned by Any content belongs to a part of the common knowledge relative to the utility model.

Utility model content

The utility model provides a kind of circuit board and supercomputer server, is cooled down using the second radiator to substrate Meanwhile the heat also reduced positioned at chip at outlet air end by the chip generation being located at air intake is influenced, and substrate both ends are made Chip temperature difference reduce, promoted supercomputer server calculated performance.

To achieve the goals above, the utility model adopts the following technical solution:

On the one hand the utility model provides a kind of circuit board comprising substrate and setting are on first face of substrate At least one chipset, include the multiple chips being sequentially connected in series in each chipset, and each chip in each chipset Between spacing be gradually increased, in which: the first radiator is provided at the top of each chip；In each chipset, at least The second radiator is provided between two chips being serially connected；Between the size of second radiator and its locating two chip Spacing size is directly proportional.

Further, parallel with one another between each chipset when the circuit board includes more than two chipsets.

Further, when the number of chips in each chipset is identical, at least two of each chip in same voltage domain A first radiator is structure as a whole.

Further, when the number of chips in each chipset is identical, between two neighboring voltage domain at least two A second radiator is structure as a whole.

Further, in same chip group, any second radiator at least one first radiator adjacent thereto is one Body structure.

Further, the second radiator is provided between at least two chips being serially connected, comprising: at least two mutually The second radiator is provided on link in tandem between concatenated chip.

Further, the height of each first radiator is lower than the height of each second radiator.

Further, first radiator includes heat dissipation bottom sheet and at least one radiating fin, it is described at least one Radiating fin is plugged in the heat dissipation bottom sheet.

Further, the top of the heat dissipation bottom sheet of first radiator and chip is pasted.

Further, second radiator includes heat dissipation bottom sheet and at least one radiating fin, it is described at least one Radiating fin is plugged in the heat dissipation bottom sheet.

Further, the circuit board further includes at least one third radiator, at least one described third radiator is set It sets on the second face of the substrate.

On the other hand the utility model provides a kind of supercomputer server comprising the circuit board.

Compared with prior art, circuit board and supercomputer server provided by the utility model has the following advantages that；

Circuit board and supercomputer server provided by the utility model, substrate are provided at least one chip on the first face Group, each chipset includes the multiple chips being sequentially connected in series, and the spacing of multiple chip chambers is gradually increased, and is provided on each chip First radiator, using the first radiator can will chip generate heat transfer to substrate outside.When circuit board is arranged in supercomputer When server etc. is calculated in equipment, the biggish one end in chips on circuit boards interval can be usually arranged in the outlet air for calculating equipment The air intake for calculating equipment is arranged in the lesser one end in chips on circuit boards interval by end, to realize to the effective of circuit board Heat dissipation.In addition, be provided with the second radiator in each chipset, between adjacent chips, and the size of the second radiator and its Spacing size between locating two chips is directly proportional, i.e., the direction of cold wind flowing in equipment is calculated along supercomputer server etc., the The heat dissipation length of second radiator is gradually increased；The circuit board and supercomputer server that the embodiments of the present invention provide utilize the While second radiator cools down to substrate, also reduce supercomputer server etc. calculate be located at outlet air end in equipment chip by The influence for the heat that chip at air intake generates, reduces the temperature difference of the chip at substrate both ends, promotes supercomputer clothes The calculated performance of business device.

In addition to the utility model described above solve the technical issues of, constitute technical solution technical characteristic and by Outside beneficial effect brought by the technical characteristic of these technical solutions, circuit board and supercomputer server provided by the utility model institute The other technical characteristics and these technical characteristic brings for including in the other technologies problem that can solve, technical solution are beneficial to effect Fruit will make further details of explanation in a specific embodiment.

Detailed description of the invention

In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be practical to this New embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below Attached drawing be only that a part of the embodiment of the utility model is not paying creation for those of ordinary skill in the art Property labour under the premise of, can also be obtained according to these attached drawings other attached drawings.

Fig. 1 is arrangement schematic diagram of the chip provided by the embodiment of the utility model on substrate；

Fig. 2 is the arrangement schematic diagram of the first radiator provided by the embodiment of the utility model and the second radiator on substrate One；

Fig. 3 is sectional view along A-A in Fig. 2；

Fig. 4 is B-B direction cross-sectional view in Fig. 2；

Fig. 5 be in Fig. 2 C-C to cross-sectional view；

Fig. 6 is the arrangement schematic diagram of the first radiator provided by the embodiment of the utility model and the second radiator on substrate Two；

Fig. 7 is the arrangement schematic diagram of the first radiator provided by the embodiment of the utility model and the second radiator on substrate Three；

Fig. 8 is arrangement schematic diagram one of the third radiator provided by the embodiment of the utility model on substrate；

Fig. 9 is arrangement schematic diagram two of the third radiator provided by the embodiment of the utility model on substrate；

Figure 10 is the structural schematic diagram of the first radiator in Fig. 3；

Figure 11 be the utility model embodiment circuit board in cabinet scheme of installation.

Description of symbols:

10- substrate,

20- chip,

The first radiator of 30-,

31- heat dissipation bottom sheet,

32- radiating fin,

The second radiator of 40-,

50- third radiator,

100- circuit board,

200- cabinet.

Specific embodiment

In order to keep the above objects, features, and advantages of the utility model more obvious and easy to understand, below in conjunction with this reality With the attached drawing in new embodiment, the technical scheme in the utility model embodiment is clearly and completely described.Obviously, Described embodiment is only a part of the embodiment of the utility model, instead of all the embodiments.It is practical new based on this Embodiment in type, those of ordinary skill in the art's all other reality obtained without creative labor Example is applied, the range of the utility model protection is belonged to.

As recorded in background technique, major part supercomputer server etc. calculates the side that equipment all uses stacked chips at present Method improving performance, and with the continuous promotion for calculating power, chip power-consumption is also significantly increased.Moreover, current most of supercomputer service Device all uses wind-cooling heat dissipating, and the method by increasing radiator increases cooling heat source area, the cooling wind then sent by fan Take away heat.But the radiator on circuit board is on circuit boards all by the way of being evenly arranged at present, and, radiator is big It is small also identical, when circuit board is arranged in the cabinet of supercomputer server, the heat that is transmitted to from chip on radiator It just needs to be discharged by the fan of cabinet two sides, the wind direction regardless of fan, the chip positioned at outlet air end can be all located at The temperature of the chip of air intake influences, and so as to will lead to, there are biggish temperature between air intake and the chip of outlet air end Difference is spent, and then the calculated performance of supercomputer server may be will affect.

In addition, although the radiator being arranged at the top of chip in the prior art can in time dissipate the partial heat of chip It goes, but the heat that other positions on substrate generate can not be dispersed, such as the heat that the chain road between each chip generates, this Sample one, even if the heat that chips on circuit boards generates can be dispersed, but the heat in other positions can not disperse in real time, shine Sample will affect the working performance of circuit board, thus also will affect the calculated performance of supercomputer server.

Circuit board provided in this embodiment, structure is as shown in Figures 1 to 5, which includes substrate 10 and setting At least one chipset on 10 first face of substrate includes the multiple chips 20 being sequentially connected in series in each chipset, and each Spacing in chipset between each chip 20 is gradually increased.Such as multiple groups chip shown in Fig. 1, the chip in each group of chip The distance between 1 (1 shown in Fig. 1) and chip 2 (2 shown in Fig. 1) (minimum) are less than chip 2 and chip 3 (institute in Fig. 1 3 shown) the distance between ... ..., again smaller than between chip 5 (5 shown in Fig. 1) and chip 6 (6 shown in Fig. 1) away from From (maximum).Wherein: the top of each chip 20 is provided with the first radiator 30；In each chipset, at least two are mutually gone here and there The second radiator 40 is provided between the chip 20 of connection；Between between the size of second radiator 40 and its locating two chip 20 It is directly proportional away from size.

Illustratively, substrate 10 is used to install the carrier of electronic component, and soft materials production or rigid material can be used Matter production, this implementation preferably make substrate 10, flexible base plate high, light-weight, thickness with Distribution density using soft materials Thin, wiring space less-restrictive, the advantages that flexibility ratio is high, facilitate being mounted in casing for circuit board.Certainly, to cooling requirements In higher scene, rigid production substrate 10, such as aluminum substrate also can be used, to further promote the heat dissipation of circuit board Effect promotes the performance of corresponding supercomputer server.

Substrate 10 it is generally rectangular in shape, two bottom surfaces of substrate 10 are respectively the first face and the second face, and the first face can For the front of substrate, the second face can be the back side of substrate (vice versa).At least one core is provided on the front of substrate 10 Piece group, each chipset include multiple chips 20, and multiple chips 20 can pass through the modes such as bonding, welding or grafting and substrate 10 It is fixedly connected, and multiple chips 20 in each chipset are sequentially connected in series by link.In the present embodiment, link is by being located at base The conducting wire that the copper foil on 10 surface of plate is formed, the supply current of chip 20, which flows through, can generate heat in each conducting wire, make electricity Road plate temperature increases, and the mode of series-fed, and the supply current of chain road is often larger, so that the heat that chain road generates It is very important.

In same chip group, the spacing between each chip 20 is gradually increased, and introduces chip 20 on substrate 10 for convenience Arrangement can bring technical effect, circuit board can be usually combined together with corresponding cabinet, in order to more preferable Heat dissipation, at least one fan respectively such as is arranged in air intake and outlet air end, with quickening in usual settable corresponding fan on cabinet The heat dissipation etc. of cabinet interior circuit board.

It, usually can be by each chipset core in order to realize better heat dissipation effect when circuit board is arranged in cabinet The side in cabinet close to air intake is arranged in the small-pitch side of piece, and the biggish side of chip spacing in each chipset is set The side in cabinet close to outlet air end is set, so that cold wind in spacing increases between chip in each chipset direction and cabinet Air inlet direction is consistent, i.e. the direction along air intake to outlet air end, and the spacing between each two neighboring chip 20 is gradually increased. That is, along cold wind air intake to the direction of outlet air end, the distributed quantity of chip 20 on the substrate 10 gradually decreases, due to The heat that each chip 20 generates is almost the same, and substrate 10 is more close to the quantity for the chip 20 that the region of air intake is arranged, accordingly Substrate 10 it is higher close to the heat of air intake, substrate 10 close to outlet air end region be arranged chip 20 quantity it is few, phase The substrate 10 answered is fewer close to the heat of outlet air end, therefore along the direction of the air intake of cold wind to outlet air end, substrate 10 The heat that chip 20 needs cold wind to take away also gradually decreases, so as to guarantee the realizability of heat dissipation.

The top of each chip 20 is provided with the first radiator 30, the first radiator 30 can by bonding, welding or The modes such as screw twist-on are fixed on the surface of chip 20, and keep being bonded with the top of chip 20, and the heat that chip 20 generates can It is transferred to the first radiator 30.When circuit board is arranged in corresponding cabinet, the cold wind in cabinet can be by the first radiator 30 Heat take away.

In some possible embodiments, the material of the first radiator 30, which generally can be, arbitrarily can be realized rapid cooling Heat Conduction Material, such as can be aluminium, copper, graphene, aluminium alloy, if it can be realized the quick transmitting of heat, and, first dissipates Also settable heat-conducting glue, heat-conducting metal or thermally conductive nonmetallic between hot device 30 and the top of chip 20, preferably by chip 20 heat transfer is not limited in any way this to the first radiator 30.

When cold wind cools down to the first radiator 30 for being located at close outlet air end, cold wind has been absorbed positioned at air intake The heat of first radiator 30, therefore when cold wind flow to the first radiator 30 close to outlet air end, the lowering ability decline of cold wind, The heat for the first radiator 30 that can be taken away is declined.For the temperature for reducing the chip 20 being located at air intake and outlet air end Difference, the present embodiment along cold wind air intake to outlet air extreme direction, in same chip group, the interval between chip 20 gradually increases Greatly, quantity gradually decreases, and the heat-sinking capability of the quantity and cold wind that make chip 20 matches.

In addition, being located in same chip group, the second radiator is provided on the substrate 10 between two neighboring chip 20 40, the second radiator 40 can be fixed on the surface of substrate 10, and the second heat dissipation by modes such as bonding, welding or screw twist-ons 40 bottom of device is bonded with the holding of substrate 10.The heat transfer generated on substrate 10 passes through the second heat dissipation to the second radiator 40 Device 40 disperses, and, also settable heat-conducting glue, heat-conducting metal or thermally conductive non-gold between the second radiator 40 and the link of substrate 10 Belong to, preferably by the heat transfer on substrate 10 to the second radiator 40.

In addition, the heat dissipation cavity of the first radiator 30 and the second radiator 40 can usually face the heat dissipation wind channel in cabinet, It, can be preferably by the first radiator 30 and second when this allows for cold wind and flows through the first radiator 30 and the second radiator 40 The heat of radiator 40 is taken away, to realize effective heat dissipation of chip Yu chain road, reduces the bulk temperature of circuit board, Jin Erti Rise the calculated performance of supercomputer server.

In the present embodiment, each second radiator 40 between each chip in same chip group, each second radiator Spacing between 40 length, two chips 20 adjacent thereto can be usually consistent, and which increases the second radiators 40 With the contact area (i.e. heat dissipation area) of substrate 10, increase the second radiator 40 to the cooling effect of substrate 10.In addition, due to same Spacing between the length of the second radiator 40 in one chipset between each chip two chips 20 adjacent thereto is consistent, That is the heat dissipation direction of air intake to the outlet air end of length cold wind along cabinet of the second radiator 40 is gradually increased.That is, On cold wind flow direction, the heat dissipation area of the radiator of circuit board is gradually increased, and the heat-sinking capability of circuit board is gradually increased, because This temperature for being located at the chip 20 of outlet air end is influenced to reduce by the heat of the chip 20 of air intake, and then makes positioned at air intake 20 temperature of chip and positioned at outlet air end chip 20 temperature difference reduce, promoted supercomputer server apparatus calculated performance.

Circuit board provided in this embodiment, in same chip group, spacing in each chipset between each chip 20 by It is cumulative big, the second radiator 40 is provided between two chips being serially connected 20；The size of second radiator 40 and its institute The spacing size located between two chips 20 is directly proportional, can not only reduce positioned at air intake chip 20 and be located at outlet air end chip Temperature difference between 20, and can cool down to substrate 10, decline the bulk temperature of circuit board, improves supercomputer clothes The calculated performance for device equipment of being engaged in.

On the basis of the above embodiments, when circuit board includes more than two chipsets, between each chipset mutually simultaneously Connection.Illustratively, when circuit board includes multiple chipsets, multiple chips in multiple chipsets can be arranged in array in substrate 10 On, it is to be understood that each chipset can be arranged in row distribution setting on the substrate 10 between each chipset in column distribution On the substrate 10, it is sequentially connected in series positioned at multiple chips 20 of same a line by link (may actually be series connection copper foil), in two phases Among the chip 20 of adjacent (being serially connected), the output voltage of one of chip 20 is the input voltage of another chip 20.

Under normal conditions, the electric current between series chip 20 is larger, thus the fever of the chain road between chip 20 is just It can be very serious.To reduce the temperature on the substrate 10 between chip 20, second can be arranged on the substrate 10 between two chips 20 and dissipate Hot device 40, the heat on substrate 10 is dispersed.

It generallys use mode in parallel between the chipset of different lines to power, so that the voltage at the both ends of each chipset It is identical.

As shown in fig. 6, in the present embodiment, when 20 quantity of chip in each chipset is identical, in same voltage domain At least two first radiators 30 of each chip 20 are structure as a whole, and are on 6 each chips in same voltage domain in Fig. 6 For one radiator 30 is structure as a whole, in fact, in actual application, can also by two, three in same voltage domain or The first radiator 30 setting on the chip of person's other quantity is structure as a whole.Wherein, in the present embodiment, it is in same voltage Each chip in domain typically refers to: operating voltage (being usually main operating voltage) and the identical chip of output voltage in each chipset, Chip usually alternatively referred to as at the same level.

For example, each chip in each chipset can be ranked up according to the height of operating voltage, such as each core It include 6 chips in piece group, the highest chip of operating voltage is No. 1 chip, and the main operating voltage of No. 1 chip is 9V, output electricity Pressure is 7.5V, and the main operating voltage of No. 2 chips is the output voltage 7.5V of No. 1 chip, output voltage 6V, the master of No. 3 chips Operating voltage is the output voltage 6V of No. 2 chips, and output voltage 4.5V, the main operating voltage of No. 4 chips is the defeated of No. 3 chips Voltage 4.5V out, output voltage 3V, the main operating voltage of No. 5 chips are the output voltage 3V of No. 4 chips, and output voltage is 1.5V, the main operating voltage of No. 6 chips are the output voltage 1.5V of No. 5 chips, and output voltage is 0 (i.e. greatly).

As shown in the above, each chip in same voltage domain may include the core of the same serial number in each group of chip Piece, if No. 1 chip in each chipset can be at the same voltage domain, No. 2 chips in each chipset can be at the same electricity Domain ... ... is pressed, No. 21 chips in each chipset can be at same voltage domain etc., as shown in fig. 1, can will be every in Fig. 1 One column chip is as a voltage domain.

Specifically, being connected in parallel between each chipset, therefore the voltage at each chipset both ends is identical, if each chipset string Join the chip 20 of same number, then it is identical to be located at voltage domain locating for multiple first radiators 30 of same row.Positioned at same row Two adjacent the first radiators 30 can be set to integral structure, or being located at continuous three the first radiators 30 of same row can Into a single integrated structure or positioned at same row all first radiators 30, which are arranged, can be set to integral structure.In the present embodiment, position It can be set to integral structure at least two the first adjacent radiators 30 of same row, can effectively reduce the first radiator of installation 30 number improves the production efficiency of circuit board.

In the present embodiment, when 20 quantity of chip in each chipset is identical, between two neighboring voltage domain extremely Few two the second radiators 40 can be structure as a whole, and be with all second radiators 40 between two neighboring voltage domain in Fig. 6 For being structure as a whole, in fact, in actual application, can also by two, three between two neighboring voltage domain or its The second radiator 40 setting of his quantity is structure as a whole.For example, two adjacent the second radiators 40 of same row can will be located at It is arranged into a single integrated structure, either continuous three the second radiators 40 that be located at same row will be arranged into a single integrated structure or will be located at same All second radiators 40 of one column are arranged into a single integrated structure etc..In the present embodiment, at least two second positioned at same row dissipate Hot device 40 be arranged it is into a single integrated structure, can effectively reduce installation the second radiator 40 number, improve the production efficiency of circuit board.

As shown in fig. 7, in the present embodiment, in same chip group, adjacent thereto at least one of any second radiator 40 First radiator 30 is structure as a whole.Specifically, second radiator 40 (can be located at neighbouring first radiator 30 The left side or the right in figure) it is structure as a whole, two the first radiators 30 that can also be close with neck are structure as a whole.

It, can also will be in multiple first radiators 30 and multiple the with a line it should be noted that in embodiment Second radiator setting is structure as a whole, however, it is desirable to which explanation is needed when the second different radiators 40 is structure as a whole Guarantee that the connection between each second radiator 40 and link is nonconducting connection, such as between the second radiator 40 and link Corresponding insulating layer is set, to prevent the second radiator 40 from not repeating this short circuit etc. of chip.

In the present embodiment, the second radiator 40 is provided between at least two chips 20 being serially connected, comprising: at least two The second radiator 40 is provided on link in tandem between a chip 20 being serially connected.Specifically, be located in same chip group, At least one second radiator 40 is installed in the multiple spacing formed between multiple chips 20 being sequentially connected in series, it is possible to understand that , multiple spacing are formed between multiple chips 20 being sequentially connected in series, in the spacing that optionally two adjacent series chips 20 are formed Second radiator 40 is installed, or is separately installed with second in multiple spacing that multiple adjacent series chips 20 are formed and dissipates Hot device 40.Above-mentioned second radiator 40 is preferably mounted at the road of the concatenated chain between two chips 20, and link is for carrying out phase Electric current transmission between adjacent chip 20 is one of main heat-generating units on substrate 10, the setting of the second radiator 40 is being connected Chain road between chip 20, can directly cool down to link, improve the second radiator 40 to the cooling effect of substrate 10.

In the present embodiment, the height of each first radiator 30 is lower than the height of each second radiator 40.Specifically, due to One radiator 30 is mounted on the top of chip 20, and chip 20 is arranged on the substrate 10, and the bottom of the second radiator 40 is mounted on On substrate 10, to keep the top of the first radiator 30 and the second radiator 40 to be on sustained height, the first radiator 30 Height is in the top of the first radiator 30 and the second radiator 40 in same plane less than the height of the second radiator 40, The installation in the cabinet of supercomputer server and convenient for other component on circuit board is mounted on convenient for circuit board.

As shown in figure 8, the first radiator 30 includes heat dissipation bottom sheet 31 and at least one radiating fin in the present embodiment 32, at least one radiating fin 32 is plugged in heat dissipation bottom sheet 31.Specifically, the first radiator 30 includes heat dissipation bottom sheet 31, dissipate Hot egative film 31 is located at the bottom of the first radiator 30, and heat dissipation bottom sheet 31 is jointly mounted to the top of chip 20.Heat dissipation bottom sheet 31 is Arc panel or straight panel with certain radian, radiating fin 32 can be rectangular slab, and radiating fin 32 is vertically mounted on heat dissipation bottom On piece 31, and heat dissipation cavity is formed between adjacent heat radiation fin 32, heat dissipation cavity can be usually consistent with heat dissipation direction, for example, working as When circuit board is arranged in cabinet, heat dissipation cavity can be arranged along cold wind flow direction, and cold wind passes through heat dissipation cavity for the first radiator 30 On heat take away.Heat dissipation bottom sheet 31 is made of arc panel, it is possible to increase the space between heat dissipation bottom sheet 31 and substrate 10, it is convenient The installation of other electronic components on the substrate 10.

It is understood that the heat dissipation bottom sheet 31 of the first radiator 30 is provided with the first installation base, the first installation base Shape is identical as the top shape of chip 20, and the material of the first installation base can be identical as the material of the first radiator 30, usually For the relatively good metal material of heat conductivity, such as aluminium, copper material.First installation base may be designed to rectangular block, the first installation The side of boss arcuately plate center line arrangement, the first installation base other side is bonded in side of the chip 20 far from substrate 10 On, the first installation base after bonding is overlapped with chip 20.First radiator 30 is connect by the first installation base with chip 20, The heat transfer efficiency between the first radiator 30 and chip 20 can be increased, while also being enhanced between the first radiator 30 and chip 20 First radiator 30 is bonded on chip 20 by bonding strength.

The present embodiment is without restriction for the connection type of the first installation base and chip 20, preferably in the first installation It is bonded between boss and chip 20 using heat-conducting glue, heat-conducting glue not only acts as fixed function, and furthermore heat-conducting glue is as interface Material has lesser thermal contact resistance, is conducive to the heat transmitting between the first installation base and chip 20.

Please continue to refer to Fig. 8, the planform of the second radiator 40 is similar to the planform of the first radiator 30, and second Radiator 40 includes heat dissipation bottom sheet 31 and at least one radiating fin 32, at least one radiating fin 32 is plugged in heat dissipation bottom sheet On 31.Specifically, the second radiator 40 includes heat dissipation bottom sheet 31, heat dissipation bottom sheet 31 is located at the bottom of the second radiator 40, radiates Egative film 31 is jointly mounted to the top of chip 20.Heat dissipation bottom sheet 31 is the arc panel with certain radian, and radiating fin 32 can be Rectangular slab, multiple radiating fins 32 are vertically mounted in heat dissipation bottom sheet 31, and form heat dissipation cavity between adjacent heat radiation fin 32, are dissipated Hot chamber is arranged along cold wind flow direction, and cold wind passes through heat dissipation cavity and takes away the heat on the second radiator 40；Heat dissipation bottom sheet 31 is adopted It is made of arc panel, it is possible to increase the space between heat dissipation bottom sheet 31 and substrate 10 facilitates other electronic components on the substrate 10 Installation.

The height of the radiating fin 32 of the second radiator 40 in the present embodiment can be greater than the radiating fin of the first radiator 30 The height of piece 32, after the second radiator 40 is mounted on substrate 10 with height phase that the first radiator 30 on chip 20 is set Together, the top on the top and the second radiator 40 that make the first radiator 30 is in same plane, is mounted on convenient for circuit board super Calculate the installation in the cabinet of server and convenient for other component on circuit board.

It is understood that the bottom of the second radiator 40 is provided with the second installation base, the shape of the second installation base It is identical as the shape of above-mentioned first installation base, and the second installation base is also identical as the connection type of chip 20, herein no longer It repeats.

As shown in FIG. 9 and 10, in the present embodiment, circuit board further includes at least one third radiator 50, at least one Third radiator 50 is arranged on the back side of substrate 10.Specifically, being dissipated on the back side of substrate 10 at least provided with a third Hot device 50, cold wind flow through third radiator 50, and heat on 10 back side of substrate can be brought to outside substrate 10, to the back side of substrate 10 into Row cooling.It is understood that substrate 10 is provided with more for the back side that the heat that chip 20 generates is quickly diffused to substrate 10 A heat transfer hole, multiple heat transfer holes can be evenly arranged around chip 20, and the heat that chip 20 generates diffuses to substrate by hole of conducting heat 10 back side diffuses in the heat transmission to third radiator 50 at 10 back side of substrate, and cold wind flows through third radiator 50 and will Heat on third radiator 50 is transplanted on outside substrate 10.

In the present embodiment, a third radiator 50 can be disposed on the second face of substrate 10, third radiator 50 The heat dissipation bottom sheet 31 of bottom can cover the back side of entire substrate 10.Alternatively, being disposed with multiple thirds on the second face of substrate 10 Radiator 50, multiple third radiators 50 are correspondingly arranged with multiple first radiators 30, and third radiator opposing substrate 10 Orthographic projection is overlapped with the orthographic projection of 30 opposing substrate 10 of the first radiator or multiple third radiators and multiple second radiators 40 are correspondingly arranged, and the orthographic projection weight of the orthographic projection of third radiator opposing substrate 10 and 40 opposing substrate 10 of the second radiator It closes.

As shown in figure 11, the present embodiment additionally provides a kind of supercomputer server, and supercomputer server may include cabinet 200, machine It may include corresponding fan on case 200, form heat dissipation wind channel between fan, may include foregoing circuit plate 100, circuit board in cabinet 100 include substrate 10 and at least one chipset being arranged on 10 first face of substrate, include successively going here and there in same chip group Multiple chips 20 of connection, and the spacing in each chipset between each chip 20 is gradually increased, in the chip that two are serially connected The second radiator 40 is provided between 20；Spacing size between the size of second radiator 40 and its locating two chip 20 at Direct ratio can not only be reduced positioned at air intake chip 20 and the temperature difference for being located at outlet air end chip 20, and can be to substrate 10 cool down, and decline the bulk temperature of circuit board 100, improve the calculated performance of supercomputer server apparatus.

Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the utility model, rather than it is limited System；Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should Understand: it is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of Technical characteristic is equivalently replaced；And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new The range of each embodiment technical solution of type.

Claims (12)

1. a kind of circuit board, which is characterized in that including substrate and at least one chip being arranged on first face of substrate Group includes the multiple chips being sequentially connected in series in each chipset, and the spacing in each chipset between each chip is gradually Increase, in which:

The first radiator is provided at the top of each chip；

In each chipset, the second radiator is provided between at least two chips being serially connected；

Spacing size between the size of second radiator and its locating two chip is directly proportional.

2. circuit board according to claim 1, which is characterized in that when the circuit board includes more than two chipsets, It is parallel with one another between each chipset.

3. circuit board according to claim 2, which is characterized in that when the number of chips in each chipset is identical, be in At least two first radiators of each chip of same voltage domain are structure as a whole.

4. circuit board according to claim 2, which is characterized in that when the number of chips in each chipset is identical, be in At least two second radiators between two neighboring voltage domain are structure as a whole.

5. circuit board according to claim 2, which is characterized in that in same chip group, any second radiator and its phase At least one adjacent first radiator is structure as a whole.

6. circuit board according to claim 1, which is characterized in that be provided between at least two chips being serially connected Second radiator, comprising:

The second radiator is provided on link in tandem between at least two chips being serially connected.

7. circuit board according to claim 1, which is characterized in that the height of each first radiator is lower than each second radiator Height.

8. circuit board according to claim 1, which is characterized in that first radiator includes heat dissipation bottom sheet and at least One radiating fin, at least one described radiating fin are plugged in the heat dissipation bottom sheet.

9. circuit board according to claim 8, which is characterized in that the heat dissipation bottom sheet of first radiator and the top of chip It pastes in portion.

10. circuit board according to claim 1, which is characterized in that second radiator includes heat dissipation bottom sheet and extremely A few radiating fin, at least one described radiating fin are plugged in the heat dissipation bottom sheet.

11. circuit board according to claim 1, which is characterized in that the circuit board further includes the heat dissipation of at least one third Device, at least one described third radiator are arranged on the second face of the substrate.

12. a kind of supercomputer server, which is characterized in that including any one of claim 1 to 11 circuit board.