WO2019228420A1 - Data processing device - Google Patents

Data processing device Download PDF

Info

Publication number
WO2019228420A1
WO2019228420A1 PCT/CN2019/089095 CN2019089095W WO2019228420A1 WO 2019228420 A1 WO2019228420 A1 WO 2019228420A1 CN 2019089095 W CN2019089095 W CN 2019089095W WO 2019228420 A1 WO2019228420 A1 WO 2019228420A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
data processing
contact
power supply
plate
Prior art date
Application number
PCT/CN2019/089095
Other languages
French (fr)
Chinese (zh)
Inventor
詹克团
张金宝
李连臣
刘国辉
邹桐
张磊
Original Assignee
北京比特大陆科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201810550736.4 priority Critical
Priority to CN201810550736.4A priority patent/CN108646890A/en
Priority to CN201810638927.6A priority patent/CN108536253A/en
Priority to CN201810638927.6 priority
Application filed by 北京比特大陆科技有限公司 filed Critical 北京比特大陆科技有限公司
Publication of WO2019228420A1 publication Critical patent/WO2019228420A1/en

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means

Abstract

A data processing device (100), comprising: at least one computing board (1) for performing data processing, a plurality of chips (4) mounted on one side of the computing board (1), and each computing board (1) having a connecting member (5); a power supply apparatus (2), which power supply apparatus (2) has at least one power supply terminal (21); a conductive apparatus (3), which conductive apparatus (3) comprises at least one conductive member (31), each conductive member (31) being respectively connected to the power supply terminal (21) and the connecting member (5) so that the power supply apparatus (2) supplies power to the computing board (1).

Description

数据处理设备Data processing equipment 技术领域Technical field
本公开涉及电子设备领域,例如涉及一种数据处理设备。The present disclosure relates to the field of electronic devices, for example, to a data processing device.
背景技术Background technique
目前,市场上数据处理设备的电源与主机分开,电源通过铜芯线缆与主机连接并供电,这样,供电线路较长,铜线线缆成本较高,进而导致产品成本较高。At present, the power of data processing equipment on the market is separated from the host, and the power is connected to the host through copper-core cables to supply power. In this way, the power supply lines are longer and the cost of copper cables is higher, which leads to higher product costs.
发明内容Summary of the Invention
本公开旨在至少解决现有技术中存在的技术问题之一。本公开提出了一种数据处理设备。The present disclosure aims to solve at least one of the technical problems existing in the prior art. The present disclosure proposes a data processing device.
根据本公开实施例的一种数据处理设备,包括:用于进行数据处理的至少一个运算板,所述运算板的一个侧面上安装有多个芯片,每个所述运算板具有连接件;电源装置,所述电源装置具有至少一个供电端子;导电装置,所述导电装置包括至少一个导电件,每个所述导电件分别与所述供电端子和所述连接件相连以实现所述电源装置对所述运算板供电。A data processing device according to an embodiment of the present disclosure includes: at least one computing board for performing data processing, a plurality of chips are mounted on one side of the computing board, and each of the computing boards has a connector; a power source; Device, the power supply device has at least one power supply terminal; conductive device, the conductive device includes at least one conductive member, each of the conductive members is respectively connected to the power supply terminal and the connecting member to realize the power supply device pair The computing board is powered.
根据本公开实施例的数据处理设备,通过导电件连接电源装置和运算板,缩短了供电距离,降低了线路阻抗及成本。According to the data processing device of the embodiment of the present disclosure, the power supply device and the computing board are connected through the conductive member, the power supply distance is shortened, and the line impedance and cost are reduced.
根据本公开的一些实施例,每个所述导电件为一体件且包括:第一导电部,所述第一导电部适于连接至所述运算板上的连接件;第二导电部,所述第二导电部垂直连接至所述第一导电部的一端,所述第二导电部与相应的所述供电端子相连。According to some embodiments of the present disclosure, each of the conductive members is an integral piece and includes: a first conductive portion, the first conductive portion is adapted to be connected to a connector on the computing board; The second conductive portion is vertically connected to one end of the first conductive portion, and the second conductive portion is connected to the corresponding power supply terminal.
根据本公开的一些实施例,所述第二导电部具有连接孔,相应的所述供电端子适于穿过所述连接孔并固定。According to some embodiments of the present disclosure, the second conductive portion has a connection hole, and the corresponding power supply terminal is adapted to pass through the connection hole and be fixed.
根据本公开的一些实施例,所述电源装置具有第一供电端子和第二供电端子,所述第一供电端子和所述第二供电端子的其中一个为正极且另一个为负极;According to some embodiments of the present disclosure, the power supply device has a first power supply terminal and a second power supply terminal, and one of the first power supply terminal and the second power supply terminal is a positive electrode and the other is a negative electrode;
所述导电装置包括并列设置的第一导电件和第二导电件,所述第一导电件和所述第二导电件分别与所述第一供电端子和所述第二供电端子相连。The conductive device includes a first conductive member and a second conductive member arranged in parallel, and the first conductive member and the second conductive member are respectively connected to the first power supply terminal and the second power supply terminal.
根据本公开的一些实施例,所述第一导电件和所述第二导电件的第一导电部和第二导电部均形成为板状件;所述第一导电件的第一导电部和所述第二导电件的所述第一导电部平 行设置;所述第二导电件还包括过渡部,所述过渡部连接在所述第一导电部和第二导电部之间以使所述第一导电件的第二导电部和所述第二导电件的第二导电部在同一方向上延伸布置。According to some embodiments of the present disclosure, the first conductive portion and the second conductive portion of the first conductive member and the second conductive member are each formed as a plate-shaped member; the first conductive portion of the first conductive member and The first conductive parts of the second conductive part are arranged in parallel; the second conductive part further includes a transition part, and the transition part is connected between the first conductive part and the second conductive part so that the The second conductive portion of the first conductive member and the second conductive portion of the second conductive member are arranged to extend in the same direction.
根据本公开的一些实施例,所述连接件具有夹持部,所述导电件设在所述连接件的所述夹持部内;所述连接件包括:本体,所述本体形成为大体U形形状且包括一端连接的第一板体和第二板体;安装部,所述安装部与所述本体连接,所述本体适于安装在所述运算板上;接触部,所述接触部连接至所述本体且限定出所述夹持部。According to some embodiments of the present disclosure, the connecting member has a clamping portion, and the conductive member is disposed in the clamping portion of the connecting member; the connecting member includes: a body formed in a generally U-shape A shape and including a first plate body and a second plate body connected at one end; a mounting portion, the mounting portion being connected to the body, the body being adapted to be mounted on the computing board; a contact portion, the contact portion being connected To the body and defining the clamping portion.
根据本公开的一些实施例,所述接触部包括:第一接触部,所述第一接触部连接至所述第一板体,且包括并列排布且彼此间隔开的多个第一接触端子;第二接触部,所述第二接触部连接至所述第二板体且与所述第一接触部相对设置,所述第二接触部包括并列排布且彼此间隔开的多个第二接触端子,所述第二接触部与所述第一接触部之间限定出至少一个颈部;其中,在所述颈部处,所述第一接触部和第二接触部之间的距离小于其他位置处的距离。According to some embodiments of the present disclosure, the contact portion includes a first contact portion that is connected to the first board and includes a plurality of first contact terminals arranged side by side and spaced apart from each other. A second contact portion, which is connected to the second plate body and is opposite to the first contact portion, the second contact portion includes a plurality of second lines arranged side by side and spaced apart from each other; The contact terminal defines at least one neck portion between the second contact portion and the first contact portion; wherein, at the neck portion, a distance between the first contact portion and the second contact portion is less than Distance at other locations.
根据本公开的一些实施例,所述第一接触部具有至少一个第一弧形部,所述第一弧形部朝向所述第二接触部凸出;所述第二接触部被构造成平板形状或具有朝向所述第一接触部凸出的第二弧形部。According to some embodiments of the present disclosure, the first contact portion has at least one first arc-shaped portion, and the first arc-shaped portion protrudes toward the second contact portion; the second contact portion is configured as a flat plate Shaped or having a second arc-shaped portion protruding toward the first contact portion.
根据本公开的一些实施例,所述第二接触部通过连接部连接至所述第二板体,所述连接部从所述第二板体的自由端朝向远离所述第一板体的方向延伸,其中所述导电件设在所述夹持部内之后其端部与所述连接部止抵。According to some embodiments of the present disclosure, the second contact portion is connected to the second plate body through a connection portion, and the connection portion faces away from the first plate body from a free end of the second plate body. An extension, wherein after the conductive member is disposed in the clamping portion, an end portion of the conductive member abuts against the connection portion.
根据本公开的一些实施例,所述第一接触部和/或第二接触部的远离所述本体部的一端具有导引部,所述导引部引导所述导电件进入所述夹持部内。According to some embodiments of the present disclosure, an end of the first contact portion and / or the second contact portion remote from the body portion has a guide portion, and the guide portion guides the conductive member into the clamping portion. .
根据本公开的一些实施例,所述第一板体和所述第二板体均形成为L形状,所述安装部垂直连接至所述第一板体和所述第二板体。According to some embodiments of the present disclosure, the first plate body and the second plate body are each formed in an L shape, and the mounting portion is vertically connected to the first plate body and the second plate body.
根据本公开的一些实施例,所述数据处理设备还包括:机箱,所述机箱内具有容纳腔,多个所述运算板设在所述容纳腔内,所述运算板沿所述机箱的高度方向设置且在所述机箱的所述宽度方向上并列排布;支架,所述支架安装至所述机箱,且所述电源装置安装至所述支架;和散热片,所述散热片设在所述运算板上,且每个散热片连接在至少一个所述芯片的一侧。According to some embodiments of the present disclosure, the data processing device further includes: a chassis having a receiving cavity therein, a plurality of the computing boards are disposed in the receiving cavity, and the computing board is along a height of the chassis. It is arranged in a direction and arranged side by side in the width direction of the chassis; a bracket, the bracket is mounted to the chassis, and the power supply device is mounted to the bracket; and a heat sink is provided in the chassis. Said computing board, and each heat sink is connected to one side of at least one of said chips.
根据本公开的一些实施例,所述机箱的高度大于其宽度,所述机箱的进风口和出风口位于所述机箱的所述宽度方向的两端。According to some embodiments of the present disclosure, the height of the chassis is greater than its width, and the air inlet and the air outlet of the chassis are located at both ends of the chassis in the width direction.
根据本公开的一些实施例,所述数据处理设备还包括:第一风扇组,所述第一风扇组设在所述机箱的所述进风口处,所述第一风扇组包括并联设置的多个第一风扇单元;第二风扇组,所述第二风扇组设在所述机箱上的所述出风口出以使所述机箱内的空气形成对流,所述第二风扇组包括并联设置的多个第二风扇单元。According to some embodiments of the present disclosure, the data processing device further includes: a first fan group, the first fan group is disposed at the air inlet of the chassis, and the first fan group includes a plurality of parallel fan modules. A first fan unit; a second fan group, the second fan group is provided at the air outlet of the chassis to form convection of the air in the chassis, and the second fan group includes Multiple second fan units.
根据本公开的一些实施例,每个所述第一风扇单元包括一个第一风扇或两个重叠布置的第一风扇;每个所述第二风扇单元包括一个第二风扇或两个重叠布置的第二风扇。According to some embodiments of the present disclosure, each of the first fan units includes one first fan or two overlapping first fans; each of the second fan unit includes one second fan or two overlapping ones The second fan.
根据本公开的一些实施例,所述进风口设在所述机箱的第一侧板上,且包括多个沿其高度方向排布的第一安装孔,多个所述第一风扇单元分别对应设置在所述第一安装孔处;所述出风口设在所述机箱的与所述第一侧板相对的所述第二侧板上,且包括多个沿其高度方向排布的第二安装孔,多个所述第二风扇单元分别对应设置在所述第二安装孔处。According to some embodiments of the present disclosure, the air inlet is provided on the first side plate of the chassis and includes a plurality of first mounting holes arranged along a height direction thereof, and the plurality of first fan units respectively correspond to The air outlet is provided on the second side plate of the chassis opposite to the first side plate, and includes a plurality of second A mounting hole, and a plurality of the second fan units are respectively disposed at the second mounting holes.
根据本公开实施例的数据处理设备,机箱竖向放置,进风口和出风口的距离缩短,芯片之间的温差减小,而且进风口和出风口的第一风扇组和第二风扇组串联形成强制对流,将所述运算板产生的热量更快速的吹出去,提升了散热效果。According to the data processing device of the embodiment of the present disclosure, the case is placed vertically, the distance between the air inlet and the air outlet is shortened, the temperature difference between the chips is reduced, and the first fan group and the second fan group of the air inlet and the air outlet are formed in series. Forced convection blows out the heat generated by the computing board more quickly, improving the heat dissipation effect.
根据本公开的一些实施例,所述每个芯片的一侧一一对应地粘接一个散热片;还包括辅助散热片,所述辅助散热片设在所述芯片的另一侧且与所述芯片一一对应。According to some embodiments of the present disclosure, one side of each chip is bonded to a heat sink in a one-to-one correspondence; and further includes an auxiliary heat sink, which is disposed on the other side of the chip and is in contact with the chip. The chips correspond one-to-one.
根据本公开的一些实施例,所述散热片包括:底片,所述底片包括位于中间的第一部分、第二部分和第三部分,所述第二部分和所述第三部分分别从所述第一部分的两侧朝着远离所述第一部分的方向倾斜地延伸;多个翅片,所述多个翅片与所述底片连接,其中一个翅片的自由端处设有握持部。According to some embodiments of the present disclosure, the heat sink includes: a negative film, the negative film includes a first portion, a second portion, and a third portion in the middle, and the second portion and the third portion are respectively from the first portion Two sides of a portion extend obliquely in a direction away from the first portion; a plurality of fins, the plurality of fins are connected to the bottom plate, and a grip portion is provided at a free end of one of the fins.
根据本公开的一些实施例,所述机箱具有位置相对的第一通孔和所述第二通孔,所述运算板具有信号接口和电源接口,所述信号接口和所述电源接口分别从所述第一通孔和所述第二通孔显露出。According to some embodiments of the present disclosure, the chassis has a first through hole and a second through hole opposite to each other, the computing board has a signal interface and a power interface, and the signal interface and the power interface are respectively from The first through hole and the second through hole are exposed.
根据本公开的一些实施例,所述信号接口和电源接口分别位于所述运算板的对角线的两端。According to some embodiments of the present disclosure, the signal interface and the power interface are respectively located at two ends of a diagonal of the computing board.
通过将信号接口和电源接口从机箱上相对的第一通孔和第二通孔露出,有效增大了运算板上信号接口和电源接口之间的距离,避免了信号发生干扰,使得运算板上的信号接口和电源接口可以相互远离地安装在机箱内,保证了数据处理设备的正常工作。By exposing the signal interface and the power interface from the first and second through holes on the chassis, the distance between the signal interface and the power interface on the computing board is effectively increased, signal interference is avoided, and the computing board is The signal interface and power interface can be installed in the chassis away from each other, ensuring the normal operation of the data processing equipment.
本公开的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本公开的实践了解到。Additional aspects and advantages of the present disclosure will be given in part in the following description, and part of them will become apparent from the following description, or be learned through the practice of the present disclosure.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
本公开的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解,其中:The above and / or additional aspects and advantages of the present disclosure will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
图1是根据本公开实施例的数据处理设备的示意图;1 is a schematic diagram of a data processing device according to an embodiment of the present disclosure;
图2是图1中所示的数据处理设备中导电件与运算板的连接示意图;2 is a schematic diagram of a connection between a conductive member and a computing board in the data processing device shown in FIG. 1;
图3是图1中所示的数据处理设备的导电件的示意图;3 is a schematic diagram of a conductive member of the data processing apparatus shown in FIG. 1;
图4是图1中所示的数据处理设备的导电装置的示意图;4 is a schematic diagram of a conductive device of the data processing apparatus shown in FIG. 1;
图5是图1中所示的数据处理设备的运算板的示意图;5 is a schematic diagram of an arithmetic board of the data processing device shown in FIG. 1;
图6是图5中所示的运算板的局部示意图,其中示出了连接件;FIG. 6 is a partial schematic diagram of the computing board shown in FIG. 5, in which a connecting member is shown;
图7a、图7b是图6中所示的连接件的两个角度的示意图;7a and 7b are schematic diagrams of two angles of the connecting member shown in FIG. 6;
图8是根据本公开另一个实施例的数据处理设备的爆炸图;8 is an exploded view of a data processing device according to another embodiment of the present disclosure;
图9是图8所示的数据处理设备的示意图;FIG. 9 is a schematic diagram of the data processing device shown in FIG. 8;
图10是根据本公开实施例的数据处理设备的原理图;10 is a schematic diagram of a data processing device according to an embodiment of the present disclosure;
图11是根据本公开一个实施例的数据处理设备的剖视图,其中示出了进风口和出风口处的风扇组;11 is a cross-sectional view of a data processing device according to an embodiment of the present disclosure, in which a fan group at an air inlet and an air outlet is shown;
图12是根据本公开另一个实施例的数据处理设备的剖视图,其中示出了进风口处的风扇组;12 is a cross-sectional view of a data processing device according to another embodiment of the present disclosure, in which a fan group at an air inlet is shown;
图13是根据本公开又一个实施例的数据处理设备的剖视图,其中示出了进风口处的风扇组;13 is a cross-sectional view of a data processing device according to another embodiment of the present disclosure, in which a fan group at an air inlet is shown;
图14是根据本公开一个实施例的数据处理设备的剖视图,其中运算板上设有一种散热片;14 is a cross-sectional view of a data processing device according to an embodiment of the present disclosure, in which a heat sink is provided on a computing board;
图15是根据本公开另一个实施例的数据处理设备中其中一个运算板的剖视图,其中示出了散热片和辅助散热片;15 is a cross-sectional view of one computing board in a data processing device according to another embodiment of the present disclosure, in which a heat sink and an auxiliary heat sink are shown;
具体实施方式Detailed ways
下面详细描述本公开的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,仅用于解释本公开,而不能理解为对本公开的限制。Hereinafter, embodiments of the present disclosure will be described in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present disclosure, and should not be construed as limiting the present disclosure.
在本公开的描述中,需要理解的是,术语“上”、“下”、“前”、“后”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系, 仅是为了便于描述本公开和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本公开的限制。需要说明的是,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。进一步地,在本公开的描述中,除非另有说明,“多个”的含义是两个或两个以上。In the description of the present disclosure, it should be understood that the directions or positions indicated by the terms "upper", "lower", "front", "rear", "top", "bottom", "inside", "outside" and the like The relationship is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, It should not be construed as a limitation on the present disclosure. It should be noted that the terms “first” and “second” are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. Further, in the description of the present disclosure, unless otherwise stated, the meaning of "plurality" is two or more.
下面参考图1-图15描述根据本公开实施例的数据处理设备100。这里的数据处理设备可以为服务器、区块链数据凭证计算设备或者其他实现计算功能且发热功率较大的机器。A data processing apparatus 100 according to an embodiment of the present disclosure is described below with reference to FIGS. 1 to 15. The data processing device here may be a server, a blockchain data voucher computing device, or another machine that implements a computing function and has a large heating power.
如图1所示,根据本公开实施例的一种数据处理设备100,包括:至少一个运算板1、电源装置2、和导电装置3。As shown in FIG. 1, a data processing device 100 according to an embodiment of the present disclosure includes: at least one arithmetic board 1, a power supply device 2, and a conductive device 3.
运算板1用于进行数据处理。当运算板1为多个时,采用并联方式连接。如图1所示的示例中,运算板3的数量为3个。如图5所示,每个运算板1的一个侧面上安装有多个芯片4。可选地,多个芯片4可以在运算板1上以规则的阵列排布。如图1和图2所示,每个运算板1具有连接件5。电源装置2具有至少一个供电端子21。The arithmetic board 1 is used for data processing. When there are multiple computing boards 1, they are connected in parallel. In the example shown in FIG. 1, the number of arithmetic boards 3 is three. As shown in FIG. 5, a plurality of chips 4 are mounted on one side of each computing board 1. Optionally, a plurality of chips 4 may be arranged on the computing board 1 in a regular array. As shown in FIGS. 1 and 2, each computing board 1 has a connecting member 5. The power supply device 2 has at least one power supply terminal 21.
导电装置3包括至少一个导电件31,每个导电件31分别与供电端子21和连接件5相连以实现电源装置2对运算板1供电。这里的导电件31例如可以为金属材质,例如铜合金、铝合金件等。如图2所示的示例中,多个运算板1并行地与导电件31相连。The conductive device 3 includes at least one conductive member 31, and each conductive member 31 is respectively connected to the power supply terminal 21 and the connecting member 5 so as to realize the power supply device 2 to supply power to the computing board 1. Here, the conductive member 31 may be a metal material, such as a copper alloy, an aluminum alloy, or the like. In the example shown in FIG. 2, a plurality of arithmetic boards 1 are connected to the conductive member 31 in parallel.
根据本公开实施例的数据处理设备100,通过导电件31连接电源装置2和运算板1,缩短了供电距离,降低了线路阻抗及成本。According to the data processing device 100 of the embodiment of the present disclosure, the power supply device 2 and the computing board 1 are connected through the conductive member 31, the power supply distance is shortened, and the line impedance and cost are reduced.
根据本公开的一些实施例,如图3所示,每个导电件31均为一体件,不产生连接或拼接节点,从而可以避免节点带来线路阻抗的增大,极大限度地减少线路阻抗,降低线路成本和人工成本,有效降低热损耗。According to some embodiments of the present disclosure, as shown in FIG. 3, each conductive member 31 is an integral piece, and no connection or splicing node is generated, thereby avoiding the increase of the line impedance brought by the node and greatly reducing the line impedance. , Reduce line costs and labor costs, effectively reduce heat loss.
每个导电件31均包括第一导电部311和第二导电部312,第一导电部311适于连接至运算板1上的连接件5,第二导电部312垂直连接至第一导电部311的一端,第二导电部312与电源装置2的相应的供电端子21相连,由此可以将运算板1与电源装置2电连接,从而实现电源装置2向运算板1上的芯片4等部件进行供电。在一些可选的实施例中,如图3所示,第二导电部312具有连接孔3121,相应的供电端子21适于穿过连接孔3121并固定。可选地,连接孔3121可以为如图示的长圆形孔,也可以为与供电端子21数量相匹配的圆孔、椭圆孔或多边形孔,在此不做进一步限制。Each conductive member 31 includes a first conductive portion 311 and a second conductive portion 312. The first conductive portion 311 is adapted to be connected to the connecting member 5 on the computing board 1, and the second conductive portion 312 is vertically connected to the first conductive portion 311. At one end, the second conductive portion 312 is connected to the corresponding power supply terminal 21 of the power supply device 2, so that the computing board 1 and the power supply device 2 can be electrically connected, so that the power supply device 2 can be implemented to the chip 4 and other components on the computing board 1. powered by. In some optional embodiments, as shown in FIG. 3, the second conductive portion 312 has a connection hole 3121, and the corresponding power supply terminal 21 is adapted to pass through the connection hole 3121 and be fixed. Optionally, the connection hole 3121 may be an oblong hole as shown in the figure, or a circular hole, an oval hole or a polygonal hole matching the number of the power supply terminals 21, which is not further limited herein.
如图1所述,在本公开的一些实施例中,电源装置2具有第一供电端子21a和第二供电 端子21b,第一供电端子21a和第二供电端子21b的其中一个为正极且另一个为负极。导电装置3包括并列设置的第一导电件31a和第二导电件31b,第一导电件31a和第二导电件31b分别与第一供电端子21a和第二供电端子21b相连。As shown in FIG. 1, in some embodiments of the present disclosure, the power supply device 2 has a first power supply terminal 21 a and a second power supply terminal 21 b. One of the first power supply terminal 21 a and the second power supply terminal 21 b is positive and the other Is negative. The conductive device 3 includes a first conductive member 31a and a second conductive member 31b arranged in parallel, and the first conductive member 31a and the second conductive member 31b are connected to the first power supply terminal 21a and the second power supply terminal 21b, respectively.
如图1所示的示例中,第一供电端子21a的极性为正极,第二供电端子21b的极性为负极,第一导电件31a与第一供电端子21a相连,第二导电件31b与第二供电端子21b供电,从而通过第一导电件31a和第二导电件31b,在运算板1和电源装置2之间形成电流通路,以便实现电源装置2对运算板1的供电。In the example shown in FIG. 1, the polarity of the first power supply terminal 21a is positive, the polarity of the second power supply terminal 21b is negative, the first conductive member 31a is connected to the first power supply terminal 21a, and the second conductive member 31b is connected to The second power supply terminal 21b supplies power to form a current path between the computing board 1 and the power supply device 2 through the first conductive member 31a and the second conductive member 31b, so that the power supply device 2 supplies power to the computing board 1.
当然,本公开并不限于此。在本公开的其他一些实施例中,可以仅设置一个供电端子21,或者,在电源电压供给不足的情况下,多个供电端子21的极性还可以相同,这样,同一个导电件31可以与一个或多个同极性的供电端子21进行连接。例如,从电源装置2连接出的多个供电端子21的极性均为正极,运算板1或设在其外部的机箱6可以接地,同样也可以形成电源装置2对运算板1的供电通路。Of course, the present disclosure is not limited to this. In other embodiments of the present disclosure, only one power supply terminal 21 may be provided, or when the power supply voltage is insufficient, the polarities of the plurality of power supply terminals 21 may also be the same, so that the same conductive member 31 may be One or more power supply terminals 21 of the same polarity are connected. For example, the polarities of the plurality of power supply terminals 21 connected from the power supply device 2 are all positive, and the computing board 1 or a case 6 provided on the computing board 1 may be grounded, and the power supply device 2 may also supply power to the computing board 1.
如图4所示的示例中,第一导电件31a和第二导电件31b的第一导电部311a、311b和第二导电部312a、312b均形成为片状件。第一导电件31a的第一导电部311a和第二导电件31b的第一导电部311b平行设置。第二导电件31b还包括过渡部313b,过渡部313b连接在第一导电部311b和第二导电部312b之间,以使第一导电件31a的第二导电部312a和第二导电件31b的第二导电部312b在同一方向上延伸布置,由此可以保证第一导电件31a、第二导电件31b适于与在同一方向上排布的供电端子21分别连接。在图4的示例中,过渡部313b呈“L”形形状。当然,本公开不限于此,在本公开的其他实施例中,过渡部313b也可以为其他形状,只要能满足将第二导电件31b的第二导电部312b和第一导电件31a的第二导电部312a能方便地连接至供电端子21即可。In the example shown in FIG. 4, the first conductive portions 311 a and 311 b and the second conductive portions 312 a and 312 b of the first conductive member 31 a and the second conductive member 31 b are each formed as a sheet-like member. The first conductive portion 311a of the first conductive member 31a and the first conductive portion 311b of the second conductive member 31b are disposed in parallel. The second conductive member 31b further includes a transition portion 313b, and the transition portion 313b is connected between the first conductive portion 311b and the second conductive portion 312b, so that the second conductive portion 312a of the first conductive member 31a and the second conductive member 31b The second conductive portions 312b are extended in the same direction, thereby ensuring that the first conductive members 31a and the second conductive members 31b are suitable for being connected to the power supply terminals 21 arranged in the same direction, respectively. In the example of FIG. 4, the transition portion 313 b has an “L” shape. Of course, the present disclosure is not limited to this. In other embodiments of the present disclosure, the transition portion 313b may have other shapes as long as it can satisfy the second conductive portion 312b of the second conductive member 31b and the second conductive portion 31a of the first conductive member 31a. The conductive portion 312 a can be easily connected to the power supply terminal 21.
在上面的描述中,第一导电件31a和第二导电件31b均为长片状,当然,本领域技术人员还可以根据实际情况,将导电件31设置成柱状或条状等形状。In the above description, the first conductive member 31a and the second conductive member 31b are both long pieces. Of course, those skilled in the art can also set the conductive member 31 into a column shape or a strip shape according to the actual situation.
在一些可选的实施例中,第一导电件31a和第二导电件31b的宽度或直径为1mm,从而能够极大限度的减少线路阻抗,降低损耗,提高电能使用效率的同时还可降低线材成本。In some optional embodiments, the width or diameter of the first conductive member 31a and the second conductive member 31b is 1mm, which can greatly reduce the line impedance, reduce the loss, and improve the efficiency of power usage while reducing the wire rod. cost.
根据本公开的一些实施例,如图5和图6所示,连接件5具有夹持部50。如图5所示,导电件31设在连接件5的夹持部50内,使得电源装置2与运算板1之间距离很短,从而降低线路阻抗。According to some embodiments of the present disclosure, as shown in FIGS. 5 and 6, the connecting member 5 has a clamping portion 50. As shown in FIG. 5, the conductive member 31 is provided in the clamping portion 50 of the connecting member 5, so that the distance between the power supply device 2 and the computing board 1 is short, thereby reducing the line impedance.
在一些具体的实施例中,如图6-图7b所示,连接件5包括:本体51、安装部52和接触部53,本体51形成为大体U形形状且包括一端连接的第一板体511和第二板体512。安 装部52与本体51连接,本体51适于安装在运算板1上,例如可以通过螺钉连接或粘接等方式。接触部53连接至本体51且限定出夹持部50,以便于将导电件31容纳在其内。In some specific embodiments, as shown in FIGS. 6-7b, the connecting member 5 includes a body 51, a mounting portion 52, and a contact portion 53. The body 51 is formed in a generally U-shape and includes a first plate body connected at one end. 511 和 第二 板 体 512. The mounting portion 52 is connected to the main body 51, and the main body 51 is suitable for being mounted on the computing board 1. For example, the mounting portion 52 can be screwed or bonded. The contact portion 53 is connected to the body 51 and defines a clamping portion 50 so as to accommodate the conductive member 31 therein.
如图7a、图7b所示,接触部53包括第一接触部53a和第二接触部53b,第一接触部53a连接至第一板体511,且包括并列排布且彼此间隔开的多个第一接触端子531a,第二接触部53b连接至第二板体512且与第一接触部53a相对设置,第二接触部53b包括并列排布且彼此间隔开的多个第二接触端子531b,第二接触部53b与第一接触部53a之间限定出至少一个颈部532;其中,在颈部532处,第一接触部53a和第二接触部53b之间的距离小于其他位置处的距离。这样,当导电件31容纳在夹持部50内时,由于颈部532的存在,导电件31被夹持在第一接触部53a和第二接触部53b之间,从而保证导电件31与连接件5的紧密接触,进而保证导电件31与运算板1之间的电连接。如图7a所示的示例中,第一接触部53a包括4个第一接触端子531a,第二接触部53b包括2个第二接触端子531b。由此,通过设置多个接触端子,可以保证导电件31与连接件5之间更好的接触性,从而避免因为接触面积过小而导致的电阻增大和热损耗过大。As shown in FIGS. 7a and 7b, the contact portion 53 includes a first contact portion 53a and a second contact portion 53b. The first contact portion 53a is connected to the first plate body 511, and includes a plurality of lines arranged side by side and spaced apart from each other. The first contact terminal 531a and the second contact portion 53b are connected to the second plate 512 and are disposed opposite to the first contact portion 53a. The second contact portion 53b includes a plurality of second contact terminals 531b arranged side by side and spaced from each other. At least one neck portion 532 is defined between the second contact portion 53b and the first contact portion 53a; wherein, at the neck portion 532, the distance between the first contact portion 53a and the second contact portion 53b is smaller than the distance at other locations . In this way, when the conductive member 31 is contained in the clamping portion 50, the conductive member 31 is clamped between the first contact portion 53a and the second contact portion 53b due to the presence of the neck portion 532, thereby ensuring the connection between the conductive member 31 and the connection The close contact of the component 5 ensures the electrical connection between the conductive component 31 and the computing board 1. In the example shown in FIG. 7a, the first contact portion 53a includes four first contact terminals 531a, and the second contact portion 53b includes two second contact terminals 531b. Therefore, by providing a plurality of contact terminals, it is possible to ensure better contact between the conductive member 31 and the connecting member 5, thereby avoiding an increase in resistance and excessive heat loss caused by a contact area that is too small.
可选地,第一接触部53a具有至少一个第一弧形部533a,每一个弧形部533a与第二接触部53b之间可以形成一个颈部532以便夹持导电件31,相应地,第二接触部53b被构造成平板形状(如图7a和图7b所示)或与所述第一弧形部533a相对设置的第二弧形部(图未示出)。Optionally, the first contact portion 53a has at least one first arc-shaped portion 533a, and a neck portion 532 may be formed between each of the arc-shaped portions 533a and the second contact portion 53b to hold the conductive member 31. Accordingly, the first The two contact portions 53b are configured in a flat plate shape (as shown in FIGS. 7a and 7b) or a second arc-shaped portion (not shown) provided opposite to the first arc-shaped portion 533a.
在本公开的一些示例中,如图7a所示,第二接触部53b通过连接部54连接至第二板体512,连接部54从第二板体512的自由端朝向远离第一板体511的方向延伸,其中导电件31设在夹持部50内之后其端部与连接部54止抵,也就是说,当导电件31进入夹持部50内后,在被夹持的同时其端部由连接部54进行支撑,因此,导电件31与连接件5之间的连接稳定。In some examples of the present disclosure, as shown in FIG. 7 a, the second contact portion 53 b is connected to the second plate 512 through a connection portion 54, and the connection portion 54 faces away from the first plate 511 from the free end of the second plate 512. The conductive member 31 is disposed in the clamping portion 50, and its end portion abuts against the connecting portion 54. That is, when the conductive member 31 enters the clamping portion 50, its end is held while being clamped. Since the portion is supported by the connection portion 54, the connection between the conductive member 31 and the connection member 5 is stable.
进一步地,如图7a和图7b所示,第一接触部53a和/或第二接触部53b的远离本体51部的一端具有导引部55,导引部55可以引导导电件31进入夹持部50内。如图7a所示的示例中,导引部55设在第二接触部53b上。Further, as shown in FIG. 7a and FIG. 7b, the end of the first contact portion 53a and / or the second contact portion 53b remote from the body 51 portion has a guide portion 55, and the guide portion 55 can guide the conductive member 31 into the clamp Inside the section 50. In the example shown in FIG. 7a, the guide portion 55 is provided on the second contact portion 53b.
此外,如图5-图7b所示,第一板体511和第二板体512均形成为L形状,安装部52垂直连接至第一板体511和第二板体512。In addition, as shown in FIGS. 5 to 7 b, the first plate body 511 and the second plate body 512 are each formed in an L shape, and the mounting portion 52 is vertically connected to the first plate body 511 and the second plate body 512.
如图8所示,在本公开的一些实施例中,数据处理设备100还包括用于固定和保护运算板1的机箱6、支架7、散热片8。机箱6内具有容纳腔60,多个运算板1设在容纳腔60内,运算板1沿机箱6的高度方向设置且在机箱6的宽度方向上并列排布。可选地,运算 板1的高度方向的尺寸大于其宽度方向的尺寸,芯片4在运算板1上以阵列方式排布,例如在高度方向上为14行、宽度方向上为6列,即在同一个运算板上可以设置6*14个芯片。As shown in FIG. 8, in some embodiments of the present disclosure, the data processing device 100 further includes a chassis 6, a bracket 7, and a heat sink 8 for fixing and protecting the computing board 1. The casing 6 has a receiving cavity 60 therein. A plurality of computing boards 1 are disposed in the receiving cavity 60. The computing boards 1 are arranged along the height direction of the chassis 6 and are arranged side by side in the width direction of the chassis 6. Optionally, the size of the computing board 1 in the height direction is larger than the width of the computing board 1. The chips 4 are arranged in an array on the computing board 1, for example, 14 rows in the height direction and 6 columns in the width direction. 6 * 14 chips can be set on the same arithmetic board.
支架7安装至机箱6,且电源装置2安装至支架7上,如图9所示。可选地,支架7成板状。The bracket 7 is mounted to the chassis 6, and the power supply unit 2 is mounted on the bracket 7, as shown in FIG. 9. Optionally, the bracket 7 is plate-shaped.
散热片8设在运算板1上,且每个散热片8粘接在至少一个芯片4的一侧。可选地,芯片4和散热片8之间可以用导热胶进行粘接,使每块芯片4均可以与散热片8充分贴合,提高了散热效果。The heat sink 8 is disposed on the computing board 1, and each heat sink 8 is bonded to one side of at least one chip 4. Optionally, the chip 4 and the heat sink 8 can be bonded with a thermally conductive adhesive, so that each chip 4 can be fully attached to the heat sink 8 to improve the heat dissipation effect.
在一些实施例中,如图8和图9所示,机箱6的高度大于其宽度,机箱6的进风口61和出风口62位于机箱6的宽度方向的两端。也就是说,机箱6为竖向放置,进风口61和出风口62之间的距离短,从而芯片4产生的热量容易被带走。在进风口61和出风口62的至少一处设置用于散热的风扇组。In some embodiments, as shown in FIGS. 8 and 9, the height of the chassis 6 is greater than its width, and the air inlet 61 and the air outlet 62 of the chassis 6 are located at two ends in the width direction of the chassis 6. That is, the case 6 is placed vertically, and the distance between the air inlet 61 and the air outlet 62 is short, so that the heat generated by the chip 4 is easily taken away. A fan unit for dissipating heat is provided at at least one of the air inlet 61 and the air outlet 62.
下面参考图10描述根据本公开实施例的数据处理设备的工作原理。The working principle of the data processing device according to the embodiment of the present disclosure is described below with reference to FIG. 10.
在数据处理设备中,包括机箱6、位于机箱6内的运算板1、与运算板1相连的控制板13和扩展板14,以及用于散热的风扇组。控制板13通过输入/输出(IO)扩展板14发送指令和相关数据。运算板1是整个设备的运算中心,通过电源装置2供电。控制板13将指令和数据下发到IO扩展板14,IO扩展板14将指令和数据转发到运算板1,运算板1运算后将结果通过IO扩展板14返回到控制板13,控制板13可以通过通信网络接口上传到互联网中。The data processing equipment includes a chassis 6, a computing board 1 located in the chassis 6, a control board 13 and an expansion board 14 connected to the computing board 1, and a fan group for heat dissipation. The control board 13 sends instructions and related data through an input / output (IO) expansion board 14. The computing board 1 is a computing center of the entire device, and is powered by a power supply device 2. The control board 13 sends instructions and data to the IO expansion board 14. The IO expansion board 14 forwards the instructions and data to the operation board 1. After the operation of the operation board 1, the result is returned to the control board 13 through the IO extension board 14. The control board 13 It can be uploaded to the Internet through the communication network interface.
可选地,运算板1还可以包括其他单元,例如供电保护电路(图未示出),该供电保护电路可以在电路装置的整体温度异常时切断电源装置2的供电。另外,在实现大功率计算时,运算板1上的每个芯片4都会产生大量热量,通过设置散热片,可以及时对芯片4进行有效地散热。Optionally, the computing board 1 may further include other units, such as a power supply protection circuit (not shown in the figure), which can cut off the power supply of the power supply device 2 when the overall temperature of the circuit device is abnormal. In addition, when implementing high-power calculations, each chip 4 on the computing board 1 generates a large amount of heat. By providing a heat sink, the chip 4 can be efficiently cooled in time.
在本公开的一些实施例中,如图11所示,用于散热的风扇组包括第一风扇组9a和第二风扇组9b。第一风扇组9a设在机箱6的进风口61处,第一风扇组9a包括并联设置的多个第一风扇单元91a。第二风扇组9b设在机箱6上的出风口62出以使机箱6内的空气形成对流,第二风扇组9b包括并联设置的多个第二风扇单元91b。In some embodiments of the present disclosure, as shown in FIG. 11, the fan group for heat dissipation includes a first fan group 9 a and a second fan group 9 b. The first fan group 9a is disposed at the air inlet 61 of the chassis 6. The first fan group 9a includes a plurality of first fan units 91a arranged in parallel. The second fan group 9b is provided at the air outlet 62 on the chassis 6 so that the air in the chassis 6 forms a convection. The second fan group 9b includes a plurality of second fan units 91b arranged in parallel.
由此,由于进风口61和出风口62之间的距离缩短,宽度方向上芯片4之间的温差减小,同时,在进风口61处采用并联的多个风扇单元91a向机箱6内部吹风,同时在出风口62处采用并联设置的多个风扇单元91b向外吹风,可以将运算板1上的芯片4运算产生的大量热量通过强制对流的方式带走,不但可以提高通过机箱6的风量,还可以使通过运算 板1的风量分布更加平均,从而提升了散热效果。Therefore, because the distance between the air inlet 61 and the air outlet 62 is shortened, the temperature difference between the chips 4 in the width direction is reduced. At the same time, a plurality of fan units 91a connected in parallel at the air inlet 61 are used to blow air to the inside of the chassis 6, At the same time, multiple fan units 91b arranged in parallel at the air outlet 62 are used to blow air outward, which can take away a large amount of heat generated by the operation of the chip 4 on the computing board 1 by means of forced convection, which can not only increase the amount of air passing through the chassis 6, It is also possible to make the air volume distribution through the computing board 1 more even, thereby improving the heat dissipation effect.
在一些可选的实施例中,并列设置的多个风扇单元91a和/或风扇单元91b可以为规格参数及功率参数相同的散热风扇,且均电连接到控制板13。其中,控制板13可以根据机箱6内的温度和/或芯片4的温度等信号实现对多个风扇单元91a的转速的控制。In some optional embodiments, the multiple fan units 91a and / or fan units 91b arranged in parallel may be cooling fans with the same specifications and power parameters, and are all electrically connected to the control board 13. The control board 13 can control the rotation speeds of the multiple fan units 91a according to signals such as the temperature in the chassis 6 and / or the temperature of the chip 4.
关于第一风扇组9a和第二风扇组9b的安装方式,如图11所示,在进风口61设在机箱6的第一侧板63上,且包括多个沿其高度方向排布的第一安装孔611,多个第一风扇单元91a分别对应设置在第一安装孔611处。相应地,出风口62设在机箱6的与第一侧板63相对的第二侧板64上,且包括多个沿其高度方向排布的第二安装孔621,多个第二风扇单元91b分别对应设置在第二安装孔621处。在一个可选的示例中,第一风扇单元91a和第二风扇单元91b分别通过螺钉方式固定在机箱6上。具体而言,在每个第一风扇911a的外周设置第一螺钉孔,在机箱6的相应位置处设置第二螺钉孔,长螺钉穿过第一螺钉孔后与第二螺钉孔连接,即可实现一个或多个第一风扇911a的安装,操作简单方便。第二风扇911b也可以同样地安装。需要说明的是,第一风扇组9a和第二风扇组9b需对称布置,以便形成多个相应的风道,从而提高散热效率。Regarding the installation manner of the first fan group 9a and the second fan group 9b, as shown in FIG. 11, the air inlet 61 is provided on the first side plate 63 of the chassis 6, and includes a plurality of first fan plates arranged along its height direction. A mounting hole 611 in which a plurality of first fan units 91 a are respectively disposed at the first mounting holes 611. Correspondingly, the air outlet 62 is provided on the second side plate 64 of the chassis 6 opposite to the first side plate 63, and includes a plurality of second mounting holes 621 arranged along its height direction, and a plurality of second fan units 91b. They are respectively disposed at the second mounting holes 621. In an optional example, the first fan unit 91a and the second fan unit 91b are fixed to the chassis 6 by screws, respectively. Specifically, a first screw hole is provided on the periphery of each first fan 911a, a second screw hole is provided at a corresponding position of the chassis 6, and a long screw passes through the first screw hole and is connected to the second screw hole. The installation of one or more first fans 911a is realized, and the operation is simple and convenient. The second fan 911b can be similarly mounted. It should be noted that the first fan group 9a and the second fan group 9b need to be symmetrically arranged so as to form a plurality of corresponding air ducts, thereby improving heat dissipation efficiency.
在一些具体的实施例中,每个第一风扇单元91a包括一个第一风扇911a或两个重叠布置的第一风扇911a,每个第二风扇单元91b包括一个第二风扇911b或两个重叠布置的第二风扇911b。以进风口61处的第一风扇组9a为例,如图12所示的示例中,第一风扇组9a包括并联设置的两个第一风扇单元91a,每个第一风扇单元91a包括一个第一风扇911a。而如图13所述的示例中,每个第一风扇单元91a包括重叠的两个第一风扇911a。通过设置重叠布置的风扇,可以增加机箱6内的风量,进一步加快了机箱6内的空气的流动速度,从而使得机箱6内芯片4产生的热量可以更加及时地被带走,进而进一步提高了散热性能。In some specific embodiments, each first fan unit 91a includes one first fan 911a or two overlapping first fans 911a, and each second fan unit 91b includes one second fan 911b or two overlapping arrangements Second fan 911b. Taking the first fan group 9a at the air inlet 61 as an example, in the example shown in FIG. 12, the first fan group 9a includes two first fan units 91a arranged in parallel, and each first fan unit 91a includes a first fan unit 91a. One fan 911a. In the example shown in FIG. 13, each first fan unit 91 a includes two first fans 911 a that overlap each other. By providing overlapping fans, the air volume in the chassis 6 can be increased, and the air flow speed in the chassis 6 can be further accelerated, so that the heat generated by the chip 4 in the chassis 6 can be taken away in a more timely manner, thereby further improving heat dissipation performance.
根据本公开实施例的数据处理设备,机箱6竖向放置,进风口61和出风口62的距离缩短,芯片4之间的温差减小,而且进风口61和出风口62的第一风扇组9a和第二风扇组9b串联形成强制对流,将所述运算板1产生的热量更快速的吹出去,提升了散热效果。According to the data processing device of the embodiment of the present disclosure, the case 6 is placed vertically, the distance between the air inlet 61 and the air outlet 62 is shortened, the temperature difference between the chips 4 is reduced, and the first fan group 9a of the air inlet 61 and the air outlet 62 is reduced. Forced convection is formed in series with the second fan group 9b, and the heat generated by the computing board 1 is blown out more quickly, thereby improving the heat dissipation effect.
根据本公开的一些实施例,每个芯片4的一侧一一对应地粘接一个散热片8,可以对运算板1上的每块芯片4单独进行散热,芯片4和散热片8之间用导热胶粘接,使每块芯片均可以与散热片充分贴合,提高了散热效果。芯片4工作产生的热量传导至散热片8上面,然后通过设在进风口61处的第一风扇组9a和出风口处的第二风扇组9b将热量吹走。According to some embodiments of the present disclosure, one side of each chip 4 is bonded to a heat sink 8 one by one, and each chip 4 on the computing board 1 can be individually cooled. The thermal conductive adhesive is bonded, so that each chip can be fully attached to the heat sink, which improves the heat dissipation effect. The heat generated by the operation of the chip 4 is transmitted to the heat sink 8, and then the heat is blown away through the first fan group 9 a provided at the air inlet 61 and the second fan group 9 b provided at the air outlet.
如图1、图15所示,在另一些实施例中,在芯片4的另一侧还设有辅助散热片80,辅 助散热片80与芯片4一一对应。可选地,辅助散热片80和散热片8的结构相同,且相对于运算板1对称排布,如图15所示。也就是说,在芯片4的双面均粘贴散热片8和80,这样有效平衡了芯片4两侧的风阻,使两侧对流换热的效率基本一致,实现了均衡散热,散热效率更好。As shown in FIGS. 1 and 15, in other embodiments, an auxiliary heat sink 80 is provided on the other side of the chip 4, and the auxiliary heat sink 80 corresponds to the chip 4 one-to-one. Optionally, the auxiliary heat sink 80 and the heat sink 8 have the same structure, and are arranged symmetrically with respect to the computing board 1 as shown in FIG. 15. In other words, the heat sinks 8 and 80 are affixed on both sides of the chip 4, which effectively balances the wind resistance on both sides of the chip 4 and makes the efficiency of convection heat exchange on both sides basically the same, achieving balanced heat dissipation and better heat dissipation efficiency.
因此,根据本公开实施例的数据处理设备,针对单个芯片4的功耗较低的情况,可以采用如图14所示的在芯片4的单个侧面粘贴散热片8的方案,这样可以节省空间,从而可以通过增加运算板1的数量来提高计算性能。而针对单个芯片4的功耗较高的情况,需要更高的散热效率,就可以采用图15所示的、增加辅助散热片80的方案。Therefore, according to the data processing device of the embodiment of the present disclosure, for a case where the power consumption of a single chip 4 is low, a solution of pasting the heat sink 8 on a single side of the chip 4 as shown in FIG. 14 can be adopted, which can save space. Therefore, the computing performance can be improved by increasing the number of the computing boards 1. For the case where the power consumption of a single chip 4 is high and higher heat dissipation efficiency is required, a solution shown in FIG. 15 with an additional auxiliary heat sink 80 can be adopted.
当然,在一些情况下,如果单个芯片4的功耗较低,也可以多个芯片4共用一个散热片8,以减少散热片的成本和工艺难度。例如,如图11-图13中所示的运算板1上,设置有6*14个芯片,此时可以设置平均分布的4个散热片,每一个散热片覆盖3*7个芯片。Of course, in some cases, if the power consumption of a single chip 4 is low, multiple chips 4 can also share a heat sink 8 to reduce the cost and process difficulty of the heat sink. For example, the computing board 1 shown in FIG. 11 to FIG. 13 is provided with 6 * 14 chips. At this time, 4 heat sinks can be arranged evenly, and each heat sink covers 3 * 7 chips.
如图15所示的具体示例中,散热片8包括底片81和多个翅片82,底片81包括位于中间的第一部分811、第二部分812和第三部分813,第二部分812和第三部分813分别从第一部分811的两侧朝着远离第一部分811的方向倾斜地延伸。多个翅片82与底片81连接,其中一个翅片82的自由端处设有握持部821,以便于机器或人工对散热片8的提起。As shown in the specific example shown in FIG. 15, the heat sink 8 includes a back sheet 81 and a plurality of fins 82. The back sheet 81 includes a first part 811, a second part 812, and a third part 813, and a second part 812 and a third part located in the middle. The portions 813 extend obliquely from both sides of the first portion 811 in a direction away from the first portion 811, respectively. A plurality of fins 82 are connected to the bottom sheet 81, and a free end of one of the fins 82 is provided with a holding portion 821 to facilitate lifting of the heat sink 8 by a machine or a human.
如图11和图12所示,在本公开的一些实施例中,机箱6具有位置相对的第一通孔65和第二通孔66,运算板1具有信号接口11和电源接口12,信号接口11和电源接口12分别从第一通孔65和第二通孔66显露出。通过将信号接口11和电源接口12从机箱6上相对的第一通孔65和第二通孔66露出,有效增大了运算板1上信号接口11和电源接口12之间的距离,避免了信号发生干扰,使得运算板1上的信号接口11和电源接口12可以相互远离地安装在机箱6内,保证了数据处理设备100的正常工作。As shown in FIGS. 11 and 12, in some embodiments of the present disclosure, the chassis 6 has a first through hole 65 and a second through hole 66 opposite to each other, and the computing board 1 has a signal interface 11 and a power interface 12. 11 and the power interface 12 are exposed from the first through hole 65 and the second through hole 66, respectively. By exposing the signal interface 11 and the power interface 12 from the opposite first and second through holes 65 and 66 on the chassis 6, the distance between the signal interface 11 and the power interface 12 on the computing board 1 is effectively increased, which avoids Signal interference occurs, so that the signal interface 11 and the power interface 12 on the computing board 1 can be installed in the chassis 6 away from each other, thereby ensuring the normal operation of the data processing device 100.
可选地,信号接口11和电源接口12还可以分别位于运算板1的对角线的两端,图未示出。Optionally, the signal interface 11 and the power interface 12 may also be respectively located at two ends of a diagonal line of the operation board 1, which are not shown in the figure.
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本公开的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, the description with reference to the terms “one embodiment”, “some embodiments”, “exemplary embodiments”, “examples”, “specific examples”, or “some examples”, etc., means that the implementation is combined Specific features, structures, materials, or characteristics described by examples or examples are included in at least one embodiment or example of the present disclosure. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
尽管已经示出和描述了本公开的实施例,本领域的普通技术人员可以理解:在不脱离本公开的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型,本公开 的范围由权利要求及其等同物限定。Although the embodiments of the present disclosure have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirit of the present disclosure, The scope of the present disclosure is defined by the claims and their equivalents.

Claims (20)

  1. 一种数据处理设备,其特征在于,包括:A data processing device, comprising:
    用于进行数据处理的至少一个运算板,所述运算板的一个侧面上安装有多个芯片,每个所述运算板具有连接件;At least one computing board for performing data processing, a plurality of chips are mounted on one side of the computing board, and each of the computing boards has a connector;
    电源装置,所述电源装置具有至少一个供电端子;A power supply device having at least one power supply terminal;
    导电装置,所述导电装置包括至少一个导电件,每个所述导电件分别与所述供电端子和所述连接件相连以实现所述电源装置对所述运算板供电。A conductive device, the conductive device includes at least one conductive member, and each of the conductive members is respectively connected to the power supply terminal and the connecting member to realize that the power supply device supplies power to the computing board.
  2. 根据权利要求1所述的数据处理设备,其特征在于,每个所述导电件为一体件且包括:The data processing device according to claim 1, wherein each of the conductive members is an integral piece and includes:
    第一导电部,所述第一导电部适于连接至所述运算板上的连接件;A first conductive portion, the first conductive portion is adapted to be connected to a connector on the computing board;
    第二导电部,所述第二导电部垂直连接至所述第一导电部的一端,所述第二导电部与相应的所述供电端子相连。A second conductive portion, which is vertically connected to one end of the first conductive portion, and the second conductive portion is connected to the corresponding power supply terminal.
  3. 根据权利要求2所述的数据处理设备,其特征在于,所述第二导电部具有连接孔,相应的所述供电端子适于穿过所述连接孔并固定。The data processing device according to claim 2, wherein the second conductive portion has a connection hole, and the corresponding power supply terminal is adapted to pass through the connection hole and be fixed.
  4. 根据权利要求2所述的数据处理设备,其特征在于,所述电源装置具有第一供电端子和第二供电端子,所述第一供电端子和所述第二供电端子的其中一个为正极且另一个为负极;The data processing device according to claim 2, wherein the power supply device has a first power supply terminal and a second power supply terminal, and one of the first power supply terminal and the second power supply terminal is positive and the other One is negative
    所述导电装置包括并列设置的第一导电件和第二导电件,所述第一导电件和所述第二导电件分别与所述第一供电端子和所述第二供电端子相连。The conductive device includes a first conductive member and a second conductive member arranged in parallel, and the first conductive member and the second conductive member are respectively connected to the first power supply terminal and the second power supply terminal.
  5. 根据权利要求4所述的数据处理设备,其特征在于,所述第一导电件和所述第二导电件的第一导电部和第二导电部均形成为板状件;The data processing apparatus according to claim 4, wherein the first conductive portion and the second conductive portion of the first conductive member and the second conductive member are each formed as a plate-like member;
    所述第一导电件的第一导电部和所述第二导电件的所述第一导电部平行设置;A first conductive portion of the first conductive member and the first conductive portion of the second conductive member are arranged in parallel;
    所述第二导电件还包括过渡部,所述过渡部连接在所述第一导电部和第二导电部之间以使所述第一导电件的第二导电部和所述第二导电件的第二导电部在同一方向上延伸布置。The second conductive member further includes a transition portion connected between the first conductive portion and the second conductive portion such that the second conductive portion of the first conductive member and the second conductive member The second conductive portion is arranged to extend in the same direction.
  6. 根据权利要求1-5中任一项所述的数据处理设备,其特征在于,所述连接件具有夹持部,所述导电件设在所述连接件的所述夹持部内;The data processing device according to any one of claims 1-5, wherein the connecting member has a clamping portion, and the conductive member is provided in the clamping portion of the connecting member;
    所述连接件包括:The connection includes:
    本体,所述本体形成为大体U形形状且包括一端连接的第一板体和第二板体;A body formed in a generally U-shape and including a first plate body and a second plate body connected at one end;
    安装部,所述安装部与所述本体连接,所述本体适于安装在所述运算板上;A mounting portion, the mounting portion is connected to the body, and the body is adapted to be mounted on the computing board;
    接触部,所述接触部连接至所述本体且限定出所述夹持部。A contact portion connected to the body and defining the clamping portion.
  7. 根据权利要求6所述的数据处理设备,其特征在于,所述接触部包括:The data processing device according to claim 6, wherein the contact portion comprises:
    第一接触部,所述第一接触部连接至所述第一板体,且包括并列排布且彼此间隔开的多个第一接触端子;A first contact portion, which is connected to the first plate body and includes a plurality of first contact terminals arranged side by side and spaced from each other;
    第二接触部,所述第二接触部连接至所述第二板体且与所述第一接触部相对设置,所述第二接触部包括并列排布且彼此间隔开的多个第二接触端子,所述第二接触部与所述第一接触部之间限定出至少一个颈部;A second contact portion connected to the second plate body and disposed opposite to the first contact portion, the second contact portion including a plurality of second contacts arranged side by side and spaced from each other A terminal, at least one neck defined between the second contact portion and the first contact portion;
    其中,在所述颈部处,所述第一接触部和第二接触部之间的距离小于其他位置处的距离。Wherein, at the neck, the distance between the first contact portion and the second contact portion is smaller than the distance at other positions.
  8. 根据权利要求7所述的数据处理设备,其特征在于,所述第一接触部具有至少一个第一弧形部,所述第一弧形部朝向所述第二接触部凸出;The data processing device according to claim 7, wherein the first contact portion has at least one first arc-shaped portion, and the first arc-shaped portion projects toward the second contact portion;
    所述第二接触部被构造成平板形状或具有朝向所述第一接触部凸出的第二弧形部。The second contact portion is configured in a flat plate shape or has a second arc-shaped portion protruding toward the first contact portion.
  9. 根据权利要求7所述的数据处理设备,其特征在于,所述第二接触部通过连接部连接至所述第二板体,所述连接部从所述第二板体的自由端朝向远离所述第一板体的方向延伸,其中所述导电件设在所述夹持部内之后其端部与所述连接部止抵。The data processing device according to claim 7, wherein the second contact portion is connected to the second plate body through a connection portion, and the connection portion faces away from the free end of the second plate body toward the second plate body. The first plate body extends in a direction, wherein after the conductive member is disposed in the clamping portion, an end portion of the conductive member stops against the connection portion.
  10. 根据权利要求7所述的数据处理设备,其特征在于,所述第一接触部和/或第二接触部的远离所述本体部的一端具有导引部,所述导引部引导所述导电件进入所述夹持部内。The data processing device according to claim 7, wherein an end of the first contact portion and / or the second contact portion remote from the body portion has a guide portion, and the guide portion guides the conductive portion Pieces enter the clamping portion.
  11. 根据权利要求6-10中任一项所述的数据处理设备,其特征在于,所述第一板体和所述第二板体均形成为L形状,所述安装部垂直连接至所述第一板体和所述第二板体。The data processing device according to any one of claims 6 to 10, wherein the first plate body and the second plate body are both formed in an L shape, and the mounting portion is vertically connected to the first plate body and the second plate body. A plate body and the second plate body.
  12. 根据权利要求1-11中任一项所述的数据处理设备,其特征在于,还包括:The data processing device according to any one of claims 1-11, further comprising:
    机箱,所述机箱内具有容纳腔,多个所述运算板设在所述容纳腔内,所述运算板沿所述机箱的高度方向设置且在所述机箱的所述宽度方向上并列排布;A chassis having a receiving cavity therein, and a plurality of the computing boards are disposed in the receiving chamber, the computing boards are arranged along a height direction of the chassis and are arranged side by side in the width direction of the chassis ;
    支架,所述支架安装至所述机箱,且所述电源装置安装至所述支架;和A bracket, the bracket is mounted to the chassis, and the power supply unit is mounted to the bracket; and
    散热片,所述散热片设在所述运算板上,且每个散热片连接在至少一个所述芯片的一侧。A heat sink is provided on the computing board, and each heat sink is connected to one side of at least one of the chips.
  13. 根据权利要求12所述的数据处理设备,其特征在于,所述机箱的高度大于其宽度,所述机箱的进风口和出风口位于所述机箱的所述宽度方向的两端。The data processing device according to claim 12, wherein a height of the chassis is greater than a width thereof, and an air inlet and an air outlet of the chassis are located at both ends of the chassis in the width direction.
  14. 根据权利要求13所述的数据处理设备,其特征在于,还包括:The data processing device according to claim 13, further comprising:
    第一风扇组,所述第一风扇组设在所述机箱的所述进风口处,所述第一风扇组包括并 联设置的多个第一风扇单元;A first fan group, where the first fan group is disposed at the air inlet of the chassis, and the first fan group includes a plurality of first fan units arranged in parallel;
    第二风扇组,所述第二风扇组设在所述机箱上的所述出风口出以使所述机箱内的空气形成对流,所述第二风扇组包括并联设置的多个第二风扇单元。A second fan group, the second fan group being provided at the air outlet of the chassis to form convection of air in the chassis, the second fan group including a plurality of second fan units arranged in parallel .
  15. 根据权利要求13所述的数据处理设备,其特征在于,每个所述第一风扇单元包括一个第一风扇或两个重叠布置的第一风扇;每个所述第二风扇单元包括一个第二风扇或两个重叠布置的第二风扇。The data processing device according to claim 13, wherein each of the first fan units includes one first fan or two first fans arranged one above the other; and each of the second fan units includes one second fan Fan or two second fans arranged on top of each other.
  16. 根据权利要求13或14所述的数据处理设备,其特征在于,所述进风口设在所述机箱的第一侧板上,且包括多个沿其高度方向排布的第一安装孔,多个所述第一风扇单元分别对应设置在所述第一安装孔处;The data processing device according to claim 13 or 14, wherein the air inlet is provided on a first side plate of the chassis, and includes a plurality of first mounting holes arranged along a height direction thereof, and The first fan units are respectively disposed at the first mounting holes;
    所述出风口设在所述机箱的与所述第一侧板相对的所述第二侧板上,且包括多个沿其高度方向排布的第二安装孔,多个所述第二风扇单元分别对应设置在所述第二安装孔处。The air outlet is provided on the second side plate of the chassis opposite to the first side plate, and includes a plurality of second mounting holes arranged along a height direction thereof, and a plurality of the second fans. The units are respectively disposed at the second mounting holes.
  17. 根据权利要求1-15中任一项所述的数据处理设备,其特征在于,所述每个芯片的一侧一一对应地粘接一个散热片;The data processing device according to any one of claims 1 to 15, wherein one side of each chip is bonded to a heat sink in a one-to-one correspondence;
    还包括辅助散热片,所述辅助散热片设在所述芯片的另一侧且与所述芯片一一对应。It also includes an auxiliary heat sink, which is disposed on the other side of the chip and corresponds to the chip one-to-one.
  18. 根据权利要求1-15中任一项所述的数据处理设备,其特征在于,所述散热片包括:The data processing device according to any one of claims 1-15, wherein the heat sink comprises:
    底片,所述底片包括位于中间的第一部分、第二部分和第三部分,所述第二部分和所述第三部分分别从所述第一部分的两侧朝着远离所述第一部分的方向倾斜地延伸;A negative film including a first portion, a second portion, and a third portion located in the middle, and the second portion and the third portion are respectively inclined from both sides of the first portion in a direction away from the first portion Ground extension
    多个翅片,所述多个翅片与所述底片连接,其中一个翅片的自由端处设有握持部。A plurality of fins, the plurality of fins are connected to the base sheet, and a holding portion is provided at a free end of one of the fins.
  19. 根据权利要求12所述的数据处理设备,其特征在于,所述机箱具有位置相对的第一通孔和所述第二通孔,所述运算板具有信号接口和电源接口,所述信号接口和所述电源接口分别从所述第一通孔和所述第二通孔显露出。The data processing device according to claim 12, wherein the chassis has a first through hole and a second through hole opposite to each other, the computing board has a signal interface and a power interface, and the signal interface and The power interface is exposed from the first through hole and the second through hole, respectively.
  20. 根据权利要求18所述的数据处理设备,其特征在于,所述信号接口和电源接口分别位于所述运算板的对角线的两端。The data processing device according to claim 18, wherein the signal interface and the power interface are respectively located at two ends of a diagonal of the computing board.
PCT/CN2019/089095 2018-05-31 2019-05-29 Data processing device WO2019228420A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201810550736.4 2018-05-31
CN201810550736.4A CN108646890A (en) 2018-05-31 2018-05-31 A kind of radiator, computing device and dig mine machine
CN201810638927.6A CN108536253A (en) 2018-06-20 2018-06-20 Data processing equipment
CN201810638927.6 2018-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201980003912.5A CN111133401A (en) 2018-05-31 2019-05-29 Data processing apparatus

Publications (1)

Publication Number Publication Date
WO2019228420A1 true WO2019228420A1 (en) 2019-12-05

Family

ID=68698700

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/089095 WO2019228420A1 (en) 2018-05-31 2019-05-29 Data processing device

Country Status (2)

Country Link
CN (1) CN111133401A (en)
WO (1) WO2019228420A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105183083A (en) * 2015-09-11 2015-12-23 安徽协创物联网技术有限公司 Battery installation structure of notebook computer
CN107203248A (en) * 2017-06-19 2017-09-26 吴晓晨 A kind of cooling cabinet
CN207319136U (en) * 2017-07-24 2018-05-04 北京嘉楠捷思信息技术有限公司 A kind of computing device
CN108536253A (en) * 2018-06-20 2018-09-14 北京比特大陆科技有限公司 Data processing equipment
CN108646890A (en) * 2018-05-31 2018-10-12 北京比特大陆科技有限公司 A kind of radiator, computing device and dig mine machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105183083A (en) * 2015-09-11 2015-12-23 安徽协创物联网技术有限公司 Battery installation structure of notebook computer
CN107203248A (en) * 2017-06-19 2017-09-26 吴晓晨 A kind of cooling cabinet
CN207319136U (en) * 2017-07-24 2018-05-04 北京嘉楠捷思信息技术有限公司 A kind of computing device
CN108646890A (en) * 2018-05-31 2018-10-12 北京比特大陆科技有限公司 A kind of radiator, computing device and dig mine machine
CN108536253A (en) * 2018-06-20 2018-09-14 北京比特大陆科技有限公司 Data processing equipment

Also Published As

Publication number Publication date
CN111133401A (en) 2020-05-08

Similar Documents

Publication Publication Date Title
US6181556B1 (en) Thermally-coupled heat dissipation apparatus for electronic devices
US9795066B2 (en) Inverter
US7764501B2 (en) Electronic device
WO2008032542A1 (en) Motor control device
CN100456205C (en) Heat radiator
WO2019228420A1 (en) Data processing device
CN208316833U (en) The video camera of high efficiency and heat radiation
WO2018196141A1 (en) Power amplifier
CN210444575U (en) Compact mainboard structure for power amplifier
WO2020103061A1 (en) Battery, unmanned aerial vehicle having battery, and electronic device
JPH08316389A (en) Heat sink cooler
TW201618657A (en) Heat dissipating module
WO2015062118A1 (en) Heat-conducting apparatus, backlight module, and liquid crystal display
JP2018207647A (en) Power conversion device
CN212649666U (en) Multichannel power amplifier
CN212033005U (en) Power module
CN212970620U (en) Switch
WO2019227393A1 (en) Heat dissipating system and photographic device
CN213186695U (en) Circuit board heat radiation structure and router
CN211378614U (en) Heat dissipation module and converter
CN212809780U (en) Memory convenient to heat dissipation
CN210202329U (en) Radiating system of direct-current power supply device
CN211267505U (en) Heat radiation structure of communication terminal
CN211959664U (en) Heat radiation assembly of PCB (printed circuit board)
CN208367615U (en) A kind of computer heat dissipation equipment

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19811530

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19811530

Country of ref document: EP

Kind code of ref document: A1