CN106847768B - Heat dissipation device and manufacturing method thereof - Google Patents

Heat dissipation device and manufacturing method thereof Download PDF

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Publication number
CN106847768B
CN106847768B CN201710142378.9A CN201710142378A CN106847768B CN 106847768 B CN106847768 B CN 106847768B CN 201710142378 A CN201710142378 A CN 201710142378A CN 106847768 B CN106847768 B CN 106847768B
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heat
pipe
fan
pcb
heat pipe
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CN106847768A (en
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杨帆
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Lenovo Beijing Ltd
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Lenovo Beijing Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Resistance Heating (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a heat sink and a manufacturing method thereof, wherein the heat sink comprises: heat pipes, heat generating elements; the heating elements are distributed on a Printed Circuit Board (PCB), and a first distribution structure is formed on the PCB; the heat pipe has a different structure by which the heat pipe can be distributed at a clearance area around the heat generating element to dissipate heat of the heat generating element.

Description

Heat dissipation device and manufacturing method thereof
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a heat dissipation device and a manufacturing method thereof.
Background
With the development of electronic products, the electronic products need to provide more and more functions for users. In order to realize the functions, more and more chips need to be integrated in the electronic product, so that the concentration of the heat source is increased, and the heat of the heat source needs to be quickly led out to ensure the performance of the chip. The existing heat dissipation devices are roughly classified into two types, one is a fan, and the other is a heat dissipation module. For the heat dissipation module, heat dissipation can be achieved by the following means: 1) the heat dissipation is realized by using the graphite sheets or the copper foils, so that the heat conduction efficiency is limited, and the heat dissipation cannot be quickly and efficiently realized for a high-power chip. 2) The heat pipe is used for heat dissipation, and the mode can only conduct heat along one direction, so that the heat dissipation effect is limited. It can be seen that how to design an efficient heat dissipation device has presented a bottleneck.
Disclosure of Invention
In order to solve the above technical problems, embodiments of the present invention provide a heat dissipation device and a manufacturing method thereof.
The heat sink provided by the embodiment of the invention comprises: heat pipes, heat generating elements; wherein the heating elements are distributed on a Printed Circuit Board (PCB) and form a first distribution structure on the PCB;
the heat pipe has a different structure by which the heat pipe can be distributed at a clearance area around the heat generating element to dissipate heat of the heat generating element.
In the embodiment of the invention, the heat dissipation device further comprises a fan, the fan is arranged on the PCB, and the heat pipe is used as a frame of the fan and is arranged on the periphery of the fan.
In the embodiment of the invention, the heat pipe is used as a frame of the fan and extends out of a connecting end, and the heat pipe is connected with the heat conduction component through the connecting end.
In the embodiment of the invention, the heat dissipation device further comprises a fan, the fan is arranged on the PCB, one end of the fan is provided with a heat dissipation (fin) sheet, and the heat pipe is connected with the fin sheet.
In the embodiment of the invention, the heat pipe is manufactured in the following way:
manufacturing a variable cross-section copper pipe, wherein the variable cross-section copper pipe means that the cross section of the copper pipe is inconsistent with the length of the copper pipe;
carrying out sectional powder filling and sintering on the variable-section copper pipe to form a capillary structure on the inner surface of the variable-section copper pipe;
and carrying out sectional flat beating on the variable-section copper pipe with the capillary structure to form the heat pipe.
The manufacturing method of the heat dissipation device provided by the embodiment of the invention comprises the following steps:
determining a first distribution structure of the heating elements on the PCB;
determining the different structure of the heat pipe according to the first distribution structure;
and arranging the heat pipe with the opposite structure at a clearance area at the periphery of the heating element so as to dissipate heat of the heating element.
In the embodiment of the present invention, the method further includes:
and arranging a fan on the PCB, and arranging a frame of the fan through the heat pipe.
In the embodiment of the present invention, the method further includes:
the heat pipe is used as a frame of the fan and extends out of a connecting end, and the heat pipe is connected to the heat conduction component through the connecting end.
In the embodiment of the present invention, the method further includes:
and a fan is arranged on the PCB, a fin sheet is arranged at one end of the fan, and the heat pipe is connected with the fin sheet.
In the embodiment of the present invention, the method further includes: the heat pipe is made by:
manufacturing a variable cross-section copper pipe, wherein the variable cross-section copper pipe means that the cross section of the copper pipe is inconsistent with the length of the copper pipe;
carrying out sectional powder filling and sintering on the variable-section copper pipe to form a capillary structure on the inner surface of the variable-section copper pipe;
and carrying out sectional flat beating on the variable-section copper pipe with the capillary structure to form the heat pipe.
In the technical solution of the embodiment of the present invention, the heat dissipation apparatus includes: heat pipes, heat generating elements; the heating elements are distributed on a PCB, and a first distribution structure is formed on the PCB; the heat pipe has a different structure by which the heat pipe can be distributed at a clearance area around the heat generating element to dissipate heat of the heat generating element. By adopting the technical scheme of the embodiment of the invention, the shape of the heat pipe can be flexibly designed according to needs, namely, when the shape of the heat pipe is designed, the heat source distribution of different systems can be aimed at, components on the board surface are avoided, the space is reasonably utilized for design, the effective heat dissipation area is increased as much as possible, and the heat dissipation efficiency is improved; in addition, the heat pipe has simple and convenient process and low manufacturing cost, and is favorable for batch production.
Drawings
Fig. 1 is a first schematic view of a heat dissipation device according to an embodiment of the invention;
FIG. 2 is a second schematic view of a heat dissipation device according to an embodiment of the present invention;
FIG. 3 is a third schematic view of a heat dissipation device according to an embodiment of the present invention;
FIG. 4 is a flowchart illustrating a method of fabricating a heat dissipation device according to an embodiment of the present invention;
FIG. 5 is a schematic view of a copper tube with a variable cross-section according to an embodiment of the present invention;
FIG. 6 is a schematic illustration of a staged powder-packed sintering according to an embodiment of the invention;
FIG. 7 is a schematic view of a segmented clap according to an embodiment of the present invention;
FIG. 8 is a schematic cross-sectional view of a copper tube according to an embodiment of the present invention.
Detailed Description
So that the manner in which the features and aspects of the embodiments of the present invention can be understood in detail, a more particular description of the embodiments of the invention, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings.
Fig. 1 is a first schematic view of a heat dissipation device according to an embodiment of the present invention, as shown in fig. 1, the heat dissipation device includes: a heat pipe 11, a heating element 12; wherein the heating elements 12 are distributed on the PCB 13, and form a first distribution structure on the PCB 13;
the heat pipe 11 has an anisotropic structure by which the heat pipe 11 can be distributed at a clearance area around the heat generating element 12 to dissipate heat of the heat generating element 12.
In the embodiment of the present invention, the heat dissipation device has a fanless structure, that is, the PCB is not provided with a fan, but dissipates heat of the heating element through other heat conducting devices, where the heat conducting devices include but are not limited to: hot plates, copper blocks (cubock), etc., however, such thermal devices are generally regular in shape and have limited placement locations, generally only on top of the heating element. For this reason, the embodiment of the present invention designs a heat pipe with an anisotropic structure, where the anisotropic structure refers to: the shape of the heat pipes can be adapted according to the first distribution structure of the heat generating elements on the PCB.
Of course, the heat dissipation device may also have a fan (fan) structure, that is, the fan is disposed on the PCB, and the heat dissipation device and the heat pipe of the embodiment of the invention together dissipate heat of the heating element, so as to further improve the heat dissipation performance.
Specifically, the heating element is an independent component on the PCB, and the heating elements are not arranged on the PCB in close proximity, with clearance between the heating elements. In order to effectively utilize the clearance area to improve the heat dissipation performance, the heat pipe is embedded at the clearance area outside the heating element to efficiently dissipate the heat of the heating element. Compared with the prior art, the heat dissipation area is larger, and the heat pipes are distributed on the periphery of each heating element, so that the heat dissipation efficiency is higher.
In the embodiment of the present invention, the heat pipe 11 is manufactured by the following steps:
manufacturing a variable cross-section copper pipe, wherein the variable cross-section copper pipe means that the cross section of the copper pipe is inconsistent with the length of the copper pipe;
carrying out sectional powder filling and sintering on the variable-section copper pipe to form a capillary structure on the inner surface of the variable-section copper pipe;
and carrying out sectional flat beating on the variable-section copper pipe with the capillary structure to form the heat pipe 11.
Fig. 2 is a second schematic view of a heat dissipation device according to an embodiment of the present invention, as shown in fig. 2, the heat dissipation device includes: a heat pipe 11, a heating element 12; wherein the heating elements 12 are distributed on the PCB 13, and form a first distribution structure on the PCB 13;
the heat pipe 11 has an anisotropic structure by which the heat pipe 11 can be distributed at a clearance area around the heat generating element 12 to dissipate heat of the heat generating element 12.
In the embodiment of the present invention, the heat dissipation device further includes a fan 14, the fan 14 is disposed on the PCB 13, and the heat pipe 11 is disposed around the fan 14 as a frame of the fan 14.
Here, the heat pipe is combined with the fan to increase a heat dissipation rate, and particularly, the heat pipe rapidly dissipates heat brought out by the fan instead of a chassis (housing) bottom plate of the fan.
The heat pipe 11 extends out of a connection end as a frame of the fan 14, and the heat pipe 11 is connected to the heat conduction component 15 through the connection end.
Here, the heat conduction member may be a hot plate, but may be a heat pipe. The heat conduction component is connected with the heating element or is positioned at the periphery of the heating element and used for guiding heat emitted by the heating element to the heat pipe and the fan.
In the embodiment of the present invention, the heat pipe 11 is manufactured by the following steps:
manufacturing a variable cross-section copper pipe, wherein the variable cross-section copper pipe means that the cross section of the copper pipe is inconsistent with the length of the copper pipe;
carrying out sectional powder filling and sintering on the variable-section copper pipe to form a capillary structure on the inner surface of the variable-section copper pipe;
and carrying out sectional flat beating on the variable-section copper pipe with the capillary structure to form the heat pipe 11.
Fig. 3 is a third schematic view of a heat dissipation device according to an embodiment of the present invention, as shown in fig. 3, the heat dissipation device includes: a heat pipe 11, a heating element 12; wherein the heating elements 12 are distributed on the PCB 13, and form a first distribution structure on the PCB 13;
the heat pipe 11 has an anisotropic structure by which the heat pipe 11 can be distributed at a clearance area around the heat generating element 12 to dissipate heat of the heat generating element 12.
In the embodiment of the present invention, the heat dissipation apparatus further includes a fan 14, the fan 14 is disposed on the PCB 13, a fin 16 is disposed at one end of the fan 14, and the heat pipe 11 is connected to the fin 16.
Here, the heat pipe is combined with the fin of the fan to increase a heat dissipation rate, and particularly, the heat pipe is connected with the fin of the fan to guide heat brought from the heat generating element to the fin of the fan, and rapid heat dissipation is performed by the fan.
In the embodiment of the present invention, the heat pipe 11 is manufactured by the following steps:
manufacturing a variable cross-section copper pipe, wherein the variable cross-section copper pipe means that the cross section of the copper pipe is inconsistent with the length of the copper pipe;
carrying out sectional powder filling and sintering on the variable-section copper pipe to form a capillary structure on the inner surface of the variable-section copper pipe;
and carrying out sectional flat beating on the variable-section copper pipe with the capillary structure to form the heat pipe 11.
Fig. 4 is a flowchart of a method for manufacturing a heat dissipation device according to an embodiment of the present invention, and as shown in fig. 4, the method includes the following steps:
step 401: a first distribution structure of the heat generating elements formed on the PCB is determined.
In the embodiment of the present invention, the heating element may be, but is not limited to, the following elements: the processor, the display card, the power supply chip, and the memory are all integrated chips, and of course, the heating element may also be a non-integrated device, such as: resistance, inductance, capacitance, etc. Different electronic devices have different heat generating elements depending on the functions implemented by the electronic device.
In the embodiment of the invention, the layout of the heating elements on the PCB is the first distribution structure.
Step 402: and determining the anisotropic structure of the heat pipe according to the first distribution structure.
In the embodiment of the invention, the anisotropic structure of the heat pipe refers to that: the shape of the heat pipes can be adapted according to the first distribution structure of the heat generating elements on the PCB. Specifically, the heating element is an independent component on the PCB, and the heating elements are not arranged on the PCB in close proximity, with clearance between the heating elements. In order to effectively utilize the clearance area to improve the heat dissipation performance, the heat pipe is embedded at the clearance area outside the heating element to efficiently dissipate the heat of the heating element. Compared with the prior art, the heat dissipation area is larger, and the heat pipes are distributed on the periphery of each heating element, so that the heat dissipation efficiency is higher.
Step 403: and arranging the heat pipe with the opposite structure at a clearance area at the periphery of the heating element so as to dissipate heat of the heating element.
In one embodiment, a fan is disposed on the PCB, and a frame of the fan is disposed through the heat pipe. The heat pipe is used as a frame of the fan and extends out of a connecting end, and the heat pipe is connected to the heat conduction component through the connecting end.
In another embodiment, a fan is provided on the PCB, and a fin sheet is provided at one end of the fan to connect the heat pipe with the fin sheet.
In the embodiment of the invention, the heat pipe is manufactured by the following method:
as shown in fig. 5: manufacturing a variable cross-section copper pipe, wherein the variable cross-section copper pipe means that the cross section of the copper pipe is inconsistent with the length of the copper pipe;
as shown in fig. 6: carrying out sectional powder filling and sintering on the variable-section copper pipe to form a capillary structure on the inner surface of the variable-section copper pipe;
as shown in fig. 7: and carrying out sectional flat beating on the variable-section copper pipe with the capillary structure to form the heat pipe. Fig. 8 is a schematic cross-sectional view of a copper tube, the left side being a cross-section of the copper tube before being flattened, and the right side being a cross-section of the copper tube after being flattened.
The technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention.

Claims (8)

1. A heat dissipating device, comprising: heat pipes, heat generating elements; the heating elements are distributed on a Printed Circuit Board (PCB), and a first distribution structure is formed on the PCB;
the heat pipe is provided with an opposite structure, and the heat pipe can be embedded in a clearance area at the periphery of the heating element through the opposite structure so as to dissipate heat of the heating element; the heat pipe has a heterogeneous structure, and the shape of the heat pipe can be adaptively set according to the first distribution structure of the heating element on the PCB; the heating element is an independent component on the PCB, the heating elements are not arranged closely, and clearance areas are arranged among the heating elements; the heat pipes are distributed at the periphery of each heating element;
the heat pipe is manufactured in the following way:
manufacturing a variable cross-section copper pipe, wherein the variable cross-section copper pipe means that the cross section of the copper pipe is inconsistent with the length of the copper pipe;
carrying out sectional powder filling and sintering on the variable-section copper pipe to form a capillary structure on the inner surface of the variable-section copper pipe;
and carrying out sectional flat beating on the variable-section copper pipe with the capillary structure to form the heat pipe.
2. The heat dissipating device of claim 1, further comprising a fan disposed on the PCB, wherein the heat pipe is disposed around a periphery of the fan as a frame of the fan.
3. The heat dissipating device of claim 2, wherein the heat pipe extends out of a connection end as a frame of the fan, and the heat pipe is connected to the heat conducting member through the connection end.
4. The heat dissipating device of claim 1, further comprising a fan disposed on the PCB, wherein one end of the fan is provided with a heat dissipating fin, and wherein the heat pipe is connected to the fin.
5. A method of making a heat dissipation device, the method comprising:
determining a first distribution structure of the heating elements on the PCB;
determining the different structure of the heat pipe according to the first distribution structure;
embedding the heat pipe with the different structure at a clearance area at the periphery of the heating element so as to dissipate heat of the heating element; the anisotropic structure of the heat pipe represents that the shape of the heat pipe can be adaptively set according to the first distribution structure of the heating element on the PCB; the heating element is an independent component on the PCB, the heating elements are not arranged closely, and clearance areas are arranged among the heating elements; the heat pipes are distributed at the periphery of each heating element;
the heat pipe is made by:
manufacturing a variable cross-section copper pipe, wherein the variable cross-section copper pipe means that the cross section of the copper pipe is inconsistent with the length of the copper pipe;
carrying out sectional powder filling and sintering on the variable-section copper pipe to form a capillary structure on the inner surface of the variable-section copper pipe;
and carrying out sectional flat beating on the variable-section copper pipe with the capillary structure to form the heat pipe.
6. The method of manufacturing a heat sink device according to claim 5, further comprising:
and arranging a fan on the PCB, and arranging a frame of the fan through the heat pipe.
7. The method of making a heat dissipating device of claim 6, further comprising:
the heat pipe is used as a frame of the fan and extends out of a connecting end, and the heat pipe is connected to the heat conduction component through the connecting end.
8. The method of manufacturing a heat sink device according to claim 5, further comprising:
and a fan is arranged on the PCB, a fin sheet is arranged at one end of the fan, and the heat pipe is connected with the fin sheet.
CN201710142378.9A 2017-03-10 2017-03-10 Heat dissipation device and manufacturing method thereof Active CN106847768B (en)

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CN106847768B true CN106847768B (en) 2020-08-25

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Publication number Priority date Publication date Assignee Title
CN109246922A (en) * 2018-09-08 2019-01-18 宁波市广侨电子科技有限公司 A kind of wiring board that thermal diffusivity is strong

Citations (4)

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Publication number Priority date Publication date Assignee Title
CN103249276A (en) * 2012-02-07 2013-08-14 联想(北京)有限公司 Heat dissipation device, heat dissipation component and electronic equipment
CN103868384A (en) * 2012-12-14 2014-06-18 富瑞精密组件（昆山）有限公司 Flat heat pipe and manufacturing method thereof
CN204948613U (en) * 2015-09-23 2016-01-06 超众科技股份有限公司 Lateral rings around heat pipe and radiator structure
US20160147269A1 (en) * 2012-06-08 2016-05-26 Apple Inc. Gaskets for thermal ducting around heat pipes

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101941024B1 (en) * 2014-03-27 2019-01-22 삼성전자주식회사 Shield can assembly and electronic device having it

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103249276A (en) * 2012-02-07 2013-08-14 联想(北京)有限公司 Heat dissipation device, heat dissipation component and electronic equipment
US20160147269A1 (en) * 2012-06-08 2016-05-26 Apple Inc. Gaskets for thermal ducting around heat pipes
CN103868384A (en) * 2012-12-14 2014-06-18 富瑞精密组件（昆山）有限公司 Flat heat pipe and manufacturing method thereof
CN204948613U (en) * 2015-09-23 2016-01-06 超众科技股份有限公司 Lateral rings around heat pipe and radiator structure

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