US20140116670A1

US20140116670A1 - Heat sink and cooling system including the same

Info

Publication number: US20140116670A1
Application number: US13/735,573
Authority: US
Inventors: Young Hoon Kwak; Eun Jung Jo; Kwang Soo Kim
Original assignee: Samsung Electro Mechanics Co Ltd
Current assignee: Samsung Electro Mechanics Co Ltd
Priority date: 2012-10-29
Filing date: 2013-01-07
Publication date: 2014-05-01
Also published as: KR101474610B1; KR20140054734A

Abstract

Disclosed herein is a heat sink including: a heat radiation pattern member having at least one bend cross section; and a heat radiation plate having the heat radiation pattern member disposed on an upper surface thereof, wherein the heat radiation pattern member includes wire patterns having a plurality of bends or a mesh bend pattern having a form of a plurality of bent cross sections.

Description

CROSS REFERENCE TO RELATED APPLICATION

This application claims the benefit of Korean Patent Application No. 10-2012-0120585, filed on Oct. 29, 2012, entitled “Heat Sink and Cooling System With the Same”, which is hereby incorporated by reference in its entirety into this application.

BACKGROUND OF THE INVENTION

1. Technical Field
The present invention relates to a heat sink and a cooling system including the same.
2. Description of the Related Art
In accordance with miniaturization of an optical communication component, an electrical component, and an electronic component, which are semiconductor devices, it is absolutely necessary to perform cooling and make a temperature constant in order to solve problems due to the miniaturization, such as noise, a decrease in a lifespan, unstable output characteristics due to heat. For example, a personal computer (PC) has been developed with a high degree of integration in accordance with improvement in performance and a speed thereof However, a technology for efficiently dissipating and cooling heat increased due to high integration has not been yet developed.
Meanwhile, the trend toward miniaturization of an electronic apparatus in accordance with high integration of an electronic chip has required a solution of a complicated thermal problem in an electronic component or system. A problem of removing heat generated in accordance with the high integration of the electronic chip has become gradually important. However, this problem is various and complicated according to a size, a shape, a heat generation amount, an internal thermal resistance of the electronic chip.
As a result, a lifespan or reliability of the electronic chip mainly depends on an operation temperature of the electronic chip. Particularly, it has been known that whenever the operation temperature of the electronic chip is raised from a design temperature thereof by 10, the lifespan of the electronic chip is decreased by 50% or more.
Therefore, it is no exaggeration to say that a lifespan and a development speed of an electronic apparatus depend on development of several cooling technologies capable of removing a high heat flux while maintaining a temperature of the electronic chip to be low.
Generally, as a heat sink, as disclosed in the following Patent Document, a rectangular straight fin (RSF) type heat sink in which each of the heat radiation fins in a vertical direction has a plate shape has been basically used, a splitted rectangular straight fin (SRSF) type heat sink, a pin fin (PF) type heat sink, and the like, have also been widely used, and a porous type heat sink having a structure for increasing a heat discharging amount in a unit area has been introduced.
The heat sink according to the prior art as described above has used a scheme in which heat is transferred from a heat source to a heat radiation plate disposed at a bottom surface of the heat sink and is transferred from the bottom surface of the heat sink to heat radiation fins, and the heat radiation fins contact air, such that cooling is made.
Most of the heat sinks according to the prior art have an extrusion type, but have a limitation in use due to a problem of a discharged heat amount. In addition, there is no special alternative other than a method of increasing a size of the heat sink.
That is, a temperature difference between distal ends of a heat radiation plate in a horizontal direction and a heat radiation fin in a vertical direction that configure the heat sink according to the prior art is large, such that a heat transfer amount cannot but be relatively decreased, and there is a limitation in a heat discharging amount due to a thermal boundary layer phenomenon appearing on the heat radiation plate and the heat radiation fin.
[Prior Art Document]
[Patent Document]
(Patent Document 1) Korean Patent Laid-Open Publication No. 2002-0048844 (laid-open published on Jun. 24, 2002)

SUMMARY OF THE INVENTION

The present invention has been made in an effort to provide a heat sink having a heat radiation pattern, capable of improving heat radiation efficiency by suppressing a thermal boundary layer phenomenon.
Further, the present invention has been made in an effort to provide a cooling system including a heat sink having a heat radiation pattern, capable of improving heat radiation efficiency by suppressing a thermal boundary layer phenomenon.
According to a preferred embodiment of the present invention, there is provided a heat sink including: a heat radiation pattern member having at least one bend cross section; and a heat radiation plate having the heat radiation pattern member disposed on an upper surface thereof.
The heat radiation pattern member may include wire patterns having a plurality of bends or a mesh bend pattern having a form of a plurality of bent cross sections.
The wire patterns may have a polygonal cross section and be bonded in plural to the upper surface of the heat radiation plate.
The mesh bend pattern may have a wedge shaped cross section or an M shaped cross section and be bonded to the upper surface of the heat radiation plate.
The heat radiation plate may be mounted at one side of a heat radiation target through a thermal conductive paste provided on a lower surface thereof.
The heat radiation pattern member may be bonded to the upper surface of the heat radiation plate by any one bonding method of a diffusion bonding method, a welding method, and a soldering method.
According to another preferred embodiment of the present invention, there is provided a cooling system including: a heat sink including a heat radiation pattern member having at least one bend cross section and a heat radiation plate having the heat radiation pattern member disposed on an upper surface thereof and mounted on a heat radiation target; an injecting part coupled to and sealed by the heat sink and having cooling air or cooling water passing therethrough and flowing therein; and a controlling unit connected to the heat sink and controlling cooling using the heat sink and the injecting unit.
The heat radiation pattern member may include wire patterns having a plurality of bends or a mesh bend pattern having a form of a plurality of bent cross sections.
The wire patterns may have a polygonal cross section and be bonded in plural to the upper surface of the heat radiation plate.
The mesh bend pattern may have a wedge shaped cross section or an M shaped cross section and be bonded to the upper surface of the heat radiation plate. The injecting part may receive the cooling air or the cooling water supplied from a pump connected to the controlling unit.
The cooling system may further include a temperature sensing sensor provided at one side of the heat sink, wherein the controlling unit controls a flow amount or flow velocity of the cooling air or the cooling water supplied by the pump using temperature information detected by the temperature sensing sensor.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a perspective view of a heat sink according to a first preferred embodiment of the present invention;

FIG. 2A is a perspective view of a heat sink according to a second preferred embodiment of the present invention;

FIG. 2B is a perspective view of a heat sink according to a third preferred embodiment of the present invention;

FIG. 2C is a perspective view of a heat sink according to a fourth preferred embodiment of the present invention;

FIG. 3 is an illustrative diagram for describing a principle of suppressing a thermal boundary layer phenomenon by the heat sink according to the preferred embodiment of the present invention;

FIG. 4A is a perspective view showing an example in which the heat sink according to the first preferred embodiment of the present invention is a power semiconductor module;

FIG. 4B is a perspective view showing an example in which the heat sink according to the second preferred embodiment of the present invention is a power semiconductor module; and

FIG. 5 is a configuration diagram for describing a cooling system including the heat sink according to the preferred embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The objects, features and advantages of the present invention will be more clearly understood from the following detailed description of the preferred embodiments taken in conjunction with the accompanying drawings. Throughout the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant descriptions thereof are omitted. Further, in the following description, the terms “first”, “second”, “one side”, “the other side” and the like are used to differentiate a certain component from other components, but the configuration of such components should not be construed to be limited by the terms. Further, in the description of the present invention, when it is determined that the detailed description of the related art would obscure the gist of the present invention, the description thereof will be omitted.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.
FIG. 1 is a perspective view of a heat sink according to a first preferred embodiment of the present invention; FIG. 2A is a perspective view of a heat sink according to a second preferred embodiment of the present invention; FIG. 2B is a perspective view of a heat sink according to a third preferred embodiment of the present invention; FIG. 2C is a perspective view of a heat sink according to a fourth preferred embodiment of the present invention; and FIG. 3 is an illustrative diagram for describing a principle of suppressing a thermal boundary layer phenomenon by the heat sink according to the preferred embodiment of the present invention.
First, the heat sink 100 according to the first preferred embodiment of the present invention is configured to include wire patterns 110 having a plurality of bends and a heat radiation plate 101 having a plurality of wire patterns 110 disposed on an upper surface thereof and spaced apart from each other.
The wire pattern 110 is a heat radiation pattern member formed by forming the plurality of bends in an arch pattern at a metal wire so as to have intervals therebeween. The plurality of wire patterns 110 may be bonded to the upper surface of the heat radiation plate 101 by a bonding method such as a diffusion bonding method, a welding method, a solder method, or the like.
The wire patterns 110 as described above may be formed in a form of various patterns having a polygonal cross section other than the arch pattern shown in FIG. 1 and be bonded to the upper surface of the heat radiation plate 101 in the state in which they are spaced apart from each other at a regular interval or at an irregular interval in one direction.
The heat radiation plate 101, which is a metal plate having high thermal conductivity, may include the plurality of wire patterns 110 disposed on the upper surface thereof, have a thermal conductive paste applied to a lower surface thereof, and be mounted on one side of a heat radiation target such as a power semiconductor module, or the like.
In the heat sink 100 including the wire pattern 110 according to the first preferred embodiment of the present invention as described above, a contact area with air or cooling water is increased by the wire pattern 110, and a thermal boundary layer phenomenon to be described below is decreased by the bend pattern such as the arch pattern, thereby making it possible to improve heat radiation efficiency.
Apart from the heat sink 100 including the wire pattern 110 according to the first preferred embodiment of the present invention, heat sinks including variously deformed mesh type heat radiation patterns as shown in FIGS. 2A to 2C may be formed.
The heat sink 200 according to the second preferred embodiment of the present invention shown in FIG. 2A is configured to include a first mesh bend pattern 210′ made of a metal material and having a form of a plurality of bent cross sections and a heat radiation plate 101 having the first mesh bend patterns 210′ disposed on an upper surface thereof.
Here, the first mesh bend pattern 210′ may be bonded to the upper surface of the heat radiation plate 201 through a solder 220 or be bonded to the upper surface of the heat radiation plate 201 by a bonding method such as a diffusion bonding method, a welding method, or the like.
Here, a process of bonding the first mesh bend pattern 210′ to the upper surface of the heat radiation plate 201 and a process of forming the bent cross-sections of the first mesh bent pattern 210′ may be simultaneously performed.
That is, a planar mesh 210 is pressed using a jig or a press to thereby be bent as bent cross-sections. At the same time, the first mesh bend pattern 210′ having the bent cross sections may be bonded to the upper surface of the heat radiation plate 201 through the solder 220.
Alternatively, after the first mesh bend pattern 210′ is prepared in advance, the first mesh bend pattern 210′ may also be bonded to the upper surface of the heat radiation plate 201 by a bonding method such as a diffusion bonding method, a welding method, or the like, using a bonding apparatus.
Although the first mesh bend pattern 210′ as described above is formed to have a wedge shaped cross section as shown in FIG. 2A, the present invention is not limited thereto. That is, according to the third preferred embodiment of the present invention, at least one bend may be formed at an upper end of the wedge shaped cross section to form a second mesh bend pattern 210′-1 having an “M” shaped cross section.
The second mesh bend pattern 210′-1 forms a cross section more bent as compared with the first mesh bend pattern 210′ to disturb a flow of air or a fluid of cooling water, such that heat exchange is more actively performed, thereby making it possible to improve heat efficiency.
In addition, as a form for further disturbing a flow of air or a fluid of cooling water to improve heat efficiency, as shown in FIG. 2C, a combination of a first mesh bend pattern 210′ and a second mesh bend pattern 210′-1 according to the fourth preferred embodiment of the present invention may be provided on the upper surface of the heat radiation plate 201.
Here, the first mesh bend pattern 210′ and the second mesh bend pattern 210′-1 may be provided on the upper surface of the heat radiation plate 201 in the state in which they are alternately disposed to be misaligned to each other.
Therefore, the flow of the air or the fluid of the cooling water is further disturbed while passing through the heat sink including the first mesh bend pattern 210′ and the second mesh bend part 201′-1, such that the heat exchange may be more actively performed.
Therefore, the heat sink according to the preferred embodiment of the present invention has the bend patterns such as the wire pattern 110, the first mesh bend pattern 210′, and the second mesh bend pattern 210′-1 to decrease the thermal boundary layer phenomenon, thereby making it possible to improve the heat radiation efficiency.
More specifically, the thermal boundary layer indicates a layer generated as a low temperature fluid passes through a high temperature flat plate 10, for example, as represented by “A” in FIG. 3. At a portion at which the fluid meets the high temperature flat plate 10, a temperature change ratio of the fluid is high; however, as the fluid passes through the flat plate 10 while becoming distant from the flat plate 10, a temperature change ratio of the fluid is gradually decreased, such that a boundary of a region is formed.
As a region of the thermal boundary layer A becomes thick in a length direction of the flat plate 10, heat transfer to the fluid is not performed, such that heat radiation efficiency cannot but be deteriorated.
Therefore, the heat sink according to the preferred embodiment of the present invention uses the heat radiation member having the bend patterns such as the wire pattern 110, the first mesh bend pattern 210′, and the second mesh bend pattern 210′-1, thereby making it possible to suppress and disturb generation of the thermal boundary layer.
Therefore, the heat sink according to the preferred embodiment of the present invention suppresses and disturbs the generation of the thermal boundary layer A, thereby making it possible to maximize transfer of the heat to the air or the fluid of the cooling water and improve the heat radiation efficiency.
Hereinafter, a module and a cooling system to which the heat sink according to the preferred embodiment of the present invention is applied will be described with reference to FIGS. 4A to 5. FIG. 4A is a perspective view showing an example in which the heat sink according to the first preferred embodiment of the present invention is a power semiconductor module; FIG. 4B is a perspective view showing an example in which the heat sink according to the second preferred embodiment of the present invention is a power semiconductor module; and FIG. 5 is a configuration diagram for describing a cooling system including the heat sink according to the preferred embodiment of the present invention.
An example shown in FIGS. 4A and 4B is an example in which the heat sink according to the preferred embodiment of the present invention is applied to a power semiconductor module in an air cooling scheme, wherein FIG. 4A shows a form in which the heat sink according to the first preferred embodiment of the present invention is bonded to an upper surface of a power semiconductor device 50, and FIG. 4B shows a form in which the heat sink according to the second preferred embodiment of the present invention is bonded to the upper surface of the power semiconductor device 50.
In addition, the heat sink according to the third preferred embodiment of the present invention shown in FIG. 2B or the heat sink according to the fourth preferred embodiment of the present invention shown in FIG. 2C may also be bonded to the upper surface of the power semiconductor device 50 to radiate heat of the power semiconductor device 50 in an air cooling scheme.
Hereinafter, in addition to the example in which the heat sink according to the preferred embodiment of the present invention is applied to the power semiconductor module in the air cooling scheme, a cooling system in which the heat sink according to the preferred embodiment of the present invention is applied to the power semiconductor module in a water cooling scheme will be described with reference to FIG. 5.
The cooling system including the heat sink according to the preferred embodiment of the present invention shown in FIG. 5 is configured to include the heat sink 100 or 200, an injecting part 300 engaged with the heat sink 100 or 200 to thereby be sealed by and coupled to the heat sink 100 or 200 and having air or cooling water flowing therein, and a controlling unit 400 generally controlling a cooling process using the heat sink 100 or 200.
The heat sink 100 or 200 may be mounted at one side of a heat radiation target such as the power semiconductor module, or the like, through a thermal conductive paste, and cooling air or cooling water may absorb heat of the heat radiation target while passing through the heat radiation member having the bend pattern such as the wire pattern 110, the first mesh bend pattern 210′ or the second mesh bend pattern 210′-1.
In addition, the heat sink 100 or 200 may include a temperature sensing sensor (not shown) dispose at one side thereof and transfer temperature information detected by the temperature sensing sensor to the controlling unit 400.
The controlling unit 400, which is connected to the temperature sensing sensor of the heat sink 100 or 200, an air pump 310, and the like, to generally control a cooling process using the heat sink 100 or 200, may receive the temperature information transferred from the temperature sensing sensor and control a flow amount, flow velocity, or the like, of the cooling air or the cooling water injected into the injecting part 300 through the air pump 310.
The cooling system including the heat sink according to the preferred embodiment of the present invention configured as described above may efficiently cool the heat radiation target such as the power semiconductor module, or the like, by the cooling air or the cooling water flowing while passing through the injecting part 300.
The heat sink according to the preferred embodiment of the present invention suppresses and disturbs the generation of the thermal boundary layer to maximize the transfer of the heat to the air of the fluid of the cooling water, thereby making it possible to improve the heat radiation efficiency.
Although the embodiments of the present invention have been disclosed for illustrative purposes, it will be appreciated that the present invention is not limited thereto, and those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention.
Accordingly, any and all modifications, variations or equivalent arrangements should be considered to be within the scope of the invention, and the detailed scope of the invention will be disclosed by the accompanying claims.

Claims

What is claimed is:

1. A heat sink comprising:

a heat radiation pattern member having at least one bend cross section; and

a heat radiation plate having the heat radiation pattern member disposed on an upper surface thereof.

2. The heat sink as set forth in claim 1, wherein the heat radiation pattern member includes wire patterns having a plurality of bends or a mesh bend pattern having a form of a plurality of bent cross sections.

3. The heat sink as set forth in claim 2, wherein the wire patterns have a polygonal cross section and are bonded in plural to the upper surface of the heat radiation plate.

4. The heat sink as set forth in claim 2, wherein the mesh bend pattern has a wedge shaped cross section or an M shaped cross section and is bonded to the upper surface of the heat radiation plate.

5. The heat sink as set forth in claim 1, wherein the heat radiation plate is mounted at one side of a heat radiation target through a thermal conductive paste provided on a lower surface thereof.

6. The heat sink as set forth in claim 1, wherein the heat radiation pattern member is bonded to the upper surface of the heat radiation plate by any one bonding method of a diffusion bonding method, a welding method, and a soldering method.

7. A cooling system comprising:

a heat sink including a heat radiation pattern member having at least one bend cross section and a heat radiation plate having the heat radiation pattern member disposed on an upper surface thereof and mounted on a heat radiation target;

an injecting part coupled to and sealed by the heat sink and having cooling air or cooling water passing therethrough and flowing therein; and

a controlling unit connected to the heat sink and controlling cooling using the heat sink and the injecting unit.

8. The cooling system as set forth in claim 7, wherein the heat radiation pattern member includes wire patterns having a plurality of bends or a mesh bend pattern having a form of a plurality of bent cross sections.

9. The cooling system as set forth in claim 8, wherein the wire patterns have a polygonal cross section and are bonded in plural to the upper surface of the heat radiation plate.

10. The cooling system as set forth in claim 8, wherein the mesh bend pattern has a wedge shaped cross section or an M shaped cross section and is bonded to the upper surface of the heat radiation plate.

11. The cooling system as set forth in claim 7, wherein the injecting part receives the cooling air or the cooling water supplied from a pump connected to the controlling unit.

12. The cooling system as set forth in claim 11, further comprising a temperature sensing sensor provided at one side of the heat sink,

wherein the controlling unit controls a flow amount or flow velocity of the cooling air or the cooling water supplied by the pump using temperature information detected by the temperature sensing sensor.