CN207623920U - High efficiency and heat radiation totally enclosed type chassis component - Google Patents

Abstract

The utility model discloses a high-efficiency heat dissipation fully-enclosed chassis assembly, which comprises a chassis shell and a PCB board. Several slots are arranged in the chassis shell, and the PCB board is suspended and fixed inside the chassis shell through the slots. The PCB board is installed There is a heating device, and a heat-conducting silicone grease sheet is arranged on the outer surface of the heating device, including a composite radiator. The composite radiator includes a heat-dissipating part and a heat-conducting part, and the heat-conducting part is attached to the heating device. The heat pipe is connected to the chassis shell; the heat generated by the chip is transmitted to the heat conduction part through the heat conduction silicone grease sheet. The surface area for heat dissipation, and the heat dissipation speed is faster.

Description

Efficient heat dissipation fully enclosed chassis components

technical field

The utility model relates to the heat dissipation technology of electronic products, in particular to a high-efficiency heat dissipation fully enclosed chassis assembly.

Background technique

Existing high-power electronic equipment, such as a chassis, usually includes a main circuit board (PCB board), a main chip, a power supply, and a heat dissipation structure. Due to the fully enclosed structure, it is not convenient to exhaust, so it is not convenient to install a fan for heat dissipation, so the heat dissipation effect of the whole device is poor.

Utility model content

The technical problem to be solved by the utility model is to solve the technical problem that the heat dissipation effect of the existing closed cabinet is poor.

In order to solve the above-mentioned technical problems, the technical solution adopted by the utility model is: a fully enclosed chassis assembly with high efficiency heat dissipation, including a chassis shell and a PCB board. Several slots are arranged in the chassis shell, and the PCB board is suspended and fixed through the slots. Inside the chassis shell, a heating device is installed on the PCB board, and a heat-conducting silicone grease sheet is arranged on the outer surface of the heating device, including a composite radiator. The composite radiator includes a heat dissipation part and a heat-conducting part. It is provided that the heat conduction part is also connected with a heat conduction pipe, and the heat conduction pipe is connected with the casing of the chassis.

Further, the composite radiator includes a bottom plate, the heat dissipation part is a plurality of heat dissipation fins, the heat conduction part includes a sealed shell, the sealed shell is arranged on the bottom plate and the bottom plate to form a sealed cavity, and the sealed cavity is filled with heat-conducting medium, A cavity is also provided in the heat pipe, and the cavity is filled with a heat conducting medium.

Further, the cavity in the heat pipe communicates with the sealed cavity in the sealed casing.

Further, a plurality of partitions arranged in parallel are arranged in the sealed housing to form a plurality of flow passages in the sealed cavity.

Further, the heat pipe includes a horizontal part and a vertical part, the vertical part is connected to the heat conducting part of the composite heat sink, and the horizontal part is attached to the surface of the chassis shell.

Further, the heat dissipation fins are arranged on both sides of the heat conduction part.

Further, the heat conducting medium is a phase change inhibiting material. It can be seen from the above technical solution that the utility model has the following advantages: the utility model has a simple structure, and the heat generated by the chip is transmitted to the heat conduction part through the heat conduction silicone grease sheet, and the heat conduction part dissipates part of the heat into the air, and at the same time passes a large amount of heat through the heat conduction part. The heat pipe is transmitted to the chassis shell, and dissipates heat through the larger surface area of the chassis shell, and the heat dissipation speed is faster.

Description of drawings

Fig. 1 is the structural representation of the utility model.

Fig. 2 is the structural representation of composite heater in the utility model;

Fig. 3 is the partial structure schematic diagram of composite heater in the utility model;

Detailed ways

The specific embodiment of the utility model is described in detail below in conjunction with accompanying drawing.

As shown in Figure 1, Figure 2 and Figure 3, the high-efficiency heat dissipation fully enclosed chassis assembly of the present invention includes a chassis shell 1 and a PCB board 3, and the chassis shell can be made of a metal alloy machine material, which is heat-conducting and has Certain hardness, such as aluminum alloy material. A plurality of slots 2 are arranged in the chassis shell 1, and the PCB board 3 is suspended and fixed inside the chassis shell through the slots, and a heating device 4 is fixed on the PCB board 3, where the heating device mainly refers to a chip. Therefore, the utility model The focus is on evacuating the heat generated by the chip. Therefore, a thermally conductive silicone grease sheet 5 is provided on the outer surface of the chip 4 . The utility model also includes a composite heat sink. The composite heat sink includes a heat dissipation part and a heat conduction part. The heat conduction part is attached to the chip. The structure is: a bottom plate 9 is included, and the heat dissipation part is a plurality of heat dissipation fins 10, and the heat dissipation fins are arranged on both sides of the heat conduction part. The heat conduction part includes a sealed casing 6, the sealed casing 6 is arranged on the bottom plate to form a sealed cavity with the bottom plate, the sealed cavity is filled with a heat conduction medium, a cavity is also arranged in the heat conduction pipe and the cavity is filled with a heat conduction medium, the heat conduction The cavity in the tube 7 is communicated with the sealing cavity in the sealed housing, and a plurality of partitions 11 arranged in parallel are arranged in the sealed housing to form a plurality of flow passages in the sealed cavity.

The heat-generating components such as chips can be used to quickly transfer the heat generated by heat-generating devices such as chips to the heat-conducting pipe, and then the heat-conducting pipe will conduct the heat to the case shell, and then dissipate the heat quickly through the case case. The heat dissipation part increases the heat dissipation area inside the machine to diffuse heat to prevent heat from accumulating locally in the machine. The composite heat sink can be fixed between the spacer column 8 and the PCB board.

The heat conduction medium is a phase-change inhibiting material, which is a semi-liquid jelly. When the phase-change inhibiting material is heated, the boiling phenomenon is inhibited, thereby showing an efficient heat transfer phenomenon, that is, the temperature at a distance from the heat source is higher than that near the heat source. ; At the same time, heat is transmitted from the heated end to the remote end at an exceptionally high rate, keeping the heated end at a low temperature. The phase change inhibiting material has the characteristics of high heat transfer rate and high heat transfer density. The effective thermal conductivity is 6000W/mK; the measured heat transfer density is 100-1000W/cm ² ; Under the use, anti-gravity heat transfer and saddle heat transfer can be realized.

The heat pipe 7 includes a horizontal part and a vertical part, the vertical part is connected to the heat conducting part of the composite radiator, the horizontal part is attached to the surface of the chassis shell, and the upper surface of the horizontal part can be set as a horizontal plane, thereby facilitating the connection with the chassis shell body contact heat transfer.

Claims (7)

1. A high-efficiency heat-dissipating fully enclosed chassis assembly, including a chassis shell and a PCB board. There are several slots in the chassis shell. The PCB board is suspended and fixed inside the chassis shell through the slots, and a heating device is installed on the PCB board. , a heat-conducting silicone grease sheet is arranged on the outer surface of the heating device, and it is characterized in that: it includes a composite heat sink, the composite heat sink includes a heat-dissipating part and a heat-conducting part, the heat-conducting part is attached to the heating device, and the heat-conducting part is also connected to a heat-conducting tube , the heat pipe is connected to the chassis shell. 2. The high-efficiency heat dissipation fully enclosed chassis assembly according to claim 1, characterized in that: the composite radiator includes a bottom plate, the heat dissipation part is a plurality of heat dissipation fins, the heat conduction part includes a sealed shell, and the sealed shell It is arranged on the bottom plate and forms a sealed cavity with the bottom plate, and the sealed cavity is filled with a heat-conducting medium, and a cavity is also provided in the heat-conducting pipe, and the cavity is filled with a heat-conducting medium. 3. The high-efficiency heat dissipation fully enclosed chassis assembly according to claim 2, characterized in that: the cavity in the heat pipe communicates with the sealed cavity in the sealed casing. 4. The high-efficiency heat dissipation fully enclosed chassis assembly according to claim 2, wherein a plurality of partitions arranged in parallel are arranged in the sealed casing to form a plurality of flow channels in the sealed cavity. 5. The high-efficiency heat dissipation fully enclosed chassis assembly according to claim 4, characterized in that: the heat pipe includes a horizontal part and a vertical part, the vertical part is connected to the heat conducting part of the composite radiator, and the horizontal part is connected to the chassis shell Body surface fit. 6. The high-efficiency heat dissipation fully enclosed chassis assembly according to claim 2, wherein the heat dissipation fins are arranged on both sides of the heat conduction part. 7. The high-efficiency heat-dissipating fully enclosed chassis assembly according to any one of claims 2-6, wherein the heat-conducting medium is a phase-change inhibiting material.