CN207623920U - High efficiency and heat radiation totally enclosed type chassis component - Google Patents

High efficiency and heat radiation totally enclosed type chassis component Download PDF

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Publication number
CN207623920U
CN207623920U CN201820058957.5U CN201820058957U CN207623920U CN 207623920 U CN207623920 U CN 207623920U CN 201820058957 U CN201820058957 U CN 201820058957U CN 207623920 U CN207623920 U CN 207623920U
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China
Prior art keywords
heat
conducting
shell body
high efficiency
totally enclosed
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CN201820058957.5U
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Chinese (zh)
Inventor
丁雪峰
韦荣杰
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Wuxi Juri Equipment Technology Co., Ltd
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Wuxi Juri Electronic Technology Co Ltd
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Priority to CN201820058957.5U priority Critical patent/CN207623920U/en
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Abstract

The utility model discloses a kind of high efficiency and heat radiation totally enclosed type chassis components, including chassis shell body and pcb board, several slots are provided in chassis shell body, pcb board is suspended vacantly by slot inside chassis shell body, heating device is installed on pcb board, heating device outer surface is provided with heat-conducting silicone grease piece, including composite heating radiator, the composite heating radiator includes radiating part and heat-conducting part, heat-conducting part is bonded setting with heating device, heat-conducting part is also connected with a heat conducting pipe, and heat conducting pipe connects casing;The heat that chip generates is transmitted to heat-conducting part by heat-conducting silicone grease piece, and heat-conducting part rejects heat to partial heat in air, while also partly largely will be transmitted to chassis shell body by heat conducting pipe, is radiated by the larger surface area of chassis shell body, and radiating rate is very fast.

Description

High efficiency and heat radiation totally enclosed type chassis component
Technical field
The utility model is related to the heat dissipation technologys of electronic product, and in particular to a kind of high efficiency and heat radiation totally enclosed type cabinet group Part.
Background technology
Existing high-power electronic device, such as cabinet, generally include main circuit board (pcb board), master chip, power supply and The heat that heat radiation chip generates is dispersed into air, is distributed to casing by air by radiator structure, radiator structure It radiates, due to full-enclosed structure, it has not been convenient to be vented, therefore be inconvenient to fan is installed and radiate, therefore whole equipment Heat dissipation effect is poor.
Utility model content
The technical problems to be solved in the utility model is to solve the technical problem of existing closed case radiation effect difference.
In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model is:A kind of high efficiency and heat radiation totally enclosed type Chassis component, including chassis shell body and pcb board, several slots are provided in chassis shell body, and pcb board is vacantly solid by slot It is scheduled on inside chassis shell body, heating device is installed on pcb board, heating device outer surface is provided with heat-conducting silicone grease piece, including Composite heating radiator, the composite heating radiator include radiating part and heat-conducting part, and heat-conducting part is bonded setting, heat-conducting part with heating device It is also connected with a heat conducting pipe, heat conducting pipe connects casing.
Further, the composite heating radiator includes a bottom plate, and radiating part is several radiating fins, and heat-conducting part includes One seal casinghousing, seal casinghousing is arranged on bottom plate forms a seal chamber with bottom plate, fills heat-conducting medium in seal chamber, leads It is also provided with cavity in heat pipe and fills heat-conducting medium in the cavity.
Further, the cavity in the heat conducting pipe is connected to setting with the seal chamber in seal casinghousing.
Further, it is provided with multiple partition boards disposed in parallel in seal casinghousing and forms multiple runners in seal chamber.
Further, the heat conducting pipe includes horizontal part and vertical portion, and vertical portion is connected with the heat-conducting part of composite heating radiator, Horizontal part is bonded with chassis shell body surface.
Further, the radiating fin is arranged in the both sides of heat-conducting part.
Further, the heat-conducting medium is that phase transformation inhibits material.From above-mentioned technical proposal it can be seen that the utility model It has the following advantages:The utility model is simple in structure, and the heat that chip generates is transmitted to heat-conducting part, heat conduction by heat-conducting silicone grease piece Portion rejects heat to partial heat in air, while also partly largely will be transmitted to chassis shell body by heat conducting pipe, passes through chassis shell The larger surface area of body radiates, and radiating rate is very fast.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the structural schematic diagram of composite heater in the utility model;
Fig. 3 is the partial structural diagram of composite heater in the utility model;
Specific implementation mode
It elaborates to specific embodiment of the present utility model below in conjunction with attached drawing.
Shown in described in as shown in Figure 1, Figure 2 and Fig. 3, the high efficiency and heat radiation totally enclosed type chassis component of the utility model, including cabinet Metal alloy machine material may be used in shell 1 and pcb board 3, chassis shell body, i.e. heat conduction has certain hardness again, as aluminium closes Golden material.Several slots 2 are provided in chassis shell body 1, pcb board 3 is suspended vacantly by slot inside chassis shell body, PCB Heating device 4 is fixed on plate 3, heating device refers mainly to chip here, and therefore, the emphasis of the utility model is produced to chip Raw heat is evacuated.Therefore, 4 outer surface of chip is provided with heat-conducting silicone grease piece 5.The utility model further includes one compound Radiator, the composite heating radiator include radiating part and heat-conducting part, and heat-conducting part is bonded setting with chip, and heat-conducting part is also connected with one A heat conducting pipe 7, heat conducting pipe connect casing, and the concrete structure of composite heating radiator is:Including a bottom plate 9, if radiating part is Dry radiating fin 10, the radiating fin are arranged in the both sides of heat-conducting part.Heat-conducting part includes a seal casinghousing 6, capsul Body 6 is arranged on bottom plate forms a seal chamber with bottom plate, and heat-conducting medium is filled in seal chamber, be also provided in heat conducting pipe cavity and Heat-conducting medium is filled in the cavity, the cavity in the heat conducting pipe 7 is connected to setting, capsul with the seal chamber in seal casinghousing It is provided with multiple partition boards disposed in parallel 11 in vivo and forms multiple runners in seal chamber.
The heat that the heating devices such as chip generate can be rapidly transferred to heat conducting pipe using conducting-heat elements, heat conducting pipe again will Heat is conducted to chassis shell body, and heat is shed rapidly by chassis shell body.Heat dissipation area in radiating part increase machine, diffusion heat Amount, in case heat is collected at part in machine.Composite heating radiator can be fixed by being realized between spacer 8 and pcb board.
Heat-conducting medium is that phase transformation inhibits material, and it is semi-liquid gel shape that phase transformation, which inhibits material, and phase transformation inhibits material heated When, boiling phenomenon is suppressed, and to which efficient heat transfer phenomenon be presented, i.e. the temperature of heat source distant place is nearby higher than heat source instead;With This generates heat simultaneously and passes to distal end from heating end with extraordinary high-speed, and heating end is made to keep low-temperature condition.Phase transformation inhibits material With high heat transfer rate, the characteristics of high heat transfer density, efficient thermal conductivity 6000W/m.K;Heat transfer density is that actual measurement is 100- 1000W/cm2;Uniform temperature is good, can under -20 DEG C of environment using, anti-gravity heat transfer may be implemented and the shape of a saddle conducts heat.
The heat conducting pipe 7 includes horizontal part and vertical portion, and vertical portion is connected with the heat-conducting part of composite heating radiator, horizontal part and Chassis shell body surface is bonded, and the upper surface of horizontal part could be provided as horizontal plane, to convenient and chassis shell body transmission of heat by contact.

Claims (7)

1. a kind of high efficiency and heat radiation totally enclosed type chassis component, including chassis shell body and pcb board, it is provided in chassis shell body several A slot, pcb board are suspended vacantly by slot inside chassis shell body, and heating device is equipped on pcb board, outside heating device Surface is provided with heat-conducting silicone grease piece, it is characterised in that:Including composite heating radiator, the composite heating radiator includes radiating part and leads Hot portion, heat-conducting part are bonded setting with heating device, and heat-conducting part is also connected with a heat conducting pipe, and heat conducting pipe connects casing.
2. high efficiency and heat radiation totally enclosed type chassis component according to claim 1, it is characterised in that:The composite heating radiator packet A bottom plate is included, radiating part is several radiating fins, and heat-conducting part includes a seal casinghousing, and seal casinghousing is arranged on bottom plate A seal chamber is formed with bottom plate, heat-conducting medium is filled in seal chamber, cavity is also provided in heat conducting pipe and is filled in the cavity Heat-conducting medium.
3. high efficiency and heat radiation totally enclosed type chassis component according to claim 2, it is characterised in that:Sky in the heat conducting pipe Chamber is connected to setting with the seal chamber in seal casinghousing.
4. high efficiency and heat radiation totally enclosed type chassis component according to claim 2, it is characterised in that:It is provided in seal casinghousing Multiple partition boards disposed in parallel form multiple runners in seal chamber.
5. high efficiency and heat radiation totally enclosed type chassis component according to claim 4, it is characterised in that:The heat conducting pipe includes water Flat portion and vertical portion, vertical portion are connected with the heat-conducting part of composite heating radiator, and horizontal part is bonded with chassis shell body surface.
6. high efficiency and heat radiation totally enclosed type chassis component according to claim 2, it is characterised in that:The radiating fin setting In the both sides of heat-conducting part.
7. according to any high efficiency and heat radiation totally enclosed type chassis components of claim 2-6, it is characterised in that:The heat conduction is situated between Matter is that phase transformation inhibits material.
CN201820058957.5U 2018-01-12 2018-01-12 High efficiency and heat radiation totally enclosed type chassis component Active CN207623920U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820058957.5U CN207623920U (en) 2018-01-12 2018-01-12 High efficiency and heat radiation totally enclosed type chassis component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820058957.5U CN207623920U (en) 2018-01-12 2018-01-12 High efficiency and heat radiation totally enclosed type chassis component

Publications (1)

Publication Number Publication Date
CN207623920U true CN207623920U (en) 2018-07-17

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CN201820058957.5U Active CN207623920U (en) 2018-01-12 2018-01-12 High efficiency and heat radiation totally enclosed type chassis component

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108925123A (en) * 2018-09-14 2018-11-30 成都爱米瑞科技有限公司 A kind of totally-enclosed conduction air-cooled case of completely new heat-transfer path
WO2020103155A1 (en) * 2018-11-23 2020-05-28 北京比特大陆科技有限公司 Main machine
WO2020103157A1 (en) * 2018-11-23 2020-05-28 北京比特大陆科技有限公司 Host
CN111651956A (en) * 2020-05-25 2020-09-11 湖北三江航天万峰科技发展有限公司 Board card assembly based on medium phase change heat transfer and electronic equipment comprising board card assembly

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108925123A (en) * 2018-09-14 2018-11-30 成都爱米瑞科技有限公司 A kind of totally-enclosed conduction air-cooled case of completely new heat-transfer path
CN108925123B (en) * 2018-09-14 2024-02-13 成都爱米瑞科技有限公司 Totally-enclosed conduction air-cooled machine case with brand-new heat transfer path
WO2020103155A1 (en) * 2018-11-23 2020-05-28 北京比特大陆科技有限公司 Main machine
WO2020103157A1 (en) * 2018-11-23 2020-05-28 北京比特大陆科技有限公司 Host
CN111651956A (en) * 2020-05-25 2020-09-11 湖北三江航天万峰科技发展有限公司 Board card assembly based on medium phase change heat transfer and electronic equipment comprising board card assembly

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GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 214000 Third Floor, 33 Huaqing Creative Park, 33 Zhihui Road, Huishan Economic Development Zone, Wuxi City, Jiangsu Province

Patentee after: Wuxi Juri Equipment Technology Co., Ltd

Address before: 214000 33 Huaqing Creative Park, 33 wisdom road, Huishan District, Wuxi, Jiangsu

Patentee before: Wuxi Juri Electronic Technology Co. Ltd.