CN110099505A - Radiator structure, circuit board assemblies and its processing technology - Google Patents
Radiator structure, circuit board assemblies and its processing technology Download PDFInfo
- Publication number
- CN110099505A CN110099505A CN201910153511.XA CN201910153511A CN110099505A CN 110099505 A CN110099505 A CN 110099505A CN 201910153511 A CN201910153511 A CN 201910153511A CN 110099505 A CN110099505 A CN 110099505A
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- Prior art keywords
- circuit board
- thermal vias
- radiating
- heat dissipation
- piece
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The embodiment of the invention provides a kind of radiator structure, circuit board assemblies and its processing technologys, are related to electronic technology field.The radiator structure includes the thermal vias and radiating piece for being set to printed circuit board.Wherein, radiating piece is pierced by thermal vias, and radiating piece is pierced by the part of thermal vias for connecting with the heat dissipation bonding pad of electronic device.Radiator structure, circuit board assemblies and its processing technology provided in an embodiment of the present invention are connected by the heat dissipation bonding pad of radiating piece and electronic device, heat spreading function is played to electronic device, to the radiating mode of alternative existing gluing radiator, gluing radiator can either be excluded in this way falls risk, it can guarantee heat dissipation effect again, reliability is higher.
Description
Technical field
The present invention relates to electronic technology fields, in particular to a kind of radiator structure, circuit board assemblies and its processing work
Skill.
Background technique
As the integration degree of current chip is higher and higher, chip energy consumption is gradually promoted.Currently, designer can mostly use
Meet radiating requirements in the mode of the front installation gluing radiator of electronic device.Such as in quad flat non-pin package
(Quad Flat No-leadPackage, QFN) or Quad Flat formula encapsulate (Plastic Quad Flat Package, QFP)
Front installation gluing radiator, to meet radiating requirements.But gluing radiator assembling process whole process manual operation, and
Assembling process has strict demand to operating time and viscose glue area, once not meeting code requirement, easily causes colloid solidification not
Completely, bonding force reduces；Product after a period of use, be easy to cause gluing radiator to fall, lead to device chip temperature
It is excessively high to work.
Summary of the invention
The purpose of the present invention includes providing a kind of radiator structure, can either exclude gluing radiator and fall risk, and energy
Enough guarantee heat dissipation effect.
The purpose of the present invention further includes providing a kind of circuit board assemblies, can either exclude gluing radiator and fall risk,
It can guarantee heat dissipation effect again.
The purpose of the present invention further includes providing a kind of processing technology of circuit board assemblies, can either exclude gluing radiator
Risk is fallen, and can guarantee heat dissipation effect.
The embodiment of the present invention is achieved in that
A kind of radiator structure, the radiator structure includes the thermal vias and radiating piece for being set to printed circuit board, described
Radiating piece is pierced by the thermal vias, and the radiating piece is pierced by the part of the thermal vias for the heat dissipation with electronic device
Pad connection.
Further, the radiating piece includes radiating part and the interconnecting piece for being convexly equipped in the radiating part side, the heat dissipation
The coat of metal is provided on the internal perisporium of through-hole, the interconnecting piece protrudes into the thermal vias and connects with the coat of metal
It connects, the radiating part is used to connect with the heat dissipation bonding pad far from the side of the interconnecting piece.
Further, the first connection pad is provided on the printed circuit board, the radiating part is connect with described first
Pad connection.
Further, the radiator structure further includes heat-conducting piece, and the heat-conducting piece fits in the interconnecting piece far from described
One end end face of radiating part.
Further, the radiator structure further includes the radiating boss being set on the shell of electronic equipment, the heat dissipation
Boss is connect with the heat-conducting piece far from the one side of the interconnecting piece.
Further, the thermal vias is multiple, multiple thermal vias array distributions.
A kind of circuit board assemblies, including electronic device and radiator structure, the radiator structure include being set to printed circuit
The thermal vias and radiating piece of plate, the radiating piece is pierced by the thermal vias, and the radiating piece is pierced by the thermal vias
Part connect with the heat dissipation bonding pad of the electronic device.
A kind of processing technology of circuit board assemblies, comprising:
Thermal vias is opened up on a printed circuit board；
Electronic device is welded on the printed circuit board；
Liquid metal welding material is set to pass through the thermal vias by wave-soldering, so that the liquid metal welding material
It is filled between the heat dissipation bonding pad of the electronic device and the printed circuit board and in the thermal vias, forms heat dissipation
Part, wherein the part that the radiating piece is pierced by the thermal vias is connect with the heat dissipation bonding pad.
It is further, described that electronic device is welded in front of the step on printed circuit board further include:
Metallization forms the coat of metal on the internal perisporium of the thermal vias；
Wherein, the radiating piece is connect with the coat of metal.
Further, described that liquid metal welding material is passed through by the thermal vias by wave-soldering, so that the liquid
State welding material of metal is filled between the heat dissipation bonding pad of the electronic device and the printed circuit board and the heat dissipation is logical
In hole, formed radiating piece the step of after further include:
Heat-conducting piece is attached at one end end face of the radiating piece far from the heat dissipation bonding pad.
The beneficial effect of radiator structure provided in an embodiment of the present invention, circuit board assemblies and its processing technology includes: to pass through
The connection of the heat dissipation bonding pad of radiating piece and electronic device, plays heat spreading function to electronic device, so that alternative existing gluing dissipates
The radiating mode of hot device can either exclude gluing radiator in this way and fall risk, and can guarantee heat dissipation effect, and reliability is more
It is high.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the structural schematic diagram of circuit board assemblies applied by radiator structure provided in an embodiment of the present invention, wherein electricity
Sub- device uses QFP chip；
Fig. 2 is structural schematic diagram of the circuit board assemblies in also not set radiating piece in Fig. 1；
Fig. 3 corresponds to the structural schematic diagram of the welding region of electronic device for the printed circuit board in Fig. 1；
Fig. 4 is that the printed circuit board for the circuit board assemblies that another embodiment provides corresponds to the welding region of electronic device
Structural schematic diagram；Wherein, thermal vias rectangular array is arranged；
The structural schematic diagram of electronic equipment applied by the radiator structure that Fig. 5 provides for further embodiment of this invention；
The structural schematic diagram of circuit board assemblies applied by the radiator structure that Fig. 6 provides for yet another embodiment of the invention,
In, electronic device uses QFN chip；
Fig. 7 is structural schematic diagram of the circuit board assemblies in also not set radiating piece in Fig. 6；
Fig. 8 is structural schematic diagram of the radiator structure after setting heat-conducting piece and radiating boss in Fig. 6；
Fig. 9 is the flow chart of the processing technology for the circuit board assemblies that some embodiments of the invention provide.
Icon: 10- circuit board assemblies；100- radiator structure；200- electronic device；210- heat dissipation bonding pad；The weldering of 220- signal
Disk；230- pin；110- printed circuit board；111- thermal vias；The connection pad of 112- first；The connection pad of 113- second；
The 114- coat of metal；115- first surface；116- second surface；120- radiating piece；121- radiating part；122- interconnecting piece；130-
Heat-conducting piece；140- radiating boss；141- heat-conducting part；142- diffusion part.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below claimed
The scope of the present invention, but be merely representative of selected embodiment of the invention.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without creative efforts belongs to the model that the present invention protects
It encloses.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the present invention, it is to be understood that, the orientation or position of the instructions such as term " on ", "lower", "inner", "outside"
Set relationship be based on the orientation or positional relationship shown in the drawings or the invention product using when the orientation or position usually put
Set relationship or orientation or positional relationship that those skilled in the art usually understand, be merely for convenience of the description present invention and
Simplify description, rather than the equipment of indication or suggestion meaning or element must have a particular orientation, with specific orientation construction
And operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second ", " third " etc. are only used for distinguishing description, it is not understood to indicate or imply
Relative importance.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" installation ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally connect
It connects；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, can also indirectly connected through an intermediary, it can
To be the connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood with concrete condition
Concrete meaning in the present invention.
Referring to Fig. 1, present embodiments providing a kind of radiator structure 100, it is applied to electronic equipment (not shown), to electricity
The electronic device 200 of sub- equipment radiates.Wherein, electronic equipment includes shell (not shown) and circuit board assemblies 10, circuit
Board group part 10 includes printed circuit board 110 and the radiator structure 100 that is set on printed circuit board 110, radiator structure 100 with
Electronic device 200 connects, and and cage connection, the heat transfer of electronic device 200 to shell is radiated.It needs to illustrate
, electronic device 200 can be the device for having the packaging belt heat dissipation bonding pad 210 of radiating requirements.Wherein, heat dissipation bonding pad 210 is
The large area exposed pads in 200 package bottom of electronic device center.For example, electronic device 200 can be QFN chip or QFP
Chip etc..The radiator structure 100 can realize the radiating mode for substituting existing gluing radiator, the case where meeting cooling requirements
Under, gluing radiator can be excluded and fall risk, reliability is higher.
The embodiment of the present invention for convenience of explanation, is mainly illustrated by taking QFN chip and QFP chip as an example, but do not answer
When being interpreted as to specific restriction of the invention, can be used as long as there is the device of the packaging belt heat dissipation bonding pad 210 of radiating requirements
Radiator structure 100 provided in an embodiment of the present invention.
The present embodiment is illustrated so that electronic device 200 is QFP chip as an example.
Fig. 1 and Fig. 2 are please referred to, radiator structure 100 includes the thermal vias 111 being set on printed circuit board 110 and dissipates
Warmware 120.Wherein, radiating piece 120 is pierced by thermal vias 111, and radiating piece 120 be pierced by thermal vias 111 part be used for
The heat dissipation bonding pad 210 of electronic device 200 connects.In addition, electronic device 200 is provided with more along its surrounding periphery in the present embodiment
A pin 230, pin 230 are used to weld with printed circuit board 110.
It is connect by radiating piece 120 with heat dissipation bonding pad 210, heat spreading function is played to electronic device 200, thus alternative existing
The radiating mode of some gluing radiators.Gluing radiator can either be excluded in this way and falls risk, and can guarantee heat dissipation effect,
Reliability is higher.
Optionally, in the present embodiment, radiating piece 120 passes through thermal vias by wave-soldering by liquid metal welding material
111, and be filled between the heat dissipation bonding pad 210 of electronic device 200 and printed circuit board 110 and thermal vias 111 in and shape
At.
Referring to Fig. 3, being provided with the first connection pad 112 on printed circuit board 110 in the present embodiment.Thermal vias 111
It is opened in the position of first connection pad 112 corresponding with heat dissipation bonding pad 210 on printed circuit board 110.
Please continue to refer to Fig. 1 and Fig. 2, the coat of metal 114 is provided on the internal perisporium of thermal vias 111.Radiating piece 120 with
The coat of metal 114 connects.It should be noted that thermal vias 111 is using plating thermal vias 111 in the present embodiment
(Plating Through Hole, PTH).Wherein, the coat of metal 114 can be using metallic copper etc..
The number and shape of thermal vias 111 are simultaneously not specifically limited, and can be one, or and it is multiple, wherein dissipating
When heat through-hole 111 is multiple, arrangement mode is also not especially limited, and is chosen as array distribution.Such as thermal vias 111 is arranged
Mode can be rectangular array arrangement (please referring to Fig. 4), circular array arrangement etc..The shape of thermal vias 111 can be circle
Or it is rectangular etc..In addition, the size of thermal vias 111, which is chosen as diameter D, meets 1mm≤D≤4mm.It should be appreciated that in printed circuit
Such large scale PTH is opened up on plate 110, and is connect by radiating piece 120 with heat dissipation bonding pad 210, and heat dissipation bonding pad is able to ascend
210 heat dissipation area improves heat dissipation effect.
In addition, printed circuit board 110 has the first surface 115 and second surface 116 being oppositely arranged.Thermal vias 111
Second surface 116 is through to by first surface 115.Heat dissipation bonding pad 210 is connect by radiating piece 120 with first surface 115.This
Sample can be such that heat dissipation bonding pad 210 is reliably fixedly connected with printed circuit board 110.
Further, radiating piece 120 includes radiating part 121 and the interconnecting piece 122 for being convexly equipped in 121 side of radiating part.Wherein,
Interconnecting piece 122 is protruded into thermal vias 111 and is connect with the coat of metal 114.Radiating part 121 is used far from the side of interconnecting piece 122
It is connect in heat dissipation bonding pad 210.In the present embodiment, interconnecting piece 122 can be one, or it is multiple, interconnecting piece 122 and dissipate
Heat through-hole 111 corresponds.Radiating part 121 is connect with first surface 115, is further firmly secured to heat dissipation bonding pad 210
Printed circuit board 110.
The one end of interconnecting piece 122 far from radiating part 121 can be concordant with second surface 116, can also protrude from the second table
Face 116 can also be accommodated in thermal vias 111 and non-bulging second surface 116, is accordingly arranged according to actual processing.
It should be appreciated that stretching in thermal vias 111 by interconnecting piece 122, the connection with the coat of metal 114 is realized.It is logical
It crosses radiating part 121 to be set between heat dissipation bonding pad 210 and printed circuit board 110, realizes heat dissipation bonding pad 210 and printed circuit board
110 the first connection pad 112 connects.So that heat dissipation bonding pad 210 and printed circuit board 110 are fixed reliable, eliminate existing
Gluing radiator falls risk, improves heat dissipation effect.
It should be noted that in process, first electronic device 200 is welded in by pin 230 in the present embodiment
On printed circuit board 110.Then heat dissipation bonding pad 210 is welded on printed circuit board 110 by wave-soldering, from second surface
116 liquid welding material of metal is perfused into thermal vias 111, so that liquid metal welding material is filled in heat dissipation bonding pad 210
Between printed circuit board 110 and radiating part 121 is formed, and liquid metal welding material is filled in thermal vias 111
And interconnecting piece 122 is formed, to form radiating piece 120.Optionally, welding material of metal can select tin.Pass through PTH and wave crest
The radiating piece 120 that weldering is formed increases effectively the heat dissipation area of heat dissipation bonding pad 210, to meet the heat dissipation need of electronic device 200
It asks.
Referring to Fig. 5, further, radiator structure 100 can also include heat-conducting piece 130 and be set to the outer of electronic equipment
Radiating boss 140 on shell.Shell is made of metal material.Heat-conducting piece 130 fits in interconnecting piece 122 far from radiating part 121
One end end face.In addition, radiating boss 140 can be pre-formed on the shell, radiating boss 140 and heat-conducting piece 130 are far from even
The one side of socket part 122 connects；Heat-conducting piece 130 can also be made directly to contact with shell by the size of setting heat-conducting piece 130.
The heat that electronic device 200 generates passes sequentially through heat dissipation bonding pad 210, radiating piece 120, heat-conducting piece 130 and radiating boss 140 and carries out
Heat dissipation, and can be transferred heat away from by shell, by setting heat-conducting piece 130 and radiating boss 140, substantially increase scattered
Heat area, to improve heat dissipation effect.
It should be noted that heat-conducting piece 130 can use high molecular material that can be thermally conductive, interconnecting piece can be attached at
122 one end end faces and second surface 116 far from radiating part 121, so that heat-conducting piece 130 and interconnecting piece 122 and the second table
Face 116 connects.
In the present embodiment, radiating boss 140 may include the heat-conducting part 141 and diffusion part 142 being stacked.Wherein, it leads
Hot portion 141 is connect with heat-conducting piece 130, and the cross sectional dimensions of diffusion part 142 is greater than the cross sectional dimensions of heat-conducting part 141.In this way, expanding
The size for dissipating portion 142 is larger, can further increase heat dissipation area, improves heat dissipation effect.It should be appreciated that diffusion part 142 can be with
For the main part of shell, so that heat be distributed.
Fig. 6~Fig. 8 is please referred to, in other embodiments of the invention, radiator structure 100 can be used in QFN chip,
In addition to the structure of QFN is different from qfp structure, the structure of radiator structure 100 is similar with above-described embodiment structure, no longer superfluous herein
It states.It should be noted that being additionally provided on electronic device 200 more in the embodiment that radiator structure 100 is applied to QFN chip
A signal pad 220, signal pad 220 are the pad for being distributed in 210 periphery of heat dissipation bonding pad.First on printed circuit board 110
The periphery of connection pad 112 is additionally provided with multiple second connection pads 113, and multiple second connection pads 113 and multiple signals weld
Disk 220 corresponds, and the second connection pad 113 is used to weld with signal pad 220.In process, first by electronic device
200 are welded in the second connection pad 113 by signal pad 220, are welded on printed circuit board 110 with electronic device 200, so
Heat dissipation bonding pad 210 is welded on printed circuit board 110 by wave-soldering afterwards.
In addition, it is necessary to which explanation, existing after the welding of QFN/QFP chip re-flow, gluing is installed in the front QFN/QFP
The heat sink conception of radiator has the disadvantages that
1. needing to be laid out reserved prohibit in printed circuit board to meet the installation space demand of gluing radiator and reprocessing demand
Cloth area is unfavorable for highly dense design；
2. gluing radiator causes to make because fixed form has hard constraints to heatsink weight and QFN/QFP chip size
It is limited with scene；
3. gluing radiator assembling process whole process manual operation, and assembling process has sternly operating time and viscose glue area
Lattice requirement easily causes colloid solidification not exclusively, bonding force reduces once not meeting code requirement；When product uses one section
Between after, radiator falls, and causes device chip temperature is excessively high can not work, customer perception is poor；
4. after gluing radiator assembles, briquetting need to be used to place 30 minutes or more, and it is pressed after also need to stand 8 it is small
When more than could put into next procedure, processing efficiency is low, and overall cost is high.
Using radiator structure 100 provided in an embodiment of the present invention, the radiating mode of alternative existing gluing radiator is right
Should be in the above-mentioned gluing radiator heat-dissipation scheme the shortcomings that, radiator structure 100 provided in an embodiment of the present invention at least has following
Advantage:
1. after cancelling gluing radiator, printed circuit board 110 is laid out the installation of adhesion without adhesiver radiator and reprocesses the design of the area Jin Bu,
Conducive to the highly dense layout of veneer；
2., to QFN/QFP chip size without limitation, usage scenario is more extensive after cancelling gluing radiator；
3. excluding gluing radiator falls risk, process whole process may be implemented to process automatically, may further eliminate
The manual operation hidden danger lack of standardization for causing gluing radiator to fall；
4. after cancelling gluing radiator, product Material Cost is reduced, and the reduction 10 of 110 process time of printed circuit board is small
When more than, processing efficiency greatly promotes.
Radiator structure 100 provided in an embodiment of the present invention is at low cost, and feasibility is strong, high in machining efficiency, is suitable for extensive
Processing.Further, it is possible to which the heat dissipation area of heat radiation pad 210, improves heat dissipation effect.
Referring to Fig. 9, in addition, the embodiments of the present invention also provide a kind of processing technology of circuit board assemblies, for adding
Circuit board assemblies 10 in work above-described embodiment.Still it is illustrated by taking QFN chip and QFP chip as an example.It does not refer to below
Place please refers to the above embodiments.The processing technology the following steps are included:
Step S100 opens up thermal vias 111 on printed circuit board 110.
It in the present embodiment, is punched on printed circuit board 110, obtains thermal vias 111.
Step S200, metallization forms the coat of metal 114 on the internal perisporium of thermal vias 111.
In the embodiment of the present invention, thermal vias 111 is using PTH.Thermal vias 111 is opened in printed circuit board 110
The position of upper first connection pad 112 corresponding with heat dissipation bonding pad 210.The size of thermal vias 111 is chosen as diameter D satisfaction
1mm≤D≤4mm。
Electronic device 200 is welded on printed circuit board 110 by step S300.
It should be noted that electronic device 200 may be mounted at the printed circuit board for having offered thermal vias 111
On 110.At this point, step S100 can be omitted.
The present invention is applied in the embodiment of QFP chip, can be welded in print by the pin 230 on electronic device 200
On circuit board 110 processed.
In the embodiment that the present invention is applied to QFN chip, can by signal pad 220 on electronic device 200 with
The second connection pad 113 on printed circuit board 110 welds.Wherein, the second connection pad 113 is set to the first connection pad
112 periphery, the second connection pad 113 are multiple, multiple second connection pads 113 and multiple signal pads 220 one-to-one correspondence.
Liquid metal welding material is passed through thermal vias 111 by wave-soldering, so that liquid metal welds by step S400
Material is filled between the heat dissipation bonding pad 210 of electronic device 200 and printed circuit board 110 and in thermal vias 111, is formed and is dissipated
Warmware 120, wherein the part that radiating piece 120 is pierced by thermal vias 111 is connect with heat dissipation bonding pad 210.
In the embodiment of the present invention, liquid welding material of metal is perfused into thermal vias 111, so that liquid metal welds material
Material is filled in formation radiating part 121 between heat dissipation bonding pad 210 and printed circuit board 110, and liquid metal welding material is filled out
It fills in forming interconnecting piece 122 in thermal vias 111, radiating piece 120 is collectively formed in radiating part 121 and interconnecting piece 122.And to dissipate
Warmware 120 connect with the coat of metal 114 and heat dissipation bonding pad 210 is welded by radiating piece 120 and printed circuit board 110.
It should be appreciated that heat dissipation bonding pad 210 is welded on printed circuit board 110 by wave-soldering, and from the of printed circuit board 110
Liquid welding material of metal is perfused into thermal vias 111 for two surfaces 116.Have by the radiating piece 120 that PTH and wave-soldering are formed
Effect increases the heat dissipation area of heat dissipation bonding pad 210, to meet the radiating requirements of electronic device 200.
Heat-conducting piece 130 is attached at one end end face of the radiating piece 120 far from heat dissipation bonding pad 210 by step S500.
In the embodiment of the present invention, heat-conducting piece 130 can use high molecular material that can be thermally conductive.Heat-conducting piece 130 can will dissipate
The heat of hot weld disk 210 is transmitted.
Circuit board assemblies 10 are attached in radiating boss 140 by step S600 by heat-conducting piece 130.
In the embodiment of the present invention, the heat that electronic device 200 generates passes sequentially through heat dissipation bonding pad 210, radiating piece 120, leads
Warmware 130 and radiating boss 140 radiate, and are transferred heat away from by shell.Radiating boss 140 can use metal
Material is made.
In conclusion radiator structure 100 provided in an embodiment of the present invention, circuit board assemblies 10 and its processing technology are by dissipating
Warmware 120 is connect with the heat dissipation bonding pad 210 of electronic device 200, plays heat spreading function to electronic device 200, thus alternative existing
The radiating mode of some gluing radiators can either exclude gluing radiator in this way and fall risk, and can guarantee heat dissipation effect,
Reliability is higher.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of radiator structure, which is characterized in that the radiator structure includes being set to the thermal vias of printed circuit board and dissipating
Warmware；
The radiating piece is pierced by the thermal vias, and the radiating piece is pierced by the part of the thermal vias and is used for and electronics device
The heat dissipation bonding pad of part connects.
2. radiator structure according to claim 1, which is characterized in that the radiating piece includes radiating part and is convexly equipped in described
The interconnecting piece of radiating part side；
Be provided with the coat of metal on the internal perisporium of the thermal vias, the interconnecting piece protrude into the thermal vias and with it is described
Coat of metal connection, the radiating part are used to connect with the heat dissipation bonding pad far from the side of the interconnecting piece.
3. radiator structure according to claim 2, which is characterized in that be provided with the first connection weldering on the printed circuit board
Disk, the radiating part connect pad connection with described first.
4. radiator structure according to claim 2, which is characterized in that further include heat-conducting piece, the heat-conducting piece fits in institute
State one end end face of the interconnecting piece far from the radiating part.
5. radiator structure according to claim 4, which is characterized in that further include being set to dissipating on the shell of electronic equipment
Hot boss, the radiating boss are connect with the heat-conducting piece far from the one side of the interconnecting piece.
6. radiator structure according to claim 1, which is characterized in that the thermal vias is multiple, multiple heat dissipations
Through-hole array distribution.
7. a kind of circuit board assemblies, which is characterized in that tied including electronic device and heat dissipation as claimed in any one of claims 1 to 6
Structure.
8. a kind of processing technology of circuit board assemblies characterized by comprising
Thermal vias is opened up on a printed circuit board；
Electronic device is welded on the printed circuit board；
Liquid metal welding material is set to pass through the thermal vias by wave-soldering, so that the liquid metal welding material is filled
Between the heat dissipation bonding pad and the printed circuit board of the electronic device and in the thermal vias, radiating piece is formed,
In, the part that the radiating piece is pierced by the thermal vias is connect with the heat dissipation bonding pad.
9. the processing technology of circuit board assemblies according to claim 8, which is characterized in that described to be welded in electronic device
Before step on printed circuit board further include:
Metallization forms the coat of metal on the internal perisporium of the thermal vias；
Wherein, the radiating piece is connect with the coat of metal.
10. the processing technology of circuit board assemblies according to claim 8, which is characterized in that it is described by wave-soldering by liquid
State welding material of metal passes through the thermal vias, so that the liquid metal welding material is filled in dissipating for the electronic device
Between hot weld disk and the printed circuit board and in the thermal vias, formed radiating piece the step of after further include:
Heat-conducting piece is attached at one end end face of the radiating piece far from the heat dissipation bonding pad.
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| CN113690195A (en) * | 2021-09-16 | 2021-11-23 | 珠海零边界集成电路有限公司 | Packaging frame, packaging structure and preparation method of packaging frame |
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