CN112272496A - High-efficiency heat dissipation device for mobile communication equipment - Google Patents
High-efficiency heat dissipation device for mobile communication equipment Download PDFInfo
- Publication number
- CN112272496A CN112272496A CN202011152815.3A CN202011152815A CN112272496A CN 112272496 A CN112272496 A CN 112272496A CN 202011152815 A CN202011152815 A CN 202011152815A CN 112272496 A CN112272496 A CN 112272496A
- Authority
- CN
- China
- Prior art keywords
- heat
- mobile communication
- communication equipment
- heat dissipation
- soaking plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 27
- 238000010295 mobile communication Methods 0.000 title claims abstract description 21
- 238000002791 soaking Methods 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229910000679 solder Inorganic materials 0.000 claims abstract description 15
- 239000004519 grease Substances 0.000 claims abstract description 10
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 10
- 230000000704 physical effect Effects 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 1
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- -1 graphite alkene Chemical class 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a high-efficiency heat dissipation device for mobile communication equipment, which comprises a PCB (printed circuit board), a soaking plate and a working chip, wherein the working chip is loaded on the PCB, the soaking plate is arranged on the working chip through an elastic metal solder layer, and heat-conducting silicone grease is filled between the soaking plate and a metal shell. The invention can improve the thermal diffusivity of the whole device.
Description
Technical Field
The invention relates to the technical field of electronic equipment heat dissipation, in particular to a high-efficiency heat dissipation device for mobile communication equipment.
Background
With the development and progress of high-tech devices, mobile communication devices, such as mobile phones, notebook computers, tablet computers, etc., begin to become the devices for people to work daily and leisure. Taking a mobile phone as an example, the main components include a processor, a memory, an input/output device, and an I/O channel. The main circuit board is the most important component in the mobile communication equipment, and the mainstream heat dissipation methods at present include graphite sheet heat dissipation, metal casing heat dissipation, heat conduction gel heat dissipation and the like. With the improvement of performance, the heat generation of equipment is increased, and the requirement on heat dissipation of the equipment is increased. Therefore, the invention discloses a heat dissipation device which is high in efficiency and can be used for mobile communication equipment, and the invention has great significance.
Disclosure of Invention
The invention aims to solve the problems that: a high-efficiency heat sink for a mobile communication device is provided, which can improve the thermal diffusivity of the whole device.
The technical scheme provided by the invention for solving the problems is as follows: the utility model provides a high-efficient heat abstractor for mobile communication equipment, includes PCB board, soaking board and work chip, the work chip loads on the PCB board, the soaking board passes through elastic metal solder layer and sets up on the work chip, it has heat conduction silicone grease to fill between soaking board and the metal casing.
Preferably, the soaking plate is operated to have efficient heat transfer circulation, so that a large amount of heat is consumed.
Preferably, the heat conducting silicone grease conducts the residual unconsumed heat and dissipates the heat through a metal shell of the mobile communication equipment.
Preferably, the resilient metal solder layer has physical properties of low absolute thermal grouping, improving thermal efficiency.
Compared with the prior art, the invention has the advantages that:
1. the elastic metal solder is used for connecting the working chip and the soaking plate, and the physical property of the thermal diffusivity of the elastic metal solder is larger, so that when the chip of the mobile communication equipment works and generates a large amount of heat, the absolute thermal resistance of the elastic metal solder is low, so that the elastic metal solder can conduct heat conduction with high thermal efficiency, the generated heat is conducted into the soaking plate in a large amount, and heat conduction circulation is carried out through the soaking plate so as to meet the heat dissipation requirement, so that the thermal efficiency is high, the reliability of the device is high, and the practicability is stronger;
2. the heat conducting silicone grease is used for filling between the soaking plate and the mobile communication equipment, and through the heat conducting materials, firstly, the two parts are subjected to gap filling, and through the physical property of easy heat conduction, the residual heat which passes through the soaking plate but does not participate in the heat conducting circulation process is subjected to next heat conduction to the surrounding environment, so that the heat efficiency of the whole working chip is improved;
3. the elastic metal solder is adopted, the soaking plate and the working chip are connected, the operation is simple, and the characteristic of low absolute thermal resistance is beneficial to the heat dissipation of the mobile communication equipment;
4. the device disclosed by the invention uses two heat dissipation materials, and the two heat dissipation materials, namely the elastic metal solder and the heat-conducting silicone grease and the like are attached to a main heat dissipation element, namely the soaking plate, so that the heat energy generated by the maximum working chip can be absorbed to the maximum extent, and the aim of high heat efficiency is fulfilled.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
FIG. 1 is a prior art heat sink for use in a mobile communication device
FIG. 2 is a schematic structural view of the present invention;
the attached drawings are marked as follows: 1. PCB board, 2, work chip, 3, metal casing, 4, graphite alkene conducting strip, 5, fin, 7, elastic metal solder layer, 8, soaking board, 9, heat conduction silicone grease.
Detailed Description
The embodiments of the present invention will be described in detail with reference to the accompanying drawings and examples, so that how to implement the technical means for solving the technical problems and achieving the technical effects of the present invention can be fully understood and implemented.
Fig. 1 shows a heat dissipation device currently and mainly used for mobile communication equipment, in which a PCB board 1 is loaded with a working chip 2, and heat conduction is performed by attaching a graphene heat conduction sheet 4 to the back of the chip, so that heat generated during the operation of the chip is conducted to a heat dissipation sheet 5, and then heat dissipation is completed on a metal shell 3.
The main components of the invention are shown in figure 2, the working chip 2 is loaded on the PCB 1, the soaking plate 8 and the working chip are connected by using metallurgical connection operation such as brazing, an elastic metal solder layer 7 is arranged between the working chip and the soaking plate 8 after the connection is finished, and the soaking plate 8 and the metal shell are filled by the heat-conducting silicone grease 9, thereby finishing the installation of the whole heat dissipation device.
When the efficient heat dissipation device for the mobile communication equipment is used and operated, the chip 2 starts to work on a PCB, and most heat can be conducted to the soaking plate 8 through the elastic metal solder layer 7 by the metal solder layer 7 with low absolute thermal resistance.
The heat conducted to the soaking plate 8 enables the liquid in the soaking plate to evaporate and absorb a large amount of heat, the liquid vapor is gradually diffused from the high-pressure area in the plate to the low-pressure area in the plate by having latent heat, the liquid vapor is contacted with the cold end of the upper plate to be liquefied and dripped to the lower end, the process is a heat transfer cycle, and therefore primary heat dissipation is completed.
When the heat passing through the soaking plate once does not participate in the heat transfer circulation, the heat is conducted to the heat-conducting silicone grease 9 through the upper plate, and then the heat is dissipated through the metal shell 3.
The heat dissipation device can greatly improve the heat efficiency during working, has obvious heat dissipation effect and provides a large space for improving the performance.
The foregoing is merely illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the claims. The present invention is not limited to the above embodiments, and the specific structure thereof is allowed to vary. All changes which come within the scope of the invention as defined by the independent claims are intended to be embraced therein.
Claims (4)
1. The utility model provides a high-efficient heat abstractor for mobile communication equipment which characterized in that: the heat-conducting silicon chip heat-conducting device comprises a PCB (printed circuit board), a soaking plate and a working chip, wherein the working chip is loaded on the PCB, the soaking plate is arranged on the working chip through an elastic metal solder layer, and heat-conducting silicone grease is filled between the soaking plate and a metal shell.
2. The efficient heat dissipation device for mobile communication equipment as claimed in claim 1, wherein: the soaking plate has efficient heat transfer circulation when working, and consumes a large amount of heat.
3. The efficient heat dissipation device for mobile communication equipment as claimed in claim 1, wherein: the heat conducting silicone grease conducts the residual unconsumed heat and dissipates the heat through the metal shell of the mobile communication equipment.
4. The efficient heat dissipation device for mobile communication equipment as claimed in claim 1, wherein: the elastic metal solder layer has physical properties of low absolute thermal group, and improves thermal efficiency.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011152815.3A CN112272496A (en) | 2020-10-26 | 2020-10-26 | High-efficiency heat dissipation device for mobile communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011152815.3A CN112272496A (en) | 2020-10-26 | 2020-10-26 | High-efficiency heat dissipation device for mobile communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112272496A true CN112272496A (en) | 2021-01-26 |
Family
ID=74341908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011152815.3A Pending CN112272496A (en) | 2020-10-26 | 2020-10-26 | High-efficiency heat dissipation device for mobile communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112272496A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117199020A (en) * | 2023-08-09 | 2023-12-08 | 南通思凯光电有限公司 | Packaging module of semiconductor element |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5396403A (en) * | 1993-07-06 | 1995-03-07 | Hewlett-Packard Company | Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate |
| US5528456A (en) * | 1993-11-15 | 1996-06-18 | Nec Corporation | Package with improved heat transfer structure for semiconductor device |
| CN1290961A (en) * | 1999-09-30 | 2001-04-11 | 国际商业机器公司 | Custum made lid for improving heat property of module by inverse mounting |
| US6462952B1 (en) * | 2000-06-02 | 2002-10-08 | Kabushiki Kaisha Toshiba | Structure and method for constructing circuit module suitable for hand-held electronic equipment |
| CN106206493A (en) * | 2016-08-30 | 2016-12-07 | 深圳天珑无线科技有限公司 | A kind of radiator structure encapsulating chip |
| CN108022894A (en) * | 2017-11-14 | 2018-05-11 | 华南理工大学 | Igbt chip and the integrated encapsulation structure and its manufacture method of phase transformation soaking plate |
| CN109362208A (en) * | 2018-10-27 | 2019-02-19 | 飞依诺科技(苏州)有限公司 | Quick soakage device and hand-held ultrasound detection device |
-
2020
- 2020-10-26 CN CN202011152815.3A patent/CN112272496A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5396403A (en) * | 1993-07-06 | 1995-03-07 | Hewlett-Packard Company | Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate |
| US5528456A (en) * | 1993-11-15 | 1996-06-18 | Nec Corporation | Package with improved heat transfer structure for semiconductor device |
| CN1290961A (en) * | 1999-09-30 | 2001-04-11 | 国际商业机器公司 | Custum made lid for improving heat property of module by inverse mounting |
| US6462952B1 (en) * | 2000-06-02 | 2002-10-08 | Kabushiki Kaisha Toshiba | Structure and method for constructing circuit module suitable for hand-held electronic equipment |
| CN106206493A (en) * | 2016-08-30 | 2016-12-07 | 深圳天珑无线科技有限公司 | A kind of radiator structure encapsulating chip |
| CN108022894A (en) * | 2017-11-14 | 2018-05-11 | 华南理工大学 | Igbt chip and the integrated encapsulation structure and its manufacture method of phase transformation soaking plate |
| CN109362208A (en) * | 2018-10-27 | 2019-02-19 | 飞依诺科技(苏州)有限公司 | Quick soakage device and hand-held ultrasound detection device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117199020A (en) * | 2023-08-09 | 2023-12-08 | 南通思凯光电有限公司 | Packaging module of semiconductor element |
| CN117199020B (en) * | 2023-08-09 | 2024-04-19 | 南通思凯光电有限公司 | Packaging module of semiconductor element |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210126 |
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