CN205789964U - A kind of LED light source structure - Google Patents
A kind of LED light source structure Download PDFInfo
- Publication number
- CN205789964U CN205789964U CN201620497371.XU CN201620497371U CN205789964U CN 205789964 U CN205789964 U CN 205789964U CN 201620497371 U CN201620497371 U CN 201620497371U CN 205789964 U CN205789964 U CN 205789964U
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- solder mask
- led
- light source
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses a kind of LED light source structure, including ceramic substrate, ceramic substrate is provided with turning circuit, solder mask structure it is additionally provided with on ceramic substrate, solder mask structure is circumferentially positioned at outside turning circuit, and solder mask structure is provided with back-up ring, and the ceramic substrate in solder mask structure is provided with heat sink, the heat sink LED chip that is provided with, LED chip is connected with turning circuit by gold thread；It is coated with silica-gel lens in the space that described back-up ring and ceramic substrate surround.This utility model simple in construction, directly will burn one altogether to turning circuit and ceramic substrate, by LED chip by heat sink fixing substrate, avoid the paster operation of single light source, reduce cost, and pottery and sintering circuit are reliably, improve the stability in the large of LED, do not react with other material simultaneously, improve the life-span of LED.
Description
Technical field
This utility model belongs to LED light source technical field, is specifically related to a kind of LED light source structure.
Background technology
LED is as new lighting engineering, and its good energy-conserving effect, long-life, startup is fast, can control luminous frequency spectrum and obtain excellent
The features such as light quality obtain the effect generally acknowledged, along with popularizing of LED light source, the various problems during LED uses all come out, with
The raising of the power of LED, and integrated use, it is the most prominent that heat sheds, light efficiency improves the problem that sheds at heat sink in time
Go out, meanwhile, reduce cost and become the problem that need to solve.With 80% when one of problem affecting LED power is LED luminescence
Distributing of the heat energy of power, such as the effect of the bad light decay directly affecting LED that dispels the heat, temperature often raises 1 degree, light decay about 1%, with
Time, too high temperature directly affects the life-span of LED chip, and therefore, raising heat dispersion, raising light efficiency, reduction cost are LED envelopes
The problem needing on assembling structure to solve.
Existing high-power LED bracket major part is copper, aluminum composite base plate, and COB aluminum, copper composite base plate support, LED wafer is straight
Connecing on the crystal bonding area being arranged on composite base plate, routing district is formed by Copper Foil etching, and communicates in other circuit.Said structure exists
Problems with: using aluminum, cuprio composite base plate, metal basal board and Copper Foil organic adhesive insulating barrier are composited, employing has
, there is the problem that thermal resistance is high in machine material, thermal conductance is 1～2.2w/mk；There is the problem that long-time use is aging in organic material；Swollen
Swollen coefficient and LED wafer (copper: 17.7X10-6/ K, aluminum: 23X10-6/ K, LED chip 5.2X10-6/ K :) there is unmatched asking
Topic；Along with the use of high-capacity LED, its heat dissipation capacity also increases, and because heat radiation is bad, causes wafer temperature rise, and light decay aggravates, brightness and
Service life reduction, because the coefficient of expansion does not mates, causes solder side to crack or ruptures completely, and thermal resistance strengthens further, heat without
Method effectively sheds.
In addition to the above-mentioned problems, there is also that packaging technology is loaded down with trivial details, be in the light and integrity problem: as before packaging by back-up ring manufacture
Complete, general employing high-temperature plastic bonding metal or nonmetal circle, there is poor reliability problem, real estate or leakage glue can be departed from；
As directly used substrate to coat cushion rubber in encapsulation process, having coating and stoving process, relatively complicated, both exists at light source
Use process causes, because of aging, heat exhaustion etc., problems such as coming off, causes light source to damage；And back-up ring exists height, side can be gone out light
Block or absorb, causing light efficiency to reduce.Therefore be badly in need of a kind of light efficiency height, LED light source structure that life-span length, reliability are high.
Utility model content
The purpose of this utility model is to provide a kind of LED light source structure.
For achieving the above object, this utility model adopts the following technical scheme that
A kind of LED light source structure, including ceramic substrate, ceramic substrate is provided with turning circuit, and described turning circuit is permissible
It is fixed on ceramic substrate by methods such as thick film screen printing sintering, vacuum coating etchings, one-body molded；It is additionally provided with on ceramic substrate
Solder mask structure, solder mask structure is circumferentially positioned at outside turning circuit, and solder mask structure is provided with back-up ring, the ceramic base in solder mask structure
Plate is provided with heat sink, the heat sink LED chip that is provided with, and LED chip is connected with turning circuit by gold thread；Described back-up ring and ceramic base
It is coated with silica-gel lens in the space that plate surrounds.
Preferably, in order to reach preferably to dispel the heat and insulation effect, described ceramic substrate is aluminium oxide ceramics or aluminium nitride
Pottery；The material of described solder mask structure is glass, pottery or the organic material of insulation；Described back-up ring material be silica gel, glass or
Pottery.
In order to reach more preferable effect, described heat sink for metal heat sink；Described LED chip is multiple.Multiple LED chip can
To carry out serial or parallel connection by the turning circuit on ceramic substrate, it is achieved the high power of whole light-source structure.
For improving light efficiency, reducing resistance, reduce heating, the material of described turning circuit is argent.
This utility model simple in construction, directly will burn one to turning circuit and ceramic substrate altogether, utilize the height of pottery to lead
Hot (96% aluminium oxide ceramics thermal conductance is 16～20W/mk), can derive heat, reduces the probability of LED chip problem, with
Time ceramic insulation high, improve circuit safety and the safety of light source be installed, improve the life-span of light source；Pottery and wire have
Having high reflective, light reflexes to top, chip and light source internal side can be gone out light-output by back-up ring simultaneously, improve light efficiency；
On the one hand silica-gel lens can improve light efficiency, on the other hand can solidify, protect the internal structure of light source, and improve light source can
By property；By LED chip by heat sink fixing substrate, it is to avoid the paster operation of single light source, reduce cost, and pottery and
Sintering circuit is reliable, improves the stability in the large of LED, does not reacts with other material simultaneously, improves the life-span of LED.
Accompanying drawing explanation
Fig. 1 is this utility model structural representation.
Detailed description of the invention
LED light source structure as shown in Figure 1, including ceramic substrate 1, ceramic substrate 1 is provided with turning circuit 2, ceramic base
Being additionally provided with solder mask structure 3 on plate 1, it is outside that solder mask structure 3 is circumferentially positioned at turning circuit 2, and solder mask structure 3 is provided with back-up ring 4, resistance
Ceramic substrate 1 in welding structure 3 is provided with heat sink 5, heat sink 5 and is provided with LED chip 6, and LED chip 6 is by gold thread 7 and electric conduction
Road 2 connects；It is coated with silica-gel lens 8 in the space that described back-up ring 4 and ceramic substrate 1 surround.
Described ceramic substrate 1 is aluminium oxide ceramics or aluminium nitride ceramics；The material of described solder mask structure 3 is glass, pottery
Or the organic material of insulation；Described back-up ring material 4 is silica gel, glass or pottery；Described heat sink 5 is metal heat sink；Described LED core
Sheet 6 is multiple.
Claims (3)
1. a LED light source structure, it is characterised in that: include that ceramic substrate, ceramic substrate are provided with turning circuit, ceramic substrate
On be additionally provided with solder mask structure, solder mask structure is circumferentially positioned at outside turning circuit, and solder mask structure is provided with back-up ring, in solder mask structure
Ceramic substrate be provided with heat sink, the heat sink LED chip that is provided with, LED chip is connected with turning circuit by gold thread；Described back-up ring
It is coated with silica-gel lens in the space surrounded with ceramic substrate.
2. LED light source structure as claimed in claim 1 a kind of, it is characterised in that described ceramic substrate be aluminium oxide ceramics or
Aluminium nitride ceramics；The material of described solder mask structure is glass, pottery or the organic material of insulation；Described back-up ring material be silica gel,
Glass or pottery.
3. a kind of LED light source structure as claimed in claim 2, it is characterised in that described heat sink for metal heat sink；Described LED
Chip is multiple；The material of described turning circuit is argent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620497371.XU CN205789964U (en) | 2016-05-26 | 2016-05-26 | A kind of LED light source structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620497371.XU CN205789964U (en) | 2016-05-26 | 2016-05-26 | A kind of LED light source structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205789964U true CN205789964U (en) | 2016-12-07 |
Family
ID=57408322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620497371.XU Active CN205789964U (en) | 2016-05-26 | 2016-05-26 | A kind of LED light source structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205789964U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870113A (en) * | 2016-05-26 | 2016-08-17 | 郑州中瓷科技有限公司 | LED light source structure and preparation method thereof |
-
2016
- 2016-05-26 CN CN201620497371.XU patent/CN205789964U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870113A (en) * | 2016-05-26 | 2016-08-17 | 郑州中瓷科技有限公司 | LED light source structure and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |