CN208158972U - A kind of novel fire resistant double-sided wiring board - Google Patents

A kind of novel fire resistant double-sided wiring board Download PDF

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Publication number
CN208158972U
CN208158972U CN201820224038.0U CN201820224038U CN208158972U CN 208158972 U CN208158972 U CN 208158972U CN 201820224038 U CN201820224038 U CN 201820224038U CN 208158972 U CN208158972 U CN 208158972U
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China
Prior art keywords
heat
glass shell
conductive layer
silica gel
copper conductive
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Application number
CN201820224038.0U
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Chinese (zh)
Inventor
刘玲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giant Xin Electronic Technology (meizhou) Co Ltd
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Giant Xin Electronic Technology (meizhou) Co Ltd
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Priority to CN201820224038.0U priority Critical patent/CN208158972U/en
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Abstract

A kind of novel fire resistant double-sided wiring board,Including glass shell,Glass shell is that shell is closed made of glass-fiber-plate,Heat-conducting silica gel sheet is arranged in the side of glass shell,Copper conductive layer is arranged in the side of heat-conducting silica gel sheet,Teflon layer is arranged in the side of copper conductive layer,The side of copper conductive layer connects the second intraphase conductor,Heat-conducting silica gel sheet is arranged in the bottom in copper conductive layer of the utility model,Heat-conducting silica gel sheet had both had flexibility and had had with good thermal conductivity,Be bonded heat-conducting silica gel sheet can either with copper conductive layer tightly,The heat that simultaneously copper conductive layer can be generated quickly introduces on glass shell,Glass shell itself has certain thermal conductivity,After glass shell absorbs heat,It can be transmitted on internal organic phase change material,Organic phase change material can pass through the mobility of phase transformation and itself,Heat is quickly transmitted to other regions of glass shell by fast endothermic simultaneously.

Description

A kind of novel fire resistant double-sided wiring board
Technical field
The utility model relates to a kind of wiring board, more precisely a kind of novel fire resistant double-sided wiring board.
Background technique
Very easy accumulation electrostatic, the electrostatic accumulation on operational process copper conductive layer and glass-fiber-plate of available circuit plate are more The phenomenon that will appear electric discharge, this higher electric discharge of voltage can act directly on the circuit element on copper conductive layer top, for More accurate element, this electric discharge can directly result in element and the damage that can not be repaired occurs, serious to even result in entire electricity It burns on road.
Summary of the invention
The purpose of the utility model is to provide a kind of novel fire resistant double-sided wiring boards, are able to solve above-mentioned problem.
The utility model to achieve the above object, is achieved through the following technical solutions:
A kind of novel fire resistant double-sided wiring board, including glass shell, glass shell are that shell is closed made of glass-fiber-plate, Heat-conducting silica gel sheet is arranged in the side of glass shell, and copper conductive layer, the side setting of copper conductive layer is arranged in the side of heat-conducting silica gel sheet Teflon layer, the side of copper conductive layer connect the second intraphase conductor, and the side of heat-conducting silica gel sheet connects the first intraphase conductor, and first point is led One end of line and one end of the second intraphase conductor are all connected with ground line, and fixing groove is opened up in the middle part of glass shell, is filled out inside fixing groove Organic phase change material is filled, the side of glass shell connects rubber container, and rubber container is that shell, rubber are closed made of rubber membrane One end inside of the side connecting conduit of container, conduit is connected to the inside of rubber container, inside the other end of conduit and fixed The inside of slot is connected to, the inside installation semiconductor chilling plate of the glass shell, the input terminal connecting wire of semiconductor chilling plate, Wire connecting power.
In order to further realize the purpose of this utility model, following technical scheme can also be used:The rubber container Elastic auxiliary locator is installed in inside, and the elasticity auxiliary locator includes two positioning rings, two positioning rings respectively with The inside two sides of rubber container connect, and the side of positioning ring is bonded with the inner wall of rubber container, install number between two positioning rings A spring, one end of spring are connect with one of positioning ring, and the other end of spring is connect with another positioning ring.
The organic phase change material can be ethylene glycol, trimethylolethane or neopentyl glycol.
The utility model has the advantage of:Heat-conducting silica gel sheet is arranged in the bottom in copper conductive layer of the utility model, thermally conductive Silica gel piece had both had flexibility and had had with good thermal conductivity, be bonded heat-conducting silica gel sheet can either with copper conductive layer tightly, simultaneously The heat that copper conductive layer can be generated quickly introduces on glass shell, and glass shell itself has certain thermal conductivity, glass It after fine shell absorbs heat, can be transmitted on internal organic phase change material, organic phase change material can pass through phase transformation and oneself The mobility of body, heat is quickly transmitted to other regions of glass shell by fast endothermic simultaneously, so as to avoid copper conductive layer The phenomenon that hot-spot, thus a possibility that effectively reducing circuit burnout.The semiconductor chilling plate of the utility model can lead to The temperature that crossing electric energy reduces inside organic phase change material enables organic phase change material to reduce the temperature of organic phase change material It is enough persistently to cool down to circuit, avoid organic phase change material from overheating.The utility model also have it is simple for structure it is compact, manufacture at This is cheap and uses easy advantage.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:Fig. 1 is The structural schematic diagram of the utility model.
Specific embodiment
It is illustrated below in conjunction with preferred embodiment of the attached drawing to the utility model, it should be understood that described herein excellent It selects embodiment to be only used for describing and explaining the present invention, is not used to limit the utility model.
A kind of novel fire resistant double-sided wiring board, as shown in Figure 1, including glass shell 4, glass shell 4 is glass-fiber-plate system At closing shell, heat-conducting silica gel sheet 3 is arranged in the side of glass shell 4, and copper conductive layer 2, copper is arranged in the side of heat-conducting silica gel sheet 3 Teflon layer 1 is arranged in the side of conductive layer 2, and the side of copper conductive layer 2 connects the second intraphase conductor 13, the side of heat-conducting silica gel sheet 3 Connect the first intraphase conductor 12, one end of one end of the first intraphase conductor 12 and the second intraphase conductor 13 is all connected with ground line 14, glass shell The middle part of body 4 opens up fixing groove 9, and organic phase change material 10 is filled inside fixing groove 9, and the side connection rubber of glass shell 4 holds Device 6, rubber container 6 are that shell is closed made of rubber membrane, the side connecting conduit 11 of rubber container 6, in one end of conduit 11 Portion is connected to the inside of rubber container 6, is connected to inside the other end of conduit 11 with the inside of fixing groove 9, the glass shell 4 Inside install semiconductor chilling plate 5, the input terminal connecting wire 12 of semiconductor chilling plate 5, conducting wire 12 connect power supply.
Heat-conducting silica gel sheet 3 is arranged in the bottom in copper conductive layer 2 of the utility model, and heat-conducting silica gel sheet 3 had both had flexibility and had It with good thermal conductivity, be bonded heat-conducting silica gel sheet 3 can either with copper conductive layer 2 tightly, while copper conductive layer 2 can be produced Raw heat quickly introduces on glass shell 4, and glass shell 4 itself has certain thermal conductivity, and glass shell 4 absorbs heat Afterwards, can be transmitted on internal organic phase change material 10, organic phase change material 10 can by the mobility of phase transformation and itself, Heat is quickly transmitted to other regions of glass shell 4 by fast endothermic simultaneously, so as to avoid 2 hot-spot of copper conductive layer Phenomenon, thus a possibility that effectively reducing circuit burnout.The semiconductor chilling plate 5 of the utility model can be reduced by electric energy Temperature inside organic phase change material 10 enables organic phase change material 10 to hold to reduce the temperature of organic phase change material 10 It is continuous to cool down to circuit, avoid organic phase change material 10 from overheating.
Described the utility model fills organic phase change material 10 inside glass shell 3, can utilize organic phase-change material Expect the characteristics of 10 phase transformations absorb heat, when the circuit hot-spot on 3 top of glass shell, organic phase change material 10 can be inhaled Heat, and is quickly transmitted to other regions by the heat for receiving hot-spot, so as to avoid the hot-spot of glass shell 3, It effectively reduces route and overheats the probability burnt.The 10 preferred liquid organic phase change material of organic phase change material of the utility model, liquid Body organic phase change material quickly can be conducted heat by flowing, so as to facilitate the rapid cooling of glass shell 3.
Teflon layer 1 can cover most of region of copper conductive layer 2, avoid most of region of copper conductive layer 2 direct With air and moisture, so that copper conductive layer 2 be avoided the phenomenon that large area corrosion occur.The Teflon layer 1 of the utility model Surface has lower frictional force, and when extraneous sharp objects are contacted with Teflon layer 1, Teflon layer 1 can utilize surface Low-frictional force avoids being penetrated by sharp objects by sliding, or mitigates the scuffing of sharp objects, to effectively keep Teflon The integrality of layer, the phenomenon that avoiding copper conductive layer 2 from corroding.
Elastic auxiliary locator is installed in the inside of the rubber container 6, and the elasticity auxiliary locator includes two Positioning ring 7, two positioning rings 7 are connect with the inside two sides of rubber container 6 respectively, and the side of positioning ring 7 is interior with rubber container 6 Wall is bonded, and installs several springs 8 between two positioning rings 7, one end of spring 8 is connect with one of positioning ring 7, spring 8 The other end is connect with another positioning ring 7.
The elastic auxiliary locator of the utility model can utilize the connection of two positioning rings 7 and 6 inner wall of rubber container, Posture of the specification rubber container 6 in expansion and contraction avoids 6 surface of rubber container from excessive fold occur, influences internal gas The circulation of body.The spring 8 of the utility model can be combined into rubber container 6 using elastic force and two positioning rings 7 and play support work With posture of the further specification rubber container 6 in expansion and contraction.
The organic phase change material 10 can be ethylene glycol, trimethylolethane or neopentyl glycol.
Finally it should be noted that:The above descriptions are merely preferred embodiments of the present invention, is not limited to this Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic It is equivalently replaced.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on, It should be included within the scope of protection of this utility model.

Claims (3)

1. a kind of novel fire resistant double-sided wiring board, it is characterised in that:Including glass shell (4), glass shell (4) is glass-fiber-plate Heat-conducting silica gel sheet (3) are arranged in the side of manufactured closing shell, glass shell (4), and the side setting copper of heat-conducting silica gel sheet (3) is led Teflon layer (1) is arranged in the side of electric layer (2), copper conductive layer (2), and the side of copper conductive layer (2) connects the second intraphase conductor (13), The side of heat-conducting silica gel sheet (3) connects the first intraphase conductor (12), one end of the first intraphase conductor (12) and the second intraphase conductor (13) One end is all connected with ground line (14), is opened up in the middle part of glass shell (4) fixing groove (9), and organic phase-change is filled inside fixing groove (9) The side of material (10), glass shell (4) connects rubber container (6), and rubber container (6) is that shell is closed made of rubber membrane, One end inside of the side connecting conduit (11) of rubber container (6), conduit (11) is connected to the inside of rubber container (6), conduit (11) it is connected to inside the other end with the inside of fixing groove (9), semiconductor chilling plate is installed in the inside of the glass shell (4) (5), the input terminal connecting wire (12) of semiconductor chilling plate (5), conducting wire (12) connect power supply.
2. a kind of novel fire resistant double-sided wiring board according to claim 1, it is characterised in that:The rubber container (6) Inside elastic auxiliary locator is installed, the elasticity auxiliary locator includes two positioning rings (7), two positioning rings (7) it being connect respectively with the inside two sides of rubber container (6), the side of positioning ring (7) is bonded with the inner wall of rubber container (6), and two It is installed several springs (8) between a positioning ring (7), one end of spring (8) is connect with one of positioning ring (7), spring (8) The other end is connect with another positioning ring (7).
3. a kind of novel fire resistant double-sided wiring board according to claim 1, it is characterised in that:The organic phase change material It (10) is ethylene glycol, trimethylolethane or neopentyl glycol.
CN201820224038.0U 2018-02-08 2018-02-08 A kind of novel fire resistant double-sided wiring board Active CN208158972U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820224038.0U CN208158972U (en) 2018-02-08 2018-02-08 A kind of novel fire resistant double-sided wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820224038.0U CN208158972U (en) 2018-02-08 2018-02-08 A kind of novel fire resistant double-sided wiring board

Publications (1)

Publication Number Publication Date
CN208158972U true CN208158972U (en) 2018-11-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820224038.0U Active CN208158972U (en) 2018-02-08 2018-02-08 A kind of novel fire resistant double-sided wiring board

Country Status (1)

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CN (1) CN208158972U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110494016A (en) * 2019-08-06 2019-11-22 华为技术有限公司 A kind of radiator and terminal electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110494016A (en) * 2019-08-06 2019-11-22 华为技术有限公司 A kind of radiator and terminal electronic device

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