CN203068866U - Radiator assembly - Google Patents

Radiator assembly Download PDF

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Publication number
CN203068866U
CN203068866U CN 201220716778 CN201220716778U CN203068866U CN 203068866 U CN203068866 U CN 203068866U CN 201220716778 CN201220716778 CN 201220716778 CN 201220716778 U CN201220716778 U CN 201220716778U CN 203068866 U CN203068866 U CN 203068866U
Authority
CN
China
Prior art keywords
cooling device
refrigeration
thermal
semiconductor cooling
protective coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220716778
Other languages
Chinese (zh)
Inventor
何爱民
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HEFEI ZHISEM REFRIGERATION TECHNOLOGY Co Ltd
Original Assignee
HEFEI ZHISEM REFRIGERATION TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HEFEI ZHISEM REFRIGERATION TECHNOLOGY Co Ltd filed Critical HEFEI ZHISEM REFRIGERATION TECHNOLOGY Co Ltd
Priority to CN 201220716778 priority Critical patent/CN203068866U/en
Application granted granted Critical
Publication of CN203068866U publication Critical patent/CN203068866U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a radiator device, in particular to a radiator assembly. The radiator assembly comprises a refrigeration end, a semiconductor refrigeration component, a thermal-protective coating and a wing-type radiator, wherein the semiconductor refrigeration component is placed on the bottom of the refrigeration end, the thermal-protective coating surrounds the semiconductor refrigeration component, and the wing-type radiator is placed on the bottom of the semiconductor refrigeration component. The middle of an end face, contacted with the refrigeration end, of the semiconductor refrigeration component is provided with a U-shaped groove, and the protruding part on the bottom of the refrigeration end extends into the U-shaped groove of the semiconductor refrigeration component. A binding face of the thermal-protective coating and the refrigeration end and a binding face of the thermal-protective coating and a binding face of the semiconductor refrigeration component are respectively provided with a heat conduction silica gel. An installation frame is placed on the wing-type radiator, and two sides of the installation frame are installed in the thermal-protective coating. The thermal-protective coating is made of foam materials. The radiator assembly is reasonable in structural design, good in refrigeration effect, high in heat dissipation efficiency, fast in heat transfer and long in service life.

Description

A kind of heat sink assembly
Technical field
The utility model relates to a kind of heat abstractor, specifically relates to a kind of heat sink assembly.
Background technology
Heat spreader structures of the prior art, the laminating type between its refrigeration end and the semiconductor cooling device is plane contact, and radiating efficiency is low, and bonding strength is not high, and service life is shorter.
The utility model content
At the technical problem that exists in the prior art, the utility model provides a kind of heat sink assembly of reasonable in design.
To achieve these goals, the technical scheme of employing is as follows:
A kind of heat sink assembly is characterized in that, comprise refrigeration end, place refrigeration end bottom semiconductor cooling device, with semiconductor cooling device around thermal insulation layer, place the gilled radiator of semiconductor cooling device bottom; The middle part of the end face that contacts with refrigeration end on the semiconductor cooling device has the U-shaped groove, and refrigeration end bottom tab branch stretches in the U-shaped groove of semiconductor cooling device; The binding face of thermal insulation layer and refrigeration end, semiconductor cooling device is equipped with heat conductive silica gel.
Further, described gilled radiator is provided with installing rack, and the both sides of installing rack are installed in the thermal insulation layer.
Further, described thermal insulation layer is the frostproof froth n material.
The utility model heat sink assembly, reasonable in design, good refrigeration effect, the radiating efficiency height, the heat transmission is rapid, long service life.
Description of drawings
For the ease of it will be appreciated by those skilled in the art that below in conjunction with accompanying drawing the utility model is further described.
Fig. 1 is structural representation of the present utility model.
The specific embodiment
See also Fig. 1, a kind of heat sink assembly, comprise refrigeration end 1, place refrigeration end 1 bottom semiconductor cooling device 3, with semiconductor cooling device 3 around thermal insulation layer 7, place the gilled radiator 5 of semiconductor cooling device 3 bottoms.
The middle part of the end face that contacts with refrigeration end 1 on the semiconductor cooling device 3 has U-shaped groove 2, and refrigeration end 1 bottom tab branch stretches in the U-shaped groove 2 of semiconductor cooling device 3.
Thermal insulation layer 7 is equipped with heat conductive silica gel 4 with the binding face of refrigeration end 1, semiconductor cooling device 3.
Simultaneously, gilled radiator 5 is provided with installing rack 6, and the both sides of installing rack 6 are installed in the thermal insulation layer 7, and thermal insulation layer 7 is preferably the frostproof froth n material, and the material of gilled radiator 5 is preferably aluminium alloy.
As a kind of concrete embodiment, refrigeration end 1 is the bottom rack of Biochemical Analyzer, and when needs were lowered the temperature, semiconductor cooling device 3 was connected power supply, heat, is distributed to it in environment by gilled radiator 5 to the cold junction transmission at last by the hot junction of semiconductor cooling device 3.
Above content only is to the utility model structure example and explanation; under those skilled in the art described specific embodiment is made various modifications or replenish or adopt similar mode to substitute; only otherwise depart from the structure of utility model or surmount the defined scope of these claims, all should belong to protection domain of the present utility model.

Claims (3)

1. a heat sink assembly is characterized in that, comprise refrigeration end, place refrigeration end bottom semiconductor cooling device, with semiconductor cooling device around thermal insulation layer, place the gilled radiator of semiconductor cooling device bottom; The middle part of the end face that contacts with refrigeration end on the semiconductor cooling device has the U-shaped groove, and refrigeration end bottom tab branch stretches in the U-shaped groove of semiconductor cooling device; The binding face of thermal insulation layer and refrigeration end, semiconductor cooling device is equipped with heat conductive silica gel.
2. a kind of heat sink assembly according to claim 1 is characterized in that, described gilled radiator is provided with installing rack, and the both sides of installing rack are installed in the thermal insulation layer.
3. a kind of heat sink assembly according to claim 1 is characterized in that, described thermal insulation layer is the frostproof froth n material.
CN 201220716778 2012-12-24 2012-12-24 Radiator assembly Expired - Fee Related CN203068866U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220716778 CN203068866U (en) 2012-12-24 2012-12-24 Radiator assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220716778 CN203068866U (en) 2012-12-24 2012-12-24 Radiator assembly

Publications (1)

Publication Number Publication Date
CN203068866U true CN203068866U (en) 2013-07-17

Family

ID=48767645

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220716778 Expired - Fee Related CN203068866U (en) 2012-12-24 2012-12-24 Radiator assembly

Country Status (1)

Country Link
CN (1) CN203068866U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109030143A (en) * 2018-07-16 2018-12-18 安徽建筑大学 A kind of preposition pretreatment unit of gas analysis system
CN111000630A (en) * 2019-12-07 2020-04-14 北京芯动力激光科技有限公司 Hand-held semiconductor laser beauty device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109030143A (en) * 2018-07-16 2018-12-18 安徽建筑大学 A kind of preposition pretreatment unit of gas analysis system
CN111000630A (en) * 2019-12-07 2020-04-14 北京芯动力激光科技有限公司 Hand-held semiconductor laser beauty device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130717

Termination date: 20141224

EXPY Termination of patent right or utility model