CN103458657A - Heat dissipation system of large-power consumption stand-along device on satellite - Google Patents
Heat dissipation system of large-power consumption stand-along device on satellite Download PDFInfo
- Publication number
- CN103458657A CN103458657A CN2013103453776A CN201310345377A CN103458657A CN 103458657 A CN103458657 A CN 103458657A CN 2013103453776 A CN2013103453776 A CN 2013103453776A CN 201310345377 A CN201310345377 A CN 201310345377A CN 103458657 A CN103458657 A CN 103458657A
- Authority
- CN
- China
- Prior art keywords
- power consumption
- heat pipe
- large power
- consumption unit
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention provides a heat dissipation system of a large-power consumption stand-along device on a satellite. The heat dissipation system of the large-power consumption stand-along device on the satellite comprises the large-power consumption stand-along device, a first heat expansion plate, a main heat dissipation plate, a first embedded heat pipe, an externally-attached heat pipe, an auxiliary heat dissipation plate, a second heat expansion plate and a second embedded heat pipe, wherein the first heat expansion plate is installed between the large-power consumption stand-along device and the main heat dissipation plate, the first embedded heat pipe is arranged in the main heat dissipation plate, the second heat expansion plate is installed on the outer surface of the auxiliary heating dissipation plate, the second embedded heat pipe is embedded in the auxiliary heat dissipation plate, one end of the externally-attached heat pipe is installed on the outer surface, embedded in the first embedded heat pipe region, of the main heat dissipation plate, and the other end of the externally-attached heat pipe is installed on the heat dissipation surface of the auxiliary heat dissipation plate. The heat dissipation system of the large-power consumption stand-along device on the satellite has the advantages of being capable of effectively emitting heat of the large-power consumption stand-along device, controlling the temperature of the large-power consumption stand-along device to be in the ideal level, and being mature in heat dissipation method technology, high in reliability, full in material source, simple in technology, easy to achieve and low in using product and material cost.
Description
Technical field
The present invention relates to a kind of heat dissipating method, be specifically related to the heat dissipating method of large power consumption unit on a kind of satellite.
Background technology
Along with the development of satellite platform technology, the integrated level of unit is more and more higher, and the power density of unit is increasing.Special for the power-supply system unit used on Large-scale satellite, more than its peak power will reach 250W.In order to guarantee that unit reliablely and stablely works, require its working temperature to maintain lower temperature range, therefore need to seek good heat radiation approach, apply the thermal resistance that various thermal control measures reduce each link, control its temperature levels.
For the general unit on satellite, because its power consumption is little, only needs to take the surface spraying high emissivity coating, with the mode of mounting panel heat conduction installation, can control temperature.But for the unit of large power consumption, at first need heat diffusion is collected and will be reduced contact heat resistance simultaneously, then adopt efficient heat transfer element that heat is derived, finally by radiating surface by heat dissipation.
Summary of the invention
The objective of the invention is the mission requirements according to satellite platform, the heat dissipating method of the large power consumption unit of a kind of satellite is proposed, the method is to take full advantage of ripe thermal control technology to carry out the combination of various high-performance heat transfer components, set up thermal coupling between each parts, finally solve the heat dissipation problem of large power consumption unit.
Cooling system according to the large power consumption unit of satellite provided by the invention, comprise that large power consumption unit, first expands hot plate, main heating panel, the first pre-buried heat pipe, outer subsides heat pipe, auxiliary heat dissipation plate, the second expansion hot plate, the second pre-buried heat pipe, wherein: first expands hot plate is arranged between large power consumption unit and main heating panel, and the first pre-buried heat pipe is embedded in main heating panel; Second expands the outer surface that hot plate is arranged on the auxiliary heat dissipation plate, and the second pre-buried heat pipe is embedded in the auxiliary heat dissipation plate; One end of outer subsides heat pipe is arranged on the outer surface that main heating panel is buried the first pre-buried heat pipe zone underground, and the other end is arranged on the radiating surface of auxiliary heat dissipation plate.
Preferably, the surface of large power consumption unit is provided with aluminium alloy black anodizing thermal control coating.
Preferably, expand between hot plate and/or, between the first expansion hot plate and main heating panel, be filled with heat filling at large power consumption unit and first.
Preferably, heat filling is the D3 heat-conducting silicone grease.
Preferably, the first expansion hot plate is the aluminium alloy plate that thickness 2mm, area are greater than main heating panel.
Preferably, the I shape diplopore aluminium ammonia heat pipe that the first pre-buried heat pipe is width 30mm, height 29.1mm, the short transverse of the first pre-buried heat pipe is close to the cellular board upper and lower panel of main heating panel.
Preferably, the Ω shape single hole heat pipe that outer subsides heat pipe is fin width 50mm, diameter of phi 10.
Preferably, the emissivity of aluminium alloy black anodizing thermal control coating is greater than 0.88.
Preferably, the outer surface of main heating panel, auxiliary heat dissipation plate is pasted with OSR second surface mirror thermal control coating.
Preferably, the bearing of trend of the second pre-buried heat pipe is arranged along the vertical direction of outer subsides heat pipe.
Compared with prior art, beneficial effect of the present invention is as follows:
(1) heat of large power consumption unit effectively can be discharged, control its temperature in desirable level;
(2) heat dissipating method technology maturation, reliability is high;
(3) material source is abundant, and technique is simple, is easy to realize;
(4) the product that uses and material cost lower.
The accompanying drawing explanation
By reading the detailed description of non-limiting example being done with reference to the following drawings, it is more obvious that other features, objects and advantages of the present invention will become:
Fig. 1 is the schematic diagram of the heat dissipating method of the large power consumption unit of satellite according to the present invention.
In figure:
1 is large power consumption unit;
2 for expanding hot plate;
3 is pre-buried heat pipe;
4 is outer subsides heat pipe;
5 is main heating panel;
6 is the auxiliary heat dissipation plate.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.Following examples will contribute to those skilled in the art further to understand the present invention, but not limit in any form the present invention.It should be pointed out that to those skilled in the art, without departing from the inventive concept of the premise, can also make some distortion and improvement.These all belong to protection scope of the present invention.
In order to solve the heat dissipation problem of large power consumption unit, the specific embodiment of the present invention is as follows:
The heat dissipating method of the large power consumption unit of satellite provided by the invention, comprise aluminium alloy black anodizing thermal control coating, expand hot plate 2, heat filling, pre-buried heat pipe 3, outer subsides heat pipe 4, main heating panel 5(be the unit mounting panel) on main radiating surface and the auxiliary heat dissipation face on auxiliary heat dissipation plate 6.Aluminium alloy black anodizing processing is carried out on the surface of large power consumption unit 1, forms aluminium alloy black anodizing thermal control coating, makes the emissivity of aluminium alloy black anodizing thermal control coating be greater than 0.88; A thick aluminium alloy of 2mm is installed between large power consumption unit 1 and main heating panel 5 and is expanded hot plate 2; Large power consumption unit 1 with expand between hot plate 2, expand filling D3 heat-conducting silicone grease between hot plate 2 and main heating panel 5; At the pre-buried heat pipe 3 of I shape diplopore aluminium ammonia of the interior pre-buried 3 width 30mm of main heating panel 5, height 29.1mm, the Width of pre-buried heat pipe 3 is close to the cellular board upper and lower panel; Outer surface in the pre-buried heat pipe of main heating panel 5 zone adopts the M4 screw to install outside the Ω shape single hole of 2 fin width 50mm, diameter of phi 10 and pastes heat pipe 4, and the other end of outer subsides heat pipe 4 is arranged on the auxiliary heat dissipation face of auxiliary heat dissipation plate 6; The inner pre-buried 3 pre-buried heat pipes 3 of auxiliary heat dissipation plate 6, direction is arranged along the vertical direction of outer subsides heat pipe 4, the outer surface of auxiliary heat dissipation plate 6 is installed a 2mm and is expanded hot plate 2, heat diffusion by outer subsides heat pipe 4, finally in the outside of main radiating surface and auxiliary heat dissipation face, paste the OSR fin, by the heat dissipation of collecting.
Above specific embodiments of the invention are described.It will be appreciated that, the present invention is not limited to above-mentioned specific implementations, and those skilled in the art can make various distortion or modification within the scope of the claims, and this does not affect flesh and blood of the present invention.
Claims (10)
1. the cooling system of the large power consumption unit of satellite, it is characterized in that, comprise that large power consumption unit, first expands hot plate, main heating panel, the first pre-buried heat pipe, outer subsides heat pipe, auxiliary heat dissipation plate, the second expansion hot plate, the second pre-buried heat pipe, wherein: first expands hot plate is arranged between large power consumption unit and main heating panel, and the first pre-buried heat pipe is embedded in main heating panel; Second expands the outer surface that hot plate is arranged on the auxiliary heat dissipation plate, and the second pre-buried heat pipe is embedded in the auxiliary heat dissipation plate; One end of outer subsides heat pipe is arranged on the outer surface that main heating panel is buried the first pre-buried heat pipe zone underground, and the other end is arranged on the radiating surface of auxiliary heat dissipation plate.
2. the cooling system of the large power consumption unit of satellite according to claim 1, is characterized in that, the surface of large power consumption unit is provided with aluminium alloy black anodizing thermal control coating.
3. the cooling system of the large power consumption unit of satellite according to claim 1, is characterized in that, at large power consumption unit and first, expands between hot plate and/or, between the first expansion hot plate and main heating panel, be filled with heat filling.
4. the cooling system of the large power consumption unit of satellite according to claim 3, is characterized in that, heat filling is the D3 heat-conducting silicone grease.
5. the cooling system of the large power consumption unit of satellite according to claim 1, is characterized in that, the first expansion hot plate is the aluminium alloy plate that thickness 2mm, area are greater than main heating panel.
6. the cooling system of the large power consumption unit of satellite according to claim 1, it is characterized in that, the I shape diplopore aluminium ammonia heat pipe that the first pre-buried heat pipe is width 30mm, height 29.1mm, the short transverse of the first pre-buried heat pipe is close to the cellular board upper and lower panel of main heating panel.
7. the cooling system of the large power consumption unit of satellite according to claim 1, is characterized in that, the Ω shape single hole heat pipe that outer subsides heat pipe is fin width 50mm, diameter of phi 10.
8. the cooling system of the large power consumption unit of satellite according to claim 2, is characterized in that, the emissivity of aluminium alloy black anodizing thermal control coating is greater than 0.88.
9. the cooling system of the large power consumption unit of satellite according to claim 1, is characterized in that, the outer surface of main heating panel, auxiliary heat dissipation plate is pasted with OSR second surface mirror thermal control coating.
10. the cooling system of the large power consumption unit of satellite according to claim 1, is characterized in that, the bearing of trend of the second pre-buried heat pipe is arranged along the vertical direction of outer subsides heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103453776A CN103458657A (en) | 2013-08-08 | 2013-08-08 | Heat dissipation system of large-power consumption stand-along device on satellite |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103453776A CN103458657A (en) | 2013-08-08 | 2013-08-08 | Heat dissipation system of large-power consumption stand-along device on satellite |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103458657A true CN103458657A (en) | 2013-12-18 |
Family
ID=49740467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103453776A Pending CN103458657A (en) | 2013-08-08 | 2013-08-08 | Heat dissipation system of large-power consumption stand-along device on satellite |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103458657A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455450A (en) * | 2016-11-22 | 2017-02-22 | 上海卫星工程研究所 | High-isothermal lightweight application method of satellite heat pipes |
| CN107995825A (en) * | 2017-10-23 | 2018-05-04 | 上海卫星工程研究所 | The high heat consumption unit lightweight cooling system of satellite based on heat pipe |
| CN108791959A (en) * | 2018-06-15 | 2018-11-13 | 上海卫星工程研究所 | Star sensor lightweight thermal controls apparatus based on structure mounting plate |
| CN109219319A (en) * | 2018-10-30 | 2019-01-15 | 航天东方红卫星有限公司 | A kind of isothermal integral heat dissipation device suitable for micro-nano satellite |
| CN109757087A (en) * | 2019-02-22 | 2019-05-14 | 江西立德科技有限公司 | Heat dissipation type radiator |
| CN111930163A (en) * | 2020-08-17 | 2020-11-13 | 中国科学院微小卫星创新研究院 | Satellite-borne single machine differential temperature control system and method |
| CN111964933A (en) * | 2020-08-17 | 2020-11-20 | 中国科学院微小卫星创新研究院 | Satellite ground test cabin based on single-phase fluid circuit |
| CN115291458A (en) * | 2022-07-22 | 2022-11-04 | 上海卫星工程研究所 | Satellite-borne camera multi-difference power consumption refrigerating unit, combined heat control method and satellite |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0725395A (en) * | 1993-07-12 | 1995-01-27 | Nec Corp | Heat radiator of apparatus mounted on artificial satellite |
| JPH11148787A (en) * | 1997-11-17 | 1999-06-02 | Mitsubishi Electric Corp | Heat pipe sandwich panel |
| JPH11159981A (en) * | 1997-11-28 | 1999-06-15 | Toshiba Corp | Heat pipe thermal coupler |
| JP2004019990A (en) * | 2002-06-13 | 2004-01-22 | Mitsubishi Electric Corp | Sandwich panel with heat pipe |
| CN2713641Y (en) * | 2004-06-09 | 2005-07-27 | 珍通科技股份有限公司 | Heat sink |
| JP2008194876A (en) * | 2007-02-09 | 2008-08-28 | Mitsubishi Electric Corp | Sandwich panel with embedded heat pipe |
| CN201327810Y (en) * | 2008-11-28 | 2009-10-14 | 北京空间飞行器总体设计部 | Externally-bonded heat pipe soaking type traveling-wave tube heat dissipating device |
| CN102079386A (en) * | 2009-11-30 | 2011-06-01 | 上海卫星工程研究所 | Simply constructed heat transfer device for stand-alone radiating of space vehicle |
| CN102092483A (en) * | 2009-12-11 | 2011-06-15 | 上海卫星工程研究所 | Heat transfer device used for radiating single machine of space vehicle |
| CN102569932A (en) * | 2010-12-10 | 2012-07-11 | 上海卫星工程研究所 | Temperature control device of storage battery for spacecraft |
| CN102673803A (en) * | 2011-03-17 | 2012-09-19 | 塔莱斯公司 | Structural satellite panel with integrated heat exchangers |
-
2013
- 2013-08-08 CN CN2013103453776A patent/CN103458657A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0725395A (en) * | 1993-07-12 | 1995-01-27 | Nec Corp | Heat radiator of apparatus mounted on artificial satellite |
| JPH11148787A (en) * | 1997-11-17 | 1999-06-02 | Mitsubishi Electric Corp | Heat pipe sandwich panel |
| JPH11159981A (en) * | 1997-11-28 | 1999-06-15 | Toshiba Corp | Heat pipe thermal coupler |
| JP2004019990A (en) * | 2002-06-13 | 2004-01-22 | Mitsubishi Electric Corp | Sandwich panel with heat pipe |
| CN2713641Y (en) * | 2004-06-09 | 2005-07-27 | 珍通科技股份有限公司 | Heat sink |
| JP2008194876A (en) * | 2007-02-09 | 2008-08-28 | Mitsubishi Electric Corp | Sandwich panel with embedded heat pipe |
| CN201327810Y (en) * | 2008-11-28 | 2009-10-14 | 北京空间飞行器总体设计部 | Externally-bonded heat pipe soaking type traveling-wave tube heat dissipating device |
| CN102079386A (en) * | 2009-11-30 | 2011-06-01 | 上海卫星工程研究所 | Simply constructed heat transfer device for stand-alone radiating of space vehicle |
| CN102092483A (en) * | 2009-12-11 | 2011-06-15 | 上海卫星工程研究所 | Heat transfer device used for radiating single machine of space vehicle |
| CN102569932A (en) * | 2010-12-10 | 2012-07-11 | 上海卫星工程研究所 | Temperature control device of storage battery for spacecraft |
| CN102673803A (en) * | 2011-03-17 | 2012-09-19 | 塔莱斯公司 | Structural satellite panel with integrated heat exchangers |
Non-Patent Citations (1)
| Title |
|---|
| 邵兴国等: "热管技术在航天领域应用和发展前景", 《第十届全国热管会议论文集》, 12 April 2011 (2011-04-12) * |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455450A (en) * | 2016-11-22 | 2017-02-22 | 上海卫星工程研究所 | High-isothermal lightweight application method of satellite heat pipes |
| CN106455450B (en) * | 2016-11-22 | 2019-01-25 | 上海卫星工程研究所 | The high isothermal lightweight application method of star heat pipe |
| CN107995825A (en) * | 2017-10-23 | 2018-05-04 | 上海卫星工程研究所 | The high heat consumption unit lightweight cooling system of satellite based on heat pipe |
| CN108791959A (en) * | 2018-06-15 | 2018-11-13 | 上海卫星工程研究所 | Star sensor lightweight thermal controls apparatus based on structure mounting plate |
| CN109219319A (en) * | 2018-10-30 | 2019-01-15 | 航天东方红卫星有限公司 | A kind of isothermal integral heat dissipation device suitable for micro-nano satellite |
| CN109757087A (en) * | 2019-02-22 | 2019-05-14 | 江西立德科技有限公司 | Heat dissipation type radiator |
| CN111930163A (en) * | 2020-08-17 | 2020-11-13 | 中国科学院微小卫星创新研究院 | Satellite-borne single machine differential temperature control system and method |
| CN111964933A (en) * | 2020-08-17 | 2020-11-20 | 中国科学院微小卫星创新研究院 | Satellite ground test cabin based on single-phase fluid circuit |
| CN111930163B (en) * | 2020-08-17 | 2021-06-08 | 中国科学院微小卫星创新研究院 | Satellite-borne single machine differential temperature control system and method |
| CN113359908A (en) * | 2020-08-17 | 2021-09-07 | 中国科学院微小卫星创新研究院 | Spacecraft satellite-borne single machine on-orbit temperature control system and method |
| CN113359908B (en) * | 2020-08-17 | 2022-06-28 | 中国科学院微小卫星创新研究院 | Spacecraft satellite-borne single machine on-orbit temperature control system and method |
| CN115291458A (en) * | 2022-07-22 | 2022-11-04 | 上海卫星工程研究所 | Satellite-borne camera multi-difference power consumption refrigerating unit, combined heat control method and satellite |
| CN115291458B (en) * | 2022-07-22 | 2024-03-12 | 上海卫星工程研究所 | Satellite-borne camera multiple differential power consumption refrigerating unit, combined heat control method and satellite |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103458657A (en) | Heat dissipation system of large-power consumption stand-along device on satellite | |
| CN103448924B (en) | A kind of satellite heating integrated device of machine of large power consumption solar array driver train | |
| CN103531652B (en) | A kind of chiller of disc type solar energy condensation photovoltaic cell panel | |
| CN205227491U (en) | Solar energy comprehensive utilization system | |
| CN102569932A (en) | Temperature control device of storage battery for spacecraft | |
| CN102299614A (en) | Semiconductor-refrigeration-based inverter radiating system | |
| CN109219319A (en) | A kind of isothermal integral heat dissipation device suitable for micro-nano satellite | |
| CN105591565A (en) | Thermoelectric generation apparatus utilizing solar energy | |
| CN105515527A (en) | Solar energy coupling multi-source heat pump integrated system | |
| CN203799328U (en) | CPU (central processing unit) radiator | |
| CN203072301U (en) | Heat radiation structure of mining electronic locomotive controller | |
| CN103256751B (en) | A kind of energy-saving semiconductor cold-hot conversion equipment and control method thereof | |
| CN205355038U (en) | Heat pipe cooling ware structure of IGBT module in converter | |
| CN204498550U (en) | Radiating subassembly | |
| CN202261069U (en) | Inverter cooling system based on semiconductor refrigeration | |
| CN203068866U (en) | Radiator assembly | |
| CN205911641U (en) | Static synchronous compensation arrangement of liquid cooling | |
| CN205079489U (en) | Utilize superconductive hot pin to absorb integrated supply system of energy of ground source heat | |
| CN203934241U (en) | A kind of Microwave Power Tubes heat abstractor | |
| CN203797602U (en) | Heat sink expansion structure assembly | |
| CN207800596U (en) | A kind of combined heat radiating system | |
| CN106357161A (en) | Installing structure of temperature-difference power generation module | |
| CN102545715A (en) | Atmospheric temperature difference power generation device | |
| CN201226629Y (en) | High-efficiency cooling device for electronic module | |
| CN202083258U (en) | Tabular heat pipe with enlarged single side |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20131218 |