CN201226629Y

CN201226629Y - High-efficiency cooling device for electronic module

Info

Publication number: CN201226629Y
Application number: CNU200820037714XU
Authority: CN
Inventors: 王建明; 陈正涛; 赵宇; 储九良; 石滨泉
Original assignee: JIANGSU YONGSHENG AIR CONDITIONER CO Ltd
Current assignee: JIANGSU YONGSHENG AIR CONDITIONER CO Ltd
Priority date: 2008-06-19
Filing date: 2008-06-19
Publication date: 2009-04-22
Anticipated expiration: 2018-06-19

Abstract

The utility model provides a high-efficiency cooling device of an electronic module; a base plate of the electronic module is jointed with a cold plate of a radiating piece; the radiating piece comprises a fin, an installation plate, heat pipes and the cold plate; the fin and the installation plate go through the upper part of a plurality of heat pipes which are lined in parallel at intervals; the cold plate goes through the lower part of the heat pipes; the fin is arranged on the installation plate; the installation plate is fixed in the inner cavity of an air pipe. The heat pipes are used for radiating and intermediate heat medium in the heat pipes realizes evaporation and condensation circulation under natural convection or the pressure of capillary, so that the heat conduction is fast, the cooling efficiency is greatly improved and the safety of the electronic heating module is effectively protected; the heat of a plurality of sets of heating modules is transmitted to the fin and exhausted through the same air pipe, so that the indoor heat pollution is reduced, the structure is simple, the noise is reduced, the air volume required by the system is obviously reduced and the power consumption is reduced; the full sealing of the electronic equipment case is easy to be realized, and the ''three protection'' of the whole system is easy.

Description

The highly efficient cooling device of electronic module

Technical field

The utility model relates to a kind of highly efficient cooling device of electronic module, is applicable to electronic applications such as land vehicle electronic device, avionic device.

Background technology

At electronic applications, the heat dissipation problem of electronic heating module is the hot issue of this area research always.Most of forced air cooling that adopts is promptly directly dried to the radiator that is installed on the heating module by blower fan in the prior art, makes the radiator cooling, thereby reaches cooling purpose.But there is following shortcoming in actual use in this structure: the 1. design complexity in air channel, as the air quantity maldistribution between the heating module, air quantity distributes the radiating efficiency of few radiator to reduce greatly, the temperature of electronic module is then up to 100-120 ℃, even reach more than 150 ℃, so high temperature very easily causes the damage of electronic heating module; 2. institute's required airflow is big, though wind cabinet pressure head is very little, power consumption is bigger; 3. because of extraneous cold wind directly blows to heating module, so whole " three is anti-" ability.

Summary of the invention

In order to overcome above-mentioned the deficiencies in the prior art, the purpose of this utility model has provided a kind of reasonable in design, and good heat dissipation effect is used for the highly efficient cooling device of electronic heating module.

The technical solution adopted in the utility model is: the highly efficient cooling device of electronic module comprises cabinet, cabinet keyset, is connected to form airduct, the electronic module in air channel with the cabinet keyset, the baseplate-laminating of described electronic module is on the cold drawing of heat sink, described heat sink comprises elongated fin, mounting panel and cold drawing, and at least one heat pipe that above parallel interval is arranged, described elongated fin, mounting panel and cold drawing all is set on the heat pipe of at least one above parallel interval arrangement.

The technical program comprises that also described fin is seated on the mounting panel, fin and mounting panel are set in the heat pipe top more than at least one in the lump, and be fixed on the cabinet keyset by mounting panel and place in the air channel, described cold drawing is set in the heat pipe bottom more than at least one.

Be installed on by many heat sink parallel interval and form the heat radiation group on the cabinet keyset.

The heat transfer ester is smeared in the cold drawing joint place of the substrate of electronic module and heat sink.

Because adopt above technical scheme, the beneficial effects of the utility model are as follows:

1, adopt heat pipe to dispel the heat, the heating agent in the heat pipe is realized evaporation, condensation cycle under free convection or capillary pressure function, and heat conduction is fast, has improved cooling effectiveness greatly, has protected the safety of electronic heating module effectively.

2, this apparatus structure is reasonable in design, is convenient to safeguard, the moving component of entire heat dissipation system reduces, and has more reliability.

3, realize the hermetically sealed of electronic equipment chassis easily, " three is anti-" of entire system is easy.

4, organize heat that electronic heating module heat is passed to fin more and concentrate by same airduct and discharge, reduces indoor thermal pollution, simple in structure, reduce noise, institute of system required airflow obviously reduces, the power consumption minimizing.

Description of drawings

Fig. 1 is the structural representation of this device;

Fig. 2 is the structural representation of heat sink;

Fig. 3 is the lateral plan of Fig. 2 heat sink.

Among the figure, fin 1, mounting panel 2, heat pipe 3, cold drawing 4, airduct 5, electronic module 6, cabinet 7, cabinet keyset 8.

Embodiment

Below in conjunction with the drawings and specific embodiments the utility model is further described.

In shown in Fig. 1,2,3, a kind of highly efficient cooling device of electronic module, comprise cabinet 7, cabinet keyset 8, airduct 5, electronic module 6, heat sink, heat sink comprises elongated fin 1, mounting panel 2 and cold drawing 4 and the heat pipe 3 that above parallel interval is arranged, elongated fin 1, mounting panel 2 are set in the top of many heat pipes, and the heat pipe top is passed cabinet keyset cold drawing and is entered in the airduct, the fin, the mounting panel that are set on heat pipe top all are in the air channel of airduct, and are installed on the cabinet keyset by mounting panel; The bottom that cold drawing is set in many heat pipes is positioned at cabinet, and the place of wearing adopts tube expansion technique, and the feasible place's expanded joint that wears is tight, is connected firmly; Electronic module 6 substrates paste mutually with the cold drawing 4 of heat sink, and smear heat transfer fat in subsides place mutually.

Be installed on by many heat sink parallel interval and form the heat radiation group on the cabinet keyset.During use, the heat of electronic module 6 is passed to cold drawing 4 by substrate, by the evaporation of heating agents in the middle of in the heat pipe 3, the circulation of condensation heat is conducted to radiating fin 1, heat is passed to cooling air in the air channel, take away the heat that electronic module 6 distributes by cooling air by fin 1.

Increase and decrease the quantity of heat sink arbitrarily according to the number of electronic heating module, the fin of heat radiation group all places in the same elongated airduct, concentrates discharges heat.

Claims

1, a kind of highly efficient cooling device of electronic module, comprise cabinet (7), cabinet keyset (8), be connected to form airduct (5), the electronic module (6) in air channel with the cabinet keyset, it is characterized in that: the baseplate-laminating of electronic module (6) is on the cold drawing (4) of heat sink, described heat sink comprises elongated fin (1), mounting panel (2) and cold drawing (4), and at least one heat pipe (3) that above parallel interval is arranged, described elongated fin, mounting panel and cold drawing all is set on the heat pipe of at least one above parallel interval arrangement.

2, the highly efficient cooling device of electronic module according to claim 1, it is characterized in that: described fin is seated at the mounting panel upper sleeve through on the heat pipe top more than at least one, and be fixed on the cabinet keyset by mounting panel and place in the air channel, described cold drawing is set in the heat pipe bottom more than at least one.

3, the highly efficient cooling device of electronic module according to claim 1 is characterized in that: be installed on by many heat sink parallel interval and form the heat radiation group on the cabinet keyset.

4, the highly efficient cooling device of electronic module according to claim 1 is characterized in that: the heat transfer ester is smeared in the cold drawing joint place of the substrate of electronic module and heat sink.