JP2008194876A - Sandwich panel with embedded heat pipe - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a heat transfer amount to a panel from deteriorating even when electronic equipment mounted on the sandwich panel with an embedded heat pipe generates a large amount of heat. <P>SOLUTION: A block having a cavity and the heat pipe adhere with each other by an adhesive, adhere to a skin material. After the skin is bonded in the state that the block is embedded in a core material with the sandwich panel integrally molded, a female screw hole is machined on the block to form the panel. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a heat pipe embedded sandwich panel used for an artificial satellite (hereinafter referred to as satellite).

In a conventional heat pipe embedded sandwich panel (hereinafter referred to as a panel), an insert for fixing an electronic device is bonded to the panel with an adhesive, and the electronic device is fastened to the insert with a bolt or the like (for example, a patent) Reference 1). Adhesion of the insert to the panel occurs after the panel is manufactured. At this time, a hole is punched through the panel, and an insert in which an internal thread is formed in advance is inserted into the hole, and the insert is bonded.
Japanese Patent Laid-Open No. 11-105174 (FIG. 1)

  However, the adhesive of the insert is hardened at a temperature lower than the temperature at the time of molding the panel. When the heat generating electronic device generates heat, the temperature of the adhesive of the insert rises before the panel is thermally damaged. The adhesive softens. Thus, when the insert is pulled toward the electronic device by the fastening force of the bolt, the fastening force of the bolt is reduced. As the calorific value of the electronic device increases, the problem of a decrease in bolt fastening force becomes obvious.

  Thus, when the fastening force of a volt | bolt falls, since the adhesiveness to the panel of an electronic device is reduced and a contact thermal resistance is increased, heat transfer is inhibited. This is a fatal problem for an electronic device whose temperature is lowered by transferring heat to the heat pipe.

  Therefore, in the conventional method for mounting high heat-generating equipment, when the electronic equipment generates a large amount of heat, there is a problem that the amount of heat transferred to the panel is reduced.

  The present invention has been made to solve such a problem, and even when an electronic device mounted on a heat pipe embedded sandwich panel generates a large amount of heat, the amount of heat transferred to the panel is reduced. The purpose is to mount an electronic device without using it.

A heat pipe-embedded sandwich panel according to the present invention comprises a block having a female screw hole and a cavity for fastening a highly heat-generating electronic device, a heat pipe, a skin material, and a core material sandwiched between the skin materials. A heat pipe embedded sandwich panel that is bonded and integrally molded with an adhesive that cures at a temperature applied during molding,
The block and the heat pipe are in close contact with each other with an adhesive, and in close contact with the skin material with an adhesive,
After the skin is bonded and the sandwich panel is integrally formed with the block embedded in the core material, a female screw hole is processed in the block so as to reach the cavity of the block or its periphery, It is formed.

  According to this invention, the block is bonded to the skin material, the core material, and the heat pipe at the time of forming the sandwich panel, and the adhesive is used to fix the block by using an adhesive that cures at a temperature applied at the time of forming the sandwich panel. By giving the adhesive the same heat resistance as the sandwich panel body, even if the mounted electronic device generates a large amount of heat, the adhesive that bonds the block will not be softened, and the fastening part will fasten the electronic device It is possible to suppress a decrease in the fastening force.

Embodiment 1 FIG.
Hereinafter, a heat pipe-embedded sandwich panel (hereinafter referred to as a panel) according to Embodiment 1 of the present invention will be described with reference to the drawings.
1A and 1B are diagrams illustrating examples of usage and structure of a panel. FIG. 1A is a perspective view showing a state in which a plurality of electronic devices are mounted on the panel, and FIG. .

  In FIG. 1B, the panel is formed by integrally bonding a skin material 1a, a skin material 1b, and a core material 2 with an adhesive 7. A heat pipe 4 and a block 5 are embedded inside the panel. The skin material 1a and the skin material 1b are panel skin materials. For example, an aluminum sheet skin is used. The core material 2 is a honeycomb core for adding rigidity to the panel. For example, an aluminum honeycomb core is used. The electronic device 3 is equipped with an amplifier, an arithmetic processor, and the like, and generates a large amount of heat by its operation. The electronic device 3 is mounted on a panel and mounted on a surface that is on the inner surface side of the satellite. The heat pipe 4 is embedded in the panel. In addition, between the skin material 1a and the skin material 1b, the heat pipe 4 may be embedded and adhere | attached in the space from which the core material 2 was removed. Thus, the surface of the heat pipe 4 opposite to the skin material 1a is directly bonded to the skin material 1b, and heat exchange between the skin materials 1a and 1b is promoted.

  The block 5 is composed of a massive member in which a female screw 50 for fixing the electronic device 3 is formed. The block 5 is provided with a light hole 6 that forms a cavity for weight reduction. The center of gravity of the light hole 6 is located closer to the core material 2 (lower side) than the cross-sectional center of the outer shape of the block 5. Accordingly, the weight of the light hole 6 is reduced while increasing the outer shape of the block 5, and sufficient adhesive strength is secured between the outer surface of the block 5 and the core material 2. In addition, inside the block 5, the end of the hole of the female screw 50 reaches the inside of the light hole 6 or its periphery. The light holes 6 are continuously formed along the longitudinal direction (heat transfer direction) of the heat pipe 4, which is the front-rear direction of the drawing, by the extrusion process similar to that of the heat pipe 4.

  The adhesive 7 integrally bonds the block 5, the skin materials 1 a and 1 b, the core material 2, and the heat pipe 4. The adhesive 7 is cured at a predetermined high temperature that is applied when the sandwich panel is formed. By curing of the adhesive 7, between the block 5 and the skin materials 1a and 1b, between the block 5 and the core material 2, between the block 5 and the heat pipe 4, and between the heat pipe 4 and the skin materials 1a and 1b, There is a close contact between them. The bolt 8 is a fastening part for fastening the electronic device 3 to the panel.

The internal thread 50 of the block 5 is processed and molded through the skin material 1a after the panel is molded. That is, after the adhesive 7 is hardened and the panel is integrally formed, the surface material 1a and the block 5 are cut with a drill, and then the female screw 50 is formed on the block 5. At this time, the skin material 1a may or may not be provided with the internal thread 50. When the female thread 50 is not provided in the skin material 1a, a hole having a diameter larger than that of the female thread 50 may be provided in the skin material 1a. Thus, by processing the female screw 50 of the block 5 after the panel is molded, a predetermined hole position accuracy can be secured for the female screw 50.
In addition, when processing so that the female screw 50 reaches the inside of the light hole 6, the efficiency of hole processing of the female screw 50 is improved, and it is not necessary to provide a separate air vent hole mixed in the light hole 6. The processing efficiency is improved. On the other hand, when drilling the internal thread 50 to such an extent that the internal thread 50 does not reach the inside of the light hole 6, the thread from the threaded hole processing does not enter the interior of the light hole 6, and the remaining chips Removal work is reduced.

  Further, since the block 5 is bonded to the skin material 1a, the core material 2, and the heat pipe 4 which are peripheral members at the time of forming the panel, as described above, an adhesive that cures at a temperature applied at the time of forming the panel is used. Can be used. Thereby, in the adhesion fixation of the block 5, it can have the same heat resistant strength as a panel main body. Even when the electronic device 3 generates a large amount of heat, the adhesive 7 that bonds the block 5 does not soften, so that the fastening force of the bolt 8 that fastens the electronic device 3 does not decrease. That is, the strength of the base material of the female screw is improved as compared with the conventional panel in which the insert provided with the female screw is inserted.

FIG. 2 shows a heat path transmitted from the electronic device to the heat pipe.
Here, as a material of the block 5, for example, an aluminum alloy which is a material having excellent thermal conductivity is used. Further, as the adhesive between the block 5 and the heat pipe 4, an adhesive having high thermal conductivity is used.

  In this case, in addition to the normal heat transfer path 11 through the heat pipe 4 as a heat transfer path for transferring the heat of the electronic device 3, another heat transfer path for transferring heat to the heat pipe 4 via the block 5. 12 can be provided. This has the effect of improving the performance of the heat pipe panel 4. Moreover, since the light hole 6 is provided, the heat from the electronic device 3 does not go toward the core material 2, but most of the heat is transmitted to the heat pipe panel 4 on the side of the block 5.

  The heat transfer amount of the block can be appropriately adjusted by changing the size of the block 5 and the size of the light hole 6. At this time, the upper boundary surface of the light hole 6 can enter the lower end of the hole of the female screw 50 or can be brought close to the vicinity of the lower end of the hole. Further, by increasing the outer shape of the block 5, the adhesion area with the periphery can be increased, and the pulling strength in the panel surface outward direction can be increased at the fastening portion for fastening the electronic device 3. Further, as another form, the cross section of the light hole 6 is formed in a triangular shape whose hypotenuse faces the electronic device 3 and the heat pipe panel 4 as shown in FIG. It is also possible.

Embodiment 2. FIG.
FIG. 4 is a diagram showing a configuration of a heat pipe embedded sandwich panel (hereinafter referred to as a panel) according to Embodiment 2 of the present invention. In the figure, as a panel in which a plurality of heat pipes are embedded, for example, a case where two stages of heat pipes are embedded is shown.

  In FIG. 4, the configurations indicated by reference numerals 1 to 8 are the same as those in the first embodiment. The panel of the second embodiment is further provided with a lower heat pipe 21. The heat pipe 21 is embedded in a shape orthogonal to the heat pipe 4 arranged immediately below the electronic device 3. The heat pipe 21 is stacked with the upper surface thereof in close contact with the heat pipe 4 and bonded to the heat pipe 4. The lower surface of the heat pipe 21 is adhered and adhered to the skin material 1b. Further, the block 5 is directly bonded to the upper surface of the heat pipe 21. By comprising in this way, the same heat resistance strength as a panel main body can be given with respect to the block 5 in which the internal thread 50 which fastens the electronic device 3 was formed. Even when the electronic device 3 generates a large amount of heat, the adhesive 7 that bonds the block 5 is not softened, and the fastening force of the bolt 8 that fastens the electronic device 3 does not decrease.

  FIG. 5 shows the flow of heat transferred from the electronic device to the heat pipe in the second embodiment. Here, the block 5 is directly bonded to the lower heat pipe 21. By using an adhesive with high thermal conductivity for this adhesive, in addition to the normal heat transfer path 11, heat is transmitted not only to the heat pipe 4 directly below but also to the lower heat pipe 21 via the block 5. A heat transfer path 31 can be provided. Thus, the performance of the heat pipe panel can be further improved.

Embodiment 3 FIG.
FIG. 6 shows a heat pipe-embedded sandwich panel (hereinafter referred to as a panel) having fins for increasing a heat conduction path as a third embodiment of the present invention.

  In FIG. 6, reference numerals 1 to 8 and 21 are the same as those in the first and second embodiments. In the third embodiment, the heat pipe 4 is further provided with fins 41. The block 42 is located immediately below the fin 41 and is in close contact with the heat pipe 4 to be bonded. Further, the block 43 is provided with a step for forming a recess, and the fins 41 are fitted and adhered to the recess surface of the block 43. The block 43 is provided with a female screw 50 for fastening the electronic device 3 beside the fin 41. With this configuration, the block 5 can have the same heat resistance as the panel body. For this reason, even when the electronic device 3 generates a large amount of heat, the adhesive 7 that bonds the block 42 and the block 43 does not soften, and the fastening force of the bolt 8 that fastens the electronic device 3 decreases. There is no.

  FIG. 7 shows the flow of heat transferred from the electronic device 3 to the heat pipe 4 in the third embodiment. As the adhesive between the heat pipe 4 and the fin 41 of the block 42 and the block 43, an adhesive having high thermal conductivity is used. Thus, in addition to the normal heat transfer path 11, the block 42 has a path for transferring heat to the main body of the heat pipe 4 via the fins 41 and a path for transferring heat to the lower heat pipe 21 via the fins 41. Can be provided. Further, the block 43 can be provided with a path for transferring heat to the main body of the heat pipe 4 via the fins 41 and a path for the block 43 to transfer heat to the lower heat pipe 21 to further improve the performance of the heat pipe panel. There is also an effect.

It is a figure which shows the heat pipe embedding panel by Embodiment 1 which concerns on this invention. It is a heat transmission path | route of the heat pipe embedding panel by Embodiment 1 which concerns on this invention. It is the other form of the light hole of the block by Embodiment 1 which concerns on this invention. It is a figure which shows the heat pipe embedding panel by Embodiment 2 which concerns on this invention. It is a heat transfer path | route of the heat pipe embedding panel by Embodiment 2 which concerns on this invention. It is a heat transfer path | route of the heat pipe embedding panel by Embodiment 3 which concerns on this invention. It is a heat transfer path | route of the heat pipe embedding panel by Embodiment 3 which concerns on this invention.

Explanation of symbols

  1 skin material, 2 core material, 3 electronic device, 4 heat pipe, 5 block, 6 light hole, 7 adhesive, 8 bolt, 21 heat pipe, 41 fin, 42 block, 43 block, 50 internal thread.

Claims (3)

A block formed with a female screw hole and a cavity for fastening a highly exothermic electronic device, a heat pipe, a skin material, and a core material sandwiched between the skin materials at a temperature applied during molding. A heat pipe embedded sandwich panel that is bonded and integrally molded with a curing adhesive,
The block and the heat pipe are in close contact with each other with an adhesive, and in close contact with the skin material with an adhesive,
After the skin is bonded and the sandwich panel is integrally formed with the block embedded in the core material, a female screw hole is processed in the block so as to reach the cavity of the block or its periphery,
A heat pipe embedded sandwich panel characterized by being formed.   The heat pipe-embedded sandwich panel according to claim 1, wherein a plurality of heat pipes are adhered and stacked with an adhesive between the skin materials.   The heat pipe-embedded sandwich panel according to claim 1 or 2, wherein the heat pipe is formed with fins that are in close contact with the block.

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