WO2013075759A1 - Heat sink device and method for producing a heat sink device - Google Patents

Heat sink device and method for producing a heat sink device Download PDF

Info

Publication number
WO2013075759A1
WO2013075759A1 PCT/EP2011/071058 EP2011071058W WO2013075759A1 WO 2013075759 A1 WO2013075759 A1 WO 2013075759A1 EP 2011071058 W EP2011071058 W EP 2011071058W WO 2013075759 A1 WO2013075759 A1 WO 2013075759A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
insert
base
hole
fastening
Prior art date
Application number
PCT/EP2011/071058
Other languages
French (fr)
Inventor
Fredrik Ohlsson
Original Assignee
Huawei Technologies Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co., Ltd. filed Critical Huawei Technologies Co., Ltd.
Priority to PCT/EP2011/071058 priority Critical patent/WO2013075759A1/en
Priority to CN2011800280079A priority patent/CN103222048A/en
Publication of WO2013075759A1 publication Critical patent/WO2013075759A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10409Screws
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the present invention relates to a heat sink device comprising an extruded heat sink profile.
  • the invention also relates to a method for producing a heat sink device by extruding a heat sink profile.
  • Heat sinks are used for cooling purposes in different applications, such as in e.g. mobile system base stations etc.
  • a component to be cooled such as a PCB (Printed Circuit Board) may be fastened to a heat sink e.g. by forcing the component to be cooled against the heat sink base using an EMC shielding cover, where the EMC cover is fastened to the heat sink using at least one threaded screw passing through a hole in the component to be cooled, the screw being screwed into a threaded hole in the heat sink base.
  • a screw joint comprising a threaded screw and a threaded hole requires a certain minimum length of the engaging threaded parts in order to obtain a necessary minimum clamping force and strength of the screw joint. Therefore the heat sink base must be arranged with enough thickness to provide enough material for the threads.
  • the necessary minimum clamping force has to be reached or exceeded in order to ensure that the screw will force the component to be cooled against the heat sink base with a force sufficient to enable adequate heat transfer between the component and the heat sink base.
  • the necessary minimum strength of the screw joint has to be reached or exceeded in order to ensure that the threads will not break due to external mechanical stress, thus maintaining the screw joint force at a level sufficient to enable adequate heat transfer between the component and the heat sink base also in cases of external mechanical stress of a level that the screw joint is subjected to during normal use.
  • extruded heat sinks are usually manufactured with a base having an essentially uniform thickness, where the thickness equals or exceeds a thickness sufficient for arranging at least one threaded hole with a thread length sufficient to obtain a necessary minimum clamping force and strength of a fastening screw j oint in the base.
  • cooling fins of the heat sink are advantageous to arrange the cooling fins of the heat sink as long as possible while allowing for a minimum thickness of the heat sink base required to enable efficient heat transfer from heat spots adjacent the base to the cooling fins and allowing for a minimum thickness of the heat sink base required to prevent mechanical distortion of the heat sink base due to heat.
  • This is especially advantageous when using forced cooling, i.e. where cooling medium such as e.g. air is forced by e.g. a fan to pass over a heat sink surface, where the cooling medium such as e.g.
  • Heat sinks in applications with forced cooling are usually manufactured by extrusion, usually by extrusion of aluminium.
  • the extrusion technology allows for profile geometry design in the x-y plane whereas the extrusion of the profile takes place in the z-direction.
  • a heat sink profile with a uniform cross section in the x-y plane is extruded in the z-direction and thereafter cut to the required length.
  • an additional machining process must be performed.
  • an additional process where material is added must be performed.
  • Aluminium and aluminium alloys commonly used for extruded heat sinks have a very good thermal conductivity and suit well for transporting heat from a heat source to a cooling surface. Extrusion is a relatively low cost method as the heat sink profile is formed in one single operation and thereafter cut into the required length.
  • the geometry of an extruded heat sink, where the heat sink has a constant profile over the entire length, is suitable when a cooling air flow in one direction is used.
  • An extruded heat sink of aluminium allows for a geometry of the heat sink profile with thin cooling fins in order to maximize the heat sink area exposed to the cooling air flow.
  • the minimum possible thickness of the base of an extruded heat sink is usually limited by the minimum length required by the treads of threaded fastening holes in the heat sink and not the minimum thickness of the heat sink base required to prevent mechanical distortion of the heat sink base due to heat. Because of the extrusion method with which the thickness of the base may not be varied, the base of the heat sink is usually extruded as thick as is required by the thread length. A typical screw thread length in aluminium is 1,5-2 times the screw diameter.
  • the object of the present invention is to provide an improved heat sink device and a method for producing a heat sink device.
  • the object is achieved by arranging a heat sink device comprising an extruded heat sink profile, the heat sink profile comprising a heat sink base and at least one cooling fin, where the heat sink device further comprises at least one heat sink insert arranged in the heat sink base, where the heat sink insert is arranged with a fastening hole arranged to receive a threaded fastening screw for fastening a component to be cooled to the heat sink device.
  • the object is further achieved by a method for producing a heat sink device comprising the steps of extruding a heat sink profile comprising a heat sink base and at least one cooling fin, arranging at least one hole in the heat sink base, and fastening a heat sink insert to the wall of the at least one hole in the heat sink base, where the heat sink insert is arranged with a fastening hole arranged to receive a threaded fastening screw for fastening a component to be cooled to the heat sink device.
  • the thickness of the heat sink base may be reduced compared to traditional extruded heat sinks.
  • the thickness of the heat sink base By reducing the thickness of the heat sink base and at the same time arranging at least one heat sink insert with a fastening hole in the heat sink base it is possible to remove unnecessary material from the heat sink resulting in that the weight of the heat sink and the amount of material used for manufacturing the heat sink is reduced.
  • Another advantage of removing unnecessary material from the heat sink is that by reducing the thickness of the heat sink base, the average cooling fin length may be increased for a heat sink having a defined maximum height.
  • a further advantage of removing unnecessary material from the heat sink is that the cooling efficiency of the heat sink is especially improved if forced cooling is used as the pressure drop over the heat sink in the extrusion direction of the cooling fins is reduced if the cooling fin height and thus the cross-sectional area of the spaces between the cooling fins is increased allowing for more air flow in the spaces between the cooling fins.
  • the heat sink design may be optimized as mentioned above by removing unnecessary material from the heat sink base.
  • the heat sink insert has a cylindrical cross- section which heat sink insert is shaped as a cylinder along the axis of the heat sink insert with a cylindrical shoulder of larger diameter.
  • the heat sink insert has a cylindrical cross- section which is substantially equal along the area where the heat sink insert is adjacent the heat sink base.
  • the heat sink insert is at least partly conical along the axis of the heat sink insert. According to one embodiment of the invention, the heat sink insert is friction welded to the heat sink base.
  • the heat sink insert is glued to the heat sink base.
  • the fastening hole in the heat sink insert is threaded.
  • the fastening hole in the heat sink insert is non-threaded.
  • the outer surface of the heat sink insert is arranged with threads arranged to engage corresponding threads in a hole in the heat sink base.
  • the outer surface of the heat sink insert is arranged somewhat larger than the diameter of a hole in the heat sink base, whereby the heat sink insert is arranged to be pressed in the hole and locked in place by mechanical deformation.
  • the hole in the heat sink base is arranged by machining.
  • the step of fastening a heat sink insert to the wall of the at least one hole in the heat sink base may comprise the step of friction welding the heat sink insert to the heat sink base.
  • the step of fastening a heat sink insert to the wall of the at least one hole in the heat sink base may comprise the step of gluing the heat sink insert to the heat sink base.
  • the step of fastening a heat sink insert to the wall of the at least one hole in the heat sink base may comprise the step of engaging protruding parts on the heat sink insert and the wall of the hole with each other.
  • the step of fastening a heat sink insert to the wall of the at least one hole in the heat sink base may comprise the step of pressing the heat sink insert into the hole in the heat sink base to be locked in place by mechanical deformation of at least one part of the heat sink insert or the heat sink base.
  • FIG. 1 shows a schematic view of a heat sink device according to the invention in substantially assembled state
  • FIG. 2 shows a schematic cross-section of a prior art heat sink design
  • - Fig. 3 shows a schematic cross-section of a part of a heat sink device according to the invention
  • - Fig. 4 shows a schematic cross-section of a heat sink insert according to figure 3;
  • FIG. 5 shows a schematic cross-section of another embodiment of a heat sink insert according to the invention.
  • FIG. 6 shows a schematic cross-section of a further embodiment of a heat sink insert according to the invention.
  • FIG. 7 shows a schematic cross-section of yet another embodiment of a heat sink insert according to the invention.
  • Fig. 1 shows a view of a heat sink device 2 according to the invention in substantially assembled state, the heat sink device 2 comprising an extruded heat sink profile 4, the heat sink profile 4 comprising a heat sink base 6 and at least one cooling fin 8, a number of cooling fins 8 are shown in the figure.
  • the heat sink device 2 comprises further at least one heat sink insert 10 arranged inserted in the heat sink base 6. In the figure, a number of heat sink inserts 10 and a number of cooling fins 8 are shown arranged across the heat sink base 6.
  • the heat sink insert 10 is arranged to receive a threaded fastening screw (not shown) for fastening a component (not shown) to be cooled such as a PCB (Printed Circuit Board) to the heat sink base 6.
  • a threaded fastening screw (not shown) is arranged to be passed through a hole (not shown) in the component to be cooled (not shown) and screwed into a fastening hole 12 in the heat sink insert 10.
  • Fig. 2 shows a cross-section of a prior art heat sink 11, for comparison, having a heat sink base 13.
  • the heat sink base 13 has a threaded fastening hole 15 being of a length 17 sufficient to ensure that a screw will be able to force a component to be cooled against the heat sink base 13 with a force sufficient to enable adequate heat transfer between the component and the heat sink base 13 without breaking the threads in the threaded fastening hole 15.
  • the prior art heat sink base 13 is thus arranged with a thickness 19 at least equalling the length 17 of the threaded fastening hole 15, but preferably with a thickness 19 exceeding the length 17 of the threaded fastening hole 15 in order to prevent water from entering the threaded fastening hole 15 from the environment 21.
  • Fig. 3 shows a cross-section of a part of a heat sink device 2 according to the invention in an assembled state showing an extruded heat sink profile 4 comprising a heat sink base 6 and at least one cooling fin 8, a number of cooling fins 8 are shown in the figure.
  • the heat sink device 2 comprises further at least one heat sink insert 10 arranged inserted in the heat sink base 6, where the heat sink insert 10 is arranged with a fastening hole 12 arranged to receive a threaded fastening screw 14 for fastening a component 16 to be cooled such as a PCB (Printed Circuit Board) to the heat sink base 6.
  • PCB Print Circuit Board
  • At least one threaded fastening screw 14 is arranged to be passed through a hole 18 in the component 16 to be cooled and screwed into the fastening hole 12 in the heat sink insert 10.
  • the fastening hole 12 is preferably threaded 20. It is also possible to use a fastening screw 14 which when screwed into a non-threaded fastening hole 12 in the heat sink base 6 produces threads 22 in said hole 12.
  • the thickness A of the heat sink base 6 of the extruded heat sink profile 4 is arranged smaller than the length B of the fastening hole 12 arranged in the heat sink insert 10, which allows for reduction in the thickness A of the heat sink base 6 and for increase in the length C of at least one cooling fin 8 compared to an extruded heat sink of the type discussed in connection with figure 2 if the two have corresponding total height, i.e. both the thickness of heat sink base and the length of cooling fin.
  • the heat sink insert 10 thus is arranged with a fastening hole 12 being of a length B sufficient to ensure that a fastening screw 14 will be able to force a component 16 to be cooled against the heat sink base 6 with a force sufficient to enable adequate heat transfer between the component 16 and the heat sink base 6 without breaking the threads in the fastening hole 12, whereas it is possible to arrange the heat sink base 6 with a smaller thickness A which is still sufficient for preventing mechanical distortion of the heat sink base due to heat.
  • Different embodiments for how to arrange the heat sink insert 10 in the heat sink base 6 will be discussed below.
  • the component 16 to be cooled is fastened to the heat sink device 2 by forcing the component 16 to be cooled against the heat sink base 6 using an EMC shielding cover 24 that abut the component 16 to be cooled, where the EMC shielding cover 24 is fastened to the heat sink device 2 using at least one threaded fastening screw 14 passing through a hole 18 in the component 16 to be cooled, the fastening screw 14 being screwed into a fastening hole 12 in the heat sink insert 10.
  • the threaded fastening screw 14 is arranged to act indirectly on the component 16 to be cooled.
  • a fastening screw of shorter length having a head which acts directly on the component to be cooled, whereby the component to be cooled is fastened to the heat sink device by forcing the component to be cooled against the heat sink base using at least one threaded fastening screw passing through a hole in the component to be cooled, the fastening screw being screwed into a fastening hole in the heat sink insert.
  • the heat sink device 2 shown according to the invention comprises in this embodiment a heat sink insert 10 having a cylindrical cross-section with a cylindrical shoulder of larger diameter.
  • the top surface of the heat sink insert 10 is preferably arranged flush with, i.e. in line with, the surface 26 of the heat sink base 6 in order for the component 16 to be cooled to be able to abut against the heat sink base 6 without play. If the heat sink insert is arranged to protrude from the surface of the heat sink base in assembled state, it is possible to arrange a corresponding recess in the component 16 to be cooled in order for it to be able to abut against the heat sink base 6 without play.
  • Fig. 4 shows a cross-section of a heat sink insert according to figure 3.
  • the heat sink device 2 shown according to the invention comprises in this embodiment a heat sink insert 10 having a cylindrical cross-section with a cylindrical shoulder of larger diameter.
  • the heat sink insert 10 according to this embodiment may advantageously be friction welded to the heat sink base 6 of the extruded heat sink profile 4.
  • the heat sink insert 10 is inserted in a corresponding hole 28 in the heat sink base 6 and rotated in relation to the heat sink base 6 while the axial surface 30 of the shoulder 32 of the heat sink insert 10 is pressed against the corresponding surface 34 on the heat sink base 6.
  • the friction from the rotational and axial pressure creates the heat necessary to partly melt and thus join the heat sink insert 10 and the heat sink base 6 at a joining surface 36.
  • the melting point of the material for the heat sink insert 10 is preferably the same as that for the heat sink base 6 in order to obtain melting in both parts.
  • the shoulder 32 of the heat sink insert 10 may optionally also be arranged with at least one protruding part 38, e.g. a ridge like part, facing the corresponding surface 34 on the heat sink base 6, which protruding part 38 is arranged to melt during the friction welding.
  • the heat sink insert 10 is thus arranged to be fastened to the wall 46 of the hole 28 in the heat sink base 6. Cooling fins 8 and the fastening hole 12 arranged in the heat sink insert 10 are also shown in the figure.
  • Fig. 5 shows a cross-section of another embodiment of a heat sink insert 10 according to the invention, where the heat sink insert 10 is inserted in a corresponding hole 28 in the heat sink base 6.
  • the heat sink insert 10 has a cylindrical cross-section which is substantially equal along the area where the heat sink insert 10 is arranged adjacent to the heat sink base 6 in the assembled state of the heat sink device 2.
  • a heat sink insert 10 according to this embodiment may advantageously be glued to the heat sink base 6.
  • the outer surface 40 of the heat sink insert 10 may be arranged with protruding parts 42 such as e.g.
  • the outer surface 40 of the heat sink insert 10 may be arranged somewhat larger than the cross-section of the hole 28 in the heat sink base 6, e.g. the protruding 42, 44 parts may be arranged with such dimensions, whereby the heat sink insert 10 is arranged to be pressed in to the hole 28 in the heat sink base 6 and locked in place by mechanical deformation of at least one part of the outer surface 40 of the heat sink insert 10 or the wall 46 of the hole 28 in the heat sink base 6.
  • Fig. 6 shows a cross-section of another embodiment of a heat sink insert 10 according to the invention, where the heat sink insert 10 is inserted in a corresponding hole 28 in the heat sink base 6.
  • the heat sink insert 10 has a cylindrical cross-section which heat sink insert 10 is conical along at least part of the axis of the heat sink insert where the heat sink insert 10 is arranged adjacent to the heat sink base 6 in the assembled state of the heat sink device 2.
  • a heat sink insert 10 according to this embodiment may advantageously be friction welded or glued to the heat sink base 6.
  • the outer surface 40 of the heat sink insert 10 may be arranged with protruding parts 42 such as e.g.
  • the outer surface 40 of the heat sink insert 10 may be arranged somewhat larger than the cross-section of the hole 28 in the heat sink base 6, e.g. the protruding 42, 44 parts may be arranged with such dimensions, whereby the heat sink insert 10 is arranged to be pressed in to the hole 28 in the heat sink base 6 and locked in place by mechanical deformation of at least one part of the outer surface 40 of the heat sink insert 10 or the wall 46 of the hole 28 in the heat sink base 6.
  • the cross-section of the heat sink insert parallel with the plane of the surface of the heat sink device 2 may have some other shape than circular, e.g. have the shape of a quadrangle or triangle.
  • Fig. 7 shows a cross-section of yet another embodiment of a heat sink insert 10 according to the invention, where the heat sink insert 10 is inserted in a corresponding hole 28 in the heat sink base 6.
  • the heat sink insert 10 has a cylindrical cross-section and is partly conical along at least part of the axis of the heat sink insert 10.
  • a heat sink insert 10 according to this embodiment may advantageously be friction welded or glued to the heat sink base 6.
  • the outer surface 40 of the heat sink insert 10 may be arranged with protruding parts 42 such as e.g.
  • the outer surface 40 of the heat sink insert 10 may be arranged somewhat larger than the cross-section of the hole 28 in the heat sink base 6, e.g. the protruding 42, 44 parts may be arranged with such dimensions, whereby the heat sink insert 10 is arranged to be pressed in to the hole 28 in the heat sink base 6 and locked in place by mechanical deformation of at least one part of the outer surface 40 of the heat sink insert 10 or the wall 46 of the hole 28 in the heat sink base 6.
  • the heat sink insert 10 is arranged with a fastening hole arranged to receive a threaded fastening screw.
  • the fastening hole may be threaded or non-threaded. If the fastening hole is non-threaded, a threaded self-tapping screw is arranged to produce a thread in the fastening hole while being mounted therein.
  • any holes for heat sink inserts are preferably machined from the opposite side of the heat sink base.
  • a respective heat sink insert may be placed in the heat sink base before or after a respective hole for a fastening screw is made in the respective heat sink insert.
  • the threading of the respective hole may take place before or after the respective heat sink insert is placed in the heat sink base.
  • the heat sink insert may be attached to the heat sink base by e.g. friction welding, soldering, welding, brazing, gluing, mechanical deformation when pressing, etc.
  • the joint between the heat sink insert and the heat sink base is preferably arranged water tight.
  • the fastening hole is preferably not arranged as a through-hole in the heat sink insert.
  • the fastening hole is preferably open at only one end of the heat sink insert 10.
  • the invention also relates to a method for producing a heat sink device 2 comprising the steps of extruding a heat sink profile 4 comprising a heat sink base 6 and at least one cooling fin 8, arranging at least one hole 28 in the heat sink base 6, and fastening a heat sink insert 10 to the wall 46 of the at least one hole 28 in the heat sink base 6, where the heat sink insert 10 is arranged with a fastening hole 12 arranged to receive a threaded fastening screw 14 for fastening a component 16 to be cooled to the heat sink device 2.
  • the hole 28 in the heat sink base 6 is e.g. arranged by machining such as drilling or milling etc.
  • the step of fastening a heat sink insert 10 to the wall 46 of the at least one hole 28 in the heat sink base 6 may comprise the steps of inserting the heat sink insert 10 in the hole 28 in the heat sink base 6 and friction welding the heat sink insert 10 to the heat sink base 6, or inserting the heat sink insert 10 in the hole 28 in the heat sink base 6 and gluing the heat sink insert 10 to the heat sink base 6, or the steps of arranging the outer surface 40 of the heat sink insert 10 with protruding parts 42 and arranging protruding parts 44 on the wall 46 of the hole 28 and engaging said protruding parts 42, 44 with each other, or the steps of arranging the outer surface 40 of the heat sink insert 10 somewhat larger than the cross-section of the hole 28 in the heat sink base 6 and pressing the heat sink insert 10 into the hole 28 in the heat sink base 6 to be locked in place by mechanical deformation of at least one part of the heat sink insert 10 or the heat sink base 6, or the step of attaching the heat sink insert 10 to the heat sink base 6 by soldering, or the step
  • the fastening screw hole 15, 12 is preferably not a through-hole in order to ensure that no water passes from outside of the heat sink base 13, 6 to the inside of the same.
  • a fastening screw hole usually has to be longer than a M4 screw which results in a required total length of 11 mm for screw hole and end wall of screw hole.
  • the thickness of the heat sink base 13, 6 may be reduced from approximately 11 mm for the prior art heat sink shown in figure 2 down to approximately 6 mm for the inventive heat sink device shown in figure 3 in order to still maintain enough mechanical robustness of the heat sink base 6.
  • Such a reduction in thickness of the heat sink base may result in a weight saving of approximately 400-800 g if the heat sink base surface is of the size of a 200x300 mm, this also resulting in material cost savings.
  • a temperature reduction on component level of approximately 5-10 degrees C may be reached when compared to the above prior art heat sink. If a heat sink has the maximum total height of 48 mm, the height of the major part of the cooling fins is increased from 37 mm to 43 mm for the inventive heat sink, i.e. with approximately 15% this resulting in a significant increase of the overall area of the heat sink that is subjected to cooling air compared to the above prior art heat sink.
  • the present invention is not limited to the embodiments described above, but also relates to and incorporates all embodiments within the scope of the appended independent claim. Thus, it is possible to combine features from the embodiments described above as long as the combinations are possible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to a heat sink device (2) comprising an extruded heat sink profile (4), the heat sink profile (4) comprising a heat sink base (6) and at least one cooling fin (8), where the heat sink device (2) further comprises at least one heat sink insert (10) arranged in the heat sink base (6), where the heat sink insert (10) is arranged with a fastening hole (12) arranged to receive a threaded fastening screw (14) for fastening a component (16) to be cooled to the heat sink device (2). The invention also relates to a method for producing a heat sink device (2) by extruding a heat sink profile (4) comprising a heat sink base (6) and at least one cooling fin (8), arranging at least one hole (28) in the heat sink base (6), and fastening a heat sink insert (10) to the wall (46) of the at least one hole (28) in the heat sink base (6), where the heat sink insert (10) is arranged with a fastening hole (12) arranged to receive a threaded fastening screw (14) for fastening a component (16) to be cooled to the heat sink device (2).

Description

HEAT SINK DEVICE AND METHOD FOR PRODUCING A HEAT SINK DEVICE Technical Field The present invention relates to a heat sink device comprising an extruded heat sink profile. The invention also relates to a method for producing a heat sink device by extruding a heat sink profile.
Background of the Invention
Heat sinks are used for cooling purposes in different applications, such as in e.g. mobile system base stations etc.
A component to be cooled such as a PCB (Printed Circuit Board) may be fastened to a heat sink e.g. by forcing the component to be cooled against the heat sink base using an EMC shielding cover, where the EMC cover is fastened to the heat sink using at least one threaded screw passing through a hole in the component to be cooled, the screw being screwed into a threaded hole in the heat sink base. Such a screw joint comprising a threaded screw and a threaded hole requires a certain minimum length of the engaging threaded parts in order to obtain a necessary minimum clamping force and strength of the screw joint. Therefore the heat sink base must be arranged with enough thickness to provide enough material for the threads. The necessary minimum clamping force has to be reached or exceeded in order to ensure that the screw will force the component to be cooled against the heat sink base with a force sufficient to enable adequate heat transfer between the component and the heat sink base. The necessary minimum strength of the screw joint has to be reached or exceeded in order to ensure that the threads will not break due to external mechanical stress, thus maintaining the screw joint force at a level sufficient to enable adequate heat transfer between the component and the heat sink base also in cases of external mechanical stress of a level that the screw joint is subjected to during normal use.
Depending on the device to which the heat sink is to be attached, the threaded holes may be arranged at different positions on the heat sink base. Therefore, extruded heat sinks are usually manufactured with a base having an essentially uniform thickness, where the thickness equals or exceeds a thickness sufficient for arranging at least one threaded hole with a thread length sufficient to obtain a necessary minimum clamping force and strength of a fastening screw j oint in the base.
In applications where the overall dimensions of a heat sink are limited, e.g. when arranging a heat sink in a cramped space surrounded by other equipment, it is advantageous to arrange the cooling fins of the heat sink as long as possible while allowing for a minimum thickness of the heat sink base required to enable efficient heat transfer from heat spots adjacent the base to the cooling fins and allowing for a minimum thickness of the heat sink base required to prevent mechanical distortion of the heat sink base due to heat. This is especially advantageous when using forced cooling, i.e. where cooling medium such as e.g. air is forced by e.g. a fan to pass over a heat sink surface, where the cooling medium such as e.g. cooling air is passed over the cooling fins with such a speed that the cooling efficiency of the cooling fins is not significantly affected in a negative way even if the cooling fins are arranged tightly spaced adjacent each other. The thicker the heat sink base is, the more it restricts air flow and cooling capacity of the heat sink. Heat sinks in applications with forced cooling are usually manufactured by extrusion, usually by extrusion of aluminium. The extrusion technology allows for profile geometry design in the x-y plane whereas the extrusion of the profile takes place in the z-direction. When manufacturing heat sinks by extrusion, a heat sink profile with a uniform cross section in the x-y plane is extruded in the z-direction and thereafter cut to the required length. To remove material, an additional machining process must be performed. To add material, an additional process where material is added must be performed.
Aluminium and aluminium alloys commonly used for extruded heat sinks have a very good thermal conductivity and suit well for transporting heat from a heat source to a cooling surface. Extrusion is a relatively low cost method as the heat sink profile is formed in one single operation and thereafter cut into the required length. The geometry of an extruded heat sink, where the heat sink has a constant profile over the entire length, is suitable when a cooling air flow in one direction is used. An extruded heat sink of aluminium allows for a geometry of the heat sink profile with thin cooling fins in order to maximize the heat sink area exposed to the cooling air flow.
The minimum possible thickness of the base of an extruded heat sink is usually limited by the minimum length required by the treads of threaded fastening holes in the heat sink and not the minimum thickness of the heat sink base required to prevent mechanical distortion of the heat sink base due to heat. Because of the extrusion method with which the thickness of the base may not be varied, the base of the heat sink is usually extruded as thick as is required by the thread length. A typical screw thread length in aluminium is 1,5-2 times the screw diameter.
In order to decrease the general thickness of an extruded heat sink base arranged with threaded holes, it is theoretically possible to remove material from the extruded heat sink base by machining of the heat sink base from the side comprising cooling fins if the cooling fins are arranged sufficiently spaced apart. Tightly spaced cooling fins make such machining more difficult if not impossible.
It is also possible to die cast a heat sink with a base of varying thickness, where the base is thicker at the areas comprising threaded screw holes and less thick at the areas not comprising threaded screw holes, but a drawback of heat sinks manufactured by die casting compared to heat sinks manufactured by extrusion is that the thermal conductivity of a casted heat sink is lower than that of an extruded heat sink. Due to the technical limitations of the die casting method, the thickness, height and spacing distance of the cooling fins may not be optimized when using forced cooling. Summary of the Invention
The object of the present invention is to provide an improved heat sink device and a method for producing a heat sink device. The object is achieved by arranging a heat sink device comprising an extruded heat sink profile, the heat sink profile comprising a heat sink base and at least one cooling fin, where the heat sink device further comprises at least one heat sink insert arranged in the heat sink base, where the heat sink insert is arranged with a fastening hole arranged to receive a threaded fastening screw for fastening a component to be cooled to the heat sink device.
The object is further achieved by a method for producing a heat sink device comprising the steps of extruding a heat sink profile comprising a heat sink base and at least one cooling fin, arranging at least one hole in the heat sink base, and fastening a heat sink insert to the wall of the at least one hole in the heat sink base, where the heat sink insert is arranged with a fastening hole arranged to receive a threaded fastening screw for fastening a component to be cooled to the heat sink device.
By arranging a heat sink insert arranged with a fastening hole arranged to receive a threaded fastening screw, the thickness of the heat sink base may be reduced compared to traditional extruded heat sinks. By reducing the thickness of the heat sink base and at the same time arranging at least one heat sink insert with a fastening hole in the heat sink base it is possible to remove unnecessary material from the heat sink resulting in that the weight of the heat sink and the amount of material used for manufacturing the heat sink is reduced. Another advantage of removing unnecessary material from the heat sink is that by reducing the thickness of the heat sink base, the average cooling fin length may be increased for a heat sink having a defined maximum height. The thicker the heat sink base is, the more it restricts the cooling capacity of the heat sink by reducing the cooling fin area for a heat sink having a defined maximum height. By increasing the cooling fin length the cooling efficiency of the heat sink is improved as the surface which may be accessed by cooling air is increased.
A further advantage of removing unnecessary material from the heat sink is that the cooling efficiency of the heat sink is especially improved if forced cooling is used as the pressure drop over the heat sink in the extrusion direction of the cooling fins is reduced if the cooling fin height and thus the cross-sectional area of the spaces between the cooling fins is increased allowing for more air flow in the spaces between the cooling fins. Thus, the heat sink design may be optimized as mentioned above by removing unnecessary material from the heat sink base.
According to one embodiment of the invention, the heat sink insert has a cylindrical cross- section which heat sink insert is shaped as a cylinder along the axis of the heat sink insert with a cylindrical shoulder of larger diameter.
According to one embodiment of the invention, the heat sink insert has a cylindrical cross- section which is substantially equal along the area where the heat sink insert is adjacent the heat sink base.
According to one embodiment of the invention, the heat sink insert is at least partly conical along the axis of the heat sink insert. According to one embodiment of the invention, the heat sink insert is friction welded to the heat sink base.
According to one embodiment of the invention, the heat sink insert is glued to the heat sink base.
According to one embodiment of the invention, the fastening hole in the heat sink insert is threaded.
According to one embodiment of the invention, the fastening hole in the heat sink insert is non-threaded.
According to one embodiment of the invention, the outer surface of the heat sink insert is arranged with threads arranged to engage corresponding threads in a hole in the heat sink base.
According to one embodiment of the invention, the outer surface of the heat sink insert is arranged somewhat larger than the diameter of a hole in the heat sink base, whereby the heat sink insert is arranged to be pressed in the hole and locked in place by mechanical deformation.
According to one embodiment of the invention, the hole in the heat sink base is arranged by machining.
According to one embodiment of the invention, the step of fastening a heat sink insert to the wall of the at least one hole in the heat sink base may comprise the step of friction welding the heat sink insert to the heat sink base. According to one embodiment of the invention, the step of fastening a heat sink insert to the wall of the at least one hole in the heat sink base may comprise the step of gluing the heat sink insert to the heat sink base.
According to one embodiment of the invention, the step of fastening a heat sink insert to the wall of the at least one hole in the heat sink base may comprise the step of engaging protruding parts on the heat sink insert and the wall of the hole with each other.
According to one embodiment of the invention, the step of fastening a heat sink insert to the wall of the at least one hole in the heat sink base may comprise the step of pressing the heat sink insert into the hole in the heat sink base to be locked in place by mechanical deformation of at least one part of the heat sink insert or the heat sink base.
Further advantages of the invention will be apparent from the following detailed description. Brief Description of the Drawings
The appended drawings are intended to clarify and explain different embodiments of the present invention in which:
- Fig. 1 shows a schematic view of a heat sink device according to the invention in substantially assembled state;
- Fig. 2 shows a schematic cross-section of a prior art heat sink design;
- Fig. 3 shows a schematic cross-section of a part of a heat sink device according to the invention; - Fig. 4 shows a schematic cross-section of a heat sink insert according to figure 3;
- Fig. 5 shows a schematic cross-section of another embodiment of a heat sink insert according to the invention;
- Fig. 6 shows a schematic cross-section of a further embodiment of a heat sink insert according to the invention; and
- Fig. 7 shows a schematic cross-section of yet another embodiment of a heat sink insert according to the invention.
Detailed Description of the Invention
Fig. 1 shows a view of a heat sink device 2 according to the invention in substantially assembled state, the heat sink device 2 comprising an extruded heat sink profile 4, the heat sink profile 4 comprising a heat sink base 6 and at least one cooling fin 8, a number of cooling fins 8 are shown in the figure. The heat sink device 2 comprises further at least one heat sink insert 10 arranged inserted in the heat sink base 6. In the figure, a number of heat sink inserts 10 and a number of cooling fins 8 are shown arranged across the heat sink base 6. As will be discussed in more detail below, the heat sink insert 10 is arranged to receive a threaded fastening screw (not shown) for fastening a component (not shown) to be cooled such as a PCB (Printed Circuit Board) to the heat sink base 6. At least one threaded screw (not shown) is arranged to be passed through a hole (not shown) in the component to be cooled (not shown) and screwed into a fastening hole 12 in the heat sink insert 10.
Fig. 2 shows a cross-section of a prior art heat sink 11, for comparison, having a heat sink base 13. The heat sink base 13 has a threaded fastening hole 15 being of a length 17 sufficient to ensure that a screw will be able to force a component to be cooled against the heat sink base 13 with a force sufficient to enable adequate heat transfer between the component and the heat sink base 13 without breaking the threads in the threaded fastening hole 15. The prior art heat sink base 13 is thus arranged with a thickness 19 at least equalling the length 17 of the threaded fastening hole 15, but preferably with a thickness 19 exceeding the length 17 of the threaded fastening hole 15 in order to prevent water from entering the threaded fastening hole 15 from the environment 21.
Fig. 3 shows a cross-section of a part of a heat sink device 2 according to the invention in an assembled state showing an extruded heat sink profile 4 comprising a heat sink base 6 and at least one cooling fin 8, a number of cooling fins 8 are shown in the figure. The heat sink device 2 comprises further at least one heat sink insert 10 arranged inserted in the heat sink base 6, where the heat sink insert 10 is arranged with a fastening hole 12 arranged to receive a threaded fastening screw 14 for fastening a component 16 to be cooled such as a PCB (Printed Circuit Board) to the heat sink base 6. At least one threaded fastening screw 14 is arranged to be passed through a hole 18 in the component 16 to be cooled and screwed into the fastening hole 12 in the heat sink insert 10. The fastening hole 12 is preferably threaded 20. It is also possible to use a fastening screw 14 which when screwed into a non-threaded fastening hole 12 in the heat sink base 6 produces threads 22 in said hole 12. As can be seen in the figure, the thickness A of the heat sink base 6 of the extruded heat sink profile 4 is arranged smaller than the length B of the fastening hole 12 arranged in the heat sink insert 10, which allows for reduction in the thickness A of the heat sink base 6 and for increase in the length C of at least one cooling fin 8 compared to an extruded heat sink of the type discussed in connection with figure 2 if the two have corresponding total height, i.e. both the thickness of heat sink base and the length of cooling fin.
The heat sink insert 10 thus is arranged with a fastening hole 12 being of a length B sufficient to ensure that a fastening screw 14 will be able to force a component 16 to be cooled against the heat sink base 6 with a force sufficient to enable adequate heat transfer between the component 16 and the heat sink base 6 without breaking the threads in the fastening hole 12, whereas it is possible to arrange the heat sink base 6 with a smaller thickness A which is still sufficient for preventing mechanical distortion of the heat sink base due to heat. Different embodiments for how to arrange the heat sink insert 10 in the heat sink base 6 will be discussed below.
In the figure is shown an embodiment where the component 16 to be cooled is fastened to the heat sink device 2 by forcing the component 16 to be cooled against the heat sink base 6 using an EMC shielding cover 24 that abut the component 16 to be cooled, where the EMC shielding cover 24 is fastened to the heat sink device 2 using at least one threaded fastening screw 14 passing through a hole 18 in the component 16 to be cooled, the fastening screw 14 being screwed into a fastening hole 12 in the heat sink insert 10. Thus, the threaded fastening screw 14 is arranged to act indirectly on the component 16 to be cooled. It is also possible to arrange a fastening screw of shorter length having a head which acts directly on the component to be cooled, whereby the component to be cooled is fastened to the heat sink device by forcing the component to be cooled against the heat sink base using at least one threaded fastening screw passing through a hole in the component to be cooled, the fastening screw being screwed into a fastening hole in the heat sink insert.
The heat sink device 2 shown according to the invention comprises in this embodiment a heat sink insert 10 having a cylindrical cross-section with a cylindrical shoulder of larger diameter.
The top surface of the heat sink insert 10 is preferably arranged flush with, i.e. in line with, the surface 26 of the heat sink base 6 in order for the component 16 to be cooled to be able to abut against the heat sink base 6 without play. If the heat sink insert is arranged to protrude from the surface of the heat sink base in assembled state, it is possible to arrange a corresponding recess in the component 16 to be cooled in order for it to be able to abut against the heat sink base 6 without play.
Fig. 4 shows a cross-section of a heat sink insert according to figure 3. The heat sink device 2 shown according to the invention comprises in this embodiment a heat sink insert 10 having a cylindrical cross-section with a cylindrical shoulder of larger diameter. The heat sink insert 10 according to this embodiment may advantageously be friction welded to the heat sink base 6 of the extruded heat sink profile 4. In this case the heat sink insert 10 is inserted in a corresponding hole 28 in the heat sink base 6 and rotated in relation to the heat sink base 6 while the axial surface 30 of the shoulder 32 of the heat sink insert 10 is pressed against the corresponding surface 34 on the heat sink base 6. The friction from the rotational and axial pressure creates the heat necessary to partly melt and thus join the heat sink insert 10 and the heat sink base 6 at a joining surface 36. The melting point of the material for the heat sink insert 10 is preferably the same as that for the heat sink base 6 in order to obtain melting in both parts. The shoulder 32 of the heat sink insert 10 may optionally also be arranged with at least one protruding part 38, e.g. a ridge like part, facing the corresponding surface 34 on the heat sink base 6, which protruding part 38 is arranged to melt during the friction welding. The heat sink insert 10 is thus arranged to be fastened to the wall 46 of the hole 28 in the heat sink base 6. Cooling fins 8 and the fastening hole 12 arranged in the heat sink insert 10 are also shown in the figure.
Fig. 5 shows a cross-section of another embodiment of a heat sink insert 10 according to the invention, where the heat sink insert 10 is inserted in a corresponding hole 28 in the heat sink base 6. In this embodiment, the heat sink insert 10 has a cylindrical cross-section which is substantially equal along the area where the heat sink insert 10 is arranged adjacent to the heat sink base 6 in the assembled state of the heat sink device 2. A heat sink insert 10 according to this embodiment may advantageously be glued to the heat sink base 6. Optionally, the outer surface 40 of the heat sink insert 10 may be arranged with protruding parts 42 such as e.g. splines or threads arranged to engage protruding parts 44 in the wall of the hole 28 arranged in the heat sink base 6, where further glue may be used to lock the respective corresponding protruding parts 42, 44 to each other. Optionally the outer surface 40 of the heat sink insert 10 may be arranged somewhat larger than the cross-section of the hole 28 in the heat sink base 6, e.g. the protruding 42, 44 parts may be arranged with such dimensions, whereby the heat sink insert 10 is arranged to be pressed in to the hole 28 in the heat sink base 6 and locked in place by mechanical deformation of at least one part of the outer surface 40 of the heat sink insert 10 or the wall 46 of the hole 28 in the heat sink base 6.
Fig. 6 shows a cross-section of another embodiment of a heat sink insert 10 according to the invention, where the heat sink insert 10 is inserted in a corresponding hole 28 in the heat sink base 6. In this embodiment, the heat sink insert 10 has a cylindrical cross-section which heat sink insert 10 is conical along at least part of the axis of the heat sink insert where the heat sink insert 10 is arranged adjacent to the heat sink base 6 in the assembled state of the heat sink device 2. A heat sink insert 10 according to this embodiment may advantageously be friction welded or glued to the heat sink base 6. Optionally, the outer surface 40 of the heat sink insert 10 may be arranged with protruding parts 42 such as e.g. splines or threads arranged to engage protruding parts 44 in the wall 46 of the hole 28 arranged in the heat sink base 6, where further glue may be used to lock the respective corresponding protruding parts 42, 44 to each other. Optionally the outer surface 40 of the heat sink insert 10 may be arranged somewhat larger than the cross-section of the hole 28 in the heat sink base 6, e.g. the protruding 42, 44 parts may be arranged with such dimensions, whereby the heat sink insert 10 is arranged to be pressed in to the hole 28 in the heat sink base 6 and locked in place by mechanical deformation of at least one part of the outer surface 40 of the heat sink insert 10 or the wall 46 of the hole 28 in the heat sink base 6.
If the heat sink insert is not arranged to be rotated when mounted in the heat sink base by friction welding or threads, the cross-section of the heat sink insert parallel with the plane of the surface of the heat sink device 2 may have some other shape than circular, e.g. have the shape of a quadrangle or triangle.
Fig. 7 shows a cross-section of yet another embodiment of a heat sink insert 10 according to the invention, where the heat sink insert 10 is inserted in a corresponding hole 28 in the heat sink base 6. In this embodiment, the heat sink insert 10 has a cylindrical cross-section and is partly conical along at least part of the axis of the heat sink insert 10. A heat sink insert 10 according to this embodiment may advantageously be friction welded or glued to the heat sink base 6. Optionally, the outer surface 40 of the heat sink insert 10 may be arranged with protruding parts 42 such as e.g. splines or threads arranged to engage protruding parts 44 in the wall 46 of the hole 28 arranged in the heat sink base 6, where further glue may be used to lock the respective corresponding protruding parts 42, 44 to each other. Optionally the outer surface 40 of the heat sink insert 10 may be arranged somewhat larger than the cross-section of the hole 28 in the heat sink base 6, e.g. the protruding 42, 44 parts may be arranged with such dimensions, whereby the heat sink insert 10 is arranged to be pressed in to the hole 28 in the heat sink base 6 and locked in place by mechanical deformation of at least one part of the outer surface 40 of the heat sink insert 10 or the wall 46 of the hole 28 in the heat sink base 6.
As mentioned above, the heat sink insert 10 is arranged with a fastening hole arranged to receive a threaded fastening screw. The fastening hole may be threaded or non-threaded. If the fastening hole is non-threaded, a threaded self-tapping screw is arranged to produce a thread in the fastening hole while being mounted therein.
Machining of the heat sink base from the cooling fin side of an extruded heat sink device is very difficult due to fragile, thin and tightly spaced cooling fins. Therefore, any holes for heat sink inserts are preferably machined from the opposite side of the heat sink base.
A respective heat sink insert may be placed in the heat sink base before or after a respective hole for a fastening screw is made in the respective heat sink insert. The threading of the respective hole may take place before or after the respective heat sink insert is placed in the heat sink base.
The heat sink insert may be attached to the heat sink base by e.g. friction welding, soldering, welding, brazing, gluing, mechanical deformation when pressing, etc.
The joint between the heat sink insert and the heat sink base is preferably arranged water tight. In order to prevent water from entering the fastening hole from the environment, the fastening hole is preferably not arranged as a through-hole in the heat sink insert. Thus, the fastening hole is preferably open at only one end of the heat sink insert 10.
The invention also relates to a method for producing a heat sink device 2 comprising the steps of extruding a heat sink profile 4 comprising a heat sink base 6 and at least one cooling fin 8, arranging at least one hole 28 in the heat sink base 6, and fastening a heat sink insert 10 to the wall 46 of the at least one hole 28 in the heat sink base 6, where the heat sink insert 10 is arranged with a fastening hole 12 arranged to receive a threaded fastening screw 14 for fastening a component 16 to be cooled to the heat sink device 2.
The hole 28 in the heat sink base 6 is e.g. arranged by machining such as drilling or milling etc.
The step of fastening a heat sink insert 10 to the wall 46 of the at least one hole 28 in the heat sink base 6 may comprise the steps of inserting the heat sink insert 10 in the hole 28 in the heat sink base 6 and friction welding the heat sink insert 10 to the heat sink base 6, or inserting the heat sink insert 10 in the hole 28 in the heat sink base 6 and gluing the heat sink insert 10 to the heat sink base 6, or the steps of arranging the outer surface 40 of the heat sink insert 10 with protruding parts 42 and arranging protruding parts 44 on the wall 46 of the hole 28 and engaging said protruding parts 42, 44 with each other, or the steps of arranging the outer surface 40 of the heat sink insert 10 somewhat larger than the cross-section of the hole 28 in the heat sink base 6 and pressing the heat sink insert 10 into the hole 28 in the heat sink base 6 to be locked in place by mechanical deformation of at least one part of the heat sink insert 10 or the heat sink base 6, or the step of attaching the heat sink insert 10 to the heat sink base 6 by soldering, or the step of attaching the heat sink insert 10 to the heat sink base 6 by brazing.
To exemplify the advantages of the invention over prior art shown in figure 2, a typical telecom transceiver heat sink of the type described in connection with figure 3 is used.
The fastening screw hole 15, 12 is preferably not a through-hole in order to ensure that no water passes from outside of the heat sink base 13, 6 to the inside of the same. Thus, such a fastening screw hole usually has to be longer than a M4 screw which results in a required total length of 11 mm for screw hole and end wall of screw hole. When using the heat sink insert according to the invention, the thickness of the heat sink base 13, 6 may be reduced from approximately 11 mm for the prior art heat sink shown in figure 2 down to approximately 6 mm for the inventive heat sink device shown in figure 3 in order to still maintain enough mechanical robustness of the heat sink base 6. Such a reduction in thickness of the heat sink base may result in a weight saving of approximately 400-800 g if the heat sink base surface is of the size of a 200x300 mm, this also resulting in material cost savings. In theory, if such an inventive heat sink device is combined with a low cost heat pipe, a temperature reduction on component level of approximately 5-10 degrees C may be reached when compared to the above prior art heat sink. If a heat sink has the maximum total height of 48 mm, the height of the major part of the cooling fins is increased from 37 mm to 43 mm for the inventive heat sink, i.e. with approximately 15% this resulting in a significant increase of the overall area of the heat sink that is subjected to cooling air compared to the above prior art heat sink. By thus increasing the cross-sectional area of the channels between the cooling fins through which channels cooling air is flowing, the pressure drop in these channels is also decreased. The heat sink inserts protruding from the heat sink base into said cooling channels give rise to turbulence of the air flow, which is advantageous for forced cooling.
The present invention is not limited to the embodiments described above, but also relates to and incorporates all embodiments within the scope of the appended independent claim. Thus, it is possible to combine features from the embodiments described above as long as the combinations are possible.

Claims

Heat sink device (2) comprising an extruded heat sink profile (4), the heat sink profile (4) comprising a heat sink base (6) and at least one cooling fin (8), characterised in that the heat sink device (2) further comprises at least one heat sink insert (10) arranged in a hole (28) in the heat sink base (6), and that the heat sink insert (10) is arranged with a fastening hole (12) arranged to receive a threaded fastening screw (14) for fastening a component (16) to be cooled to the heat sink device (2).
Heat sink device according to claim 1, wherein the top surface of the heat sink insert (10) is arranged in line with the surface (26) of the heat sink base (6).
Heat sink device according to claim 1, wherein the component (16) to be cooled is arranged to abut against the heat sink base (6).
Heat sink device according to claim 1, wherein the component (16) to be cooled is a PCB.
Heat sink device according to claim 1, wherein the fastening hole (12) is threaded (20).
6. Heat sink device according to claim 1, wherein the fastening hole (12) is non-threaded and wherein the fastening screw (14) is a threaded self-tapping screw.
7. Heat sink device according to claim 1, wherein the threaded fastening screw (14) is arranged to be passed through a hole (18) in the component (16) to be cooled.
8. Heat sink device according to claim 1, wherein the heat sink insert (10) has a cylindrical cross-section with a cylindrical shoulder (32) of larger diameter.
9. Heat sink device according to claim 1, wherein the heat sink insert (10) has a cylindrical cross-section which is substantially equal along the area where the heat sink insert (10) is arranged adjacent to the heat sink base (6) in the assembled state of the heat sink device (2).
10. Heat sink device according to claim 1, wherein the heat sink insert (10) has a cylindrical cross-section which heat sink insert (10) is substantially conical along at least part of the axis of the heat sink insert (10) where the heat sink insert (10) is arranged adjacent to the heat sink base (6) in the assembled state of the heat sink device (2).
11. Heat sink device according to claim 1, wherein the fastening hole (12) is open at only one end of the heat sink insert (10).
12. Heat sink device according to claim 1, wherein the cross-section of the heat sink insert (10) has the shape of a cylinder or a quadrangle or a triangle.
13. Heat sink device according to any one of claims 1 to 12, wherein the thickness (A) of the heat sink base (6) of the extruded heat sink profile (4) is arranged smaller than the length (B) of the fastening hole (12) arranged in the heat sink insert (10).
14. Method for producing a heat sink device (2) characterised by the steps of extruding a heat sink profile (4) comprising a heat sink base (6) and at least one cooling fin (8), arranging at least one hole (28) in the heat sink base (6), and fastening a heat sink insert (10) to the wall (46) of the at least one hole (28) in the heat sink base (6), where the heat sink insert (10) is arranged with a fastening hole (12) arranged to receive a threaded fastening screw (14) for fastening a component (16) to be cooled to the heat sink device (2).
15. Method for producing a heat sink device (2) according to claim 14, where the step of fastening a heat sink insert (10) to the wall (46) of the at least one hole (28) in the heat sink base (6) comprises the steps of inserting the heat sink insert (10) in the hole (28) in the heat sink base (6) and friction welding the heat sink insert (10) to the heat sink base (6).
16. Method for producing a heat sink device (2) according to claim 14, where the step of fastening a heat sink insert (10) to the wall (46) of the at least one hole (28) in the heat sink base (6) comprises the steps of inserting the heat sink insert (10) in the hole (28) in the heat sink base (6) and gluing the heat sink insert (10) to the heat sink base (6).
17. Method for producing a heat sink device (2) according to claim 14, where the step of fastening a heat sink insert (10) to the wall (46) of the at least one hole (28) in the heat sink base (6) comprises the steps of arranging the outer surface (40) of the heat sink insert (10) with protruding parts (42), arranging protruding parts (44) on the wall (46) of the hole (28) and engaging said protruding parts (42, 44) with each other.
18. Method for producing a heat sink device (2) according to claim 14, where the step of fastening a heat sink insert (10) to the wall (46) of the at least one hole (28) in the heat sink base (6) comprises the steps of arranging the outer surface (40) of the heat sink insert (10) somewhat larger than the cross-section of the hole (28) in the heat sink base (6), and pressing the heat sink insert (10) into the hole (28) in the heat sink base (6) to be locked in place by mechanical deformation of at least one part of the heat sink insert (10) or the heat sink base (6).
19. Method for producing a heat sink device (2) according to claim 14, where the step of fastening a heat sink insert (10) to the wall (46) of the at least one hole (28) in the heat sink base (6) comprises the step of attaching the heat sink insert (10) to the heat sink base (6) by soldering.
20. Method for producing a heat sink device (2) according to claim 14, where the step of fastening a heat sink insert (10) to the wall (46) of the at least one hole (28) in the heat sink base (6) comprises the step of attaching the heat sink insert (10) to the heat sink base (6) by brazing.
PCT/EP2011/071058 2011-11-25 2011-11-25 Heat sink device and method for producing a heat sink device WO2013075759A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/EP2011/071058 WO2013075759A1 (en) 2011-11-25 2011-11-25 Heat sink device and method for producing a heat sink device
CN2011800280079A CN103222048A (en) 2011-11-25 2011-11-25 Heat sink device and method for producing a heat sink device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2011/071058 WO2013075759A1 (en) 2011-11-25 2011-11-25 Heat sink device and method for producing a heat sink device

Publications (1)

Publication Number Publication Date
WO2013075759A1 true WO2013075759A1 (en) 2013-05-30

Family

ID=45093737

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/071058 WO2013075759A1 (en) 2011-11-25 2011-11-25 Heat sink device and method for producing a heat sink device

Country Status (2)

Country Link
CN (1) CN103222048A (en)
WO (1) WO2013075759A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021127641A1 (en) 2021-10-25 2023-04-27 Rolls-Royce Deutschland Ltd & Co Kg Printed circuit board assembly and method for its manufacture

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106486722A (en) * 2015-08-27 2017-03-08 苏州市永创金属科技有限公司 A kind of strong filter cavity of local heat-sinking capability and its processing method
DE102017129250B4 (en) * 2017-12-08 2024-02-15 Lisa Dräxlmaier GmbH Cooling device, vehicle and method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2201041A (en) * 1987-01-15 1988-08-17 Marston Palmer Ltd Heat sink
US20050072558A1 (en) * 2003-10-03 2005-04-07 Aavid Thermalloy, Llc Heat sink assembly and connecting device
US20050078455A1 (en) * 2003-10-09 2005-04-14 Macgregor Mike G. Appartus including circuit board and heat sink and method of making the apparatus
US20060221572A1 (en) * 2005-03-31 2006-10-05 Richard Power-Fardy Stud-nut
US20070230138A1 (en) * 2006-04-04 2007-10-04 Nidec Corporation Heat sink and fan unit
US20080165501A1 (en) * 2007-01-10 2008-07-10 Sun Microsystems, Inc. High-load even pressure heatsink loading for low-profile blade computer applications

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2312473Y (en) * 1997-07-30 1999-03-31 鸿海精密工业股份有限公司 Heat radiator of electronic device
CN201533477U (en) * 2009-09-28 2010-07-21 常州市默顿电气有限公司 Radiator

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2201041A (en) * 1987-01-15 1988-08-17 Marston Palmer Ltd Heat sink
US20050072558A1 (en) * 2003-10-03 2005-04-07 Aavid Thermalloy, Llc Heat sink assembly and connecting device
US20050078455A1 (en) * 2003-10-09 2005-04-14 Macgregor Mike G. Appartus including circuit board and heat sink and method of making the apparatus
US20060221572A1 (en) * 2005-03-31 2006-10-05 Richard Power-Fardy Stud-nut
US20070230138A1 (en) * 2006-04-04 2007-10-04 Nidec Corporation Heat sink and fan unit
US20080165501A1 (en) * 2007-01-10 2008-07-10 Sun Microsystems, Inc. High-load even pressure heatsink loading for low-profile blade computer applications

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021127641A1 (en) 2021-10-25 2023-04-27 Rolls-Royce Deutschland Ltd & Co Kg Printed circuit board assembly and method for its manufacture

Also Published As

Publication number Publication date
CN103222048A (en) 2013-07-24

Similar Documents

Publication Publication Date Title
US11231239B2 (en) Threaded cooling apparatus with integrated cooling channels and heat exchanger
US7028757B1 (en) Twin fin arrayed cooling device with liquid chamber
US6819561B2 (en) Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same
US6935412B2 (en) Cooler for electrical and/ or electronic components, linked to present cooling needs
CN100456461C (en) Heat sink of heat pipe
US20070240867A1 (en) Liquid-Cooling Type Cooling Plate
US20030056368A1 (en) Method for manufacturing a heat sink
JP2004336031A (en) High performance cooling device with heat spreader
JP5926928B2 (en) Power semiconductor module cooling device
WO2013075759A1 (en) Heat sink device and method for producing a heat sink device
CN104932648A (en) Water-cooled type heat pipe radiator and manufacturing method thereof
US7497248B2 (en) Twin fin arrayed cooling device
EP2099275B1 (en) Electronic module having thermal cooling insert
US20130000870A1 (en) Thermal module and method of manufacturing same
US6684501B2 (en) Foil heat sink and a method for fabricating same
JP2007281215A (en) Heat receiving jacket, manufacturing method thereof, and cooling device having same
CN201294706Y (en) Composite material tube cold type radiator
JP5316004B2 (en) Cooling system
US11770914B2 (en) Cooling device and method of manufacturing the same
US20090159254A1 (en) Heat sink assembly and method of fabricating
CN220043752U (en) High-efficient heat dissipation formula aluminum substrate with blind hole
CN219145946U (en) Radiator, air conditioner frequency converter and electronic equipment
CN219802938U (en) Radiator
CN218679677U (en) Single-layer printed circuit board based on anti-electromagnetic interference structure
CN216905752U (en) Spliced aluminum alloy radiator profile

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11790943

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11790943

Country of ref document: EP

Kind code of ref document: A1