CN220043752U - High-efficient heat dissipation formula aluminum substrate with blind hole - Google Patents
High-efficient heat dissipation formula aluminum substrate with blind hole Download PDFInfo
- Publication number
- CN220043752U CN220043752U CN202321432179.9U CN202321432179U CN220043752U CN 220043752 U CN220043752 U CN 220043752U CN 202321432179 U CN202321432179 U CN 202321432179U CN 220043752 U CN220043752 U CN 220043752U
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- China
- Prior art keywords
- aluminum substrate
- heat dissipation
- heat
- blind hole
- fixedly connected
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 100
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 99
- 239000000758 substrate Substances 0.000 title claims abstract description 95
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 60
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000011889 copper foil Substances 0.000 claims abstract description 21
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 description 25
- 230000007547 defect Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a high-efficiency heat-dissipation type aluminum substrate with blind holes, which relates to the field of automobile circuit board processing and comprises an aluminum substrate assembly and a heat dissipation assembly, wherein a blind hole body is formed at the top of the aluminum substrate assembly, a galvanized layer is fixedly connected to the inner surface of the blind hole body, and a copper foil is fixedly arranged at the top of the aluminum substrate assembly. This high-efficient heat dissipation formula aluminum substrate with blind hole through blind hole body and galvanized layer that sets up for this aluminum substrate has effectively solved the effect of product conduction heat, it is that directly conducts the aluminum substrate body through circuit layer copper wire and links to each other, on the aluminum substrate body to the heat conduction that the product produced, the copper foil links to each other body collocation through blind hole body and aluminum substrate body, make thermal conduction more high-efficient swift, the effectual cost that has reduced, and convenient to use, the security is higher, simultaneously through the setting of heat dissipation arch and radiating component, make the radiating efficiency of aluminum substrate body obtain further promotion.
Description
Technical Field
The utility model relates to the field of automobile circuit board processing, in particular to a high-efficiency heat-dissipation type aluminum substrate with blind holes.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a common aluminum-based single panel is composed of three layers, namely a circuit layer (copper foil), an insulating layer and a metal base layer.
However, the existing aluminum substrate still has some defects, such as lower heat dissipation efficiency of the existing aluminum substrate, so that the heat of the aluminum substrate still can gradually rise after a long-time operation process, thereby causing interference to subsequent operation of components on the aluminum substrate, and the disassembly and assembly steps of the existing aluminum substrate heat dissipation assembly are complicated, so that a worker needs to spend a long time for disassembling the heat dissipation assembly when the worker needs to repair or clean the heat dissipation assembly, and thus the overall cleaning or maintenance efficiency of the worker is disturbed.
Therefore, improvement of the defect is urgently needed, and the utility model provides an efficient heat dissipation type aluminum substrate with blind holes, which aims at researching and improving the defects of the existing structure.
Disclosure of Invention
The utility model aims to provide a high-efficiency heat-dissipation type aluminum substrate with blind holes, so as to solve the problems in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a high-efficient heat dissipation formula aluminum substrate with blind hole, includes aluminum substrate assembly and radiator unit, the blind hole body has been seted up at aluminum substrate assembly's top, and the internal surface fixedly connected with galvanized layer of blind hole body to aluminum substrate assembly's top fixed mounting has the copper foil, and the avris of copper foil is connected with galvanized layer's avris laminating, and copper foil's top fixedly connected with solder resist ink layer simultaneously, radiator unit laminating is connected in aluminum substrate assembly's bottom, and radiator unit's tip threaded connection has fastening bolt.
Further, the aluminum substrate assembly comprises an aluminum substrate body, a heat dissipation protrusion and an insulating layer, the heat dissipation protrusion is fixedly arranged on the side of the aluminum substrate body, the insulating layer is fixedly connected to the top of the aluminum substrate body, and the top of the insulating layer is fixedly connected with the bottom of the copper foil.
Furthermore, the number of the radiating protrusions is twenty, every ten radiating protrusions are in one group, the two radiating protrusions are symmetrically arranged by taking the perpendicular bisector of the aluminum substrate body as a symmetry axis, and each radiating protrusion is arranged on the side of the aluminum substrate body at equal intervals in an array mode.
Further, the size of the blind hole body is one millimeter, the depth is four millimeters, and the lower end of the blind hole body is positioned in the aluminum substrate body.
Further, the galvanized layer is made by a zinc soaking process, and is attached and fixed on the top of the insulating layer.
Further, the heat dissipation assembly comprises a connecting block, a heat conducting plate and heat dissipation fins, the end part of the connecting block is fixedly connected with the heat conducting plate, the bottom of the heat conducting plate is welded with the heat dissipation fins at equal intervals in an array mode, and the heat conducting plate and the heat dissipation fins are made of copper materials.
Further, the top of the heat radiation fin is fixedly connected with the bottom of the heat conduction plate, the side of the heat conduction plate is fixedly connected with the end part of the connecting block, and the heat radiation fin and the connecting block form a fixed structure through the heat conduction plate.
Further, the number of the connecting blocks is four, every two of the four connecting blocks are in a group, the two groups of the connecting blocks are symmetrically arranged by taking the perpendicular bisectors of the heat conducting plates as symmetry axes, the inside of the connecting blocks are in threaded connection with the side sides of the fastening bolts, the end parts of the fastening bolts are in threaded connection with the inside of the aluminum substrate body, and the connecting blocks are connected with the aluminum substrate body through the fastening bolts.
The utility model provides a high-efficiency heat-dissipation type aluminum substrate with blind holes, which has the following beneficial effects:
1. the utility model effectively solves the problem of heat conduction of the product through the blind hole body and the galvanized layer, and the aluminum substrate is directly connected to the aluminum substrate body through the copper wires of the circuit layer, so that the heat generated by the product is conducted to the aluminum substrate body, and the copper foil is matched with the aluminum substrate body through the blind hole body, so that the heat conduction is more efficient and rapid, the cost is effectively reduced, the use is convenient, the safety is higher, and meanwhile, the heat dissipation efficiency of the aluminum substrate body is further improved through the arrangement of the heat dissipation protrusions and the heat dissipation assembly.
2. According to the utility model, through the connecting blocks and the fastening bolts, the heat radiation assembly is convenient for a worker to detach quickly, so that the situation that the whole cleaning of the worker or the maintenance efficiency is disturbed due to the fact that the worker needs to spend a long time to detach the heat radiation assembly when the worker needs to maintain or clean the heat radiation assembly is avoided.
Drawings
FIG. 1 is a schematic diagram of a front view of a heat dissipating aluminum substrate with blind holes;
FIG. 2 is a schematic diagram of a front cross-sectional structure of a high-efficiency heat-dissipating aluminum substrate with blind holes according to the present utility model;
fig. 3 is a schematic perspective view of a heat conducting plate-heat dissipating fin of a high-efficiency heat dissipating aluminum substrate with blind holes according to the present utility model.
In the figure: 1. an aluminum substrate assembly; 101. an aluminum substrate body; 102. a heat radiation protrusion; 103. an insulating layer; 2. a blind hole body; 3. a zinc plating layer; 4. copper foil; 5. a solder resist ink layer; 6. a heat dissipation assembly; 601. a connecting block; 602. a heat conductive plate; 603. a heat radiation fin; 7. and (5) fastening a bolt.
Description of the embodiments
Embodiments of the present utility model are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the utility model but are not intended to limit the scope of the utility model.
As shown in fig. 1-3, a high-efficiency heat dissipation aluminum substrate with blind holes comprises an aluminum substrate component 1 and a heat dissipation component 6, wherein the top of the aluminum substrate component 1 is provided with a blind hole body 2, the aluminum substrate component 1 comprises an aluminum substrate body 101, heat dissipation protrusions 102 and an insulating layer 103, the heat dissipation protrusions 102 are fixedly arranged on the side of the aluminum substrate body 101, the number of the heat dissipation protrusions 102 is twenty, every ten heat dissipation protrusions 102 are a group, the two groups of heat dissipation protrusions 102 are symmetrically arranged by taking the perpendicular bisector of the aluminum substrate body 101 as a symmetrical axis, each group of heat dissipation protrusions 102 are equidistantly arranged on the side of the aluminum substrate body 101 in an array mode, the heat dissipation protrusions 102 are uniformly arranged on the side of the aluminum substrate body 101 in an array mode, the top of the aluminum substrate body 101 is fixedly connected with the insulating layer 103, the top of the insulating layer 103 is fixedly connected with the bottom of the copper foil 4, the heat dissipation efficiency of the aluminum substrate body 101 is further improved through the arranged heat dissipation protrusions 102, the galvanized layer 3 is fixedly connected to the inner surface of the blind hole body 2, the size of the blind hole body 2 is one millimeter, the depth is four millimeters, the lower end of the blind hole body 2 is positioned in the aluminum substrate body 101, the heat at the copper foil 4 can be quickly conducted to the aluminum substrate body 101 through the arranged blind hole body 2, the copper foil 4 is fixedly arranged at the top of the aluminum substrate assembly 1, the side of the copper foil 4 is in fit connection with the side of the galvanized layer 3, the galvanized layer 3 is manufactured by a zinc soaking process, the galvanized layer 3 is in fit and fixed to the top of the insulating layer 103, the heat conduction is more convenient through the arranged galvanized layer 3, meanwhile, the top of the copper foil 4 is fixedly connected with the solder resist ink layer 5, the heat radiation component 6 is attached and connected to the bottom of the aluminum substrate component 1, the heat radiation component 6 comprises connecting blocks 601, heat conducting plates 602 and heat radiation fins 603, the end portions of the connecting blocks 601 are fixedly connected with the heat conducting plates 602, the number of the connecting blocks 601 is four, each two of the four connecting blocks 601 is one group, two groups of connecting blocks 601 are symmetrically arranged by taking the perpendicular bisectors of the heat conducting plates 602 as symmetry axes, the inside of each connecting block 601 is in threaded connection with the side of each fastening bolt 7, the end portions of the fastening bolts 7 are in threaded connection with the inner threads of the aluminum substrate body 101, the connecting blocks 601 are connected with the aluminum substrate body 101 through the fastening bolts 7, the heat radiation component 6 is convenient for workers to carry out quick dismounting treatment through the connecting blocks 601, the bottom of each heat conducting plate 602 is provided with the corresponding heat radiation fins 603 in an array type equidistance, the top of each heat radiation fin 603 is fixedly connected with the bottom of each heat conducting plate 602, the side of each heat conducting plate 602 is fixedly connected with the end portion of each connecting block 601, the fins 603 and the connecting block 601 form a fixing structure through the heat conducting plates 602, the heat radiation fins 603 and the connecting blocks 601 are arranged into the fixing structure, the heat radiation fins 603 and the connecting blocks are not fall off when the heat radiation fins 603 are connected with the aluminum substrate body 101, the heat radiation fins are in time, the heat radiation fins are connected with the aluminum substrate body 101, and the heat radiation fins are made into the heat radiation fins and can be connected with the heat radiation fins and the heat radiation body and are connected with the heat radiation fins and are timely through the heat radiation fins and the heat radiation body and are connected.
As shown in fig. 2 and 3, the heat dissipation assembly 6 is attached to the bottom of the aluminum substrate assembly 1, and the end of the heat dissipation assembly 6 is screwed with a fastening bolt 7.
In summary, according to the structure shown in fig. 1 to 3, a worker attaches the heat conducting plate 602 to the bottom of the aluminum substrate body 101, aligns the threaded hole at the connection block 601 to the threaded hole at the bottom of the aluminum substrate body 101, rotates the fastening bolt 7 to firmly connect the connection block 601 and the aluminum substrate body 101 together, thereby completing the installation work of the heat dissipating component 6, automatically generating heat along with the surface of the running copper foil 4 of the electronic component at the top of the galvanized layer 3, then guiding the heat on the surface of the copper foil 4 to the aluminum substrate body 101 in time through the matching of the blind hole body 2, automatically dissipating the heat through the matching of the aluminum substrate body 101 and the heat dissipating protrusions 102, then transmitting the redundant heat to the heat dissipating fins 603 through the heat conducting plate 602, and finally improving the self-heat dissipating efficiency of the aluminum substrate body 101 through the heat dissipating fins 603, thereby effectively ensuring that the heat of the aluminum substrate is not excessively high during the subsequent operation;
meanwhile, the manufacturing process of the high-efficiency heat-dissipation type aluminum substrate with the blind holes comprises the following steps of: drilling a blind hole (note: grinding a drill bit into a flat bit with a bore diameter of 1.0MM and a depth of 0.4 MM) on a copper wire part of a copper guide line of an aluminum metal PCB, grinding a burr of a bore hole, transferring to zinc soaking pretreatment of an aluminum piece to enable zinc ions to react with aluminum surfaces (note: ensuring uniform zinc on the blind hole) so as to enable an aluminum layer, a dielectric layer and a copper foil on the surface to react and be connected together, (note: conducting 15-ampere electroplating for 20 minutes after a small current is applied, and ensuring that the copper thickness of copper holes on the blind hole is more than 6-8 microns).
The embodiments of the utility model have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the utility model in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, and to enable others of ordinary skill in the art to understand the utility model for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (8)
1. The utility model provides a high-efficient heat dissipation formula aluminum substrate with blind hole, includes aluminum substrate subassembly (1) and radiator unit (6), its characterized in that, blind hole body (2) have been seted up at the top of aluminum substrate subassembly (1), and the internal surface fixedly connected with galvanized layer (3) of blind hole body (2), and the top fixed mounting of aluminum substrate subassembly (1) has copper foil (4), the avris of copper foil (4) is connected with the avris laminating of galvanized layer (3) moreover, the top fixedly connected with solder resist ink layer (5) of copper foil (4) simultaneously, radiator unit (6) laminating is connected in the bottom of aluminum substrate subassembly (1), and the tip threaded connection of radiator unit (6) has fastening bolt (7).
2. The high-efficiency heat dissipation type aluminum substrate with the blind holes according to claim 1, wherein the aluminum substrate assembly (1) comprises an aluminum substrate body (101), heat dissipation protrusions (102) and an insulating layer (103), the heat dissipation protrusions (102) are fixedly arranged on the side of the aluminum substrate body (101), the insulating layer (103) is fixedly connected to the top of the aluminum substrate body (101), and the top of the insulating layer (103) is fixedly connected with the bottom of the copper foil (4).
3. The high-efficiency heat dissipation type aluminum substrate with blind holes according to claim 2, wherein the number of the heat dissipation protrusions (102) is twenty, twenty heat dissipation protrusions (102) are each ten, two groups of heat dissipation protrusions (102) are symmetrically arranged by taking a perpendicular bisector of the aluminum substrate body (101) as a symmetry axis, and each group of heat dissipation protrusions (102) are equidistantly arranged on the side of the aluminum substrate body (101) in an array.
4. The high-efficiency heat dissipation type aluminum substrate with the blind holes according to claim 1, wherein the size of the blind hole body (2) is one millimeter, the depth is four millimeters, and the lower end of the blind hole body (2) is positioned in the aluminum substrate body (101).
5. The high-efficiency heat dissipation type aluminum substrate with blind holes according to claim 1, wherein the galvanized layer (3) is made by a zinc soaking process, and the galvanized layer (3) is adhered and fixed on the top of the insulating layer (103).
6. The high-efficiency heat dissipation type aluminum substrate with blind holes according to claim 1, wherein the heat dissipation component (6) comprises a connecting block (601), a heat conduction plate (602) and heat dissipation fins (603), the end part of the connecting block (601) is fixedly connected with the heat conduction plate (602), the bottom of the heat conduction plate (602) is welded with the heat dissipation fins (603) at equal intervals in an array mode, and the heat conduction plate (602) and the heat dissipation fins (603) are made of copper materials.
7. The high-efficiency heat dissipation type aluminum substrate with blind holes according to claim 6, wherein the top of the heat dissipation fins (603) is fixedly connected with the bottom of the heat conduction plate (602), the side of the heat conduction plate (602) is fixedly connected with the end part of the connecting block (601), and the heat dissipation fins (603) and the connecting block (601) form a fixed structure through the heat conduction plate (602).
8. The high-efficiency heat dissipation type aluminum substrate with blind holes according to claim 6, wherein the number of the connecting blocks (601) is four, each two of the four connecting blocks (601) is one group, the two groups of connecting blocks (601) are symmetrically arranged by taking a perpendicular bisector of the heat conducting plate (602) as a symmetry axis, the inside of the connecting block (601) is in threaded connection with the side of the fastening bolt (7), the end part of the fastening bolt (7) is in threaded connection with the inside of the aluminum substrate body (101), and the connecting blocks (601) are connected with the aluminum substrate body (101) through the fastening bolt (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321432179.9U CN220043752U (en) | 2023-06-07 | 2023-06-07 | High-efficient heat dissipation formula aluminum substrate with blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321432179.9U CN220043752U (en) | 2023-06-07 | 2023-06-07 | High-efficient heat dissipation formula aluminum substrate with blind hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220043752U true CN220043752U (en) | 2023-11-17 |
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ID=88743820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321432179.9U Active CN220043752U (en) | 2023-06-07 | 2023-06-07 | High-efficient heat dissipation formula aluminum substrate with blind hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220043752U (en) |
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2023
- 2023-06-07 CN CN202321432179.9U patent/CN220043752U/en active Active
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