CN203799328U - CPU (central processing unit) radiator - Google Patents

CPU (central processing unit) radiator Download PDF

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Publication number
CN203799328U
CN203799328U CN201420135670.XU CN201420135670U CN203799328U CN 203799328 U CN203799328 U CN 203799328U CN 201420135670 U CN201420135670 U CN 201420135670U CN 203799328 U CN203799328 U CN 203799328U
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CN
China
Prior art keywords
heat
heat pipe
connection block
cpu
mounting groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420135670.XU
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Chinese (zh)
Inventor
林琼榕
廖南练
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHONGSHAN JIUNENG PHOTOELECTRIC TECHNOLOGY CO LTD
Original Assignee
ZHONGSHAN JIUNENG PHOTOELECTRIC TECHNOLOGY CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHONGSHAN JIUNENG PHOTOELECTRIC TECHNOLOGY CO LTD filed Critical ZHONGSHAN JIUNENG PHOTOELECTRIC TECHNOLOGY CO LTD
Priority to CN201420135670.XU priority Critical patent/CN203799328U/en
Application granted granted Critical
Publication of CN203799328U publication Critical patent/CN203799328U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a CPU (central processing unit) radiator. The CPU radiator comprises connection seats (1) of a mounting heat source, a plurality of first heat tubes (2-1) are arranged on the connection seats (1), and the first heat tubes (2-1) are connected with the connection seat (1) to form a loop.

Description

A kind of cpu heat
[technical field]
The utility model relates to heating radiator, especially cpu heat.
[background technology]
Existing cpu heat adopts aluminum alloy fin heat radiation more, or soaking plate is installed on CPU, then by heat pipe, the heat in soaking plate is exported on the radiating fin of peripheral hardware and dispel the heat, because soaking plate cost is good, so the cost of heating radiator increases, and adopt the radiating efficiency of fin heat radiation bad, so use while heat radiation on CPU, can affect not in time the life-span of CPU owing to dispelling the heat, adopting existing heating radiator is the uneconomical volume that takies again.
[utility model content]
In order to solve deficiency of the prior art, a kind of good heat dissipation effect is provided, the heating radiator that volume is little, the technical solution adopted in the utility model is:
A kind of cpu heat, includes the Connection Block that thermal source is installed, and is provided with some the first heat pipes on described Connection Block, and the first described heat pipe is connected and surrounds annular with Connection Block.
On described Connection Block, be provided with some the first mounting grooves, the first described heat pipe is fixed in the first mounting groove.
On described Connection Block, be provided with step, be fixed with some the second heat pipes on described step, the second described heat pipe is connected and surrounds into annular with step.
On described step, be provided with the second mounting groove, the second described heat pipe is fixed in the second mounting groove.
A kind of cpu heat, includes several Connection Blocks, between adjacent two Connection Blocks, is provided with some the first heat pipes, and described the first heat pipe and Connection Block surround into annular.
On described Connection Block, be provided with some the first mounting grooves, the first described heat pipe two ends are fixed in the first mounting groove.
On described Connection Block, be provided with step, between the step of described adjacent two Connection Blocks, be connected with the second heat pipe, described the second heat pipe and step surround annular.
On described step, be provided with the second mounting groove, the second described heat pipe two ends are all fixed in the second mounting groove.
Adopt the heating radiator of technique scheme, traditional soaking plate and radiating fin of passing through carried out to heating radiator and make into dispel the heat by heat pipe, because adopting heat pipes for heat transfer is effective, so the heat that thermal source on Connection Block can be produced transfers away rapidly from Connection Block, by heat pipe by dissipation of heat in air, heat pipe is arranged to annular, and he can dwindle the volume of heating radiator like this, if need to need the heating radiator of relatively high power, heat pipe need to be very long, be designed to annular and just can save a lot of spaces, and the components and parts that need to dispel the heat are arranged on Connection Block such with regard to the more effective space that utilizes of energy in ring, if heat radiation power is very large, need to increase heat pipe a step can be set on Connection Block, can one circle annular heat pipe be set again and be arranged on step at the annular heat pipe inner ring being originally arranged on Connection Block like this, so not only increase heat radiation power but also saved space, if multiple heat dissipation elements need to be installed, multiple heat sinks can be set, between adjacent two heat sinks, heat pipe is set, heat pipe and heat sink composition annular, save space, the components and parts that need to dispel the heat can be arranged on Connection Block and effectively utilize space in ring, step can also be set on Connection Block, multilayer heat pipe can be set, heat pipe is placed on Connection Block and extend into soaking plate middle part and can play the effect of soaking plate, heat is transmitted and opened rapidly, save cost.
[brief description of the drawings]
Fig. 1 is the utility model embodiment 1 stereographic map.
Fig. 2 is the explosive view of Fig. 1.
Fig. 3 is the utility model embodiment 2 stereographic maps.
Fig. 4 is the explosive view of Fig. 3.
Fig. 5 is the utility model Connection Block embodiment 1 structural drawing.
Fig. 6 is the utility model Connection Block embodiment 2 structural drawing.
[embodiment]
Heating radiator as depicted in figs. 1 and 2, include the Connection Block 1 of mounting related components, also include some the first heat pipes 2 ?1, the first heat pipe 2 ?1 two ends are all located on Connection Block 1 annular with Connection Block 1 composition, on Connection Block 1, be provided with as shown in Figure 5 the first mounting groove 1 ?1, the first heat pipe 2 ?1 two ends be just fixed on the first mounting groove 1 ?in 1, the first heat pipe 2 ?1 two ends stretch into the first mounting groove 1 ?1 interior one section (heat at Connection Block middle part can be transmitted rapidly like this, play the effect of soaking plate, thereby avoid using soaking plate to reduce cost), the heat at Connection Block 1 middle part can be passed fast like this, improve radiating effect.On Connection Block 1, step 3 can be set as shown in Figure 6, on step 3, arrange the second mounting groove 3 ?1, the first heat pipe 2 ?be arranged with again in 1 annular frame surrounding with Connection Block 1 with step 3 surround annular the second heat pipe 2 ?2, the second heat pipe 2 ?2 two ends be all fixed on the second mounting groove 3 on step 3 ?in 1, the second heat pipe 2 ?2 two ends stretch into the second mounting groove 3 ?1 interior one section, so just the heat at step 3 centers can be passed fast, arrange that two-layer heat pipe can strengthen heat radiation power and the volume that need not increase heating radiator, heat pipe is arranged to annular and can be dwindled the volume of heating radiator, and need the components and parts of heat radiation components and parts can be located to (now the installed surface of web joint is towards ring-shaped inner part) in heat pipe annular frame on Connection Block time installing, like this can be more effective utilization empty, further reducing heating radiator takes up room.
If to multiple components and parts heat radiations, multiple Connection Blocks 1 can be set, between adjacent two Connection Blocks 1, heat pipe is set, heating radiator as shown in Figure 3 and Figure 4, include two Connection Blocks 1, between two Connection Blocks 1, be provided with some the first heat pipes 2 ?1, the first heat pipe 2 ?1 two ends be located at respectively on two Connection Blocks 1, on Connection Block 1, be provided with as shown in Figure 5 the first mounting groove 1 ?1, the first heat pipe 2 ?1 be just fixed on the first mounting groove 1 ?in 1 and stretch in mounting groove, the heat at Connection Block 1 center can be passed rapidly to raising radiating efficiency like this, the first heat pipe 2 ?1 and Connection Block 1 surround annular, save like this space.On Connection Block 1, step 3 can be set as shown in Figure 6, on step 3, arrange the second mounting groove 3 ?1, between adjacent two Connection Blocks 1, be also provided with the second heat pipe 2 ?2, the second heat pipe 2 ?2 two ends be arranged on respectively the second mounting groove 3 on adjacent two Connection Blocks 1 ?in 1 and stretch in groove one section, the heat at step center can be passed fast like this, step 3 and the second heat pipe 2 ?2 also surround annular cut be set in the first heat pipe 2 ?in 1 annular space surrounding with Connection Block 1, so not only can increase heat radiation power but also can not increase the volume of heating radiator, and need the components and parts of heat radiation components and parts can be located in annular frame on Connection Block time installing, like this can be more effective utilization empty, further reducing heating radiator takes up room.

Claims (8)

1. a cpu heat, includes the Connection Block (1) that thermal source is installed, and it is characterized in that: on described Connection Block (1), be provided with some the first heat pipes (2 ?1), described the first heat pipe (2 ?1) is connected and surrounds annular with Connection Block (1).
2. a kind of cpu heat according to claim 1, is characterized in that: on described Connection Block (1), be provided with some the first mounting grooves (1 ?1), described the first heat pipe (2 ?1) is fixed in the first mounting groove (1 ?1).
3. a kind of cpu heat according to claim 1 and 2, it is characterized in that: on described Connection Block (1), be provided with step (3), on described step (3), be fixed with some the second heat pipes (2 ?2), described the second heat pipe (2 ?2) is connected and surrounds into annular with step (3).
4. a kind of cpu heat according to claim 3, and being characterised in that: be provided with the second mounting groove (3 ?1) on described step (3), described the second heat pipe (2 ?2) is fixed in the second mounting groove (3 ?1).
5. a cpu heat, includes several Connection Blocks (1), it is characterized in that: between adjacent two Connection Blocks (1), be provided with some the first heat pipes (2 ?1), described the first heat pipe (2 ?1) surrounds into annular with Connection Block (1).
6. a kind of cpu heat according to claim 5, is characterized in that: on described Connection Block (1), be provided with some the first mounting grooves (1 ?1), described the first heat pipe (2 ?1) two ends are fixed in the first mounting groove (1 ?1).
7. according to a kind of cpu heat described in claim 5 or 6, it is characterized in that: on described Connection Block (1), be provided with step (3), between the step (3) of described adjacent two Connection Blocks (1), be connected with the second heat pipe (2 ?2), described the second heat pipe (2 ?2) surrounds annular with step (3).
8. a kind of cpu heat according to claim 7, is characterized in that: on described step (3), be provided with the second mounting groove (3 ?1), described the second heat pipe (2 ?2) two ends are all fixed in the second mounting groove (3 ?1).
CN201420135670.XU 2014-03-24 2014-03-24 CPU (central processing unit) radiator Expired - Fee Related CN203799328U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420135670.XU CN203799328U (en) 2014-03-24 2014-03-24 CPU (central processing unit) radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420135670.XU CN203799328U (en) 2014-03-24 2014-03-24 CPU (central processing unit) radiator

Publications (1)

Publication Number Publication Date
CN203799328U true CN203799328U (en) 2014-08-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420135670.XU Expired - Fee Related CN203799328U (en) 2014-03-24 2014-03-24 CPU (central processing unit) radiator

Country Status (1)

Country Link
CN (1) CN203799328U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105929915A (en) * 2016-04-08 2016-09-07 吉首大学 CPU temperature monitoring and heat dissipation device
CN110906293A (en) * 2019-11-27 2020-03-24 特能热交换科技(中山)有限公司 Heat radiator
CN114992605A (en) * 2022-06-17 2022-09-02 深圳市骁阳技术有限公司 Heat dissipation device of ultra-high-power LED spotlight

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105929915A (en) * 2016-04-08 2016-09-07 吉首大学 CPU temperature monitoring and heat dissipation device
CN110906293A (en) * 2019-11-27 2020-03-24 特能热交换科技(中山)有限公司 Heat radiator
CN114992605A (en) * 2022-06-17 2022-09-02 深圳市骁阳技术有限公司 Heat dissipation device of ultra-high-power LED spotlight

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140827

Termination date: 20180324

CF01 Termination of patent right due to non-payment of annual fee