CN114992605A - Heat dissipation device of ultra-high-power LED spotlight - Google Patents
Heat dissipation device of ultra-high-power LED spotlight Download PDFInfo
- Publication number
- CN114992605A CN114992605A CN202210689555.6A CN202210689555A CN114992605A CN 114992605 A CN114992605 A CN 114992605A CN 202210689555 A CN202210689555 A CN 202210689555A CN 114992605 A CN114992605 A CN 114992605A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat pipe
- substrate
- assembly
- collecting substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a LED lighting field, especially a heat abstractor of super large power LED spotlight, including first heat accumulation base plate, second heat accumulation base plate, two first heat pipe subassemblies and second heat pipe subassembly, two first heat pipe subassembly and the cavity that second heat pipe subassembly constitutes is inside to be equipped with a heat dissipation wing subassembly along same heat dissipation direction respectively, the evaporation zone of first heat pipe subassembly with first heat accumulation base plate is connected, the condensation zone of first heat pipe subassembly the evaporation zone of second heat pipe subassembly respectively with second heat accumulation base plate is connected, shifts the heat that the LED spotlight produced in the air fast through first heat pipe subassembly, second heat pipe subassembly and heat dissipation wing subassembly.
Description
Technical Field
The application relates to the field of LED lighting, in particular to a heat dissipation device of an ultra-high-power LED spotlight.
Background
The high-power LED spotlight is mainly used for photography and movie and television, the existing high-power LED spotlight on the market at present has an ARRI Orbiter series, the maximum power of the LED spotlight is 500W, and a heat pipe heat dissipation form is adopted; the LED spotlight with the highest power on the market is LS1200dPro of Aitushi, the power of the LED spotlight is 1200W, and the heat dissipation mode is the heat pipe heat dissipation.
The influence of the self characteristics of the heated tube of the heat pipe radiator has a heat dissipation limit, because the heat dissipation capacity of the ultra-high-power LED spotlight is large and the heat dissipation is very concentrated (namely the heat dissipation area is small), the heat dissipation performance of the common heat pipe radiator is insufficient or even out of limit, the heat generated by the spotlight can not be taken away in time, so that the temperature of the LED spotlight is too high and the LED spotlight is damaged, the heat dissipation limit of the heated tube is limited, the existing LED spotlight with the maximum power in the market is 1200W, and the market demands for the LED spotlight with higher power are met for photography and movie and television, so the heat dissipation problem of the ultra-high-power LED spotlight becomes a bottleneck technical problem of industrial development and needs to break through urgently.
Disclosure of Invention
In view of the above, the present application is proposed in order to provide a heat sink for an ultra high power LED spotlight which overcomes or at least partly solves the above mentioned problems.
The heat dissipation device comprises a first heat collection substrate, a second heat collection substrate, two first heat pipe assemblies and a second heat pipe assembly, wherein one end face of the first heat collection substrate is connected with a core plate of the LED spotlight, the second heat collection substrate is arranged at a position corresponding to the other end face of the first heat collection substrate at a distance, the two first heat pipe assemblies are clamped between the corresponding end faces of the first heat collection substrate and the second heat collection substrate and are symmetrically arranged along the center lines of the first heat collection substrate and the second heat collection substrate, the second heat pipe assembly is clamped on the other end face of the second heat collection substrate, a heat dissipation fin assembly is arranged in a hollow space formed by the two first heat pipe assemblies and the second heat pipe assembly along the same heat dissipation direction, an evaporation section of each first heat pipe assembly is connected with the first heat collection substrate, and a condensation section of each first heat pipe assembly and an evaporation section of each second heat pipe assembly are connected with the second heat collection substrate.
Preferably, the first heat pipe assembly includes a plurality of first heat pipe components arranged at equal intervals, the first heat pipe components include first heat pipe units and second heat pipe units stacked in a staggered manner, evaporation sections of the first heat pipe units and the second heat pipe units are clamped on the first heat collecting substrate, and condensation sections of the first heat pipe units and the second heat pipe units are clamped on the second heat collecting substrate.
Preferably, one of the heat dissipation fin assemblies is connected with one end face of the first heat collecting substrate, the other heat dissipation fin assembly is connected with one end face of the second heat collecting substrate, and each heat dissipation fin assembly comprises a plurality of heat dissipation fins which are uniformly arranged at intervals and a third heat pipe unit which penetrates through each heat dissipation fin.
Preferably, the evaporation section of the third heat pipe unit is close to the first heat collecting substrate and/or the second heat collecting substrate.
Preferably, the second heat pipe assembly includes a plurality of second heat pipe components uniformly arranged at intervals, the second heat pipe components include a fourth heat pipe unit and a fifth heat pipe unit which are alternately stacked in a high-low manner, and evaporation sections of the fourth heat pipe unit and the fifth heat pipe unit are clamped on the second heat accumulation substrate.
Preferably, a supporting connecting member is arranged between the first heat pipe unit and the second heat pipe unit, or between the fourth heat pipe unit and the fifth heat pipe unit.
Preferably, a plurality of heat pipe embedding grooves penetrating through two sides are respectively formed in the end faces of the first heat collecting substrate and the second heat collecting substrate on the same side at intervals, the evaporation section of the first heat pipe assembly is clamped in the heat pipe embedding groove of the first heat collecting substrate, and the condensation section of the first heat pipe assembly and the evaporation section of the second heat pipe assembly are clamped in the heat pipe embedding groove of the second heat collecting substrate.
Preferably, the heat pipe module further comprises a surrounding plate, the surrounding plate is connected with the side edges of the first heat collecting substrate and the second heat collecting substrate, and the first heat pipe assembly, the second heat pipe assembly and the heat dissipation fin assembly are arranged in the surrounding plate.
Preferably, fan devices are respectively arranged outside the first heat pipe assembly and the second heat pipe assembly, and the air outlet ends of the fan devices correspond to the heat dissipation direction of the heat dissipation fin assembly.
An LED spotlight is also provided, comprising a heat sink as described above.
The application has the following advantages:
in the embodiment of the application, the device comprises a first heat collecting substrate, a second heat collecting substrate, two first heat pipe assemblies and a second heat pipe assembly, wherein one end face of the first heat collecting substrate is connected with a core plate of the LED spotlight, the second heat collecting substrate is arranged at a distance corresponding to the other end face of the first heat collecting substrate, the two first heat pipe assemblies are clamped between the corresponding end faces of the first heat collecting substrate and the second heat collecting substrate and are symmetrically arranged along the center lines of the first heat collecting substrate and the second heat collecting substrate, the second heat pipe assembly is clamped on the other end face of the second heat collecting substrate, a heat dissipation fin assembly is respectively arranged in the hollow interior formed by the two first heat pipe assemblies and the second heat pipe assembly along the same heat dissipation direction, the evaporation section of the first heat pipe assembly is connected with the first heat collecting substrate, and the condensation section of the first heat pipe assembly and the evaporation section of the second heat pipe assembly are respectively connected with the second heat collecting substrate; part of heat of the first heat collecting substrate is quickly converted to the second heat collecting substrate through the phase change heat exchange process of the first heat pipe assembly, and then part of heat condensed on the second heat collecting substrate is converted to the air through the phase change process of the second heat pipe assembly.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings needed to be used in the description of the present application will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.
Fig. 1 is a schematic overall structure diagram of a heat dissipation device of an ultra-high power LED spotlight according to an embodiment of the present disclosure;
fig. 2 is an exploded schematic view of a heat dissipation device of an ultra-high power LED spotlight according to an embodiment of the present disclosure;
fig. 3 is a schematic view of a mounting structure of a heat pipe component of a heat dissipation device of an ultra-high power LED spotlight according to an embodiment of the present invention;
fig. 4 is a schematic top view of a heat dissipation device of an ultra-high power LED spotlight according to an embodiment of the present invention;
in the figure, 1, an LED spotlight; 10. a first heat collecting substrate; 20. a second thermal substrate; 30. a first heat pipe assembly; 31. a first heat pipe unit; 32. a second heat pipe unit; 40. a second heat pipe assembly; 41. a fourth heat pipe unit; 42. a fifth heat pipe unit; 43. a support link; 50. a heat dissipating fin assembly; 51. a heat dissipating fin; 52. a third heat pipe unit; 60. and (4) enclosing plates.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that, in any embodiment of the present invention, the heat dissipation device mentioned above can be used in a heat dissipation scene of a general power LED spotlight, and more preferably, the heat dissipation device can meet the heat dissipation requirement of a 1200W-1800W ultra-high power LED spotlight, thereby effectively improving the service life of the ultra-high power LED spotlight.
Referring to fig. 1 to 4, a heat dissipating device of an ultra-high power LED spotlight according to an embodiment of the present invention is shown, which includes a first heat collecting substrate 10 having one end surface connected to a core plate of the LED spotlight 1, a second heat collecting substrate 20 disposed at a distance from the other end surface of the first heat collecting substrate 10, two first heat pipe assemblies 30 clamped between the corresponding end surfaces of the first heat collecting substrate 10 and the second heat collecting substrate 20 and symmetrically disposed along a center line of the first heat collecting substrate 10 and the second heat collecting substrate 20, and a second heat pipe assembly 40 clamped on the other end surface of the second heat collecting substrate 20, wherein a heat dissipating fin assembly 50 is disposed in a hollow interior formed by the two first heat pipe assemblies 30 and the second heat pipe assembly 40, respectively, and an evaporation section of the first heat pipe assembly 30 is connected to the first heat collecting substrate 10, the condensation section of the first heat pipe assembly 30 and the evaporation section of the second heat pipe assembly 40 are connected to the second thermal substrate 20, respectively.
The device comprises a first heat collecting substrate 10, a second heat collecting substrate 20, two first heat pipe assemblies 30 and a second heat pipe assembly 40, wherein one end face of the first heat collecting substrate 10 is connected with a core plate of the LED spotlight 1, the second heat collecting substrate 20 is arranged at a distance from the other end face of the first heat collecting substrate 10, the two first heat pipe assemblies 30 are clamped between the corresponding end faces of the first heat collecting substrate 10 and the second heat collecting substrate 20 and are symmetrically arranged along the center lines of the first heat collecting substrate 10 and the second heat collecting substrate 20, the second heat pipe assembly 40 is clamped on the other end face of the second heat collecting substrate 20, a heat dissipation fin assembly 50 is respectively arranged in a hollow interior formed by the two first heat pipe assemblies 30 and the second heat pipe assembly 40 along the same heat dissipation direction, the evaporation section of the first heat pipe assembly 30 is connected with the first heat collecting substrate 10, and the condensation section of the first heat pipe assembly 30 and the evaporation section of the second heat pipe assembly 40 are respectively connected with the second heat collecting substrate 20; after a large amount of heat of the LED spotlight 1 is absorbed by the first heat collecting substrate 10, part of the heat of the first heat collecting substrate 10 is rapidly transferred to the second heat collecting substrate 20 through the phase change heat exchange process of the first heat pipe assembly 30, and then part of the heat condensed on the second heat collecting substrate 20 is transferred to the air through the phase change process of the second heat pipe assembly 40, and at the same time, the heat dissipation fin assemblies 50 disposed inside the first heat pipe assembly 30 and the second heat pipe assembly 40 enhance the conductive heat dissipation effect of the corresponding heat collecting substrates.
The heat dissipation device of the ultra-high power LED spotlight is further described by the following embodiments.
In an embodiment of the present application, the first heat pipe assembly 30 includes a plurality of first heat pipe components that are uniformly arranged at intervals, the first heat pipe components include first heat pipe units 31 and second heat pipe units 32 that are stacked in a staggered manner, evaporation sections of the first heat pipe units 31 and the second heat pipe units 32 are clamped on the first heat collecting substrate 10, and condensation sections of the first heat pipe units 31 and the second heat pipe units 32 are clamped on the second heat collecting substrate 20.
It should be noted that, the first heat pipe unit 31 and the second heat pipe unit 32 are stacked in a staggered manner, and a certain gap may exist between the two units, so that the unit heat dissipation area of the heat pipe components is effectively increased, and each first heat pipe component is arranged at intervals, so that the total heat conduction area is greatly increased.
It can be understood that the first heat pipe unit 31 or the second heat pipe unit 32 is U-shaped, one section is an evaporation section, and the other section is a condensation section, and heat is transmitted to the condensation section through the evaporation section in a variable manner, that is, heat of the first heat collecting substrate 10 can be rapidly conducted to the second heat collecting substrate 20 through the first heat pipe assembly 30; because the plurality of first heat pipe components are arranged at intervals, part of heat is radiated to the air in the heat conduction process.
In an embodiment of the present application, one of the heat dissipation fin assemblies 50 is connected to an end surface of the first heat collecting substrate 10, and the other heat dissipation fin assembly 50 is connected to an end surface of the second heat collecting substrate 20, and the heat dissipation fin assembly 50 includes a plurality of heat dissipation fins 51 uniformly arranged at intervals, and a third heat pipe unit 52 penetrating through each of the heat dissipation fins 51.
It can be understood that the heat conduction mode through the heat pipe effect is not enough to conduct the heat of the heat-collecting substrate to the maximum extent, and the heat conduction efficiency of the heat-collecting substrate is accelerated by adding the heat dissipation fin assembly 50; furthermore, each heat dissipation fin 51 is provided with a third heat pipe unit 52, so as to improve the heat conduction efficiency of the heat dissipation fin 51.
Specifically, the evaporation section of the third heat pipe unit 52 is attached to the first heat collecting substrate 10 and/or the second heat collecting substrate 20; each of the heat dissipating fin assemblies 50 is arranged in a high-low manner to penetrate through three third heat pipe units 52, so that the heat conduction efficiency of the heat collecting substrate is improved in a heat pipe and heat dissipating fin combination manner.
In an embodiment of the present application, the second heat pipe assembly 40 includes a plurality of second heat pipe components arranged at equal intervals, the second heat pipe components include fourth heat pipe units 41 and fifth heat pipe units 42 stacked in an alternating manner, and evaporation sections of the fourth heat pipe units 41 and the fifth heat pipe units 42 are clamped on the second thermal substrate 20.
It should be noted that, when most of the heat is collected on the second heat collecting substrate 20, the heat on the second heat collecting substrate 20 is rapidly conducted to the air through the second heat pipe components uniformly arranged at intervals in the second heat pipe assembly 40, specifically, the evaporation sections of the fourth heat pipe unit 41 and the fifth heat pipe unit 42, which are alternately stacked in a high-low manner, of the second heat pipe components are clamped on the second heat collecting substrate 20, the heat on the second heat collecting substrate 20 is rapidly conducted to the condensation section contacting with the air through a phase change effect, and further, the heat of the first heat collecting substrate 10 is rapidly exchanged or dissipated by conduction through the heat pipe units in a multi-stage (at least two-stage) stacking design.
The fourth heat pipe unit 41 and the fifth heat pipe unit 42 are C-shaped, and the end of the evaporation section is arranged corresponding to the end of the condensation section.
In an embodiment of the present application, a supporting connection 43 is disposed between the first heat pipe unit 31 and the second heat pipe unit 32, or between the fourth heat pipe unit 41 and the fifth heat pipe unit 42.
It can be understood that the supporting connection piece 43 keeps the first heat pipe unit 31 and the second heat pipe unit 32 or the fourth heat pipe unit 41 and the fifth heat pipe unit 42 in a stable staggered corresponding relationship, and the gaps staggered in height are beneficial to heat dissipation into the air.
In an embodiment of the present invention, a plurality of heat pipe fitting grooves penetrating through both sides are respectively formed on the same side end surfaces of the first heat collecting substrate 10 and the second heat collecting substrate 20 at intervals, the evaporation section of the first heat pipe assembly 30 is clamped in the heat pipe fitting groove of the first heat collecting substrate 10, and the condensation section of the first heat pipe assembly 30 and the evaporation section of the second heat pipe assembly 40 are clamped in the heat pipe fitting groove of the second heat collecting substrate 20.
It can be understood that the heat pipe fitting groove of the second heat collecting substrate 20 simultaneously fits the first heat pipe assembly 30 and the second heat pipe assembly 40, so that heat conduction can be directly performed between the two, and the overall heat dissipation efficiency is further improved.
In an embodiment of the present application, the heat pipe assembly further includes a surrounding plate 60, the surrounding plate 60 is connected to the side edges of the first heat collecting substrate 10 and the second heat collecting substrate 20, and the first heat pipe assembly 30, the second heat pipe assembly 40, and the heat dissipation fin assembly 50 are disposed in the surrounding plate 60.
The enclosing plate 60 stabilizes the relative position of the first heat collecting substrate 10 and the second heat collecting substrate 20, so as to protect the first heat pipe assembly 30, the second heat pipe assembly 40 and the heat dissipating fin assembly 50 disposed inside.
In an embodiment of the present application, a fan device (not shown) is respectively disposed outside the first heat pipe assembly 30 and the second heat pipe assembly 40, and an air outlet end of the fan device corresponds to a heat dissipation direction of the heat dissipation fin assembly 50.
It can be understood that, by providing the fan device outside the first heat pipe assembly 30 and the second heat pipe assembly 40, the air outlet end of the fan device corresponds to the heat dissipation direction of the heat dissipation fin assembly 50, that is, the air outlet end of the fan device corresponds to the gaps between the heat pipe assemblies and the heat dissipation fins 51, and convection is formed between the first heat pipe assembly 30, the second heat pipe assembly 40 and the heat dissipation fin assembly 50 inside by the fan device, so as to accelerate the heat convection rate in the air. In summary, the application combines various modes such as phase-change heat exchange, solid heat conduction and convection heat exchange, so that heat generated by the LED spotlight can be dissipated more quickly and effectively, the heat dissipation problem of the ultra-high-power LED spotlight is solved, a foundation is laid for research and development of 1500W, 1800W, 2000W and even higher ultra-high-power LED spotlights, and the development process of the ultra-high-power LED spotlight in the film and television and photography industries is accelerated.
While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "include", "including" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or terminal device including a series of elements includes not only those elements but also other elements not explicitly listed or inherent to such process, method, article, or terminal device. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The above detailed description is given to the heat dissipation device of the ultra-high power LED spotlight provided in the present application, and specific examples are applied herein to explain the principles and embodiments of the present application, and the description of the above embodiments is only used to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A heat dissipation device of an ultra-high power LED spotlight is characterized by comprising a first heat collection substrate, a second heat collection substrate, two first heat pipe assemblies and a second heat pipe assembly, wherein one end face of the first heat collection substrate is connected with a core plate of the LED spotlight, the second heat collection substrate is arranged at a distance corresponding to the other end face of the first heat collection substrate, the two first heat pipe assemblies are clamped between the corresponding end faces of the first heat collection substrate and the second heat collection substrate and are symmetrically arranged along the central lines of the first heat collection substrate and the second heat collection substrate, the second heat pipe assembly is clamped on the other end face of the second heat collection substrate, hollow interiors formed by the two first heat pipe assemblies and the second heat pipe assemblies are respectively provided with a heat dissipation fin assembly along the same heat dissipation direction, the evaporation section of the first heat pipe assembly is connected with the first heat collecting substrate, and the condensation section of the first heat pipe assembly and the evaporation section of the second heat pipe assembly are respectively connected with the second heat collecting substrate.
2. The heat dissipation device as defined in claim 1, wherein the first heat pipe assembly includes a plurality of first heat pipe components arranged at regular intervals, the first heat pipe components include first heat pipe units and second heat pipe units stacked in an alternating manner, evaporation sections of the first heat pipe units and the second heat pipe units are clamped on the first heat collecting substrate, and condensation sections of the first heat pipe units and the second heat pipe units are clamped on the second heat collecting substrate.
3. The heat dissipating device as claimed in claim 1, wherein one of the heat dissipating fin assemblies is connected to an end surface of the first heat collecting substrate, and the other heat dissipating fin assembly is connected to an end surface of the second heat collecting substrate, and the heat dissipating fin assembly includes a plurality of heat dissipating fins arranged at regular intervals, and a third heat pipe unit penetrating through each of the heat dissipating fins.
4. The heat dissipation device of claim 3, wherein the evaporation section of the third heat pipe unit is attached to the first heat collecting substrate and/or the second heat collecting substrate.
5. The heat dissipation device as defined in claim 1, wherein the second heat pipe assembly includes a plurality of second heat pipe components arranged at regular intervals, the second heat pipe components include a fourth heat pipe unit and a fifth heat pipe unit stacked alternately in a high-low manner, and evaporation sections of the fourth heat pipe unit and the fifth heat pipe unit are clamped on the second thermal substrate.
6. The heat dissipating device of claim 2 or 5, wherein a support connection is provided between the first heat pipe unit and the second heat pipe unit, or between the fourth heat pipe unit and the fifth heat pipe unit.
7. The heat dissipating device as claimed in claim 1, wherein a plurality of heat pipe engaging grooves are formed at intervals on the same side end surfaces of the first heat collecting substrate and the second heat collecting substrate, the evaporation section of the first heat pipe assembly is engaged with the heat pipe engaging groove of the first heat collecting substrate, and the condensation section of the first heat pipe assembly and the evaporation section of the second heat pipe assembly are engaged with the heat pipe engaging groove of the second heat collecting substrate.
8. The heat dissipating device of claim 1, further comprising a shroud connected to the sides of the first and second heat collecting substrates, the first and second heat pipe assemblies and the heat dissipating fin assembly being disposed within the shroud.
9. The heat dissipation device as defined in claim 1, wherein a fan device is disposed outside each of the first heat pipe assembly and the second heat pipe assembly, and an air outlet end of the fan device corresponds to a heat dissipation direction of the heat dissipation fin assembly.
10. An LED spotlight comprising a heat sink according to any of claims 1-5 and 7-9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210689555.6A CN114992605B (en) | 2022-06-17 | 2022-06-17 | Heat abstractor of super high power LED spotlight |
| PCT/CN2022/104963 WO2023240724A1 (en) | 2022-06-17 | 2022-07-11 | Heat dissipation device of ultra-high-power led spotlight |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210689555.6A CN114992605B (en) | 2022-06-17 | 2022-06-17 | Heat abstractor of super high power LED spotlight |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114992605A true CN114992605A (en) | 2022-09-02 |
| CN114992605B CN114992605B (en) | 2023-06-02 |
Family
ID=83035701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210689555.6A Active CN114992605B (en) | 2022-06-17 | 2022-06-17 | Heat abstractor of super high power LED spotlight |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114992605B (en) |
| WO (1) | WO2023240724A1 (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203799328U (en) * | 2014-03-24 | 2014-08-27 | 中山市久能光电科技有限公司 | CPU (central processing unit) radiator |
| CN105387438A (en) * | 2015-12-24 | 2016-03-09 | 刘树泽 | Cooling suite of LED project lamp |
| CN110848646A (en) * | 2019-11-27 | 2020-02-28 | 特能热交换科技（中山）有限公司 | High-efficiency radiator and lamp with same |
| CN110906293A (en) * | 2019-11-27 | 2020-03-24 | 特能热交换科技（中山）有限公司 | Heat radiator |
| CN215003107U (en) * | 2021-05-11 | 2021-12-03 | 特能热交换科技（中山）有限公司 | Heat pipe radiator |
| CN215725361U (en) * | 2021-05-11 | 2022-02-01 | 特能热交换科技（中山）有限公司 | High heat conduction type radiator |
| CN216308711U (en) * | 2021-10-14 | 2022-04-15 | 特能(厦门)超导科技有限公司 | Heat pipe radiator |
| CN216308713U (en) * | 2021-10-14 | 2022-04-15 | 特能(厦门)超导科技有限公司 | Heat pipe sheet type heat dissipation device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101316495B (en) * | 2007-06-01 | 2011-12-21 | 富准精密工业(深圳)有限公司 | Heat sink assembly |
| TW200915051A (en) * | 2007-09-21 | 2009-04-01 | Foxconn Tech Co Ltd | Heat dissipation device |
| TWI484895B (en) * | 2010-05-14 | 2015-05-11 | Asia Vital Components Co Ltd | Heat dissipation device |
| CN206846331U (en) * | 2017-04-27 | 2018-01-05 | 中山市久能光电科技有限公司 | A kind of LED radiator of good heat dissipation effect |
| US11817372B2 (en) * | 2020-04-15 | 2023-11-14 | Asia Vital Components Co., Ltd. | Heat sink device |
-
2022
- 2022-06-17 CN CN202210689555.6A patent/CN114992605B/en active Active
- 2022-07-11 WO PCT/CN2022/104963 patent/WO2023240724A1/en unknown
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203799328U (en) * | 2014-03-24 | 2014-08-27 | 中山市久能光电科技有限公司 | CPU (central processing unit) radiator |
| CN105387438A (en) * | 2015-12-24 | 2016-03-09 | 刘树泽 | Cooling suite of LED project lamp |
| CN110848646A (en) * | 2019-11-27 | 2020-02-28 | 特能热交换科技（中山）有限公司 | High-efficiency radiator and lamp with same |
| CN110906293A (en) * | 2019-11-27 | 2020-03-24 | 特能热交换科技（中山）有限公司 | Heat radiator |
| CN215003107U (en) * | 2021-05-11 | 2021-12-03 | 特能热交换科技（中山）有限公司 | Heat pipe radiator |
| CN215725361U (en) * | 2021-05-11 | 2022-02-01 | 特能热交换科技（中山）有限公司 | High heat conduction type radiator |
| CN216308711U (en) * | 2021-10-14 | 2022-04-15 | 特能(厦门)超导科技有限公司 | Heat pipe radiator |
| CN216308713U (en) * | 2021-10-14 | 2022-04-15 | 特能(厦门)超导科技有限公司 | Heat pipe sheet type heat dissipation device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023240724A1 (en) | 2023-12-21 |
| CN114992605B (en) | 2023-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1945814A (en) | Heat radiator fin and circular heat tube radiator | |
| CN114992605A (en) | Heat dissipation device of ultra-high-power LED spotlight | |
| CN101287347A (en) | Heat pipe radiating device | |
| CN211177171U (en) | Radiator and air conditioner | |
| CN108419416A (en) | A kind of high heat dissipation capacity heat-pipe radiator of IGBT | |
| CN212259643U (en) | Heat sink device | |
| CN112748631B (en) | Laser light source and laser projection equipment | |
| TWI686130B (en) | Cooling module | |
| JP2018174184A (en) | Cooler and lighting device including cooler | |
| CN111328249A (en) | Heat radiator | |
| CN113675494A (en) | Heat pipe fin type cooling structure applied to power battery module | |
| CN112285847A (en) | Multipath parallel optical module heat radiation structure | |
| CN112601421A (en) | High-efficient heat radiation structure of 3U airtight quick-witted case | |
| CN110848820A (en) | Radiator and air conditioner | |
| WO2008037135A1 (en) | Heat sink with heat pipe and manufacturing method thereof | |
| CN112748632A (en) | Laser light source and laser projection equipment | |
| CN219693180U (en) | Radiator, radiating assembly and lamp equipment | |
| CN112787027A (en) | Heat dissipation bottom plate and battery box | |
| CN215117139U (en) | Heat dissipation module and projection ray apparatus | |
| CN219588893U (en) | Light source radiator | |
| CN214067563U (en) | Low-thermal-resistance projection light source heat dissipation device | |
| CN212227850U (en) | Radiator with excellent radiating effect | |
| CN215345591U (en) | Heat radiation structure | |
| CN213755498U (en) | Square heat pipe radiator | |
| CN210772061U (en) | LED light source heat dissipation platform |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |