CN213755498U - Square heat pipe radiator - Google Patents

Square heat pipe radiator Download PDF

Info

Publication number
CN213755498U
CN213755498U CN202023087420.8U CN202023087420U CN213755498U CN 213755498 U CN213755498 U CN 213755498U CN 202023087420 U CN202023087420 U CN 202023087420U CN 213755498 U CN213755498 U CN 213755498U
Authority
CN
China
Prior art keywords
heat
square
pipe
heat dissipation
pipes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202023087420.8U
Other languages
Chinese (zh)
Inventor
李卫民
张建杰
陈泽伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Wanhengda Heat Transfer Technology Co ltd
Original Assignee
Dongguan Wanhengda Heat Transfer Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Wanhengda Heat Transfer Technology Co ltd filed Critical Dongguan Wanhengda Heat Transfer Technology Co ltd
Priority to CN202023087420.8U priority Critical patent/CN213755498U/en
Application granted granted Critical
Publication of CN213755498U publication Critical patent/CN213755498U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The utility model relates to the technical field of radiators, in particular to a square heat pipe radiator, which comprises a fin group and a heat transfer group connected with the fin group; the fin group comprises a heat transfer fixing groove, a first heat dissipation area positioned above the heat transfer fixing groove and second heat dissipation areas positioned on two sides of the first heat dissipation area; the heat transfer group comprises at least two groups of first heat pipes and second heat pipes, the first heat pipes are provided with first square pipe parts, the second heat pipes are provided with second square pipe parts, the first square pipe parts and the second square pipe parts are arranged in the heat transfer fixing grooves, the first heat pipes extend to the first heat dissipation area, and the second heat pipes extend to the second heat dissipation area; the utility model discloses a fin group and the heat transfer group of square heat pipe weld structure side by side carries out the square processing at the heat pipe heating end, makes the exact area between heat pipe and the heat pipe bigger, and the heating end plane degree is changeed and is controlled, has promoted the radiating effect to the aspect of the dispersion nature ability, guarantees the stability of chip temperature, has improved the life of chip.

Description

Square heat pipe radiator
Technical Field
The utility model relates to a radiator technical field especially relates to a square heat pipe radiator.
Background
Along with the continuous development of science and technology, many scientific and technological products have all been merged into in production and the life, these scientific and technological products are in the production of giving people, the life provides convenient while, self can constantly generate heat at energy conversion's in-process, how guarantee the normal operating of these products, firstly, will solve their heat dissipation problem, especially inside some equipment that power is higher, because the work efficiency of equipment constantly improves, peripheral electronic component also constantly increases simultaneously, make the whole calorific capacity of equipment also promote thereupon by a wide margin, traditional heat abstractor is mostly the cooling method of fin with the fan, this cooling method has gradually can not satisfy the heat dissipation demand of high-power equipment, often make equipment can not normal operating because of the high temperature.
The existing heat pipe of the radiator adopts a circular heat pipe, and because the contact surface of the circular heat pipe is small, heat transfer needs to be realized by connecting a heat conducting block, so that the cost is high, and the heat pipe is difficult to completely attach for heat transfer, so that the heat pipe structure can be further improved to improve the heat dissipation performance of the radiator.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, the present invention provides a square heat pipe radiator, which employs a parallel welding structure of a fin set and a square heat pipe, and performs square processing at the heating end of the heat pipe, so that the area between the heat pipe and the heat pipe is larger, the flatness of the heating end is easier to control, the radiating effect is improved in the aspect of the dispersion performance, the stability of the temperature of the chip is ensured, and the service life of the chip is prolonged.
The utility model adopts the technical proposal that: a square heat pipe radiator comprises a fin group and a heat transfer group connected with the fin group; the fin group comprises a heat transfer fixing groove, a first heat dissipation area positioned above the heat transfer fixing groove and second heat dissipation areas positioned on two sides of the first heat dissipation area; the heat transfer set comprises at least two sets of first heat pipes and second heat pipes, the first heat pipes are provided with first square pipe portions, the second heat pipes are provided with second square pipe portions, the first square pipe portions and the second square pipe portions are arranged in the heat transfer fixing grooves, the first heat pipes extend to the first heat dissipation areas, and the second heat pipes extend to the second heat dissipation areas.
The further improvement of the scheme is that the fin group is positioned on two sides of the heat transfer fixing groove and provided with lower planes, and the lower planes are flush with the first square pipe part and the second square pipe part.
The scheme is further improved in that the fin group is formed by connecting a plurality of groups of radiating fins.
The scheme is further improved in that the first heat dissipation area is provided with soldering lugs for connecting multiple groups of heat dissipation fins in a welding mode.
In a further improvement of the above solution, the second heat dissipation area is provided with an upper plane on a surface thereof.
The further improvement of the scheme is that the radiating fins are aluminum fins.
The further improvement of the above scheme is that the first heat dissipation area is provided with a first through hole, and the first heat pipe penetrates into the first through hole.
The scheme is further improved in that the second heat dissipation area is provided with a second through hole, and the second heat pipe penetrates into the second through hole.
The scheme is further improved in that the first heat pipes are symmetrically arranged in two groups.
The scheme is further improved in that the second heat pipes are symmetrically arranged in two groups.
The utility model has the advantages that:
compare traditional radiator, the utility model discloses a fin group and the heat transfer group of square heat pipe weld structure side by side carries out the square processing at the heat pipe heating end, makes the exact area between heat pipe and the heat pipe bigger, and the control is changeed to the heating end plane degree, has promoted the radiating effect to the aspect of the dispersivity ability, guarantees the stability of chip temperature, has improved the life of chip. Specifically, a fin group and a heat transfer group connected with the fin group are arranged; the fin group comprises a heat transfer fixing groove, a first heat dissipation area positioned above the heat transfer fixing groove and second heat dissipation areas positioned on two sides of the first heat dissipation area; the heat transfer set comprises at least two sets of first heat pipes and second heat pipes, the first heat pipes are provided with first square pipe portions, the second heat pipes are provided with second square pipe portions, the first square pipe portions and the second square pipe portions are arranged in the heat transfer fixing grooves, the first heat pipes extend to the first heat dissipation areas, the second heat pipes extend to the second heat dissipation areas, the whole structure is stable and reliable, multiple sets of heat pipes are adopted for heat transfer, and the heat transfer efficiency is high.
Drawings
Fig. 1 is a schematic perspective view of the present invention;
fig. 2 is a schematic diagram of the explosion structure of the present invention.
Description of reference numerals: the heat pipe structure comprises a fin group 100, a heat transfer fixing groove 110, a lower plane 111, a first heat dissipation area 120, a first through hole 121, a second heat dissipation area 130, an upper plane 131, a second through hole 132, a heat transfer group 200, a first heat pipe 210, a first square pipe portion 211, a second heat pipe 220 and a second square pipe portion 221.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1-2, a square heat pipe radiator includes a fin set 100 and a heat transfer set 200 connected to the fin set 100; the fin assembly 100 includes a heat-transferring fixing groove 110, a first heat-dissipating region 120 located above the heat-transferring fixing groove 110, and second heat-dissipating regions 130 located at two sides of the first heat-dissipating region 120; the heat transfer unit 200 includes at least two sets of a first heat pipe 210 and a second heat pipe 220, the first heat pipe 210 has a first square pipe portion 211, the second heat pipe 220 has a second square pipe portion 221, the first square pipe portion 211 and the second square pipe portion 221 are both disposed in the heat transfer fixing groove 110, the first heat pipe 210 extends to the first heat dissipation area 120, and the second heat pipe 220 extends to the second heat dissipation area 130.
Fin group 100 is located heat transfer fixed slot 110 both sides and sets up lower plane 111, lower plane 111 and first square tube portion 211 and second square tube portion 221 parallel and level, through the installation of lower plane 111 cooperation square tube, conveniently laminate the heating part and carry out heat transfer heat dissipation.
The fin group 100 is formed by connecting a plurality of groups of radiating fins, and the further improvement is that the fin group 100 is formed by connecting a plurality of groups of radiating fins, the radiating fins are aluminum fins, and the radiating fins are connected with each other to radiate heat, so that the radiating range is large.
The surface of the second heat dissipation area 130 is provided with an upper plane 131, and the upper plane 131 can be used for dust prevention and is convenient to clean.
The first heat dissipation area 120 is provided with a first through hole 121, and the first heat pipe 210 penetrates into the first through hole 121, further modified in that the second heat dissipation area 130 starts to be provided with a second through hole 132, and the second heat pipe 220 penetrates into the second through hole 132.
In this embodiment, the first heat pipes 210 are symmetrically disposed in two sets, and the second heat pipes 220 are symmetrically disposed in two sets.
The utility model discloses a fin group 100 and heat transfer group 200 parallel welded structure of square heat pipe carry out the square processing at the heat pipe heating end, make the heat pipe bigger with the exact area between the heat pipe, the heating end plane degree is changeed and is controlled, has promoted the radiating effect to the aspect of the dispersibility ability, guarantees the stability of chip temperature, has improved the life of chip. Specifically, a fin group 100 and a heat transfer group 200 connected to the fin group 100 are provided; the fin assembly 100 includes a heat-transferring fixing groove 110, a first heat-dissipating region 120 located above the heat-transferring fixing groove 110, and second heat-dissipating regions 130 located at two sides of the first heat-dissipating region 120; the heat transfer unit 200 includes at least two sets of first heat pipes 210 and second heat pipes 220, the first heat pipes 210 have first square pipe portions 211, the second heat pipes 220 have second square pipe portions 221, the first square pipe portions 211 and the second square pipe portions 221 are both disposed in the heat transfer fixing grooves 110, the first heat pipes 210 extend to the first heat dissipation areas 120, the second heat pipes 220 extend to the second heat dissipation areas 130, the overall structure is stable and reliable, multiple sets of heat pipes are used for heat transfer, and the heat transfer efficiency is high.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. A square heat pipe radiator is characterized in that: comprises a fin group and a heat transfer group connected with the fin group; the fin group comprises a heat transfer fixing groove, a first heat dissipation area positioned above the heat transfer fixing groove and second heat dissipation areas positioned on two sides of the first heat dissipation area; the heat transfer set comprises at least two sets of first heat pipes and second heat pipes, the first heat pipes are provided with first square pipe portions, the second heat pipes are provided with second square pipe portions, the first square pipe portions and the second square pipe portions are arranged in the heat transfer fixing grooves, the first heat pipes extend to the first heat dissipation areas, and the second heat pipes extend to the second heat dissipation areas.
2. A square heat pipe radiator as claimed in claim 1, wherein: the fin group is located heat transfer fixed slot both sides and sets up the lower plane, lower plane and first side pipe portion and second side pipe portion parallel and level.
3. A square heat pipe radiator as claimed in claim 1, wherein: the fin group is formed by connecting a plurality of groups of radiating fins.
4. A square heat pipe radiator as claimed in claim 3, wherein: the first heat dissipation area is provided with soldering lugs for connecting multiple groups of heat dissipation fins in a welding mode.
5. A square heat pipe radiator as claimed in claim 4, wherein: the radiating fins are aluminum fins.
6. A square heat pipe radiator as claimed in claim 1, wherein: the surface of the second heat dissipation area is provided with an upper plane.
7. A square heat pipe radiator as claimed in claim 1, wherein: the first heat dissipation area is provided with a first through hole, and the first heat pipe penetrates into the first through hole.
8. A square heat pipe radiator as claimed in claim 1, wherein: and a second through hole is formed in the second heat dissipation area, and the second heat pipe penetrates into the second through hole.
9. A square heat pipe radiator as claimed in claim 1, wherein: the first heat pipes are symmetrically arranged in two groups.
10. A square heat pipe radiator as claimed in claim 1, wherein: the second heat pipes are symmetrically arranged in two groups.
CN202023087420.8U 2020-12-21 2020-12-21 Square heat pipe radiator Active CN213755498U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202023087420.8U CN213755498U (en) 2020-12-21 2020-12-21 Square heat pipe radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202023087420.8U CN213755498U (en) 2020-12-21 2020-12-21 Square heat pipe radiator

Publications (1)

Publication Number Publication Date
CN213755498U true CN213755498U (en) 2021-07-20

Family

ID=76835989

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202023087420.8U Active CN213755498U (en) 2020-12-21 2020-12-21 Square heat pipe radiator

Country Status (1)

Country Link
CN (1) CN213755498U (en)

Similar Documents

Publication Publication Date Title
CN210379348U (en) New energy automobile power battery water-cooling heat dissipation system
CN213755498U (en) Square heat pipe radiator
CN216775336U (en) Integral type multi-structure aluminum alloy ex-trusions radiator
WO2022222759A1 (en) Radiator, packaging structure, and electronic device
CN213892207U (en) Fill electric pile power module with heat dissipation function
CN212970604U (en) Servo driver with high-efficiency heat dissipation
CN213755497U (en) Air-cooling and water-cooling integrated radiator
CN218848707U (en) Radiator with heat energy conversion function
CN217241238U (en) Heat pipe radiator
CN210630152U (en) Dual-splicing uniform-temperature seamless radiator
CN200976725Y (en) Minisize fin type heat sink
CN211716667U (en) Heating body with good heat dissipation performance
CN110769657A (en) Integrated uniform temperature plate radiator
CN210373350U (en) Polygon combination kilowatt level LED laser heat dissipation module
CN213120217U (en) Heat pipe stacking heat conduction and dissipation device
CN211317014U (en) Combined radiating fin device
CN216650326U (en) Array intubation superconducting high-power combined heat dissipation module
CN216624869U (en) Heat dissipation device and laser
CN214470341U (en) Copper-aluminum seamless inlaid combined type air suction type radiator
CN219572406U (en) Dual-mode radiator for joint of refrigerating piece
CN216650328U (en) Optical module and electronic equipment
CN215421387U (en) Heat radiation module
CN209804642U (en) Integrated heat dissipation thyristor with multiple flow channels
CN207305233U (en) A kind of radiator
CN216054672U (en) Semiconductor diode structure capable of improving overcurrent capacity and facilitating heat dissipation

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant