CN216650326U - Array intubation superconducting high-power combined heat dissipation module - Google Patents

Array intubation superconducting high-power combined heat dissipation module Download PDF

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Publication number
CN216650326U
CN216650326U CN202122728449.8U CN202122728449U CN216650326U CN 216650326 U CN216650326 U CN 216650326U CN 202122728449 U CN202122728449 U CN 202122728449U CN 216650326 U CN216650326 U CN 216650326U
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heat
heat pipe
heat transfer
array
heat dissipation
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CN202122728449.8U
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田飞雄
张建杰
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Dongguan Wanhengda Heat Transfer Technology Co ltd
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Dongguan Wanhengda Heat Transfer Technology Co ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

Abstract

The utility model relates to the technical field of heat dissipation devices, in particular to an array intubation superconductive high-power combined heat dissipation module, which comprises a heat transfer base, a plurality of groups of heat pipe sets uniformly distributed on the surface of the heat transfer base, a fin set arranged on the heat transfer base and used for fixing the heat pipe sets, and a fixing element arranged on the heat pipe sets and used for fixing the heat pipe sets; the surface of the heat transfer base is provided with a plurality of heat transfer grooves in a linear array, the heat pipe set comprises a first heat pipe and a second heat pipe which are arranged in the heat transfer grooves, and the fin set is arranged on the heat transfer base and fixes the first heat pipe and the second heat pipe in the heat transfer grooves; the heat pipe set is arranged on the heat transfer base and used for heat transfer and heat dissipation, and the fin set is arranged on the heat transfer base and used for heat dissipation of the heat pipe set, so that the heat dissipation effect can be further improved, the heat pipe and the fins are combined for heat dissipation, and the heat dissipation efficiency is high.

Description

Array intubation superconducting high-power combined heat dissipation module
Technical Field
The utility model relates to the technical field of heat dissipation devices, in particular to an array intubation superconductive high-power combined heat dissipation module.
Background
Along with the continuous development of science and technology, many scientific and technological products have all been merged into in production and the life, these scientific and technological products are in the production of giving people, the life provides convenient while, self can constantly generate heat at energy conversion's in-process, how guarantee the normal operating of these products, firstly, will solve their heat dissipation problem, especially inside some equipment that power is higher, because the work efficiency of equipment constantly improves, peripheral electronic component also constantly increases simultaneously, make the whole calorific capacity of equipment also promote thereupon by a wide margin, traditional heat abstractor is mostly the cooling method of fin with the fan, this cooling method has gradually can not satisfy the heat dissipation demand of high-power equipment, often make equipment can not normal operating because of the high temperature.
The conventional heat dissipation module is generally single in structure, heat cannot be stably conducted out for heat dissipation in the heat dissipation process, and the overall heat dissipation efficiency is greatly influenced.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, the utility model provides an array intubation superconductive high-power combined heat dissipation module which can further improve the heat dissipation effect by arranging a heat pipe set on a heat transfer base for heat transfer and heat dissipation and arranging a fin set on the heat transfer base for heat dissipation of the heat pipe set, and combines heat pipes and fins for heat dissipation, thereby having high heat dissipation efficiency.
The technical scheme adopted by the utility model is as follows: an array intubation superconducting high-power combined heat dissipation module comprises a heat transfer base, a plurality of groups of heat pipe sets uniformly distributed on the surface of the heat transfer base, a fin set arranged on the heat transfer base and used for fixing the heat pipe sets, and a fixing element arranged on the heat pipe sets and used for fixing the heat pipe sets; the surface of the heat transfer base is provided with a plurality of heat transfer grooves in a linear array, the heat pipe set comprises a first heat pipe and a second heat pipe which are arranged in the heat transfer grooves, and the fin set is arranged on the heat transfer base and fixes the first heat pipe and the second heat pipe in the heat transfer grooves.
The scheme is further improved in that the heat transfer base is a copper base, and the first heat pipe and the second heat pipe are fixed in the heat transfer groove through welding.
The further improvement of the scheme is that the lower surface and two sides of the heat transfer base are both provided with connecting holes.
The scheme is further improved in that the first heat pipe and the second heat pipe are symmetrically provided with two groups which are arranged in the heat transfer groove.
The first heat pipe comprises a first connecting part arranged in the heat transfer groove, a first extending part connected with the first connecting part in a bending way, and a first inward-folding part connected with the first extending part in a bending way.
The second heat pipe comprises a second connecting part arranged in the heat transfer groove, a second extending part connected with the second connecting part in a bending mode, and a second inward folding part connected with the second extending part in a bending mode.
The further improvement of the scheme is that the bending amplitude of the second extension part is larger than that of the first extension part; the bending amplitude of the second inward-folding part is larger than that of the first inward-folding part.
The further improvement of the scheme is that the fin group comprises a connecting panel connected to the surface of the heat transfer base and a plurality of radiating fins arranged on the connecting panel.
The further improvement of the above scheme is that the heat dissipation fins are integrally formed on the connection panel.
In a further improvement of the above solution, the fixing element is provided with a plurality of fixing grooves, and the fixing grooves fix the first heat pipe and the second heat pipe.
The utility model has the beneficial effects that:
compared with the existing heat dissipation module, the heat pipe set is arranged on the heat transfer base and used for heat transfer and heat dissipation, and the fin set is arranged on the heat transfer base and used for heat dissipation of the heat pipe set, so that the heat dissipation effect can be further improved, the heat pipe and the fins are combined for heat dissipation, the heat dissipation efficiency is high, and the structure is reliable. The heat pipe assembly comprises a heat transfer base, a plurality of groups of heat pipe sets uniformly distributed on the surface of the heat transfer base, a fin set arranged on the heat transfer base and used for fixing the heat pipe assembly, and a fixing element arranged on the heat pipe sets and used for fixing the heat pipe sets; the surface of the heat transfer base is provided with a plurality of heat transfer grooves in a linear array, the heat pipe set comprises a first heat pipe and a second heat pipe which are arranged in the heat transfer grooves, and the fin set is arranged on the heat transfer base and fixes the first heat pipe and the second heat pipe in the heat transfer grooves. The heat transfer groove is used for connecting the first heat pipe and the second heat pipe for heat transfer and heat dissipation, and the fin group is used for fixing, so that the heat transfer and heat dissipation efficiency is high, and the structure is reliable.
Drawings
FIG. 1 is a perspective view of an array tube superconducting high power combined heat dissipation module according to the present invention;
fig. 2 is a schematic perspective view of another view angle of the array tube superconducting high power combined heat dissipation module in fig. 1;
fig. 3 is an exploded view of the array tube superconducting high power combined heat dissipation module shown in fig. 1.
Description of reference numerals: the heat pipe comprises a heat transfer base 1, a heat transfer groove 11, a connecting hole 12, a heat pipe group 2, a first heat pipe 21, a first connecting part 211, a first extending part 212, a first inward-folding part 213, a second heat pipe 22, a second connecting part 221, a second extending part 222, a second inward-folding part 223, a fin group 3, a connecting panel 31, a heat dissipation fin 32, a fixing element 4 and a fixing groove 41.
Detailed Description
To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.
As shown in fig. 1 to 3, an array intubation superconducting high-power combined heat dissipation module includes a heat transfer base 1, a plurality of sets of heat pipe sets 2 uniformly distributed on the surface of the heat transfer base 1, a fin set 3 mounted on the heat transfer base 1 and fixing the heat pipe sets 2, and a fixing element 4 disposed on the heat pipe sets 2 and fixing the heat pipe sets 2; the surface of the heat transfer base 1 is provided with a plurality of heat transfer grooves 11 in a linear array, the heat pipe group 2 comprises a first heat pipe 21 and a second heat pipe 22 which are arranged in the heat transfer grooves 11, and the fin group 3 is arranged on the heat transfer base 1 and fixes the first heat pipe 21 and the second heat pipe 22 in the heat transfer grooves 11.
The heat transfer base 1 is a copper base, and the first heat pipe 21 and the second heat pipe 22 are fixed in the heat transfer groove 11 by welding; the copper base is used as a structure for heat transfer, so that the heat transfer efficiency is extremely high, and the follow-up stable heat dissipation is ensured.
Connecting holes 12 are formed in the lower surface and the two sides of the heat transfer base 1, the connecting holes 12 are arranged to facilitate fixed connection of the structure, and connection is convenient.
The first heat pipe 21 and the second heat pipe 22 are symmetrically provided with two groups which are arranged in the heat transfer groove 11, and a plurality of groups of arrays are adopted, so that heat can be rapidly transferred and dissipated, and the heat dissipation efficiency is high.
The first heat pipe 21 comprises a first connecting part 211 arranged in the heat transfer groove 11, a first extending part 212 connected with the first connecting part 211 in a bending way, and a first inward-folding part 213 connected with the first extending part 212 in a bending way, and the improvement is that the second heat pipe 22 comprises a second connecting part 221 arranged in the heat transfer groove 11, a second extending part 222 connected with the second connecting part 221 in a bending way, and a second inward-folding part 223 connected with the second extending part 222 in a bending way; the bending amplitude of the second extension portion 222 is greater than that of the first extension portion 212; the bending amplitude of the second inward-folding portion 223 is greater than that of the first inward-folding portion 213; the connecting part is adopted for connecting and transferring heat, and then the heat transfer area and the heat dissipation area are increased through the extending part and the inward folding part.
The fin group 3 comprises a connecting panel 31 connected to the surface of the heat transfer base 1 and a plurality of radiating fins 32 arranged on the connecting panel 31, and the further improvement is that the radiating fins 32 are integrally processed and formed on the connecting panel 31, and the radiating fins 32 are used for radiating heat with high efficiency through integral processing, so that the radiating efficiency is high, stable and reliable.
The fixing element 4 is provided with a plurality of fixing grooves 41, the fixing grooves 41 are used for fixing the first heat pipe 21 and the second heat pipe 22, and the plurality of fixing grooves 41 are used for fixing the first heat pipe 21 and the second heat pipe 22, so that the stability and the reliability of the structure are ensured.
According to the utility model, the heat pipe set 2 is arranged on the heat transfer base 1 for heat transfer and radiation, and the fin set 3 is arranged on the heat transfer base 1 for radiating the heat pipe set 2, so that the radiating effect can be further improved, the heat pipes and the fins are combined for radiating, the radiating efficiency is high, and the structure is reliable. Specifically, a heat transfer base 1, a plurality of groups of heat pipe sets 2 uniformly distributed on the surface of the heat transfer base 1, a fin set 3 which is arranged on the heat transfer base 1 and fixes the heat pipe sets 2, and a fixing element 4 which is arranged on the heat pipe sets 2 and fixes the heat pipe sets 2 are arranged; the surface of the heat transfer base 1 is provided with a plurality of heat transfer grooves 11 in a linear array, the heat pipe group 2 comprises a first heat pipe 21 and a second heat pipe 22 which are arranged in the heat transfer grooves 11, and the fin group 3 is arranged on the heat transfer base 1 and fixes the first heat pipe 21 and the second heat pipe 22 in the heat transfer grooves 11. The heat transfer groove 11 is used for connecting the first heat pipe 21 and the second heat pipe 22 for heat transfer and heat dissipation, and the fin group 3 is used for fixing, so that the heat transfer and heat dissipation efficiency is high, and the structure is reliable.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. The utility model provides a superconductive type high power combination heat dissipation module of array intubate which characterized in that: the heat pipe fixing device comprises a heat transfer base, a plurality of groups of heat pipe sets uniformly distributed on the surface of the heat transfer base, a fin group arranged on the heat transfer base and used for fixing the heat pipe sets, and a fixing element arranged on the heat pipe sets and used for fixing the heat pipe sets; the surface of the heat transfer base is provided with a plurality of heat transfer grooves in a linear array, the heat pipe set comprises a first heat pipe and a second heat pipe which are arranged in the heat transfer grooves, and the fin set is arranged on the heat transfer base and fixes the first heat pipe and the second heat pipe in the heat transfer grooves.
2. The array cannula superconducting high-power combined heat dissipation module of claim 1, wherein: the heat transfer base is a copper base, and the first heat pipe and the second heat pipe are fixed in the heat transfer groove through welding.
3. The array cannula superconducting high-power combined heat dissipation module of claim 1, wherein: the lower surface and the two sides of the heat transfer base are both provided with connecting holes.
4. The array cannula superconducting high-power combined heat dissipation module of claim 1, wherein: the first heat pipe and the second heat pipe are symmetrically provided with two groups which are arranged in the heat transfer groove.
5. The array cannula superconducting high-power combined heat dissipation module of claim 1, wherein: the first heat pipe comprises a first connecting part arranged in the heat transfer groove, a first extending part connected with the first connecting part in a bending mode, and a first inward folding part connected with the first extending part in a bending mode.
6. The array cannula superconducting high-power combined heat dissipation module according to claim 5, wherein: the second heat pipe comprises a second connecting part arranged in the heat transfer groove, a second extending part connected to the second connecting part in a bending mode, and a second inward folding part connected to the second extending part in a bending mode.
7. The array cannula superconducting high-power combined heat dissipation module according to claim 6, wherein: the bending amplitude of the second extension part is larger than that of the first extension part; the bending amplitude of the second inward-folding part is larger than that of the first inward-folding part.
8. The array cannula superconducting high-power combined heat dissipation module of claim 1, wherein: the fin group comprises a connecting panel connected to the surface of the heat transfer base and a plurality of radiating fins arranged on the connecting panel.
9. The array cannula superconducting high-power combined heat dissipation module of claim 8, wherein: the heat dissipation fins are integrally formed on the connecting panel.
10. The array cannula superconducting high-power combined heat dissipation module of claim 1, wherein: the fixing element is provided with a plurality of fixing grooves, and the fixing grooves fix the first heat pipe and the second heat pipe.
CN202122728449.8U 2021-11-09 2021-11-09 Array intubation superconducting high-power combined heat dissipation module Active CN216650326U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122728449.8U CN216650326U (en) 2021-11-09 2021-11-09 Array intubation superconducting high-power combined heat dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122728449.8U CN216650326U (en) 2021-11-09 2021-11-09 Array intubation superconducting high-power combined heat dissipation module

Publications (1)

Publication Number Publication Date
CN216650326U true CN216650326U (en) 2022-05-31

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ID=81732979

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122728449.8U Active CN216650326U (en) 2021-11-09 2021-11-09 Array intubation superconducting high-power combined heat dissipation module

Country Status (1)

Country Link
CN (1) CN216650326U (en)

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