CN210373350U - Polygon combination kilowatt level LED laser heat dissipation module - Google Patents
Polygon combination kilowatt level LED laser heat dissipation module Download PDFInfo
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- CN210373350U CN210373350U CN201921600804.XU CN201921600804U CN210373350U CN 210373350 U CN210373350 U CN 210373350U CN 201921600804 U CN201921600804 U CN 201921600804U CN 210373350 U CN210373350 U CN 210373350U
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Abstract
The utility model relates to the technical field of heat dissipation, in particular to a polygonal combined kilowatt-level LED laser heat dissipation module, which comprises a heat dissipation main body, wherein the heat dissipation main body comprises a heat conduction assembly used for connecting a heating component, a heat dissipation assembly connected with the heat conduction assembly, and a heat dissipation fan arranged on the heat dissipation assembly; the heat conducting component comprises a polygonal heat conducting plate for attaching a heating part and a plurality of groups of heat conducting pipes attached and connected with the polygonal heat conducting plate; the heat-radiating assembly comprises a plurality of heat-radiating fins, and the heat-conducting pipe penetrates through a plurality of groups of heat-radiating fins; the utility model discloses the temperature rise that can do is low to 15 degrees centigrade, adopts the heat conduction structure that the polygon is constituteed, can realize the focus heat dissipation of high power LED light center, and then guarantees radiating effect and stability.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially relates to a polygon combination kilowatt level LED laser heat dissipation module.
Background
Along with the continuous development of science and technology, many scientific and technological products have all been merged into in production and the life, these scientific and technological products are in the production of giving people, the life provides convenient while, self can constantly generate heat at energy conversion's in-process, how guarantee the normal operating of these products, firstly, will solve their heat dissipation problem, especially inside some equipment that power is higher, because the work efficiency of equipment constantly improves, peripheral electronic component also constantly increases simultaneously, make the whole calorific capacity of equipment also promote thereupon by a wide margin, traditional heat abstractor is mostly the cooling method of fin with the fan, this cooling method has gradually can not satisfy the heat dissipation demand of high-power equipment, often make equipment can not normal operating because of the high temperature.
In the kilowatt-level LED laser module working process, can give off a large amount of heats, the effective even heat conduction of the heat that LED laser module sent is very difficult to the radiator among the prior art, and then leads to the heat to pile up in LED laser module, can't realize quick heat dissipation, leads to the not enough of radiating effect.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a temperature rise that can do is low to 15 degrees centigrade, adopts the heat conduction structure that the polygon is constituteed, can realize the focus heat dissipation of high power LED light center, and then guarantees the polygon combination kilowatt level LED laser heat dissipation module of radiating effect and stability.
The utility model adopts the technical proposal that: a polygonal combined kilowatt-level LED laser heat dissipation module comprises a heat dissipation main body, wherein the heat dissipation main body comprises a heat conduction assembly used for being connected with a heating component, a heat dissipation assembly connected with the heat conduction assembly, and a heat dissipation fan arranged on the heat dissipation assembly; the heat conducting component comprises a polygonal heat conducting plate for attaching a heating part and a plurality of groups of heat conducting pipes attached and connected with the polygonal heat conducting plate; the heat dissipation assembly comprises a plurality of heat dissipation fins, and the heat conduction pipe penetrates through a plurality of groups of heat dissipation fins.
The scheme is further improved in that the two groups of heat dissipation main bodies are provided, and heat conduction assemblies of the two groups of heat dissipation main bodies are oppositely combined to fixedly attach heating components.
The further improvement of the scheme is that the polygonal heat-conducting plate is arranged in one of a triangle, a quadrangle, a pentagon or a hexagon.
The scheme is further improved in that the heat conduction pipes are uniformly distributed in a linear array and connected with the polygonal heat conduction plate; the polygonal heat conducting plate and the heat conducting pipe are both made of red copper.
The further improvement of the scheme is that the heat dissipation assembly comprises a first fixing plate and a second fixing plate, the first fixing plate fixes the side surfaces of the plurality of groups of heat dissipation fins, and the second fixing plate fixes the top surfaces of the plurality of groups of heat dissipation fins; the heat radiation fan is fixedly arranged on the second fixing plate.
The first fixing plate is provided with steps, fixing grooves are formed in the steps corresponding to the heat dissipation fins, the steps are clamped into the fixing grooves, and the steps are provided with a plurality of fixing screws fixedly connected with the heat dissipation fins.
The utility model has the advantages that:
1. the heat dissipation main bodies are arranged symmetrically, and the polygonal heat conduction plates are arranged and are folded to attach and fix heating parts, so that a high-efficiency heat conduction effect is realized, heat can be led out more quickly, and the heat can be dissipated more quickly;
2. the heat dissipation main body is composed of a heat conduction assembly, a heat dissipation assembly and a heat dissipation fan, heat conduction is realized after the heat conduction assembly is attached to a heating component, heat is dissipated to the heat dissipation assembly through heat conduction, the heat dissipation effect can be further enhanced through the heat dissipation fan, and the heat dissipation is more stable and reliable;
3. the heat conducting component is provided with the polygonal heat conducting plate and a plurality of groups of heat conducting pipes attached to the polygonal heat conducting plate, and particularly, the polygonal heat conducting plate is attached to conduct heat, so that the heat conducting effect can be further enhanced, heat emitted from a heating part can be rapidly led out, and the heat radiating effect and strength are further enhanced;
4. the radiating assembly is provided with a plurality of groups of radiating fins, the radiating tubes penetrate into the radiating fins, and then the radiating fins can quickly radiate heat in the heat conduction process through a plurality of groups of radiating fins, and then the radiating assembly is matched with a radiating fan to dissipate heat, so that the radiating effect is further improved.
The utility model discloses in, the temperature rise that can do is low to 15 degrees centigrade, adopts the heat conduction structure that the polygon is constituteed, can realize the focus heat dissipation of high power LED light center, and then guarantees radiating effect and stability.
Drawings
Fig. 1 is a schematic diagram of the explosion structure of the present invention;
fig. 2 is a schematic perspective view of the present invention;
fig. 3 is a schematic side view of the present invention.
Description of reference numerals: the heat sink comprises a heat sink body 100, a heat conducting member 110, a polygonal heat conducting plate 111, a heat conducting pipe 112, a heat sink 120, heat dissipating fins 121, a first fixing plate 122, a second fixing plate 123, a step 124, a fixing groove 125, and a heat dissipating fan 130.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1 to 3, a polygonal combined kilowatt-level LED laser heat dissipation module includes a heat dissipation main body 100, wherein the heat dissipation main body 100 includes a heat conduction assembly 110 for connecting a heat generating component, a heat dissipation assembly 120 connected to the heat conduction assembly 110, and a heat dissipation fan 130 installed on the heat dissipation assembly 120; the heat conducting component 110 comprises a polygonal heat conducting plate 111 for attaching to a heat generating component, and a plurality of groups of heat conducting pipes 112 attached to the polygonal heat conducting plate 111; the heat dissipating assembly 120 includes a plurality of heat dissipating fins 121, and the heat pipe 112 penetrates through the plurality of sets of heat dissipating fins 121.
The heat dissipation main bodies 100 are two sets, and the heat conduction assemblies 110 of the two sets of heat dissipation main bodies 100 are fixedly attached to heating components in a folding manner, so that two sets of symmetrical structures can be adopted for use, and the heat dissipation effect can be improved in multiples when the heat dissipation main bodies are used in some high-heating components.
Polygon heat-conducting plate 111 is the setting in trilateral, quadrangle, pentagon or the hexagon, adopts polygonized structure's heat-conducting plate, can guarantee to generate heat the part laminating more thoroughly, and the heat conduction effect is better, and then guarantees the radiating strength.
The heat conduction pipes 112 are uniformly distributed in a linear array and are connected with the polygonal heat conduction plate 111; the polygonal heat conduction plate 111 and the heat conduction pipes 112 are both made of red copper, and a plurality of groups of uniformly distributed heat conduction pipes 112 are adopted, so that more uniform heat conduction can be ensured, and the effect is further improved in high-efficiency heat dissipation; adopt red copper and then can strengthen heat transfer efficiency, heat transfer effect is good to promote the radiating effect.
The heat dissipation assembly 120 includes a first fixing plate 122 and a second fixing plate 123, the first fixing plate 122 fixes the plurality of groups of heat dissipation fins 121 at the side surface, and the second fixing plate 123 fixes the plurality of groups of heat dissipation fins 121 at the top surface; the heat dissipation fan 130 is fixedly mounted on the second fixing plate 123, and the first fixing plate 122 and the second fixing plate fix the plurality of sets of heat dissipation fins 121, so as to ensure the mounting stability, and also ensure that a certain gap is reserved between the plurality of sets of heat dissipation fins 121 for heat dissipation, thereby further improving the heat dissipation effect.
The first fixing plate 122 is provided with a step 124, the heat dissipation fins 121 have fixing grooves 125 corresponding to the step 124, the step 124 is clamped into the fixing grooves 125, the step 124 is provided with a plurality of fixing screws and fixedly connected with the heat dissipation fins, and the fixing effect on the heat dissipation fins 121 can be ensured by matching the step 124 with the fixing grooves 125, so that stable heat dissipation can be ensured.
On the first hand, the heat dissipation main body 100 is provided, the heat dissipation main body 100 can be provided in two groups of symmetrical arrangement, and the polygonal heat conduction plates 111 are arranged to be folded to attach and fix heating components, so that a high-efficiency heat conduction effect is realized, heat can be led out more quickly, and heat dissipation can be performed more quickly after heat is led out; in a second aspect, the heat dissipation body 100 is specifically composed of a heat conduction assembly 110, a heat dissipation assembly 120 and a heat dissipation fan 130, and specifically, heat conduction is realized after the heat conduction assembly 110 is attached to a heat generating component, heat is dissipated to the heat dissipation assembly 120 through heat conduction, and a heat dissipation effect can be further enhanced through the heat dissipation fan 130, so that more stable and reliable heat dissipation is ensured; in the third aspect, the heat conducting assembly 110 is provided with the polygonal heat conducting plate 111 and a plurality of groups of heat conducting pipes 112 attached to the polygonal heat conducting plate 111, specifically, the polygonal heat conducting plate 111 is attached to conduct heat, so that the heat conducting effect can be further enhanced, heat emitted from a heat generating component can be rapidly conducted out, and the heat radiating effect and strength can be further enhanced; in the fourth aspect, the heat dissipation assembly 120 is provided with a plurality of sets of heat dissipation fins 121, and the heat dissipation pipe penetrates into the heat dissipation fins 121, so that the heat can be quickly dissipated through the plurality of sets of heat dissipation fins 121 in the heat conduction process, and then the heat dissipation fan 130 is matched to dissipate the heat, so that the heat dissipation effect is further improved.
The utility model discloses in, the temperature rise that can do is low to 15 degrees centigrade, adopts the heat conduction structure that the polygon is constituteed, can realize the focus heat dissipation of high power LED light center, and then guarantees radiating effect and stability.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. The utility model provides a polygon combination kilowatt level LED laser heat dissipation module, includes the heat dissipation main part, its characterized in that: the heat dissipation main body comprises a heat conduction assembly used for connecting a heating component, a heat dissipation assembly connected with the heat conduction assembly, and a heat dissipation fan arranged on the heat dissipation assembly; the heat conducting component comprises a polygonal heat conducting plate for attaching a heating part and a plurality of groups of heat conducting pipes attached and connected with the polygonal heat conducting plate; the heat dissipation assembly comprises a plurality of heat dissipation fins, and the heat conduction pipe penetrates through a plurality of groups of heat dissipation fins.
2. The polygonal combined kilowatt-level LED laser heat dissipation module of claim 1, which is characterized in that: the heat dissipation main bodies are divided into two groups, and heat conduction assemblies of the two groups of heat dissipation main bodies are oppositely closed to fixedly attach heating components.
3. The polygonal combined kilowatt-level LED laser heat dissipation module of claim 1, which is characterized in that: the polygonal heat-conducting plate is arranged in one of a triangle, a quadrangle, a pentagon or a hexagon.
4. The polygonal combined kilowatt-level LED laser heat dissipation module of claim 1, which is characterized in that: the heat conduction pipes are uniformly distributed in a linear array and connected with the polygonal heat conduction plate; the polygonal heat conducting plate and the heat conducting pipe are both made of red copper.
5. The polygonal combined kilowatt-level LED laser heat dissipation module of claim 1, which is characterized in that: the heat dissipation assembly comprises a first fixing plate and a second fixing plate, wherein the first fixing plate fixes the side surfaces of a plurality of groups of heat dissipation fins, and the second fixing plate fixes the top surfaces of a plurality of groups of heat dissipation fins; the heat radiation fan is fixedly arranged on the second fixing plate.
6. The polygonal combined kilowatt-level LED laser heat dissipation module of claim 5, which is characterized in that: the first fixing plate is provided with steps, the heat dissipation fins are provided with fixing grooves corresponding to the steps, the steps are clamped into the fixing grooves, and the steps are provided with a plurality of fixing screws fixedly connected with the heat dissipation fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921600804.XU CN210373350U (en) | 2019-09-25 | 2019-09-25 | Polygon combination kilowatt level LED laser heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921600804.XU CN210373350U (en) | 2019-09-25 | 2019-09-25 | Polygon combination kilowatt level LED laser heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210373350U true CN210373350U (en) | 2020-04-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921600804.XU Active CN210373350U (en) | 2019-09-25 | 2019-09-25 | Polygon combination kilowatt level LED laser heat dissipation module |
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| Country | Link |
|---|---|
| CN (1) | CN210373350U (en) |
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2019
- 2019-09-25 CN CN201921600804.XU patent/CN210373350U/en active Active
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