CN210630152U - Dual-splicing uniform-temperature seamless radiator - Google Patents
Dual-splicing uniform-temperature seamless radiator Download PDFInfo
- Publication number
- CN210630152U CN210630152U CN201921601014.3U CN201921601014U CN210630152U CN 210630152 U CN210630152 U CN 210630152U CN 201921601014 U CN201921601014 U CN 201921601014U CN 210630152 U CN210630152 U CN 210630152U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- seamless
- assembly
- embedded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The utility model relates to the technical field of heat dissipation, in particular to a double-spliced uniform-temperature seamless radiator, which comprises a heat dissipation component and a heat conduction component embedded in the heat dissipation component; the heat dissipation assembly is composed of at least two groups of heat dissipation plates, the at least two groups of heat dissipation plates are connected through friction welding, a plurality of groups of embedded grooves are formed in the heat dissipation plates, the heat conduction assembly is embedded in the embedded grooves, and a plurality of heat dissipation fins are formed in one surface of the heat dissipation plate, which is far away from the heat conduction assembly; the utility model discloses a friction welding has solved large-scale aluminium and has extruded with high costs problem, can unify and do surface treatment, and whole outward appearance is seamless welding really new, can also guarantee heat dissipation homogeneity and stability simultaneously.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially relates to a seamless radiator of dual concatenation samming.
Background
Along with the continuous development of science and technology, many scientific and technological products have all been merged into in production and the life, these scientific and technological products are in the production of giving people, the life provides convenient while, self can constantly generate heat at energy conversion's in-process, how guarantee the normal operating of these products, firstly, will solve their heat dissipation problem, especially inside some equipment that power is higher, because the work efficiency of equipment constantly improves, peripheral electronic component also constantly increases simultaneously, make the whole calorific capacity of equipment also promote thereupon by a wide margin, traditional heat abstractor is mostly the cooling method of fin with the fan, this cooling method has gradually can not satisfy the heat dissipation demand of high-power equipment, often make equipment can not normal operating because of the high temperature.
The traditional large radiator is generally formed by fixing and assembling a plurality of groups of aluminum materials through screws in use, and certain gaps can be formed at the assembling position in the mode, so that the heat conducting performance is insufficient; in addition, the cost of the large radiator formed by integrally extruding is high, and the forming difficulty is high, so that the structure of the large radiator needs to be improved.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides an adopted friction welding to have solved large-scale aluminium and extruded problem with high costs, can unify and do surface treatment, whole outward appearance is seamless welding newly in reality, can also guarantee the seamless radiator of dual concatenation samming of heat dissipation homogeneity and stability simultaneously.
The utility model adopts the technical proposal that: a double-spliced temperature-equalizing seamless radiator comprises a radiating component and a heat conducting component embedded in the radiating component; the heat dissipation assembly is composed of at least two groups of heat dissipation plates, the heat dissipation plates are connected through friction welding, a plurality of groups of embedded grooves are formed in the heat dissipation plates, the heat conduction assembly is embedded in the embedded grooves, and a plurality of heat dissipation fins are formed in the heat dissipation plate and face away from the heat conduction assembly.
The further improvement of the scheme is that the heat dissipation assembly comprises a first heat dissipation substrate and a second heat dissipation substrate, and the first heat dissipation substrate is connected with the second heat dissipation substrate through friction welding.
The further improvement of the scheme is that one end of the first heat dissipation substrate, which is far away from the second heat dissipation substrate, is provided with a cavity.
The further improvement of the scheme is that the first heat dissipation substrate and the second heat dissipation substrate are both provided with a plurality of mounting holes.
The further improvement of the scheme is that the heat dissipation plate is provided with a plurality of reinforcing plates, and the reinforcing plates separate a plurality of groups of heat dissipation fins.
The further improvement to above-mentioned scheme does, heat-conducting component is the red copper heat pipe of a plurality of groups, the embedded groove is located in the embedding of red copper heat pipe.
The utility model has the advantages that:
1. when the heat dissipation assembly and the heat conduction assembly are used, the heat conduction assembly is attached to the heating component, and heat is conducted out of the heat dissipation assembly through the heat conduction assembly to be dissipated quickly, so that the heat dissipation assembly is simple in overall structure, good in heat dissipation effect, stable and strong in reliability;
2. the heat dissipation assembly is composed of at least two groups of heat dissipation plates which are connected through friction welding, the principle of the friction welding is that certain axial pressure is applied to the welding end faces of two weldments, the contact faces are enabled to do violent friction movement, heat generated by friction stops moving rapidly when the contact faces are heated to a certain welding temperature (generally slightly lower than the melting point of materials, such as the welding temperature of aluminum materials), certain upsetting pressure is applied, a certain amount of plastic deformation is generated on the metal of the two weldments, the two weldments are firmly welded together, the friction welding is adopted, the appearance is more attractive, seamless welding is achieved, the structural stability is good, and the strength is high;
3. the heat dissipation plate is provided with the embedded groove, the heat dissipation assembly can be embedded and installed through the embedded groove, the overall structure stability is high, the heat conduction effect is good, and the heat dissipation effect of the heat dissipation plate is enhanced;
4. the heat dissipation plate is also provided with heat dissipation fins, the heat dissipation effect can be further enhanced through the heat dissipation fins, and the heat dissipation strength is further improved.
The utility model discloses in, adopted friction weld to solve large-scale aluminium and extruded problem with high costs, can unify and do surface treatment, whole outward appearance is seamless welding newly in fact, can also guarantee heat dissipation homogeneity and stability simultaneously.
Drawings
Fig. 1 is a schematic diagram of the explosion structure of the present invention;
fig. 2 is a schematic perspective view of the present invention;
fig. 3 is a schematic perspective view of another perspective of the present invention.
Description of reference numerals: the heat sink 100, the heat dissipation assembly 110, the heat conduction assembly 120, the heat dissipation plate 130, the embedded groove 131, the heat dissipation fins 132, the reinforcing plate 133, the first heat dissipation substrate 140, the clearance 141, the mounting hole 142, and the second heat dissipation substrate 150.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1 to 3, a dual-spliced temperature-equalizing seamless heat sink 100 includes a heat dissipation assembly 110 and a heat conduction assembly 120 embedded in the heat dissipation assembly 110; the heat dissipation assembly 110 is composed of at least two groups of heat dissipation plates 130, the at least two groups of heat dissipation plates 130 are connected through friction welding, a plurality of groups of embedded grooves 131 are formed in the heat dissipation plates 130, the heat conduction assembly 120 is embedded in the embedded grooves 131, and a plurality of heat dissipation fins 132 are formed in one surface, deviating from the heat conduction assembly 120, of the heat dissipation plate 130.
The heat dissipation assembly 110 comprises a first heat dissipation substrate 140 and a second heat dissipation substrate 150, the first heat dissipation substrate 140 is connected with the second heat dissipation substrate 150 through friction welding, two groups of heat dissipation substrates are connected through friction welding, the connection effect is good, seamless welding is achieved, the integrity is stronger, and the use strength is higher.
The first heat dissipating substrate 140 has a cavity 141 at an end thereof away from the second heat dissipating substrate 150, and the cavity 141 can be used for space avoidance in mounting, thereby ensuring convenience in mounting.
The first heat dissipation substrate 140 and the second heat dissipation substrate 150 are both provided with a plurality of mounting holes 142, and the mounting holes 142 are used for connecting the mounting of the whole structure for use, so that the mounting is convenient.
The heat dissipation plate 130 is provided with a plurality of reinforcing plates 133, the reinforcing plates 133 separate a plurality of groups of heat dissipation fins 132, and the reinforcing plates 133 ensure the stability of the heat dissipation plate 130 and ensure the higher use strength of the whole structure.
On the first hand, when the heat dissipation assembly 110 and the heat conduction assembly 120 are used, the heat conduction assembly 120 is attached to a heat generating component, and heat is conducted to the heat dissipation assembly 110 through the heat conduction assembly 120 for rapid heat dissipation, so that the heat dissipation assembly is simple in overall structure, good in heat dissipation effect, stable and reliable; in a second aspect, the heat dissipation assembly 110 is composed of at least two groups of heat dissipation plates 130, the heat dissipation plates 130 are connected by friction welding, the principle of the friction welding is that a certain axial pressure is applied to the welding end faces of two weldments, the contact faces are made to do violent friction movement, heat generated by friction stops moving rapidly when the contact faces are heated to a certain welding temperature (generally slightly lower than the melting point of materials, such as the welding temperature of aluminum materials), and a certain upsetting pressure is applied to make the metals of the two weldments generate a certain amount of plastic deformation, so that the two weldments are welded together firmly, the friction welding is more attractive in appearance, seamless welding is realized, the structural stability is good, and the strength is high; in the third aspect, the heat dissipation plate 130 is provided with the embedded groove 131, and the heat dissipation assembly 110 can be embedded and mounted through the embedded groove 131, so that the overall structure is strong in stability and good in heat conduction effect, and the heat dissipation effect of the heat dissipation plate 130 is enhanced; in the fourth aspect, the heat dissipation plate 130 is further provided with heat dissipation fins 132, so that the heat dissipation effect can be further enhanced through the heat dissipation fins 132, and the heat dissipation strength is further improved.
The utility model discloses in, adopted friction weld to solve large-scale aluminium and extruded problem with high costs, can unify and do surface treatment, whole outward appearance is seamless welding newly in fact, can also guarantee heat dissipation homogeneity and stability simultaneously.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. A double-spliced temperature-equalizing seamless radiator comprises a radiating component and a heat conducting component embedded in the radiating component; the method is characterized in that: the heat dissipation assembly is composed of at least two groups of heat dissipation plates, the heat dissipation plates are connected through friction welding, a plurality of groups of embedded grooves are formed in the heat dissipation plates, the heat conduction assembly is embedded in the embedded grooves, and a plurality of heat dissipation fins are formed in the heat dissipation plate and face away from the heat conduction assembly.
2. The double-spliced temperature-equalizing seamless radiator according to claim 1, characterized in that: the heat dissipation assembly comprises a first heat dissipation substrate and a second heat dissipation substrate, and the first heat dissipation substrate is connected with the second heat dissipation substrate through friction welding.
3. The double-spliced temperature-equalizing seamless radiator according to claim 2, characterized in that: one end of the first heat dissipation substrate, which is far away from the second heat dissipation substrate, is provided with a cavity.
4. The double-spliced temperature-equalizing seamless radiator according to claim 3, characterized in that: a plurality of mounting holes are formed in the first heat dissipation substrate and the second heat dissipation substrate.
5. The double-spliced temperature-equalizing seamless radiator according to claim 1, characterized in that: the heat dissipation plate is provided with a plurality of reinforcing plates, and the reinforcing plates separate a plurality of groups of heat dissipation fins.
6. The double-spliced temperature-equalizing seamless radiator according to claim 1, characterized in that: the heat conduction assembly is a plurality of groups of red copper heat conduction pipes, and the red copper heat conduction pipes are embedded in the embedding grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921601014.3U CN210630152U (en) | 2019-09-25 | 2019-09-25 | Dual-splicing uniform-temperature seamless radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921601014.3U CN210630152U (en) | 2019-09-25 | 2019-09-25 | Dual-splicing uniform-temperature seamless radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210630152U true CN210630152U (en) | 2020-05-26 |
Family
ID=70749330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921601014.3U Active CN210630152U (en) | 2019-09-25 | 2019-09-25 | Dual-splicing uniform-temperature seamless radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210630152U (en) |
-
2019
- 2019-09-25 CN CN201921601014.3U patent/CN210630152U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20180308780A1 (en) | Thermally superconducting heat dissipation device and manufacturing method thereof | |
| CN112151478B (en) | Micro-channel radiator and preparation method and application thereof | |
| US20090314471A1 (en) | Heat pipe type heat sink and method of manufacturing the same | |
| CN109979901A (en) | Two-side water cooling device for power electronic semiconductor | |
| CN203949540U (en) | A kind of flat-plate heat pipe | |
| CN210630152U (en) | Dual-splicing uniform-temperature seamless radiator | |
| CN216775338U (en) | Heat dissipation module based on lateral groove veneering structure | |
| CN212724952U (en) | High-power magnetic core with heat conduction structure | |
| CN212413685U (en) | Small heat-conducting pipe combined radiator | |
| CN202218152U (en) | IGBT (Insulated Gate Bipolar Transistor) heat-radiation structure of photovoltaic inverter | |
| CN215177187U (en) | Adopt 3D heat dissipation module of samming plate structure | |
| CN210470088U (en) | Aluminum profile substrate for cooling of refrigerant | |
| CN213755498U (en) | Square heat pipe radiator | |
| CN210053731U (en) | High-speed heat conduction radiator based on copper-aluminum paster | |
| CN209462863U (en) | A kind of radiator and heat radiator assembly | |
| CN210610182U (en) | Environment-friendly tin-free process variable fastening radiator | |
| CN210373350U (en) | Polygon combination kilowatt level LED laser heat dissipation module | |
| CN215421387U (en) | Heat radiation module | |
| CN218244210U (en) | Radiator of component | |
| CN216775343U (en) | Aluminum product radiator based on integrated rapid circulating cold channel structure | |
| CN217135899U (en) | Heat dissipation cover of frequency converter | |
| CN215181686U (en) | Computer radiator fin aluminum section bar | |
| CN217085706U (en) | Passive CPU radiator | |
| CN220489099U (en) | Water cooling device for ultra-high power solid-state light source | |
| JP3083679U (en) | Heat sink fixing structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |