CN112748632A - Laser light source and laser projection equipment - Google Patents
Laser light source and laser projection equipment Download PDFInfo
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- CN112748632A CN112748632A CN201911039253.9A CN201911039253A CN112748632A CN 112748632 A CN112748632 A CN 112748632A CN 201911039253 A CN201911039253 A CN 201911039253A CN 112748632 A CN112748632 A CN 112748632A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
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Abstract
The invention discloses a laser light source and laser projection equipment, relates to the technical field of laser projection equipment, and aims to reduce or avoid the influence of condensation and temperature shock of a cold end face of a thermoelectric refrigeration part on a laser on the premise of ensuring good heat dissipation performance of the laser. The laser light source comprises: a laser housing; the evaporation end of the first heat pipe is used for exchanging heat with the radiating surface of the laser shell and is connected with a first radiating assembly; the first heat dissipation assembly is arranged at the condensation end of the first heat pipe; thermoelectric refrigeration part, connect on first heat pipe, thermoelectric refrigeration part have hot terminal surface and with the cold junction face, thermoelectric refrigeration part's cold junction face is used for carrying out the heat exchange with first heat pipe, thermoelectric refrigeration part's hot terminal surface and second radiator unit carry out the heat exchange. The technical scheme is applied to heat dissipation of the laser light source.
Description
Technical Field
The invention relates to the technical field of laser projection equipment, in particular to a laser light source and laser projection equipment.
Background
The laser projection display technology adopts a high-power semiconductor laser to convert electric energy into laser beams, and the laser beams are projected onto a screen by a light path system, a circuit system and an illumination system, so that the laser projection display technology is a novel display technology for laser picture projection.
However, when the semiconductor laser converts the electric energy into the laser beam, the conversion efficiency is only 40%, and the rest 60% of the electric energy is converted into the heat energy, which causes the temperature of the laser to rise. Moreover, as the temperature of the laser increases, the efficiency of converting electrical energy into optical energy of the laser gradually decreases, and therefore, temperature reduction control management of the semiconductor laser is important for laser projection.
Currently, a thermoelectric cooling component may be provided in the laser light source to dissipate heat from the laser. In order to ensure the heat dissipation efficiency of the thermoelectric cooling component to the laser, the cold end surface of the thermoelectric cooling component is generally required to be attached to the heat dissipation surface of the laser housing. However, when the indoor humidity is high and the cold end of the thermoelectric refrigerating piece is lower than the ambient temperature, the water vapor in the environment can be liquefied into liquid at the cold end surface of the thermoelectric refrigerating component, so that the cold end surface of the thermoelectric refrigerating component can generate condensation, and the normal operation of the laser is influenced.
Disclosure of Invention
The invention aims to provide a laser light source and laser projection equipment, which are used for reducing or avoiding the influence on a laser caused by possible condensation or temperature shock on a cold end surface of a thermoelectric refrigeration part when the thermoelectric refrigeration part and the laser part are attached in a heat dissipation mode on the premise of ensuring good heat dissipation performance of the laser.
In order to achieve the above object, the present invention provides a laser light source comprising:
a laser housing;
the evaporation end of the first heat pipe is used for exchanging heat with the radiating surface of the laser shell and is connected with the first radiating assembly;
the first heat dissipation assembly is arranged at the condensation end of the first heat pipe;
thermoelectric refrigeration part, connect on first heat pipe, thermoelectric refrigeration part have hot terminal surface and with the cold junction face, thermoelectric refrigeration part's cold junction face is used for carrying out the heat exchange with first heat pipe, thermoelectric refrigeration part's hot terminal surface and second radiator unit carry out the heat exchange.
Compared with the prior art, in the laser light source provided by the embodiment of the invention, on one hand, heat of the laser light source exchanges heat with the evaporation end of the first heat pipe through the heat dissipation surface of the shell, so that the heat generated by the laser in the operation process can be ensured to evaporate the phase-change material in the evaporation end of the first heat pipe, the heat generated by the laser is taken away, the evaporated phase-change material is condensed by the first heat dissipation assembly, and the heat dissipation of the laser is realized. Meanwhile, a thermoelectric refrigeration part is connected to the position, far away from the radiating surface of the laser shell, of the first heat pipe, the cold end face of the thermoelectric refrigeration part is used for carrying out heat exchange with the first heat pipe, and the hot end face of the thermoelectric refrigeration part is used for carrying out heat exchange with the second radiating assembly, so that the temperature of the phase-change material evaporated in the first heat pipe is reduced, the condensation speed of the phase-change material evaporated is accelerated, and the radiating capacity of the heat pipe is improved. In addition, the cold end face of the thermoelectric cooling component is not in contact with the heat dissipation surface of the laser shell, so that the low temperature of the cold end face of the thermoelectric cooling component does not influence the operation of the laser, such as the stress change problem caused by condensation or temperature drop, while the thermoelectric cooling component dissipates heat of the first heat pipe.
In addition, the cold end face of the thermoelectric refrigeration part can absorb heat of the heat pipe, so that the condensation speed of the phase-change material in the heat pipe is increased, the temperature of the phase-change material at the condensation end of the heat pipe is low, and the first heat dissipation assembly with low power is selected to achieve the heat dissipation effect. When the heat dissipation assembly with lower power is selected to dissipate heat of the condensation end of the heat pipe, the volume of the heat dissipation assembly is smaller, and the working noise is lower.
The invention also provides laser projection equipment. The laser projection equipment comprises an optical machine, a lens and the laser light source;
the laser light source is used for providing an illumination light beam for the optical machine; the optical machine is used for modulating the illumination light beams and projecting the modulated light beams to the lens, and the lens receives the modulated light beams for projection imaging.
Compared with the prior art, the beneficial effects of the laser projection device provided by the invention are the same as those of the laser light source in the technical scheme, and are not repeated herein.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of a laser light source according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a laser light source according to an embodiment of the present invention;
FIG. 3 is an exploded view of a laser light source according to an embodiment of the present invention;
fig. 4 is a first schematic structural diagram of a laser heat dissipation device in a laser light source according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a laser heat dissipation device in a laser light source according to an embodiment of the present invention;
fig. 6 is an exploded schematic view of a laser heat sink in a laser light source according to an embodiment of the present invention;
fig. 7 is an exploded view of a heat-conducting fixing element in a laser light source according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The laser projection display technology adopts a high-power semiconductor laser to convert electric energy into laser beams, and the laser beams are projected onto a screen by a light path system, a circuit system and an illumination system, so that the laser projection display technology is a novel display technology for laser picture projection.
However, when a semiconductor laser converts electric energy into light energy, the conversion efficiency is only 40%, the remaining 60% of the electric energy is converted into heat energy, and the efficiency of the laser converting the electric energy into the light energy gradually decreases as the temperature of the laser increases.
Fig. 1 shows a schematic structural diagram of a conventional laser projection apparatus. As shown in fig. 1, the laser projection apparatus includes a laser light source 1, an optical engine 2, and a lens 3.
As shown in fig. 1, the laser light source 1 is used for providing an illumination beam to an optical machine; the optical machine 2 is configured to modulate the illumination light beam and project the modulated illumination light beam to the lens, so that the modulated illumination light beam is imaged through the lens 3. In order to reduce the volume of the laser projection device, the lasers in the laser light source 1 are changed into integrated semiconductor chips from the prior bank column arrangement. In this case, the requirement for heat dissipation from the laser is higher.
At present, the semiconductor refrigeration technology can be used for heat dissipation of the laser, that is, a thermoelectric refrigeration component is arranged on a heat sink surface of the laser, generally a heat dissipation surface of a laser shell, so as to dissipate heat of the laser. In order to ensure that the heat dissipation efficiency of the thermoelectric refrigeration part can meet the heat dissipation requirement of the laser, the heat dissipation surface of the laser shell is attached to the cold end surface of the thermoelectric refrigeration part. However, when the thermoelectric cooling element is energized, the temperature of the cold end face of the thermoelectric cooling element is lower than the ambient temperature. At this moment, if the humidity of indoor air is higher, the vapor in the environment can be liquefied into liquid at the cold junction face of thermoelectric refrigeration part, makes the cold junction face of thermoelectric refrigeration part produce condensation or even frost, and thermoelectric refrigeration part can take place the temperature dip in the short time when the circular telegram operation to, when its cold junction face pastes and to bear the great temperature difference change when the laser heat sinks the face, also can lead to the laser to bear great difference in temperature change, to sum up the factor, all can lead to the laser can not normal operating.
In one implementation, when the laser light source is radiated, the heat of the laser is conducted to the first heat dissipation assembly through the first heat pipe mainly by the heat pipe phase change technology, the first heat dissipation assembly can be a heat dissipation fin, and the heat dissipation fin is dissipated by the configuration fan, so that the purpose of cooling the heat dissipation assembly is achieved. On the basis, a thermoelectric refrigeration part is also applied, the thermoelectric refrigeration part is not directly contacted with the heat sink surface of the laser but is connected to the first heat pipe, so that the thermoelectric refrigeration part is far away from the heat sink surface of the laser or the heat dissipation surface of the light source shell of the laser, and the cold end surface of the thermoelectric refrigeration part cannot bring the impact of condensation or sudden temperature drop to the laser.
The laser projection device shown in fig. 3 comprises a laser housing 10, a first heat pipe 13, the first heat pipe 13 being in thermal conduction with a heat dissipation surface of the laser housing 10 via a thermally conductive contact 16. The first heat pipe 13 conducts heat to the first heat sink 11, and the fan 17 is used for air-cooling the first heat sink 11. Wherein the thermoelectric cooling component 12 is located at a position on the first heat pipe 13 and a connection of the first heat pipe 13 to the laser housing 10, such as specifically referred to a position of the heat conductive contact 16, with a preset distance, which may be greater than one-half of the total length of the first heat pipe 13.
As shown in fig. 3 to 7, the first heat pipe 13 has an evaporation end and a condensation end, the evaporation end is connected to the heat dissipation surface of the laser housing 10, and the condensation end is connected to the first heat dissipation assembly 11. The thermoelectric cooling component 12 is located between the evaporation end and the condensation end of the first heat pipe 13, and preferably, the thermoelectric cooling component 13 is located on the first heat pipe 13 near the condensation end of the first heat pipe 13, that is, the thermoelectric cooling component 13 is preferably disposed near the first heat sink 11.
Referring to fig. 2, 3 and 4, the laser light source includes a laser housing 10, a first heat sink assembly 11, a thermoelectric cooling component 12 and a first heat pipe 13.
The evaporation end of the first heat pipe 13 is used for heat exchange with the heat dissipation surface of the laser housing 10. The thermal conductivity of the first heat pipe 13 is much greater than that of the simple substance material, so as to improve the thermal conductivity of the first heat pipe 13. It will be appreciated that the first heat pipe 13 has a high thermal conductivity and has a phase change material therein, which can be evaporated or condensed at different temperatures. Based on this, the first heat pipe 13 includes an evaporation end, a condensation end, and a transition section between the evaporation end and the condensation end. The first heat sink 11 is disposed at a condensation end of the first heat pipe 13. In addition, the number of the first heat pipes 13 can be set according to actual needs, and generally, the greater the number of the first heat pipes 13, the better the heat dissipation performance. For example: the number of the first heat pipes 13 may be three.
The thermoelectric cooling element 12 is made by using the peltier effect of semiconductor materials, which is a phenomenon in which when a direct current passes through a couple of two semiconductor materials, one end of the thermoelectric cooling element absorbs heat and the other end releases heat, and therefore, the thermoelectric cooling element 12 includes a P-type semiconductor and an N-type semiconductor connected by electrodes, and the thermoelectric cooling element 12 has a hot end face and a cold end face. The thermoelectric refrigeration component 12 has a cold end surface for exchanging heat with the first heat pipe 13, and the thermoelectric refrigeration component 12 has a hot end surface for exchanging heat with the second heat dissipation assembly through the second heat pipe. In this way, the hot side of the thermoelectric cooling element 12 exchanges heat with the first heat sink 11 via the second heat pipe 15. It should be understood that the thermoelectric cooling element 12 may be a thermoelectric cooling plate, or may be a plurality of thermoelectric cooling plates connected in series or in parallel. The number of the thermoelectric cooling fins can be selected according to actual conditions, and the greater the number of the thermoelectric cooling fins, the higher the heat dissipation efficiency of the thermoelectric cooling component 12. For example: the thermoelectric cooling element 12 comprises a thermoelectric cooling plate, and the thermoelectric cooling plate has a cold end surface for exchanging heat with the first heat pipe 13, and a hot end surface for exchanging heat with the first heat sink 11.
By arranging the first heat dissipation assembly and the second heat dissipation assembly as a whole, the number of heat dissipation fins in the heat dissipation system can be reduced. In the following embodiments, the first heat dissipation assembly 11 is used to replace the first heat dissipation assembly and the second heat dissipation assembly.
When the temperature of the laser is high and heat dissipation is required, the heat generated by the laser is transferred to the evaporation end of the first heat pipe 13 through the heat dissipation surface of the laser housing 10, so that the phase change material in the evaporation end of the first heat pipe 13 is evaporated, and the heat generated by the laser is taken away. The cold end face of the thermoelectric refrigeration part 12 and the first heat dissipation assembly 11 exchange heat with the first heat pipe 13, so that the temperature of the phase change material in the first heat pipe 13 is reduced, the evaporated phase change material is promoted to be condensed, and the heat dissipation of the laser is realized.
As can be known from the structure and the heat dissipation process of the laser light source, in the laser light source provided by the embodiment of the present invention, the semiconductor thermoelectric refrigeration technology and the heat pipe heat dissipation technology are combined, and the evaporation end of the first heat pipe 13 exchanges heat with the heat dissipation surface of the laser housing 10, so that the heat of the laser can be transferred to the evaporation end of the first heat pipe 13. The first heat dissipation assembly 11 disposed at the condensation end of the first heat pipe 13 can dissipate heat from the condensation end of the first heat pipe 13, so as to condense the phase change material evaporated in the first heat pipe 13, reduce the temperature of the phase change material, and thus realize heat dissipation of the laser. While the thermoelectric cooling element 12 has a hot end face and a cold end face. The thermoelectric refrigeration component 12 has a cold end surface for exchanging heat with the first heat pipe 13, and a hot end surface for exchanging heat with the first heat dissipation assembly 11, so that the temperature of the phase change material in the first heat pipe 13 is reduced, thereby realizing heat dissipation of the laser. At this time, the cold end surface of the thermoelectric refrigeration component 12 and the first heat dissipation assembly 11 exchange heat with the first heat pipe 13 at the same time, so that the condensation speed of the phase change material evaporated in the first heat pipe 13 is increased, and the heat dissipation capability of the laser is improved. Further, since the cold end surface of the thermoelectric cooling member 12 does not contact the heat radiation surface of the laser housing 10, the laser operation is not affected by the dew condensation or the impact due to the sudden temperature drop on the cold end surface of the thermoelectric cooling member 12.
Preferably, in the implementation, the thermoelectric cooling component 12 is disposed far away from the heat dissipation surface of the laser housing and close to the first heat dissipation assembly 11, and this is for the purpose that, since the efficiency of the thermoelectric cooling component 12 is very high, if the thermoelectric cooling component is disposed close to the laser housing, the heat transfer path in the heat pipe is short, and the heat is cooled, in the heat dissipation of the phase-change heat pipe, the heat needs to flow by means of the temperature difference, when the temperature of the thermoelectric cooling component corresponding to the first heat pipe is low, or is close to the temperature of the first heat dissipation assembly or close to the room temperature, the heat will not flow continuously, and the first heat dissipation assembly is connected to the first heat pipe, but cannot effectively transfer the heat, so that the heat dissipation efficiency of the system is low, and the burden of the thermoelectric cooling component is increased.
In addition, the cold end face of the thermoelectric refrigeration component 12 can absorb the heat of the first heat pipe 13, so that the condensation speed of the phase change material in the first heat pipe 13 is increased, the temperature of the phase change material at the condensation end of the first heat pipe 13 is low, and at this time, the first heat dissipation assembly 11 with low power is selected to achieve the heat dissipation effect. When the first heat dissipation assembly 11 with lower power is selected to dissipate heat from the condensation end of the first heat pipe 13, the first heat dissipation assembly 11 not only has a smaller volume, but also has lower working noise.
In addition, the first heat dissipation assembly 11 simultaneously dissipates the heat of the condensation end of the first heat pipe 13 and the hot end face of the thermoelectric refrigeration component 12, and the first heat dissipation assembly 11 is fully utilized, so that the space occupied by the laser light source is reduced, and the design purpose of miniaturization of the optical engine is achieved.
Because the temperature of the hot side end of the thermoelectric refrigeration component is high, preferably, the second heat pipe 15 is a straight heat pipe and is directly inserted into the first heat dissipation assembly 11, and because the first heat dissipation assembly 11 needs to be shared, the first heat pipe 13 is bent at some angles correspondingly.
As a possible implementation manner, the first heat pipe 13 may be a linear pipe, and the first heat pipe 13 may be an approximately "L" shaped pipe (with a bend of not 90 °), a U-shaped bent pipe or an S-shaped bent pipe. The non-linear section is a transition section. In a specific application, the bending section of the heat pipe is a transition section, and the non-bending section is generally understood as a linear section.
Fig. 5 is a schematic structural diagram illustrating a laser heat sink in a laser light source according to an embodiment of the present invention. Fig. 6 is a schematic junction-exploded view illustrating a laser heat sink in a laser light source according to an embodiment of the present invention. Referring to fig. 5 and 6, in the laser light source provided by the embodiment of the present invention, each first heat pipe 13 includes a first linear heat pipe segment 131, a second linear heat pipe segment 132, and a bent heat pipe segment 133 connecting the first linear heat pipe segment and the second linear heat pipe segment. It should be understood that linearity in the first and second linear heat pipe segments 131, 132 means that the first and second linear heat pipe segments 131, 132 run as straight lines.
However, when the first heat pipe 13 includes the bent heat pipe section 133, the first heat pipe 13 is bent, which causes a change in the hydrodynamic properties of the phase change material in the bent heat pipe section 133 included in the first heat pipe 13, thereby reducing the heat dissipation performance of the first heat pipe 13. In order to reduce the heat dissipation performance of the first heat pipe 13 lost when the bent heat pipe section 133 is bent, the R angle of the bent heat pipe section 133 is greater than n times the pipe diameter of the bent heat pipe section 133, and n is greater than or equal to 2. The angle R is the radius of the arc of the bent heat pipe section 133, and the pipe diameter of the bent heat pipe section 133 is generally the outer diameter of the bent heat pipe section 133.
Illustratively, when the angle between the linear direction of the first linear heat pipe segment 31 and the linear direction of the second linear heat pipe segment 132 is 70 ° -110 °, the R angle of the bent heat pipe segment 133 is greater than 2 times the pipe diameter of the bent heat pipe segment 133.
For example: the R intersection of the bent heat pipe sections 133 included in the first heat pipe 13 is 3 times the pipe diameter 133 of the bent heat pipe sections, and the angle between the linear direction of the first linear heat pipe section 131 and the linear direction of the second linear heat pipe section 132 included in the first heat pipe 13 is 90 °.
As a possible implementation, when the first heat pipe 13 exchanges heat with the cold end surface of the thermoelectric cooling component 12, the first heat pipe 13 may be directly in contact with the cold end surface of the thermoelectric cooling component 12, but since the first heat pipe 13 is generally a cylindrical pipe and the cold end surface of the thermoelectric cooling component 12 is generally a planar structure, the cold end surface of the thermoelectric cooling component 12 is in line contact with the first heat pipe 13. At this time, the thermal resistance between the first heat pipe 13 and the thermoelectric cooling part 12 is large, so that the heat exchange efficiency between the first heat pipe 13 and the cold end surface of the thermoelectric cooling part 12 is low, and the heat dissipation efficiency of the heat dissipation surface of the laser housing 10 is low.
In order to improve the heat exchange efficiency between the first heat pipe 13 and the thermoelectric cooling component 12, referring to fig. 2 to 6, the laser light source further includes a heat-conducting fixing member 14 disposed on the first heat pipe 13, and the thermoelectric cooling component 12 is disposed on the heat-conducting fixing member 14. At this time, the heat of the first heat pipe 13 is firstly transferred to the heat-conducting fixing member 14, and then the heat-conducting fixing member 14 transfers the heat to the cold end face of the thermoelectric cooling part 12. Because the heat-conducting fixing piece 14 has good heat-conducting performance, and the heat-conducting fixing piece 14 is in surface contact with the first heat pipe 13 and the cold end face of the thermoelectric refrigeration part 12, the heat exchange efficiency between the first heat pipe 13 and the cold end face of the thermoelectric refrigeration part 12 is improved, and the heat dissipation efficiency of the laser is improved.
It should be appreciated that the thermally conductive fixture 14 should have good thermal conductivity. The material of the heat-conducting fixing member 14 is selected from materials with good heat conductivity, such as: copper, copper aluminum alloy, graphene, graphite, carbon fiber or C/C composite material. For example: copper material with the designation C1100 may be selected to fabricate the copper block structure as the thermally conductive fixture 14 in an extrusion die.
In one embodiment, referring to fig. 2 to 6, the heat-conducting fixing member 14 may be sleeved on the first heat pipe 13. At this time, the area of the contact surface between the first heat pipe 13 and the heat conducting fixing member 14 is large, so that the heat transfer efficiency between the first heat pipe 13 and the heat conducting fixing member 14 is improved, and further the heat dissipation efficiency of the laser is improved.
For example, after the heat-conducting fixing member 14 is sleeved on the first heat pipe 13, the heat-conducting fixing member 14 may be welded and fixed on the first heat pipe 13 by using a welding method. At this time, the thermal contact resistance between the first heat pipe 13 and the heat conducting fixing member 14 is small, so that the heat exchange efficiency between the first heat pipe 13 and the heat conducting fixing member 14 is further improved, and the heat dissipation efficiency of the laser is also improved accordingly.
Specifically, referring to fig. 2 to 6, the heat conducting fixing member 14 is sleeved between the evaporation end and the condensation end of the first heat pipe 13. For example: the heat-conducting fixing member 14 is sleeved on the transition section of the first heat pipe 13 to ensure that the condensation speed of the evaporated phase-change material is increased on the premise that the heat absorption of the evaporation end of the first heat pipe 13 is not affected by the thermoelectric refrigeration component 12, thereby further improving the heat dissipation capacity of the laser.
It should be noted that the heat-conducting fixing member 14 may be an integral structure or a split structure. For example: referring to fig. 7, the heat conductive fixing member 14 includes a first heat conductive fixing member 141 and a second heat conductive fixing member 142. The first heat conductive fixing member 141 and the second heat conductive fixing member 142 sandwich the first heat pipe 13. The shapes of the surfaces of the first and second heat- conductive fixing members 141 and 142 contacting the first heat pipe 13 match the shape of the first heat pipe 13. The cold end surface of the thermoelectric cooling component 12 is disposed on a side of the first heat conducting fixing member 141 or the second heat conducting fixing member 142 away from the first heat pipe 13.
In one embodiment, referring to fig. 4, the cold side of the thermoelectric cooling element 12 may be secured to the thermally conductive fixture 14 by welding. For example, the cold end face of the thermoelectric cooling element 12 is fixed to the side of the first heat-conducting fixing member 141 or the second heat-conducting fixing member 142 away from the first heat pipe 13. When the cold end face of the first thermoelectric refrigeration component 12 is fixed on the heat-conducting fixing component 14 in a welding manner, the thermal contact resistance between the heat-conducting fixing component 14 and the thermoelectric refrigeration component 12 is reduced, so that the heat conduction efficiency of the cold end faces of the heat-conducting fixing component 14 and the thermoelectric refrigeration component 12 is improved, and the heat dissipation efficiency of the laser is further improved.
As a possible implementation manner, referring to fig. 2 to 6, the laser light source further includes a second heat pipe 15 disposed on the first heat sink 11. The thermoelectric cooling element 12 is located between the second heat pipe 15 and the thermally conductive fixture 14. At this time, the heat of the hot end face of the thermoelectric cooling component 12 is transferred to the first heat dissipation assembly 11 through the second heat pipe 15, thereby facilitating the heat exchange between the hot end face of the thermoelectric cooling component 12 and the first heat dissipation assembly 11.
In order to fix the thermoelectric cooling component 12, referring to fig. 2 to 6, the second heat pipe 15 is fixed to the heat conducting fixing member 14. At this time, since the thermoelectric cooling element 12 is located between the second heat pipe 15 and the heat conductive fixing member 14, the thermoelectric cooling element 12 is pressed by the second heat pipe 15 and the heat conductive fixing member 14, so that the thermoelectric cooling element 12 can be fixed between the second heat pipe 15 and the heat conductive fixing member 14, and the integrated design of the hot end face and the cold end face of the thermoelectric cooling element 12 can be realized.
For example, as shown in fig. 4 to 6, the second heat pipe 15 may be fixed on the heat-conducting fixing member 14 by welding. For example: the second heat pipe 15 is connected to the thermoelectric cooling part through a heat conducting plate 151, and a plurality of screw holes are uniformly formed in the edge of the heat conducting plate 151, and each screw hole is fixed to the heat conducting fixing member 14 by a screw. At this time, the heat-conducting fixing piece 14 and the heat-conducting plate 151 are uniformly stressed at each position, and the stress on the thermoelectric refrigeration component 12 is uniformly distributed, so that the stress damage to the thermoelectric refrigeration component 12 caused by the nonuniform stress on each position of the heat-conducting fixing piece 14 and the heat-conducting plate 151 is avoided. For example: the four corners of the first heat conduction plate 151 are respectively provided with screw holes, and the second heat pipe 15 is fixed to the heat conduction fixing member 14 by four screws.
In some embodiments, in order to improve the heat exchange efficiency between the cold end surface of the thermoelectric cooling component 12 and the heat conducting fixing component 14 and the heat exchange efficiency between the hot end surface of the thermoelectric cooling component 12 and the second heat pipe 15, referring to fig. 2 to 6, the surface of the heat conducting fixing component 14 adjacent to the thermoelectric cooling component 12 has a first heat conducting contact surface, and the surface of the second heat pipe 15 adjacent to the thermoelectric cooling component 12 has a second heat conducting contact surface; the cold end face of the thermoelectric cooling element 12 is in contact with the first heat conducting contact face and the hot end face of the thermoelectric cooling element 12 is in contact with the second heat conducting contact face. At this time, the cold end surface of the thermoelectric cooling element 12 is in surface contact with the heat conductive fixing 14, and the contact area between the cold end surface of the thermoelectric cooling element 12 and the heat conductive fixing 14 is large, so that the heat transfer efficiency between the cold end surface of the thermoelectric cooling element 12 and the heat conductive fixing 14 is high. Similarly, since the hot end surface of the thermoelectric cooling component 12 is in surface contact with the second heat pipe 15, the contact area between the hot end surface of the thermoelectric cooling component 12 and the second heat pipe 15 is large, and therefore, the heat transfer efficiency between the hot end surface of the thermoelectric cooling component 12 and the second heat pipe 15 is high.
Referring to fig. 2 to 6, when the second heat pipe 15 is fixed on the heat conducting fixing member 14, the cold end surface of the thermoelectric cooling component 12 contacts with the first heat conducting contact surface, and the hot end surface of the thermoelectric cooling component 12 contacts with the second heat conducting contact surface, the pressing force of the heat conducting fixing member 14 is uniformly distributed on the cold end surface of the thermoelectric cooling component 12, and the pressing force of the second heat pipe 15 is also uniformly distributed on the hot end surface of the thermoelectric cooling component 12. At this time, the stress applied to the thermoelectric cooling component 12 between the heat conducting fixing member 14 and the second heat pipe 15 is uniformly distributed, thereby improving the reliability and the service life of the thermoelectric cooling component 12.
For example, referring to fig. 4 to 6, the heat conducting plate 151 is in contact with the hot side of the thermoelectric cooling element 12, and the first heat sink 11 is disposed on the second heat pipe 15. It should be understood that the heat conducting plate 151 and the second heat pipe 15 have good heat conducting performance, and the heat conducting plate 151 may also be made of copper (C1100), copper-aluminum alloy, graphene, graphite, carbon fiber, C/C composite material, and other materials with high heat conducting performance. And when the heat conductive plate 151 is made of a copper material, the heat conductive plate 151 may be regarded as a copper plate heat sink.
Specifically, referring to fig. 4 to 6, in order to reduce the contact thermal resistance of the second heat pipe 15, the axial direction of the second heat pipe 15 is perpendicular to the plate surface of the heat conducting plate 151. In order to reduce the thermal resistance between the second heat pipe 15 and the first heat sink 11, the second heat pipe 15 extends into the first heat sink 11 and is welded to the first heat sink 11. At this time, the thermal contact resistance between the second heat pipe 15 and the first heat dissipation assembly 11 is reduced, so that the heat exchange efficiency between the second heat pipe 15 and the first heat dissipation assembly 11 is improved, and the heat dissipation efficiency of the laser can be improved.
In order to achieve heat transfer between the heat dissipation surface of the laser housing 10 and the evaporation end of the first heat pipe 13, the evaporation end of the first heat pipe 13 may be in contact with the heat dissipation surface of the laser housing 10. However, since the first heat pipe 13 is a cylindrical pipe, the heat dissipation surface of the laser housing 10 is a planar structure, and the evaporation end of the first heat pipe 13 is in line contact with the heat dissipation surface of the laser housing 10, the contact area between the evaporation end of the first heat pipe 13 and the heat dissipation surface of the laser housing 10 is small, so that the heat exchange efficiency between the evaporation end of the first heat pipe 13 and the heat dissipation surface of the laser housing 10 is small. In order to improve the heat exchange efficiency between the heat dissipation surface of the laser housing 10 and the evaporation end of the first heat pipe 13, referring to fig. 2 to 6, the laser light source further includes a heat conduction contact 16 disposed on the evaporation end of the first heat pipe 13, and the heat conduction contact 16 is disposed on the heat dissipation surface of the laser housing 10. It will be appreciated that the thermally conductive contact 16 described above should have good thermal conductivity. The heat conductive contact piece 16 may also be made of a material with high heat conductivity, such as copper (C1100), copper-aluminum alloy, graphene, graphite, carbon fiber, and C/C composite material, and the heat conductive contact piece 16 may be the same as the heat conductive fixing piece 14 or different from the heat conductive fixing piece 14, and is specifically selected according to actual conditions.
In some embodiments, referring to fig. 2-6, the heat conductive contact 16 can be sleeved on the evaporation end of the first heat pipe 13. At this time, the area of the contact surface between the heat conductive contact 16 and the first heat pipe 13 is large, so that the thermal contact resistance between the heat conductive contact 16 and the first heat pipe 13 is reduced, and therefore, the heat transfer efficiency between the heat conductive contact 16 and the first heat pipe 13 is improved, and the heat dissipation efficiency of the laser is improved.
For example, when the heat conductive contact 16 is sleeved on the evaporation end of the first heat pipe 13, the heat conductive contact 16 may be fixed on the evaporation end of the first heat pipe 13 by welding. At this time, the thermal contact resistance between the thermal contact 16 and the first heat pipe 13 is small, so that the exchange efficiency between the thermal contact 16 and the first heat pipe 13 is further improved, and the heat dissipation efficiency of the laser is also improved accordingly.
The heat conductive contact 16 may be an integrated structure or a split structure. For example: referring to fig. 6, the above-described heat-conductive contact 16 includes a first heat-conductive contact 161 and a second heat-conductive contact 162. The first heat conductive contact 161 and the second heat conductive contact 162 sandwich the evaporation end of the first heat pipe 13. The shape of the surfaces of the first and second heat- conductive contacts 161 and 162 in contact with the first heat pipe 13 matches the shape of the first heat pipe 13. The heat dissipation surface of the laser housing 10 is disposed on a side of the first heat conduction contact 161 or the second heat conduction contact 162 away from the first heat pipe 13.
And, in one embodiment, the thermally conductive contact 16 primarily serves to secure the first heat pipe 13 and may further contact the heat dissipating surface of the laser housing 10 through the thermally conductive copper block 18.
In some realizable manners, in order to improve the heat dissipation efficiency of the first heat dissipation assembly 11, referring to fig. 2 to 6, the first heat dissipation assembly 11 is a fin heat sink 11, the fin heat sink 11 is disposed at the condensation end of the first heat pipe 13, and the heat dissipation fan 17 is disposed at one side of the fin heat sink 11. The finned radiator 11 can cool the condensation end of the first heat pipe 13, so that the first heat pipe 13 can maintain a proper temperature. The heat dissipation fan 17 conducts convection heat transfer to the fin heat sink 11 in a forced convection manner, so that heat on the fin heat sink 11 is discharged to the outside of the laser projection apparatus. Meanwhile, the forced convection of the cooling fan 17 can also discharge the heat of the laser light source 1 to the outside of the laser projection device, so that the heat transferred from the cooling surface of the laser housing 10 to the first heat pipe 13 is reduced, and the volume of the finned heat sink 11 can be reduced, so that the volume of the laser light source 1 in the embodiment of the invention is reduced.
Specifically, in order to reduce the thermal contact resistance between the first heat pipe 13 and the fin heat dissipation device, referring to fig. 4 to 6, the first heat pipe 13 is fixed to the heat dissipation fins in the fin heat dissipation device 11 by welding after extending deeply into the fin heat dissipation device 11.
In order to prove the heat dissipation capability of the laser light source provided by the embodiment of the invention, a comparative method is used for illustration.
The laser heat sink in the embodiment of the present invention shown in fig. 4 is different from the laser heat sink disclosed in the comparative example in that: the laser heat sink of the comparative example includes 5 heat pipes, and the laser heat sink of the comparative example does not have a copper block structure as a heat conductive fixing member, a heat conductive plate and a heat conductive pipe as a heat conductive component, and a thermoelectric cooling part.
The laser heat dissipation device in the embodiment of the present invention includes 3 first heat pipes 13, and the laser heat dissipation device in the embodiment of the present invention includes a thermoelectric cooling component 12, a copper block as a heat conducting fixing member 14, and a heat conducting plate 151 and a second heat pipe 15 as a heat conducting component, and the operating current of the thermoelectric cooling component 12 in the embodiment of the present invention is 1A.
The laser heat dissipation device in the embodiment of the invention and the laser heat dissipation device disclosed in the comparative example are used for dissipating heat of a laser with the thermal power of 150W. Table 1 shows the heat dissipation performance test results of the laser devices with the same heat dissipation fan type and different air volumes.
TABLE 1 test results of heat dissipation performance of laser devices with the same fan model and different air volumes
| Ambient temperature | Thermal power | Rotating speed of fan | Comparative example laser temperature rise (. degree. C.) | The temperature of the laser rises (DEG C) | Electric current |
| 25℃ | 150W | 1000RPM | 40 | 35.6 | |
| 25℃ | 150W | 1500RPM | 35.8 | 32.4 | |
| 25℃ | 150W | 2000RPM | 32.6 | 28.8 | |
| 25℃ | 150W | 3000RPM | 26.2 | 20.5 | 1A |
As can be seen from table 1: under the same air quantity, the quantity of the heat pipes in the laser heat dissipation device in the embodiment of the invention is less than that of the heat pipes in the laser heat dissipation device in the comparative example as much as possible, but the heat dissipation capacity of the laser heat dissipation device in the embodiment of the invention to the laser is still better than that of the laser heat dissipation device in the comparative example to the laser, so that the laser heat dissipation device in the embodiment of the invention can better dissipate heat of a laser light source, and the laser heat dissipation device in the embodiment of the invention can solve the heat dissipation problem for the high-power laser.
The embodiment of the invention also provides laser projection equipment. Referring to fig. 1, the laser projection apparatus includes an optical machine 2, a lens 3, and the laser light source 1; the laser light source 1 is used for providing an illumination light beam to the optical machine 2; the optical machine 2 is configured to modulate the illumination light beam and project the modulated illumination light beam to the lens 3, so that the modulated illumination light beam is imaged through the lens 3.
Compared with the prior art, the beneficial effects of the laser projection device provided by the embodiment of the invention are the same as those of the laser light source, and are not repeated again.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A laser light source, comprising:
a laser housing;
the evaporation end of the first heat pipe is used for exchanging heat with the radiating surface of the laser shell and is connected with a first radiating assembly;
the first heat dissipation assembly is arranged at the condensation end of the first heat pipe;
the thermoelectric refrigeration part is connected to the first heat pipe, the thermoelectric refrigeration part is provided with a hot end face and a cold end face, the cold end face of the thermoelectric refrigeration part is used for carrying out heat exchange with the first heat pipe, and the hot end face of the thermoelectric refrigeration part is used for carrying out heat exchange with the second heat dissipation assembly.
2. The laser light source of claim 1, wherein the thermoelectric cooling component is located on the first heat pipe at a predetermined distance from the connection of the first heat pipe and the laser housing.
3. The laser light source of claim 1, wherein the thermoelectric cooling element is located between the evaporating end and the condensing end of the first heat pipe, and the thermoelectric cooling element is located on the first heat pipe near the condensing end of the first heat pipe.
4. The laser light source of claim 1, wherein the first heat sink assembly and the second heat sink assembly are integral.
5. The laser light source of claim 1, wherein the thermoelectric cooling component is in heat exchange with the second heat sink assembly via a second heat pipe.
6. The laser light source of claim 1, further comprising a thermally conductive fixture disposed on the first heat pipe, wherein the thermoelectric cooling component is disposed on the thermally conductive fixture.
7. The laser light source of claim 1, wherein the first heat pipe comprises a first linear heat pipe segment, a second linear heat pipe segment, and a transition segment connecting the first linear heat pipe segment and the second linear heat pipe segment.
8. The laser light source of claim 7, wherein the transition section is a bend section.
9. The laser light source of claim 6, further comprising a heat conducting assembly disposed on the heat sink assembly, wherein the thermoelectric cooling element is disposed between the heat conducting assembly and the heat conducting fixture.
10. A laser projection apparatus, comprising an optical machine, a lens and the laser light source according to any one of claims 1 to 9;
the laser light source is used for providing an illumination light beam for the light machine; the optical machine is used for modulating the illumination light beam and projecting the modulated light beam to the lens, and the lens receives the modulated light beam for projection imaging.
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| CN115175542A (en) * | 2022-08-11 | 2022-10-11 | 四川启睿克科技有限公司 | Chip heat radiation structure and projector |
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