CN101008773A - Projector and radiator thereof - Google Patents
Projector and radiator thereof Download PDFInfo
- Publication number
- CN101008773A CN101008773A CN 200610006604 CN200610006604A CN101008773A CN 101008773 A CN101008773 A CN 101008773A CN 200610006604 CN200610006604 CN 200610006604 CN 200610006604 A CN200610006604 A CN 200610006604A CN 101008773 A CN101008773 A CN 101008773A
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- heat
- light valve
- heat radiator
- projector
- conductor module
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Abstract
This invention discloses one projection device and its dissipation device, wherein, the dissipation device uses heat conductive parts to connect light valve and heat cooler device; then using first dissipation slice to connect electrical cooling device to conduct heat energy by light valve into electrical cooling device; then using heat cooler to convert heat energy into first dissipation slice to dissipate heat energy.
Description
Technical field
The present invention relates to a kind of projector, relate in particular to the heat abstractor that is used for projector.
Background technology
See also Fig. 1, this figure is the synoptic diagram of existing projector 2 and heat abstractor 4 thereof.Projector 2 comprises light engine 6, and light engine 6 comprises light valve (light valve) 602.In the course of the work, the continuous illuminating light valve 602 of the light beam that the light source 8 of light engine 6 provides, light valve 602 will produce a large amount of heat energy, if can not disperse in real time, will cause light valve 602 to be damaged.In the prior art, be equiped with heat abstractor 4 to distribute the heat energy that light valve 602 is produced.
Existing heat abstractor 4 comprises heat radiator 402.Wherein, heat radiator 402 is directly connected on the light valve 602, utilizes the area of dissipation of heat conduction with increase light valve 602, and dispels the heat in the mode of natural convection (freeconvection).If radiating effect is not good, the deviser needs to set up fan 404 in contiguous heat radiator 402 parts, in order to produce airflow, distributes light valve 602 and heat radiator 402 heat on every side with forced convertion (force convection).
Yet for the high power projector 2 of big wattage and so on, the heat energy that light valve 602 is produced is very big, and the required temperature difference of the forced convertion that fan 404 produces is too little, so can not produce effective heat transmission.For instance, projector with 5000 lumens (lumen) is an example, the temperature of light valve 602 reality is 65 ℃ (being the surface temperature of light beam irradiates in light valve 602), and the temperature of heat radiator 402 and light valve 602 surface of contact only is 53 ℃, if environment temperature is 35 ℃, then the required temperature difference of heat transmission only is 18 ℃ (being the required temperature difference of forced convertion), compares less for 30 ℃ with the temperature difference of reality.If this increases the power of fan 404, meeting additionally produces noise and makes user's discomfort, and also therefore increases component costs.And generally speaking, set up the highest radiating requirements that only can satisfy below 3600 lumens (lumen) of fan heat radiation, surpass this lumen number and then must seek other solution, can satisfy the demand of projector high brightness.
Therefore, the object of the present invention is to provide a kind of projector and heat abstractor thereof, to address the above problem.
Summary of the invention
The object of the present invention is to provide a kind of projector and heat abstractor thereof, the heat energy that it can effectively distribute light valve and is produced.
The present invention relates to a kind of projector and heat abstractor thereof.This projector has a light engine, and this light engine comprises a light valve, and wherein, projector is that digital light is handled (Digital LightProcessing; DLP) projector, light valve are digital micro-mirror device (Digital MicromirrorDevice; DMD).Heat abstractor comprises a termal conductor module, a thermoelectric refrigerating unit (Thermoelectriccoolers; TECs), one first heat radiator and a fan.
Termal conductor module system comprises first end and second end, and first end is connected in light valve.This thermoelectric refrigerating unit comprises cold junction and hot junction, and the cold junction of this thermoelectric refrigerating unit is connected with second end.First heat radiator is connected with the hot junction.Wherein, fan is set at contiguous second end and the first heat radiator place, in order to produce airflow, with the heat energy of the loses heat conducting subassembly and first heat radiator.
Because projector of the present invention and heat abstractor thereof utilize thermoelectric refrigerating unit and termal conductor module to transmit heat, and cooperate fan to produce cooling draught, can effectively disperse two thermals source such as light valve and thermoelectric refrigerating unit, thus the heat energy that can distribute light valve effectively and produced.
Can be about advantage of the present invention and design by detailed description of the present invention further being understood below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is the synoptic diagram of existing projector and heat abstractor thereof;
Fig. 2 is the projector of first embodiment of the invention and the synoptic diagram of heat abstractor thereof;
Fig. 3 is the projector of second embodiment of the invention and the synoptic diagram of heat abstractor thereof;
Fig. 4 is the projector of third embodiment of the invention and the synoptic diagram of heat abstractor thereof;
Fig. 5 is the projector of four embodiment of the invention and the synoptic diagram of heat abstractor thereof;
Fig. 6 is the projector of fifth embodiment of the invention and the synoptic diagram of heat abstractor thereof;
Fig. 7 is the synoptic diagram of thermoelectric refrigerating unit of the present invention.
The description of reference numerals of critical piece
Heat abstractor 4,32 light engines 6,34
Thermoelectric refrigerating unit 42 first heat radiator 44
First end, 4,002 second ends 4004
The 3rd end 4202 the 4th end 4204
Second heat pipe 62 backing 64 that scatters
The 3rd heat pipe 70 cold junction insulation courses 4212
Cold side metal layer 4214 semiconductor layer 4215
Hot junction insulation course 4216 hot side metal layers 4218
N-type semiconductor 82 P-type semiconductors 84
Embodiment
First embodiment
See also Fig. 2, this figure is the projector 30 of first embodiment of the invention and the synoptic diagram of heat abstractor 32 thereof.Projector 30 has light source 38 and light engine 34, light source 38 is in order to offer light beam light engine 34, light engine 34 comprises light valve 36 and projection lens 37, light valve 36 is suitable for transforming the light beam into image strip, projection lens 37 is suitable for the image that image strip forms is projeced on the screen (not shown), and projector 30 is handled (Digital Light Processing for digital light; DLP) projector, light valve 36 are digital micro-mirror device (Digital Micromirror Device; DMD).Heat abstractor 32 comprises termal conductor module 40, thermoelectric refrigerating unit (Thermoelectric coolers; TECs) 42, first heat radiator 44 and fan 46.
Thermoelectric refrigerating unit 42 comprises the 3rd end 4202 and the 4th end 4204, and the 3rd end 4202 of thermoelectric refrigerating unit 42 is connected with second end 4004 of termal conductor module 40.First heat radiator 44 is connected with the 4th end 4204 of thermoelectric refrigerating unit 42.Whereby, the thermal energy conduction that can fast light valve 36 be produced is scattered in entire heat dissipation device 32.In the present embodiment, the 3rd end 4202 of light valve 36 and thermoelectric refrigerating unit 42 is set on the same surface of termal conductor module 40.
Below thermoelectric refrigerating unit 42 is illustrated.See also Fig. 7, Fig. 7 is the synoptic diagram of thermoelectric refrigerating unit 42 of the present invention.Foregoing heat abstractor 32, wherein the 3rd end 4202 is the cold junction of thermoelectric refrigerating unit 42, the 4th end 4204 is the hot junction of thermoelectric refrigerating unit 42.Wherein, thermoelectric refrigerating unit 42 comprises cold junction insulation course 4212, cold side metal layer 4214, semiconductor layer 4215, hot junction insulation course 4216 and the hot side metal layer 4218 that horizontal layer is arranged.Cold junction insulation course 4212 and hot junction insulation course 4216 difference double teams are in the outside of cold side metal layer 4214 with hot side metal layer 4218, cold side metal layer 4214 and hot side metal layer 4218 double team semiconductor layer 4215.Semiconductor layer 4215 is N-type semiconductor 82 and the NP semiconductor layer of P-type semiconductor 84 lateral separations arrangement to form, and at present, the main available bismuth telluride of this NP semiconductor layer (Bismuth Telluride) mixes and forms N-type semiconductor 82 or P-type semiconductor 84.Cold junction insulation course 4212 and hot junction insulation course 4216 are made of stupalith.After thermoelectric refrigerating unit 42 energized, electronics is set out by negative pole, at first pass through P-type semiconductor 84, absorb the heat energy of cold junction in this, arrived N-type semiconductor 82, again heat energy is emitted in the hot junction, thus every through one group of N-type semiconductor 82 and P-type semiconductor 84, just heat can be passed to the hot junction from cold junction.It should be noted that on cold junction insulation course 4212 and hot junction insulation course 4216 and surface that other article contact and can coat thermal grease, be beneficial to the conduction of heat.
Wherein, fan 46 is set at second end 4004 and first heat radiator, 44 places of proximity thermal conducting subassembly 40, in order to produce the heat of airflow with the loses heat conducting subassembly 40 and first heat radiator 44.It should be noted that in the embodiments of the present invention, fan can exhausting or the blowing mode heat of the conduction device 40 and first heat radiator 44 is discharged.
The heat radiation approach of heat abstractor 32 of the present invention is after being passed to thermoelectric refrigerating unit 42 by the heat energy that light valve 36 produces via termal conductor module 40, carry out thermal power transfer apace via thermoelectric refrigerating unit 42, and heat is reached first heat radiator 44, therefore can avoid heat energy to accumulate on light valve 36 and cause light valve 36 to be decreased.Pass through first heat radiator 42 then in large area with Natural Heat Convection, the heat that is produced by light valve 36 can be effectively distributed in the forced convertion that cooperates fan 46 to produce again.
Second embodiment
See also Fig. 3, this figure is the projector 30 of second embodiment of the invention and the synoptic diagram of heat abstractor 32 thereof.The difference of the second embodiment of the invention and first embodiment is that termal conductor module 40 is for having second heat radiator 50 of radiating fin 51.The heat energy that light valve 36 is produced is passed to thermoelectric refrigerating unit 42 by second heat radiator 50, and is made thermal power transfer and heat is reached first heat radiator 44 by thermoelectric refrigerating unit 42, cools off first heat radiator 44 and second heat radiator 50 simultaneously by fan 46 again.
The 3rd embodiment
See also Fig. 4, this figure is the projector 30 of third embodiment of the invention and the synoptic diagram of heat abstractor 32 thereof.The difference of the third embodiment of the invention and second embodiment is, also comprises first heat pipe (heat pipe) 52 in second heat radiator 50.First heat pipe 52 is set in second heat radiator 50, and first heat pipe 52 extends to second end 4004 from first end 4002 of second heat radiator 50.Except aforementioned heat radiation process, first heat pipe 52 can be more quickly with the thermal energy transfer of light valve 36 to thermoelectric refrigerating unit 42.
The 4th embodiment
See also Fig. 5, this figure is the projector 30 of four embodiment of the invention and the synoptic diagram of heat abstractor 32 thereof.The difference of the four embodiment of the invention and first embodiment is, termal conductor module 40 comprises the 3rd heat radiator 60, second heat pipe 62 and backing 64 that scatters, the 3rd heat radiator 60 is connected on the light valve 36, backing 64 that scatters is connected on the thermoelectric refrigerating unit 42, and two ends of second heat pipe 62 connect the 3rd heat radiator 60 and backing 64 that scatters respectively.The heat that light valve 36 produced is passed to thermoelectric refrigerating unit 42 through the 3rd heat radiator 60, second heat pipe 62, backing 64 that scatters in regular turn.
The 5th embodiment
See also Fig. 6.Fig. 6 is the projector 30 of fifth embodiment of the invention and the synoptic diagram of heat abstractor 32 thereof.The difference of the fifth embodiment of the invention and first embodiment is that termal conductor module 40 is that two ends of the 3rd heat pipe 70, the three heat pipes 70 connect light valve 36 and thermoelectric refrigerating unit 42 respectively.The heat that light valve 36 is produced is passed to the other end fast by the 3rd heat pipe 70, and is made thermal power transfer and heat is reached first heat radiator 44 by thermoelectric refrigerating unit 42, again by fan 46 coolings first heat radiator 44.
Therefore, projector of the present invention and heat abstractor thereof utilize termal conductor module can be rapidly the amount of localized heat of light valve to be conducted to another cooling system (being thermoelectric refrigerator 42), to reduce the thermal load of light valve, avoid the too many heat energy of light valve accumulation and be damaged, and the cold junction of thermoelectric refrigerating unit 42 and the temperature difference in hot junction are bigger, can improve heat transference efficiency, can distribute the heat energy of light valve at short notice effectively whereby, and can reduce the thermal load of fan.
More than the detailed description the present invention made by concrete preferred implementation be intended to more clearly to describe feature of the present invention and design, and be not to be to limit the scope of the invention with top disclosed concrete preferred implementation.Otherwise the claimed scope of claim of the present invention has contained various changes and the equivalents of having done within the scope of the present invention.
Claims (15)
- One kind in order to the cooling light valve heat abstractor, this heat abstractor comprises:One termal conductor module, it comprises one first end and one second end, described first end is connected in described light valve;One thermoelectric refrigerating unit, it comprises a cold junction and a hot junction, described cold junction is connected with described second end;One first heat radiator, it is connected with described hot junction; AndOne fan, it is configured to contiguous described second end and described first heat radiator, distributes the airflow of the heat energy of described heat abstractor in order to generation.
- 2. heat abstractor as claimed in claim 1, wherein, described termal conductor module is a heat radiator.
- 3. heat abstractor as claimed in claim 1, wherein, described termal conductor module comprises a heat radiator and one first heat pipe, this first heat pipe is set in the heat radiator of described termal conductor module, and this first heat pipe extends to described second end from described first end.
- 4. heat abstractor as claimed in claim 1, wherein, described termal conductor module is one the 3rd heat radiator, one second heat pipe, and one the backing that scatters, described the 3rd heat radiator is set at described first end and is connected in described light valve, described backing that scatters is set at described second end and is connected in the cold junction of described thermoelectric refrigerating unit, and two ends of described second heat pipe connect described the 3rd heat radiator and described backing that scatters respectively.
- 5. heat abstractor as claimed in claim 1, wherein, described termal conductor module is a heat pipe, described first end and described second end are two ends of this heat pipe.
- 6. heat abstractor as claimed in claim 1, wherein, described light valve is a digital micro-mirror device.
- 7. heat abstractor as claimed in claim 1, wherein, described thermoelectric refrigerating unit comprises a cold junction insulation course, a cold side metal layer, semi-conductor layer, a hot junction insulation course and the hot side metal layer that horizontal layer is arranged, described cold junction insulation course and described hot junction insulation course difference double team are in the outside of described cold side metal layer and described hot side metal layer, described cold side metal layer and the described semiconductor layer of described hot side metal layer double team, described cold junction insulation course and described hot junction insulation course are made by stupalith.
- 8. heat abstractor as claimed in claim 1, wherein, described light valve and described thermoelectric refrigerating unit are located on the same surface of described termal conductor module.
- 9. projector comprises:One light engine, it comprises a light valve;One termal conductor module, it comprises one first end and one second end, described first end is connected in described light valve;One thermoelectric refrigerating unit, it comprises a cold junction and a hot junction, described cold junction is connected with described second end;One first heat radiator, it is connected with described hot junction; AndOne fan, it is configured to contiguous described second end and described first heat radiator, distributes the airflow of the heat energy of described termal conductor module and described first heat radiator in order to generation.
- 10. projector as claimed in claim 9, wherein, described termal conductor module is a heat radiator.
- 11. projector as claimed in claim 9, wherein, described termal conductor module comprises a heat radiator and one first heat pipe, and this first heat pipe is set in the heat radiator of described termal conductor module, and described first heat pipe extends to described second end from described first end.
- 12. projector as claimed in claim 9, wherein, described termal conductor module is one the 3rd heat radiator, one second heat pipe and one backing that scatters, described the 3rd heat radiator is arranged at described first end and is connected in described light valve, described backing that scatters is arranged at described second end and is connected in described thermoelectric refrigerating unit, and two ends of described second heat pipe connect described the 3rd heat radiator and described backing that scatters respectively.
- 13. projector as claimed in claim 9, wherein, described termal conductor module is one the 3rd heat pipe, and described first end and described second end are two ends of described the 3rd heat pipe.
- 14. projector as claimed in claim 9, wherein, described light valve is a digital micro-mirror device.
- 15. projector as claimed in claim 9, wherein, described thermoelectric refrigerating unit comprises a cold junction insulation course, a cold side metal layer, semi-conductor layer, a hot junction insulation course and the hot side metal layer that horizontal layer is arranged, described cold junction insulation course and described hot junction insulation course difference double team are in the outside of described cold side metal layer and described hot side metal layer, described cold side metal layer and the described semiconductor layer of described hot side metal layer double team, described cold junction insulation course and described hot junction insulation course are made of stupalith.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610006604 CN101008773A (en) | 2006-01-26 | 2006-01-26 | Projector and radiator thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610006604 CN101008773A (en) | 2006-01-26 | 2006-01-26 | Projector and radiator thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101008773A true CN101008773A (en) | 2007-08-01 |
Family
ID=38697263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610006604 Pending CN101008773A (en) | 2006-01-26 | 2006-01-26 | Projector and radiator thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101008773A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101986196A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | DLP projector of totally enclosed cooling system |
| CN101986203A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | Heat pipe heat radiating system of digital light processing (DLP) projector |
| CN101986195A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | Digital light processing (DLP) projector with semiconductor freezer omniseal cooling system |
| CN101986194A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | Semiconductor cooling system of liquid crystal display (LCD) projector |
| CN102147166A (en) * | 2010-02-10 | 2011-08-10 | 郑云兵 | Semiconductor refrigerator |
| CN102289139A (en) * | 2011-08-19 | 2011-12-21 | 四川长虹电器股份有限公司 | Heat radiating system of whole machine of laser projector |
| CN102853377A (en) * | 2012-01-07 | 2013-01-02 | 深圳市光峰光电技术有限公司 | Wavelength converter and light-emitting device |
| CN103035592A (en) * | 2011-10-09 | 2013-04-10 | 李明烈 | Heat dissipation device transmitting heat by using phonons |
| CN103713376A (en) * | 2012-09-28 | 2014-04-09 | 中强光电股份有限公司 | Projection camera and optical engine |
| CN104110605A (en) * | 2013-04-16 | 2014-10-22 | 深圳金立翔视效科技有限公司 | LED module and display screen applying same |
| CN105135365A (en) * | 2013-04-25 | 2015-12-09 | 深圳市光峰光电技术有限公司 | Wavelength conversion device and related light-emitting device |
| CN111474814A (en) * | 2019-01-23 | 2020-07-31 | 中强光电股份有限公司 | Heat dissipation module and projection device |
| CN112748632A (en) * | 2019-10-29 | 2021-05-04 | 青岛海信激光显示股份有限公司 | Laser light source and laser projection equipment |
| US11169434B2 (en) | 2019-04-29 | 2021-11-09 | Coretronic Corporation | Optical engine module and projector |
| CN113727082A (en) * | 2021-08-20 | 2021-11-30 | 深圳亮仔光电科技有限公司 | Active intelligent heat dissipation device and projector sealing machine |
-
2006
- 2006-01-26 CN CN 200610006604 patent/CN101008773A/en active Pending
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102147166A (en) * | 2010-02-10 | 2011-08-10 | 郑云兵 | Semiconductor refrigerator |
| CN101986194B (en) * | 2010-07-19 | 2013-05-29 | 深圳雅图数字视频技术有限公司 | Semiconductor cooling system of liquid crystal display (LCD) projector |
| CN101986203A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | Heat pipe heat radiating system of digital light processing (DLP) projector |
| CN101986195A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | Digital light processing (DLP) projector with semiconductor freezer omniseal cooling system |
| CN101986194A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | Semiconductor cooling system of liquid crystal display (LCD) projector |
| CN101986196A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | DLP projector of totally enclosed cooling system |
| CN101986196B (en) * | 2010-07-19 | 2012-05-09 | 深圳雅图数字视频技术有限公司 | DLP projector of totally enclosed cooling system |
| CN101986195B (en) * | 2010-07-19 | 2012-09-12 | 深圳雅图数字视频技术有限公司 | Digital light processing (DLP) projector with semiconductor freezer omniseal cooling system |
| CN101986203B (en) * | 2010-07-19 | 2013-05-29 | 深圳雅图数字视频技术有限公司 | Heat pipe heat radiating system of digital light processing (DLP) projector |
| CN102289139A (en) * | 2011-08-19 | 2011-12-21 | 四川长虹电器股份有限公司 | Heat radiating system of whole machine of laser projector |
| CN103035592A (en) * | 2011-10-09 | 2013-04-10 | 李明烈 | Heat dissipation device transmitting heat by using phonons |
| CN102853377A (en) * | 2012-01-07 | 2013-01-02 | 深圳市光峰光电技术有限公司 | Wavelength converter and light-emitting device |
| CN103713376A (en) * | 2012-09-28 | 2014-04-09 | 中强光电股份有限公司 | Projection camera and optical engine |
| CN104110605A (en) * | 2013-04-16 | 2014-10-22 | 深圳金立翔视效科技有限公司 | LED module and display screen applying same |
| CN105135365A (en) * | 2013-04-25 | 2015-12-09 | 深圳市光峰光电技术有限公司 | Wavelength conversion device and related light-emitting device |
| CN111474814A (en) * | 2019-01-23 | 2020-07-31 | 中强光电股份有限公司 | Heat dissipation module and projection device |
| US11169434B2 (en) | 2019-04-29 | 2021-11-09 | Coretronic Corporation | Optical engine module and projector |
| CN112748632A (en) * | 2019-10-29 | 2021-05-04 | 青岛海信激光显示股份有限公司 | Laser light source and laser projection equipment |
| CN113727082A (en) * | 2021-08-20 | 2021-11-30 | 深圳亮仔光电科技有限公司 | Active intelligent heat dissipation device and projector sealing machine |
| CN113727082B (en) * | 2021-08-20 | 2023-12-01 | 深圳亮仔光电科技有限公司 | Initiative intelligent heat abstractor and projector sealing ray apparatus |
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