CN101986194B - Semiconductor cooling system of liquid crystal display (LCD) projector - Google Patents
Semiconductor cooling system of liquid crystal display (LCD) projector Download PDFInfo
- Publication number
- CN101986194B CN101986194B CN 201010230500 CN201010230500A CN101986194B CN 101986194 B CN101986194 B CN 101986194B CN 201010230500 CN201010230500 CN 201010230500 CN 201010230500 A CN201010230500 A CN 201010230500A CN 101986194 B CN101986194 B CN 101986194B
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- heat
- projector
- cooling system
- seal
- optical bodies
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Abstract
The invention relates to a semiconductor cooling system of a liquid crystal display (LCD) projector, which comprises an optical main body, a sealing body for sealing the optical main body and transmitting the heat generated by the optical main body, a heat radiator, and a semiconductor cooler tightly arranged between the sealing body and the heat radiator. The semiconductor cooling system of the LCD projector is characterized in that a heat exchanger is arranged in the sealing body; the optical main body is cooled through the semiconductor cooler and the heat radiator outside the sealing body; and the cooling of the optical main body can reach extremely good cooling effect without the requirement of absorbing air from the outside so as to avoid the pollution of dust and dirt on the optical main body.
Description
[technical field]
The present invention relates to a kind of image documentation equipment, especially a kind of projector cooling system.
In traditional projector, imaging system is core, if occur dust, oil smoke and dust etc. in optical element wherein or the image-forming component, can cause the pollution of parts, thereby affect contrast, color and the serviceable life of projector.And the usually pollution that makes to stop imaging system airborne dust of when cooling etc. by Air Filter, dustproof sponge of traditional projector, but this traditional dust-control method has caused the imaging system surface dirt to be piled up, cause heat accumulation, it is deteriorated to produce heat, has seriously reduced the image quality of projected image.
Based on this, be necessary to provide a kind of LCD projector semiconductor cooling system that can either prevent dust and can improve cooling effectiveness.
A kind of LCD projector semiconductor cooling system, comprise optical bodies, also comprise the seal that seals described optical bodies and conduct the heat of described optical bodies generation, heating radiator and be closely set in described seal and described heating radiator between semiconductor cooler, described seal comprises the heat exchanger of being close to setting with described optical bodies, described seal also comprises top cover and bottom, described top cover and bottom form the space of accommodating described optical bodies, described bottom arranges the refrigeration mouth, described heat exchanger places on the described refrigeration mouth, and described refrigeration mouth is suitable with described semiconductor cooler.
Preferably, described seal also comprises the air channel of being close to the fan of setting and being connected in described fan with described heat exchanger, and described air channel is with the air-flow described optical bodies that leads.
Preferably, two fans are set in the described seal.
Preferably, described semiconductor cooler passes described refrigeration and mouthful is close to setting with described heat exchanger.
Preferably, described semiconductor cooler arranges heat-absorbent surface and heat delivery surface, and described heat-absorbent surface is closely set in described seal, and described heat delivery surface is closely set in described heating radiator.
Preferably, described heating radiator is provided with radiating fin.
Above-mentioned LCD projector semiconductor cooling system is arranged at heat exchanger in the seal, semiconductor cooler and the heating radiator outer by seal cool off optical bodies, so that the cooling of optical bodies no longer needs can reach extraordinary cooling effect from extraneous air amount, thereby avoided dust, dust to the pollution of optical bodies.
[description of drawings]
Fig. 1 is the explosive view of LCD projector semiconductor cooling system among the embodiment;
Fig. 2 is the structural representation of LCD projector semiconductor cooling system among the embodiment;
Fig. 3 is the synoptic diagram of LCD projector semiconductor cooling system among the embodiment.
[embodiment]
As shown in Figures 1 to 3, LCD projector semiconductor cooling system comprises seal 100, heating radiator 300 and is close to semiconductor cooler 200 between described seal 100 and the described heating radiator 300.
The seal 100 described optical bodies 400 of sealing are also conducted the heat that described optical bodies 400 produces, and comprise lid and heat-transfer device 120.Optical bodies 400 is the parts that produce heat in the optical system of projector.
Lid and heat-transfer device 120 form the receiving space of accommodating optical bodies 400, comprise top cover 110 and bottom 130.The breach suitable with optical bodies 400 is set in the lid, and particularly, respectively corresponding setting party's v notch v 132 and arc notch 134 in top cover 110 and the bottom 130 are to seal optical bodies 400.Top cover 110 and bottom 130 closures, then top cover 110 merges with arc notch 134 in the bottom 130, with suitable with lens shape, make camera lens pass arc notch 134 and places seal 100 outsides, and link to each other with optical bodies 400.In addition, refrigeration mouth 136 is set in the bottom 130.
Heat-transfer device 120 is close to setting with bottom 130, also can be one-body molded with it, comprise heat exchanger 122, the fan 124 of heat of cooling air and the air channel 126 that fan 124 is connected as one of conduction optical bodies 400 heats.Air channel 126 is with the air-flow optical bodies 400 that leads.In the present embodiment, a plurality of parts such as the liquid crystal panel assembly of LCD projector produce a large amount of heat and enter in the air, and heat exchanger 122 places on the refrigeration mouth 136, are close to camera lens, and semiconductor cooler 200 passes refrigeration mouth 136 and is close to heat exchanger 122.In optical bodies 400, for accelerating cooling, semiconductor cooler 200 turns cold rapidly heat exchanger 122, and hot-air is after cooling under the effect of heat exchanger 122 and fan 124, in heat exchanger 122 suction fans 124, then through air channel 126 cooling liquid crystal panel assemblies, so circulate and realize cooling.Heat exchanger 122 is provided with U-shaped mouth 123, to place camera lens.Fan 124 is provided with two, be closely set in symmetrically heat exchanger 122 both sides, separate by U-shaped mouth 123 between the two, wherein crosswind fan 124 is connected with optical bodies 400 by air channel 126, to promote the whole seal 100 of cooling, reach the purpose that reduces temperature.
When LCD projector worked, optical bodies 410 produced a large amount of heat in the seal 100, and optical bodies 400 is close to heat-transfer device 120, and the heat that optical bodies 400 produces is derived seal 100.Particularly, the heat in the optical bodies 400 contacts with air wherein, and the air in the optical bodies 400 is heated and becomes hot-air, and comes together in heat exchanger 122.Hot-air in this heat exchanger 122 cools off under the interaction of semiconductor cooler 200 and heat exchanger 122, so far, cooled air is sucked by fan 124, and 126 enter optical bodies 400 through the air channel, the heat that produces with optical bodies 400 contacts, its heat flows to: the heat that optical bodies 400 produces is under the cooling of the air that is blown out by the air channel, heat enters in the air, form hot-air, flow to heat exchanger 122, by semiconductor cooler 200 and heat exchanger 122 hot-air is cooled off.
Above-mentioned LCD projector semiconductor cooling system is arranged at heat exchanger in the seal, semiconductor cooler and the heating radiator outer by seal cool off optical bodies, so that the cooling of optical bodies no longer needs can reach extraordinary cooling effect from extraneous air amount, thereby avoided dust, dust to the pollution of optical bodies.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (6)
1. LCD projector semiconductor cooling system, comprise optical bodies, it is characterized in that, also comprise the seal that seals described optical bodies and conduct the heat of described optical bodies generation, heating radiator and be closely set in described seal and described heating radiator between semiconductor cooler, described seal comprises the heat exchanger of being close to setting with described optical bodies, described seal also comprises top cover and bottom, described top cover and bottom form the space of accommodating described optical bodies, described bottom arranges the refrigeration mouth, described heat exchanger places on the described refrigeration mouth, and described refrigeration mouth is suitable with described semiconductor cooler.
2. LCD according to claim 1 projector semiconductor cooling system is characterized in that described seal also comprises the air channel of being close to the fan of setting and being connected in described fan with described heat exchanger, and described air channel is with the air-flow described optical bodies that leads.
3. LCD according to claim 2 projector semiconductor cooling system is characterized in that, two fans are set in the described seal.
4. LCD according to claim 1 projector semiconductor cooling system is characterized in that, described semiconductor cooler passes described refrigeration and mouthful is close to setting with described heat exchanger.
5. LCD according to claim 1 projector semiconductor cooling system is characterized in that described semiconductor cooler arranges heat-absorbent surface and heat delivery surface, and described heat-absorbent surface is closely set in described seal, and described heat delivery surface is closely set in described heating radiator.
6. LCD according to claim 1 projector semiconductor cooling system is characterized in that described heating radiator is provided with radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010230500 CN101986194B (en) | 2010-07-19 | 2010-07-19 | Semiconductor cooling system of liquid crystal display (LCD) projector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010230500 CN101986194B (en) | 2010-07-19 | 2010-07-19 | Semiconductor cooling system of liquid crystal display (LCD) projector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101986194A CN101986194A (en) | 2011-03-16 |
| CN101986194B true CN101986194B (en) | 2013-05-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010230500 Expired - Fee Related CN101986194B (en) | 2010-07-19 | 2010-07-19 | Semiconductor cooling system of liquid crystal display (LCD) projector |
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| Country | Link |
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| CN (1) | CN101986194B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102830581B (en) * | 2012-09-11 | 2015-03-25 | 广东威创视讯科技股份有限公司 | Radiating device of projector |
| CN104469280A (en) * | 2013-09-23 | 2015-03-25 | 国家电网公司 | Video monitoring device |
| JP6578715B2 (en) * | 2015-04-08 | 2019-09-25 | セイコーエプソン株式会社 | projector |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000298311A (en) * | 1999-04-15 | 2000-10-24 | Seiko Epson Corp | Projection type display device |
| JP2004317956A (en) * | 2003-04-18 | 2004-11-11 | Aisin Seiki Co Ltd | Image device and peltier element device |
| CN101008773A (en) * | 2006-01-26 | 2007-08-01 | 中强光电股份有限公司 | Projector and radiator thereof |
| CN201017162Y (en) * | 2007-02-25 | 2008-02-06 | 李洪斌 | Dustproof heat radiating device of projector |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101650517B (en) * | 2008-08-11 | 2011-03-23 | 鸿富锦精密工业（深圳）有限公司 | Projector |
-
2010
- 2010-07-19 CN CN 201010230500 patent/CN101986194B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000298311A (en) * | 1999-04-15 | 2000-10-24 | Seiko Epson Corp | Projection type display device |
| JP2004317956A (en) * | 2003-04-18 | 2004-11-11 | Aisin Seiki Co Ltd | Image device and peltier element device |
| CN101008773A (en) * | 2006-01-26 | 2007-08-01 | 中强光电股份有限公司 | Projector and radiator thereof |
| CN201017162Y (en) * | 2007-02-25 | 2008-02-06 | 李洪斌 | Dustproof heat radiating device of projector |
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| Publication number | Publication date |
|---|---|
| CN101986194A (en) | 2011-03-16 |
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