CN101986195A - Digital light processing (DLP) projector with semiconductor freezer omniseal cooling system - Google Patents
Digital light processing (DLP) projector with semiconductor freezer omniseal cooling system Download PDFInfo
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- CN101986195A CN101986195A CN 201010230558 CN201010230558A CN101986195A CN 101986195 A CN101986195 A CN 101986195A CN 201010230558 CN201010230558 CN 201010230558 CN 201010230558 A CN201010230558 A CN 201010230558A CN 101986195 A CN101986195 A CN 101986195A
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- heat
- semiconductor cooler
- projector
- cooling system
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Abstract
The invention discloses a digital light processing (DLP) projector with a semiconductor freezer omniseal cooling system, which comprises an optical main body, a sealing member, an external radiator, a semiconductor freezer and a fan, wherein the sealing member seals the optical main body and transmits the heat generated by the optical body, the semiconductor freezer is tightly attached between the sealing member and the external radiator, and the fan dissipates the heat from the external radiator. With respect to the DLP projector with the semiconductor freezer omniseal cooling system, excellent cooling efficacy on the cooling of imaging components can be obtained without sucking air from outside any more through arranging the radiator on an omniseal shell, thereby avoiding the pollution to the imaging components by dust.
Description
[technical field]
The present invention relates to image documentation equipment, particularly relate to the hermetically sealed cooling system DLP of a kind of semiconductor cooler projector.
[background technology]
In the DLP projector of traditional use led light source, if core image-forming block surface heat accumulation, then the image quality of projected image will deterioration.And, the optic modulating device of liquid crystal panel etc., because thermotolerance is relatively poor, the heating to the light beam irradiates from light supply apparatus causes might produce hot deterioration.But the cooling procedure of traditional DLP projector is but just from extraneous air draught, and subsidiaryly is blown into dust, oil smoke and dust etc., thereby causes the pollution of parts.
[summary of the invention]
Based on this, be necessary to provide a kind of hermetically sealed, the hermetically sealed cooling system DLP of the semiconductor cooler projector that can improve cooling effectiveness.
The hermetically sealed cooling system DLP of a kind of semiconductor cooler projector comprises optical bodies, the described optical bodies of sealing and conducts seal, the external heat sink of the heat of described optical bodies generation, the fan that is closely set in the semiconductor cooler between described seal and the described external heat sink and described external heat sink is dispelled the heat.
Preferably, described seal comprises the heat transfer device of being close to setting with the thermal source of described optical bodies.
Preferably, described heat transfer device comprises the digital micromirror elements heat-conducting plate of light source heat-conducting plate, conductive digit micro-mirror element heat of conduction light source heat and the connecting portion that light source heat-conducting plate and digital micromirror elements heat-conducting plate are connected as one.
Preferably, described seal also comprises lid and base plate, and described lid, base plate and described heat transfer device form the space of accommodating optical bodies.
Preferably, described lid is provided with breach, and described breach and described light source heat-conducting plate are suitable, and described light source heat-conducting plate passes described breach and is close to light source.
Preferably, described semiconductor cooler is closely set on the described heat transfer device.
Preferably, described external heat sink is provided with the holding part of an adaptive described semiconductor cooler, described semiconductor cooler places in the described holding part, and described digital micromirror elements heat-conducting plate is provided with boss, and described external heat sink is close to setting by described semiconductor cooler and described boss.
Preferably, described semiconductor cooler is provided with heat-absorbent surface and heat delivery surface, and described heat-absorbent surface is close to described boss, and described heat delivery surface is close to described external heat sink.
Preferably, described external heat sink is provided with radiating fin, and described radiating fin and described fan are over against setting.
Preferably, described digital micromirror elements heat-conducting plate is provided with the heat-conducting plate radiating fin, and described heat-conducting plate radiating fin and described fan are over against setting.
The hermetically sealed cooling system DLP of above-mentioned semiconductor cooler projector is by being installed in heating radiator on the hermetic housing, make the cooling of image-forming block no longer need to suck air and can reach extraordinary cooling effect, thereby avoided the pollution of dust, dust image-forming block from the external world;
The hermetically sealed cooling system DLP of semiconductor cooler projector carries out heat interchange by semiconductor cooler, outside the heat shedder, has guaranteed the heat radiation of hermetically sealed cooling system.
[description of drawings]
Fig. 1 is the synoptic diagram of the hermetically sealed cooling system DLP of semiconductor cooler projector;
Fig. 2 is the structural representation of the hermetically sealed cooling system DLP of semiconductor cooler projector;
Fig. 3 is the cut-away view of the hermetically sealed cooling system DLP of semiconductor cooler projector.
[embodiment]
As shown in Figures 1 to 3, the hermetically sealed cooling system DLP of semiconductor cooler projector comprises optical bodies 100, fan 200, seal 300, semiconductor cooler 400 and external heat sink 500.Semiconductor cooler 400 is close between seal 300 and the external heat sink 500.Fan 200 is over against external heat sink 500 being provided with and external heat sink 500 being dispelled the heat.
The seal 300 described optical bodies 100 of sealing are also conducted the heat that described optical bodies 100 produces, and comprising: lid 310, base plate 320 and heat transfer device 330.Lid 310 forms the space of accommodating optical bodies 100 with heat transfer device 330, is provided with it on and breach 312 that light source heat-conducting plate 322 is suitable.Seal 300 is sealed in optical bodies 100 therebetween, has stopped optical bodies 100 and has carried out air exchange with the external world, has also played the dustproof effect in heat radiation.Heat transfer device 330 is close to setting with base plate 320, also can be one-body molded with it, comprise the micro-mirror element heat-conducting plate 326 of light source heat-conducting plate 322, conductive digit micro-mirror element heat of conduction light source 110 heats and the connecting portion 324 that light source heat-conducting plate 322 and digital micromirror elements heat-conducting plate 326 are connected as one.Optical bodies 100 is the parts that produce heat in the projection machine optical system.In optical bodies 100, light source and digital micromirror elements are main thermals source, light source 110 is 3 red, green and blue LED light sources, therefore, for accelerating the heat conduction of led light source and digital micromirror elements, light source heat-conducting plate 322 passes breach 312 and is close to light source 110, and boss 3262 and heat-conducting plate radiating fin 3264 are set on the digital micromirror elements heat-conducting plate 326.
When the hermetically sealed cooling system DLP of semiconductor cooler projector works, in the seal 300, light source 110 and digital micromirror elements heat-conducting plate 326 produce a large amount of heat, light source 110 is close to light source heat-conducting plate 322, the heat that light source 110 produces is derived, and come together in digital micromirror elements heat-conducting plate 326 through connecting portion 324 and the heat that digital micromirror elements produces.Heat in the digital micromirror elements heat-conducting plate 326 is heating radiator 500 externally, the interaction of semiconductor cooler 400 and fan 200 is cooling down, its heat flows to: the connecting portion 324 of flowing through after the heat that light source 110 produces is absorbed by light source heat-conducting plate 322 is transmitted to digital micromirror elements heat-conducting plate 326, and the heat in the digital micromirror elements also is transmitted on the digital micromirror elements heat-conducting plate 326, so far the heat that converges in digital micromirror elements heat-conducting plate 326 is transmitted in the external heat sink 500 by the effect of the heat-conducting plate radiating fin 3264 of semiconductor cooler 400 and digital micromirror elements heat-conducting plate 320, heat in the last external heat sink 500 is derived through radiating fin 510, and finishes the heat radiation cooling of DLP projector under the effect of fan 200.
The hermetically sealed cooling system DLP of above-mentioned semiconductor cooler projector is by being installed in heating radiator on the hermetic housing, make the cooling of image-forming block no longer need to suck air and can reach extraordinary cooling effect, thereby avoided the pollution of dust, dust image-forming block from the external world;
The hermetically sealed cooling system DLP of semiconductor cooler projector carries out heat interchange by external heat sink, semiconductor cooler and heat transfer device, outside the heat shedder, has guaranteed the heat radiation of hermetically sealed cooling system.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. the hermetically sealed cooling system DLP of semiconductor cooler projector, comprise optical bodies, it is characterized in that, also comprise the described optical bodies of sealing and conduct seal, the external heat sink of the heat of described optical bodies generation, the fan that is closely set in the semiconductor cooler between described seal and the described external heat sink and described external heat sink is dispelled the heat.
2. the hermetically sealed cooling system DLP of semiconductor cooler according to claim 1 projector is characterized in that described seal comprises the heat transfer device of being close to setting with the thermal source of described optical bodies.
3. the hermetically sealed cooling system DLP of semiconductor cooler according to claim 2 projector, it is characterized in that described heat transfer device comprises the digital micromirror elements heat-conducting plate of light source heat-conducting plate, conductive digit micro-mirror element heat of conduction light source heat and the connecting portion that light source heat-conducting plate and digital micromirror elements heat-conducting plate are connected as one.
4. the hermetically sealed cooling system DLP of semiconductor cooler according to claim 3 projector is characterized in that described seal also comprises lid and base plate, and described lid, base plate and described heat transfer device form the space of accommodating optical bodies.
5. the hermetically sealed cooling system DLP of semiconductor cooler according to claim 4 projector is characterized in that described lid is provided with breach, and described breach and described light source heat-conducting plate are suitable, and described light source heat-conducting plate passes described breach and is close to light source.
6. according to any hermetically sealed cooling system DLP of described semiconductor cooler projector in the claim 2 to 5, it is characterized in that described semiconductor cooler is closely set on the described heat transfer device.
7. the hermetically sealed cooling system DLP of semiconductor cooler according to claim 3 projector, it is characterized in that, described external heat sink is provided with the holding part of an adaptive described semiconductor cooler, described semiconductor cooler places in the described holding part, described digital micromirror elements heat-conducting plate is provided with boss, and described external heat sink is close to setting by described semiconductor cooler and described boss.
8. the hermetically sealed cooling system DLP of semiconductor cooler according to claim 7 projector, it is characterized in that, described semiconductor cooler is provided with heat-absorbent surface and heat delivery surface, and described heat-absorbent surface is close to described boss, and described heat delivery surface is close to described external heat sink.
9. the hermetically sealed cooling system DLP of semiconductor cooler according to claim 1 projector is characterized in that described external heat sink is provided with radiating fin, and described radiating fin and described fan are over against setting.
10. the hermetically sealed cooling system DLP of semiconductor cooler according to claim 3 projector is characterized in that described digital micromirror elements heat-conducting plate is provided with the heat-conducting plate radiating fin, and described heat-conducting plate radiating fin and described fan are over against setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102305580A CN101986195B (en) | 2010-07-19 | 2010-07-19 | Digital light processing (DLP) projector with semiconductor freezer omniseal cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102305580A CN101986195B (en) | 2010-07-19 | 2010-07-19 | Digital light processing (DLP) projector with semiconductor freezer omniseal cooling system |
Publications (2)
| Publication Number | Publication Date |
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| CN101986195A true CN101986195A (en) | 2011-03-16 |
| CN101986195B CN101986195B (en) | 2012-09-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010102305580A Expired - Fee Related CN101986195B (en) | 2010-07-19 | 2010-07-19 | Digital light processing (DLP) projector with semiconductor freezer omniseal cooling system |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103135326A (en) * | 2011-11-23 | 2013-06-05 | 鸿富锦精密工业（深圳）有限公司 | Cooling device for optical machine of projector |
| US9033515B2 (en) | 2011-11-11 | 2015-05-19 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device of light engine with fan module and heat sink |
| CN108572496A (en) * | 2017-03-13 | 2018-09-25 | 台达电子工业股份有限公司 | Radiating subassembly and projector |
| CN110632812A (en) * | 2019-10-12 | 2019-12-31 | 广东联大光电有限公司 | DLP projector with improved cooling system |
| CN110750025A (en) * | 2019-09-25 | 2020-02-04 | 深圳市火乐科技发展有限公司 | Heat dissipation device and projection equipment |
| CN111474814A (en) * | 2019-01-23 | 2020-07-31 | 中强光电股份有限公司 | Heat dissipation module and projection device |
| CN112782917A (en) * | 2019-11-01 | 2021-05-11 | 理光工业解决方案有限公司 | Image projection apparatus |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6428170B1 (en) * | 1999-04-15 | 2002-08-06 | Seiko Epson Corporation | Optical projector with image enlarging and projecting capability and heat insulating and cooling means |
| CN101008773A (en) * | 2006-01-26 | 2007-08-01 | 中强光电股份有限公司 | Projector and radiator thereof |
| CN101650517A (en) * | 2008-08-11 | 2010-02-17 | 鸿富锦精密工业（深圳）有限公司 | Projector |
| CN101661212A (en) * | 2008-08-29 | 2010-03-03 | 鸿富锦精密工业（深圳）有限公司 | Projector configuration |
-
2010
- 2010-07-19 CN CN2010102305580A patent/CN101986195B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6428170B1 (en) * | 1999-04-15 | 2002-08-06 | Seiko Epson Corporation | Optical projector with image enlarging and projecting capability and heat insulating and cooling means |
| CN101008773A (en) * | 2006-01-26 | 2007-08-01 | 中强光电股份有限公司 | Projector and radiator thereof |
| CN101650517A (en) * | 2008-08-11 | 2010-02-17 | 鸿富锦精密工业（深圳）有限公司 | Projector |
| CN101661212A (en) * | 2008-08-29 | 2010-03-03 | 鸿富锦精密工业（深圳）有限公司 | Projector configuration |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9033515B2 (en) | 2011-11-11 | 2015-05-19 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device of light engine with fan module and heat sink |
| CN103135326A (en) * | 2011-11-23 | 2013-06-05 | 鸿富锦精密工业（深圳）有限公司 | Cooling device for optical machine of projector |
| CN108572496A (en) * | 2017-03-13 | 2018-09-25 | 台达电子工业股份有限公司 | Radiating subassembly and projector |
| CN111474814A (en) * | 2019-01-23 | 2020-07-31 | 中强光电股份有限公司 | Heat dissipation module and projection device |
| CN113934090A (en) * | 2019-01-23 | 2022-01-14 | 中强光电股份有限公司 | Heat dissipation module and projection device |
| CN113934090B (en) * | 2019-01-23 | 2023-05-12 | 中强光电股份有限公司 | Radiating module and projection device |
| CN110750025A (en) * | 2019-09-25 | 2020-02-04 | 深圳市火乐科技发展有限公司 | Heat dissipation device and projection equipment |
| CN110632812A (en) * | 2019-10-12 | 2019-12-31 | 广东联大光电有限公司 | DLP projector with improved cooling system |
| CN112782917A (en) * | 2019-11-01 | 2021-05-11 | 理光工业解决方案有限公司 | Image projection apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101986195B (en) | 2012-09-12 |
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