201228569 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係關於/種容置骏置及包含該容置裝置之電子設 備總成，該容置裝置可形成密閉空間以供電子裝置設置 . ，並對其進行泠卻。 【先前技術】 [〇〇〇2]隨著科技的進步及使用者需求的改變，生活中隨處可見 各種可攜式電子裝置’其中，因為投影機的普及’使得 影像畫面也得以依照使用者的需求及地點進行顯示及投 ° 射。 [〇〇〇3]由於光源效能的提升及解析摩的增加，投影機對於大尺 寸畫面的顯示具有相當優異的表現，且建構的成本也相 對低廉，故現今的投影機已經不僅被使用於辦公室或住 家等室内環境，許多戶外活動場地、地下鐵或車站等室 外環境，也可見投影機的蹤跡。然而，室外的環境因素 ’必然不若室内環境穩定，例如灰塵、昆蟲或濕氣等不 〇 利因素，此已造成投影機使用上的限制。 [0004]第1圖所示為習知投影機1之示意圖，其内部設置有許多 光學元件，如光源及各式光學元件等等，最終將顯示畫 面從鏡頭15中投射出來。當投影機1運作時，由於内部光 學元件運作會相應地產生高溫，若高溫持續累積，會對 投影機1的壽命產生不利影響。因此，為了能夠有效降低 投影機1内部的溫度，通常會設置風扇13於殼體11的風流 入口 111 ,當風扇13運轉時，適可自外部抽吸產生一風流 2，經由風流入口 ill吹向一風流出口 113，藉由主動散熱 099144345 表單編號A0101 第3 1/共18頁 0992076671-0 201228569 之方式降低投影機1内部的工作溫度。 [0005] [0006] [0007] 099144345 然而，因為習知的投影機1是利用風扇13將外部空氣導入 ，於投影機1内部形成風流2，可想見地，在使用一段時 間之後，内部的光學元件會堆積灰塵，從而對投影機1的 發光效率及使用壽命產生不利影響。尤其當將投影機1設 置於戶外活動場地、地下鐵或車站，甚至是野外等更惡 劣的環境時，内部光學元件遭受灰塵污染的情況將更為 嚴重。 習知的一種解決方式，係在投影機1的風流入口 11處設置 濾網17，當風扇13將風流2導入時，預先進行過濾的動作 ，將外界的灰塵先行阻擋於濾網17上，避免對内部光學 元件造成污染。然而，習知使用濾網的缺點在於需定期 更換濾網，尤其當投影機係設置於戶外活動場所時，其 更換的頻率將更為頻繁，否則當濾網堆積過多的灰塵而 造成阻塞後，風扇便無法有效將風流導入，反而容易導 致過熱等問題。而且濾網的過濾效果仍有其侷限，結構 孔徑較粗的濾網，對灰塵或粉塵的過濾效果差，而結構 孔徑較細的濾網，除了仍難以完全過濾灰塵或粉塵外， 同時還有冷卻風流阻力過大等缺點。 有鑑於此，如何避免灰塵堆積於電子裝置内部，同時又 可有效對電子裝置進行散熱，乃為此一業界亟待解決的 問題。 【發明内容】 本發明之一目的在於提供一種容置裝置及電子設備總成 ，該容置裝置形成一密閉空間，當電子裝置設置於該容 表單編號A0101 第4頁/共18頁 0992076671-0 [0008] 201228569 置裝置内，可與外界實質上完全隔離，維持密閉空間的 潔淨度，以避免環境灰塵或粉塵等雜物，污染電子裝置 〇 [0009] 本發明之另一目的在於提供一種容置裝置及電子設備總 成，其具有一熱交換單元，包含一吸熱部分及一散熱部 分，係分別設置於容置裝置之内部及外側，以協助將密 閉空間内電子裝置所產生的熱，由内部傳導至外側。 [0010] 為達上述目的，本發明提供一種供電子裝置設置於内之 容置裝置，該容置裝置包含一本體及一熱交換單元，該 本體形成一密閉空間以容納該電子裝置，該熱交換單元 與該本體聯結，用以將該電子裝置所產生的熱，由該密 閉空間傳導至該本體外。本發明更提供一種電子設備總 成，其係包含一電子裝置及前述之容置裝置。 [0011] 為讓上述目的、技術特徵、和優點能更明顯易懂，下文 係以較佳實施例配合所附圖式進行詳細說明。 【實施方式】 [0012] 請參閱第2圖，本發明之第一實施例係揭露一種容置裝置 5，其包含一本體51 ，本體51形成一密閉空間52，以 容納電子裝置3，電子裝置3設於容置裝置5之内部，並實 質上與外界環境隔絕。 [0013] 容置裝置5更包含一熱交換單元53，與該本體51聯結設置 。詳言之，該熱交換單元53包含吸熱部分531、以及與該 吸熱部分531熱傳導連接之散熱部分533。於本實施例中 ，吸熱部分531係設置於本體51内部的密閉空間52，而散 099144345 表單編號A0101 第5頁/共18頁 0992076671-0 201228569 熱部分533係設置於該本體51外。藉此，熱交換單元53之 吸熱部分531吸收本體51内部的熱能，並傳遞至外部的散 熱部分533，使得電子裝置3所產生的熱，由該密閉空間 52傳導至該本體51外。 [0014] [0015] [0016] 為增進散熱效率，可嘗試在本體51内部形成一風流4，使 其於5亥岔閉空間52中流動。為方面說明，可在本體5 j與 電子裝置3之間共同形成一流道，使該風流4沿該流道循 %流動。如第2圖所示，該流道係由電子裝置3之一側向 上延伸’經由電子裝置3上方的空間而延伸到電子裝置3 之另一側。實際作法_L，容置裝置5可更包含一導流風扇 5 5，设置於密閉空間5 2内的適當位置，用以驅動風流4之 流動。風流4之目的在於將電子裝置3所產生的熱，快速 地傳導至熱交換單元53之吸熱部分531，進而傳遞至散熱 部分533。 该容置裝置5之設計目的，其中之一是疼得各式電子裝置 3 ’均得以容置其内。一般來說，電子裝置3通常具有— 殼體31，且殼禮3〗會設有一風流、口 3丨1及一風流出口 313，用以導引空氣由風流入口 進入電子裝置3内部， 以對内部元件進行散熱，而後由風流出口 313排出。習知 的電子裝置3可更選擇性地於風流入口 311及風流出口 313 分別設置一入風風扇33及一出風風扇35。 以第2圖之示意圖進行說明，當電子裝置3設置於容置裝 置5内時，設置於風流入口 311的入風風扇33用以將右側 流道的空氣導入電子裝置3内，設置於風流出口 31 3的出 風風扇35用以將電子裝置3内的熱空氣導出電子裝置3至 099144345 表單編號A0101 第6頁/共18頁 0992076671-0 201228569 〇 [0017] 左側流道，此高溫氣流將隨成為風流4的一部份，並由左 侧流道向上被引導至熱交換單元53後，經由電子裝置3頂 部與吸熱部分531之間的上流道，導引至右侧流道，如此 循環便可將電子裝置3的熱能排散出去。需要說明的是， 就第2圖的配置而言，較佳宜儘量減少電子裝置3底部與 密閉空間52之間隔，以使風流4能儘可能地沿左侧流道、 上流道、再至右側流道而循環，其目的在於確保風流4流 經熱交換單元5 3，避免不經熱交換單元5 3而直接經由底 部的密閉空間52而流至風流入口 311。 此外，前述定義於電子裝置3頂部與吸熱部分531之間的 上流道，並非限定電子裝置3與吸熱部分531之間必須間 隔一距離。實際上，吸熱部分531亦可局部或全部貼近電 子裝置3之頂部，或者吸熱部分531採用鰭片式設計，使 得上流道形成於鰭片之間，以供風流4流通。 [0018] ❹ 該電子裝置3可為一投影機，由於投影機具有一鏡頭37， 用以投射光線，故本體51可更包含一透光部511，對應於 該鏡頭37設置。藉此，來自該鏡頭37之光線，適可經由 該透光部511向外投射。 [0019] 本發明熱交換單元53之熱傳導機制，可依需求採用不同 的設計，以下將以多個實施例進行說明。其中，由於容 置裝置5内部的電子裝置3與第一實施例相同，圖式及說 明將不另贅述，以下實施例僅針對熱交換單元53進行說 明。 [0020] 本發明之第二實施例如第3圖所示，其中，熱交換單元53 099144345 表單編號A0101 第7頁/共18頁 0992076671-0 201228569 更包含熱管71 ’連接吸熱部分531及散熱部分533。詳言 之’熱管71係在於利用内部密閉空間的冷凝液進行蒸發 及凝結的循環’進而於一端吸收該吸熱部分5 31的熱能， 並於另一端將熱能釋放至散熱部分533，來達到熱傳導的 機制。 [0021] 本發明之第三實施例如第4圖所示，其中該熱交換單元53 可更配置散熱風扇73 ’其位置係鄰設於該散熱部分533， 以協助發散該散熱部分533之熱能。本實施例亦可與前述 第二實施例結合，亦即同時配置熱管71及散熱風扇73， 此領域具有通常者應可藉由上述揭露技術，獲知其組合 之可此性，圖式不另綠示。 [〇〇22] 本發明之第四實施例如第5圖所示，其中讓熱交換單元53 可更包含一熱交換器（Heat Exchanger，HEX) 75，與 該散熱部分533連接。熱交換器75較佳可為一水冷裝置， 用以快速地將散熱部分533傳導出去。同樣地，本實施例 亦可與則述第二實施例結会，亦即進一步於吸熱部分531 與散熱部分533之間配置熱管71 » [0023] 本發明之第四實施例如第6圖所示，其中該熱交換單元53 更包含一致冷晶片模組（Therm〇eiectric cooler Module) 77 ’連接吸熱部分531及散熱部分533 ’用以快 速地將熱能由本體51内部的吸熱部分mi，傳導至本體51 外部的散熱部分5 3 3。本實施例可更與第三實施例之散熱 風扇73及第四實施例之熱交換器75加以結合，除了將熱 能由吸熱部分531快速傳導至散熱部分533之外，更進一 步將散熱部分5 3 3的熱能排散至外部環境。 099144345 表單編號A0101 第8頁/共18頁 0992076671-0 201228569 [0024] 請再次參閱第2圖，將電子裝置3設置於容置裝置5之内部 ，其整體將可成為一電子設備總成9,由於電子裝置3係 處於容置裝置5所形成的内部密閉環境中，故不易受到環 境的影響。第3-6圖所示之實施例，當然可以應用於此 ' 電子設備總成9。 [0025] 需說明的是，為了讓容置裝置5可適用既有的電子裝置3 設置，容置裝置5勢必需要具有可開啟的功能，例如一門 結構。當該電子裝置3放置進去之後，便可加以關閉，並 _ 維持内部的密閉狀態。此外，由於電子裝置可能需要連 ❹ 接電源及訊號，故容置裝置5内部可能需要設置電連接器 ，並延伸至殼體51外部，使得電子裝置3可經由該電連接 器，間接地與外部電性連接或訊號連接。以上裝置雖未 於圖式中顯示，惟所屬領域具有通常之事者，應能輕易 思及。 [0026] 綜上所述，藉由該容置裝置形成一密閉空間，電子裝置 設置於内部時可與外界實質上完全隔離，故無須安裝習 0 知的濾網，更可確保密閉空間的潔淨度，使其幾乎不受 環境灰塵或雜質的影響，有效避免污染或灰塵堆積。此 外，藉由熱交換單元之配置，來兼顧對於電子裝置的有 效散熱。以上功效均可有效維護電子裝置的使用壽命。 [0027] 上述之實施例僅用來例舉本發明之實施態樣，以及闡釋 本發明之技術特徵，並非用來限制本發明之保護範疇。 任何熟悉此技術者可輕易完成之改變或均等性之安排均 屬於本發明所主張之範圍，.本發明之權利保護範圍應以 申請專利範圍為準。 099144345 表單編號A0101 第9頁/共18頁 0992076671-0 201228569 【圖式簡單說明】 [0028] 第1圖係習知投影機之示意圖； [0029] 第2圖係本發明第一實施例之示意圖，其係同時顯示容置 裝置及其内之電子裝置； [0030] 第3圖係本發明第二實施例之示意圖； [0031] 第4圖係本發明第三實施例之示意圖； [0032] 第5圖係本發明第四實施例之示意圖；以及 [0033] 第6圖係為本發明第五實施例之示意圖。 【主要元件符號說明】 [0034] 1投影機11殼體111風流入口 113風流出口 13 風扇15鏡頭17濾網2風流3電子裝置31殼體 311風流入口 313風流出口 33入風風扇35出風風 扇37鏡頭4風流5容置裝置51本體511透光部 52密閉空間53熱交換單元531吸熱部分533散熱 部分55導流風扇71熱管73散熱風扇75熱交換 器77致冷晶片模组9電子設備總成 099144345 表單編號A0101 第10頁/共18頁 0992076671-0201228569 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to an electronic device assembly and an electronic device assembly including the same, which can form a sealed space for an electronic device Set . and lick it. [Prior Art] [〇〇〇2] With the advancement of technology and changes in user needs, various portable electronic devices can be seen everywhere in life. Among them, because of the popularity of projectors, video images can be customized according to users. Display and cast the demand and location. [〇〇〇3] Due to the improvement of the light source performance and the increase of the analytical motor, the projector has a very good performance for the display of large-size images, and the construction cost is relatively low, so today's projectors have been used not only in the office. Or the indoor environment such as home, many outdoor activities, subways or stations and other outdoor environments, as well as the trace of the projector. However, the outdoor environmental factors are inevitably not as stable as the indoor environment, such as dust, insects or moisture, which has caused restrictions on the use of the projector. Fig. 1 is a schematic view of a conventional projector 1 in which a plurality of optical elements, such as a light source and various optical elements, are disposed, and finally the display screen is projected from the lens 15. When the projector 1 is operated, since the internal optical components operate to generate high temperatures, if the high temperature continues to accumulate, the life of the projector 1 is adversely affected. Therefore, in order to effectively reduce the temperature inside the projector 1, a fan 13 is usually provided in the airflow inlet 111 of the casing 11. When the fan 13 is in operation, a windflow 2 is generated from the outside, and is blown through the airflow inlet ill. An airflow outlet 113 reduces the operating temperature inside the projector 1 by actively dissipating the heat of 099144345, Form No. A0101, No. 3 1/18, 0992076671-0 201228569. [0006] [0007] [0007] 099144345 However, since the conventional projector 1 uses the fan 13 to introduce outside air, a wind flow 2 is formed inside the projector 1, and conceivably, after a period of use, internal optics The components can accumulate dust, which adversely affects the luminous efficiency and service life of the projector 1. Especially when the projector 1 is placed in an outdoor activity venue, a subway or a station, or even a more hostile environment such as the wild, the internal optical components are more polluted by dust. A conventional solution is to provide a filter screen 17 at the airflow inlet 11 of the projector 1. When the fan 13 introduces the wind flow 2, the filtering operation is performed in advance to block the external dust from the filter screen 17 to avoid Contamination of internal optical components. However, the conventional use of the filter screen has the disadvantage that the filter screen needs to be replaced regularly, especially when the projector is installed in an outdoor activity place, the frequency of replacement will be more frequent, otherwise, when the filter screen accumulates excessive dust and causes blockage, The fan cannot effectively introduce the wind flow, but it is easy to cause problems such as overheating. Moreover, the filtering effect of the filter screen still has its limitations. The filter screen with a relatively large pore size has a poor filtering effect on dust or dust, and the filter screen with a fine structure aperture is difficult to completely filter dust or dust, and also has a dust filter or dust. Shortcomings such as excessive cooling air flow resistance. In view of this, how to prevent dust from accumulating inside the electronic device and effectively dissipating heat from the electronic device is an urgent problem to be solved in the industry. SUMMARY OF THE INVENTION An object of the present invention is to provide an accommodating device and an electronic device assembly, and the accommodating device forms a sealed space. When the electronic device is disposed on the volume form No. A0101, page 4 / 18 pages 0992076671-0 [0008] 201228569 can be completely isolated from the outside world, maintaining the cleanliness of the confined space to avoid environmental dust, dust and other debris, contaminating the electronic device. [0009] Another object of the present invention is to provide a capacity The device and the electronic device assembly have a heat exchange unit including a heat absorbing portion and a heat dissipating portion respectively disposed inside and outside of the accommodating device to assist in the heat generated by the electronic device in the sealed space. The inside is conducted to the outside. [0010] In order to achieve the above object, the present invention provides an accommodating device for an electronic device, the accommodating device comprising a body and a heat exchange unit, the body forming a sealed space to accommodate the electronic device, the heat The exchange unit is coupled to the body for conducting heat generated by the electronic device from the sealed space to the outside of the body. The present invention further provides an electronic device assembly including an electronic device and the aforementioned receiving device. [0011] The above described objects, features, and advantages will be more apparent from the following description. [Embodiment] [0012] Referring to FIG. 2, a first embodiment of the present invention discloses a receiving device 5 including a body 51. The body 51 forms a sealed space 52 for accommodating the electronic device 3. 3 is disposed inside the accommodating device 5 and is substantially isolated from the external environment. [0013] The accommodating device 5 further includes a heat exchange unit 53 coupled to the body 51. In detail, the heat exchange unit 53 includes a heat absorbing portion 531, and a heat radiating portion 533 thermally coupled to the heat absorbing portion 531. In the present embodiment, the heat absorbing portion 531 is disposed in the sealed space 52 inside the body 51, and is dispersed. 099144345 Form No. A0101 Page 5 of 18 0992076671-0 201228569 The hot portion 533 is disposed outside the body 51. Thereby, the heat absorbing portion 531 of the heat exchange unit 53 absorbs the heat energy inside the body 51 and transmits it to the external heat radiating portion 533, so that the heat generated by the electronic device 3 is conducted from the sealed space 52 to the outside of the body 51. [0016] In order to improve heat dissipation efficiency, it is attempted to form a wind flow 4 inside the body 51 to flow in the 5 岔 closed space 52. For the sake of illustration, a first-class track can be formed between the body 5j and the electronic device 3, so that the wind flow 4 flows along the flow path. As shown in Fig. 2, the flow path extends laterally from one of the electronic devices 3 to extend to the other side of the electronic device 3 via the space above the electronic device 3. In a practical manner, the accommodating device 5 further includes a flow guiding fan 5 5 disposed at an appropriate position in the sealed space 52 for driving the flow of the wind flow 4. The purpose of the airflow 4 is to rapidly transfer the heat generated by the electronic device 3 to the heat absorbing portion 531 of the heat exchange unit 53, and then to the heat radiating portion 533. One of the design purposes of the accommodating device 5 is that the various electronic devices 3' are accommodated therein. Generally, the electronic device 3 usually has a housing 31, and the shell 3 is provided with a wind flow, a port 3丨1 and a wind flow outlet 313 for guiding air from the airflow inlet into the interior of the electronic device 3, The internal components dissipate heat and are then discharged by the airflow outlet 313. The conventional electronic device 3 can selectively provide an air inlet fan 33 and an air outlet fan 35 at the air inlet 311 and the air outlet 313, respectively. As shown in the schematic diagram of FIG. 2, when the electronic device 3 is disposed in the accommodating device 5, the air inlet fan 33 disposed at the airflow inlet 311 is configured to introduce the air of the right side channel into the electronic device 3, and is disposed at the airflow outlet. The air outlet fan 35 of 31 3 is used to guide the hot air in the electronic device 3 to the electronic device 3 to 099144345. Form No. A0101 Page 6 / 18 pages 0992076671-0 201228569 〇 [0017] The left side flow channel, this high temperature air flow will follow After being part of the wind flow 4 and being guided upward by the left flow path to the heat exchange unit 53, the upper flow path is guided to the right flow path via the upper flow path between the top of the electronic device 3 and the heat absorption portion 531, and thus the cycle is performed. The thermal energy of the electronic device 3 can be discharged. It should be noted that, in the configuration of FIG. 2, it is preferable to minimize the interval between the bottom of the electronic device 3 and the sealed space 52 so that the wind flow 4 can be along the left flow path, the upper flow path, and then the right side as much as possible. The flow path is circulated, and the purpose thereof is to ensure that the wind flow 4 flows through the heat exchange unit 53 to avoid flowing directly to the air flow inlet 311 via the bottom closed space 52 without passing through the heat exchange unit 53. Further, the above-described upper flow path defined between the top of the electronic device 3 and the heat absorbing portion 531 does not necessarily mean that a distance must be separated between the electronic device 3 and the heat absorbing portion 531. In fact, the heat absorbing portion 531 may be partially or completely adjacent to the top of the electronic device 3, or the heat absorbing portion 531 may be of a fin design such that the upper flow path is formed between the fins for the flow of the wind. [0018] The electronic device 3 can be a projector. Since the projector has a lens 37 for projecting light, the body 51 can further include a light transmitting portion 511 corresponding to the lens 37. Thereby, the light from the lens 37 can be projected outward through the light transmitting portion 511. [0019] The heat transfer mechanism of the heat exchange unit 53 of the present invention can be designed differently according to requirements, and will be described below in various embodiments. The electronic device 3 inside the accommodating device 5 is the same as the first embodiment, and the drawings and descriptions are not described again. The following embodiments are only described for the heat exchange unit 53. [0020] A second embodiment of the present invention is shown in FIG. 3, wherein the heat exchange unit 53 099144345 Form No. A0101 Page 7 / Total 18 Page 0992076671-0 201228569 further includes a heat pipe 71 'connecting the heat absorption portion 531 and the heat dissipation portion 533 . In detail, the 'heat pipe 71 is a cycle in which evaporation and condensation are performed by the condensate in the inner closed space', and the heat energy of the heat absorbing portion 531 is absorbed at one end, and the heat energy is released to the heat radiating portion 533 at the other end to achieve heat conduction. mechanism. [0021] A third embodiment of the present invention is shown in FIG. 4, wherein the heat exchange unit 53 is further provided with a heat dissipating fan 73' disposed adjacent to the heat dissipating portion 533 to assist in dissipating heat energy of the heat dissipating portion 533. This embodiment can also be combined with the foregoing second embodiment, that is, the heat pipe 71 and the heat dissipating fan 73 are disposed at the same time. In the field, it is generally possible to obtain the combination of the above-mentioned disclosure techniques, and the figure is not green. Show. [第四22] A fourth embodiment of the present invention is shown in Fig. 5, wherein the heat exchange unit 53 further includes a heat exchanger (HEX) 75 connected to the heat radiating portion 533. The heat exchanger 75 is preferably a water-cooling device for rapidly conducting the heat-dissipating portion 533. Similarly, the present embodiment can also be combined with the second embodiment, that is, the heat pipe 71 is further disposed between the heat absorbing portion 531 and the heat radiating portion 533. [0023] The fourth embodiment of the present invention is shown in FIG. The heat exchange unit 53 further includes a Therm〇eiectric cooler Module 77' connecting the heat absorption portion 531 and the heat dissipation portion 533' for rapidly transferring heat energy from the heat absorption portion mi inside the body 51 to the body. 51 External heat sink section 5 3 3. This embodiment can be further combined with the heat dissipation fan 73 of the third embodiment and the heat exchanger 75 of the fourth embodiment, except that the heat energy is quickly conducted from the heat absorption portion 531 to the heat dissipation portion 533, and the heat dissipation portion 5 3 is further removed. The heat of 3 is dissipated to the external environment. 099144345 Form No. A0101 Page 8 of 18 0992076671-0 201228569 [0024] Referring again to FIG. 2, the electronic device 3 is disposed inside the accommodating device 5, and the whole body can become an electronic device assembly 9, Since the electronic device 3 is in the internal sealed environment formed by the accommodating device 5, it is not easily affected by the environment. The embodiment shown in Figures 3-6 can of course be applied to this 'electronic device assembly 9. [0025] It should be noted that, in order to make the accommodating device 5 applicable to the existing electronic device 3, the accommodating device 5 is required to have an openable function, such as a door structure. When the electronic device 3 is placed in, it can be turned off and _ maintains the internal sealed state. In addition, since the electronic device may need to be connected to the power supply and the signal, the electrical device may need to be disposed inside the receiving device 5 and extended to the outside of the housing 51, so that the electronic device 3 can be indirectly connected to the outside through the electrical connector. Electrical connection or signal connection. Although the above devices are not shown in the drawings, they should be easily considered if they are common in the field. In summary, the accommodating device forms a closed space, and the electronic device can be completely completely isolated from the outside when the electronic device is disposed inside, so that it is not necessary to install the filter screen of the prior art, and the clean space can be ensured. Degree, so that it is almost free from environmental dust or impurities, effectively avoiding pollution or dust accumulation. In addition, efficient heat dissipation to the electronic device is achieved by the arrangement of the heat exchange unit. The above effects can effectively maintain the service life of the electronic device. The embodiments described above are only intended to illustrate the embodiments of the present invention, and to explain the technical features of the present invention, and are not intended to limit the scope of protection of the present invention. Any changes or equivalents that can be easily made by those skilled in the art are within the scope of the invention. The scope of the invention should be determined by the scope of the claims. 099144345 Form No. A0101 Page 9/18 Page 0992076671-0 201228569 [Simplified Schematic] [0028] Fig. 1 is a schematic view of a conventional projector; [0029] Fig. 2 is a schematic view of a first embodiment of the present invention FIG. 3 is a schematic view showing a second embodiment of the present invention; [0031] FIG. 4 is a schematic view showing a third embodiment of the present invention; [0032] 5 is a schematic view of a fourth embodiment of the present invention; and [0033] FIG. 6 is a schematic view showing a fifth embodiment of the present invention. [Description of main component symbols] [0034] 1 projector 11 housing 111 airflow inlet 113 airflow outlet 13 fan 15 lens 17 filter 2 wind flow 3 electronic device 31 housing 311 airflow inlet 313 airflow outlet 33 air inlet fan 35 air outlet fan 37 lens 4 wind flow 5 accommodating device 51 body 511 light transmitting portion 52 confined space 53 heat exchange unit 531 heat absorbing portion 533 heat radiating portion 55 flow guiding fan 71 heat pipe 73 cooling fan 75 heat exchanger 77 cooling chip module 9 electronic equipment total Form 099144345 Form No. A0101 Page 10 / Total 18 Page 0992076671-0