US20120152778A1

US20120152778A1 - Container and electronic apparatus assembly comprising the same

Info

Publication number: US20120152778A1
Application number: US13/190,673
Authority: US
Inventors: Hui-Chih Lin; Chia-Jui Lin
Original assignee: Delta Electronics Inc
Current assignee: Delta Electronics Inc
Priority date: 2010-12-17
Filing date: 2011-07-26
Publication date: 2012-06-21
Also published as: CN102573369A; TW201228569A

Abstract

A container for accommodating an electronic device and an electronic apparatus assembly comprising the container are provided. The container comprises a body and a heat exchange unit connected to the body. The body forms a closed space for receiving the electronic device. The heat exchange unit operatively guides the heat generated by the electronic device from the closed space to the exterior of the body. Thereby, the electronic device can be isolated and cooled within the closed space.

Description

This application claims the benefit of the priority based on Taiwan Patent Application No. 099144345 filed on Dec. 17, 2010, the disclosure of which is incorporated herein by reference in its entirety.

CROSS-REFERENCES TO RELATED APPLICATIONS

Not applicable.

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to a container and an electronic apparatus assembly comprising the same. The container forms a closed space for receiving and cooling the electronic device.
2. Descriptions of the Related Art
Because of the advancement of science and technology and diversified needs of the users, various portable electronic devices can be found almost everywhere in daily life. Particularly, with the widespread use of projectors, images can now be displayed and projected according to the users' needs and location.
Due to the improvement in both the performance of light sources and resolution, projectors have superior performance in displaying large-sized frames and also have low costs. Therefore, projectors have found widespread application not only in indoor environments such offices or homes, but also in many outdoor environments such as outdoor activity spaces, metro lines or stations. However, outdoor environmental conditions are not as stable as indoor environmental conditions, and unfavorable factors such as dusts, insects or moisture have imposed limitations on the use of the projectors.
FIG. 1 is a schematic view of a conventional projector 1. A lot of optical components (e.g., the light source, variety of optical components and the like) are disposed in the projector 1 to finally project a display frame from a lens 15. During the operation of the projector 1, intense heat is generated by the internal optical components. The accumulation of the intense heat has an undesirable influence on the service life of the projector 1. Therefore, to effectively decrease the temperature inside the projector 1, a fan 13 is usually provided at the airflow inlet 111 of the housing 11. When the fan 13 operates, an airflow 2 is drawn from the outside into the airflow inlet 111 and then blown towards an airflow outlet 113. With active heat dissipation, the operating temperature inside the projector 1 can be decreased.
However, a conventional projector 1 introduces air from the outside into the projector 1 to form an airflow 2 by means of the fan 13, so conceivably, after using the projector 1 for a period of time, dusts will accumulate in the internal optical components to impose an undesirable influence on the light-emitting efficiency and the service life of the projector 1. When the projector 1 is disposed in an outdoor activity space, a metro line or a station or even in more severe environments such as fields, pollution of the internal optical components by dusts will become more of an issue.
A conventional solution to this problem is to dispose a filter screen on the airflow inlet 11 of the projector 1. Then, when the airflow 2 is introduced by the fan 13, dusts are filtered by the filter screen 17 to prevent pollution to the internal optical components. However, the disadvantage of using a filter screen is that the filter screen has to be replaced frequently, which is especially the case when a projector is disposed in an outdoor activity space. Otherwise, too much dust will accumulate on the filter screen to block the effective intake of the airflow, which causes overheating of the projector. Moreover, the filter screen only provides a limited filtration effect; more specifically, a filter screen with a large mesh size provides a poor filtering effect of dust, while a filter screen with a small mesh size may not completely filter out dust but also presents an undue resistance to the cooling airflow.
Accordingly, an urgent need exists in the art to provide a solution that can effectively cool the electronic device while still preventing the accumulation of dust in the electronic device.

SUMMARY OF THE INVENTION

An objective of the present invention is to provide a container and an electronic apparatus assembly comprising the same. The container forms a closed space. When the electronic device is disposed in the container, the electronic device can be completely isolated from the outside and the cleanliness of the closed space can be maintained to prevent foreign materials such as dust and stives from polluting the electronic device.
Another objective of the present invention is to provide a container and an electronic apparatus assembly. The container has a heat exchange unit. The heat exchange unit comprises a heat absorption portion and a heat dissipation portion, which are disposed inside the closed space and outside the body respectively to assist in conducting heat generated by the electronic device from the closed space to the outside.
To achieve the aforesaid objectives, the present invention provides a container for accommodating an electronic device, which comprises a body and a heat exchange unit. The body forms a closed space for receiving the electronic device. The heat exchange unit connects with the body for guiding heat generated by the electronic device from the closed space to the exterior of the body. The present invention further provides an electronic apparatus assembly, which comprises an electronic device and the aforesaid container.
The detailed technology and preferred embodiments implemented for the subject invention are described in the following paragraphs accompanying the appended drawings for people skilled in this field to well appreciate the features of the claimed invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of a conventional projector;

FIG. 2 is a schematic view of the first embodiment of the present invention, which illustrates a container and an electronic device contained therein simultaneously;

FIG. 3 is a schematic view of the second embodiment of the present invention;

FIG. 4 is a schematic view of the third embodiment of the present invention;

FIG. 5 is a schematic view of the fourth embodiment of the present invention; and

FIG. 6 is a schematic view of the fifth embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT

In reference to FIG. 2, the first embodiment of the present invention discloses a container 5. The container 5 comprises a body 51 which forms a closed space 52 for receiving the electronic device 3. The electronic device 3 is disposed inside the container 5 and substantially isolated from the outside.
The container 5 further comprises a heat exchange unit 53 connecting with the body 51. In more detail, the heat exchange unit 53 comprises a heat absorption portion 531 and a heat dissipation portion 533 thermally connecting with the heat absorption portion 531. In this embodiment, the heat absorption portion 531 is disposed inside the closed space 52 of the body 51, while the heat dissipation portion 533 is disposed outside the body 51. Thereby, heat generated inside the body 51 can be absorbed by the heat absorption portion 531 of the heat exchange unit 53 and further conducted to the heat dissipation portion 533 so that the heat generated by the electronic device 3 can be conducted from the closed space 52 to the outside of the body 51.
To improve the heat dissipation efficiency, an airflow 4 flowing in the closed space 52 may be formed inside the body 51. For convenience of description, a flow path may be formed between the body 51 and the electronic device 3 so that the airflow 4 circulates along the flow path. As shown in FIG. 2, the flow path extends upwards from one side of the electronic device 3, passes through a space above the electronic device 3 and then extends to the other side of the electronic device 3. In practice, the container 5 may further comprise a fan 55 for conducting the airflow, which is disposed at an appropriate position inside the closed space 52 for driving the airflow 4. The purpose of the airflow 4 is to have the heat generated by the electronic device 3 conducted rapidly to the heat absorption portion 531 of the heat exchange unit 53 and further to the heat dissipation portion 533.
One goal of designing of the container 5 is to make it suitable for accommodating a variety of electronic devices 3 therein. Generally speaking, the electronic device 3 typically comprises a housing 31 that has an airflow inlet 311 and an airflow outlet 313. The airflow is guided into the electronic device 3 through the airflow inlet 311 to cool the internal components and then exits from the electronic device 3 through the airflow outlet 313. Further, the conventional electronic device 3 may be selectively provided with an intake fan 33 and an exhaust fan 35 at the airflow inlet 311 and the airflow outlet 313 respectively.
As illustrated in the schematic view of FIG. 2, when the electronic device 3 is disposed in the container 5, the intake fan 33 disposed at the airflow inlet 311 is adapted to guide the air from the right flow path into the electronic device 3, and the exhaust fan 33 disposed at the airflow outlet 313 is adapted to guide the hot air from the electronic device 3 into the left flow path. The hot airflow then becomes a portion of the airflow 4 and is guided upwards from the left flow path to the heat exchange unit 53, where the airflow 4 passes through the upper flow path between the top of the electronic device 3 and the heat dissipation portion 531 to the right flow path. Through the circulation in this way, the airflow 4 can dissipate the heat outwards from the electronic device 3. It shall be noted that for the arrangement shown in FIG. 2, the spacing between the bottom of the electronic device 3 and the closed space 52 is preferably minimized so that the airflow 4 circulates through the left flow path, the upper flow path and then to the right flow path as much as possible. This is intended to ensure that the airflow 4 flows through the heat exchange unit 54 instead of flowing through the bottom of the closed space 52 to the airflow inlet 311 directly without passing through the heat exchange unit 53.
Additionally, for the upper flow path defined between the top of the electronic device 3 and the heat absorption portion 531, it is not limited that a distance between the electronic device 3 and the heat absorption portion 531 must exist. Actually, the heat absorption portion 531 may also partially or totally make contact with the top of the electronic device 3. The heat absorption portion 531 may also be of a fin design, in which case the upper flow path is formed between the fins for the airflow 4 to flow therethrough.
The electronic device 3 may be a projector. Because the projector has a lens 37 for projecting a light beam, the body 51 may further comprise a transparent portion 511 disposed corresponding to the lens 37. Thereby, the light beam from the lens 37 is operatively projected outwards through the transparent portion 511.
The heat conduction mechanism of the heat exchange unit 53 of the present invention may be designed differently depending on the different needs. Hereinafter, this will be described with reference to several embodiments. Because the electronic device 3 inside the container 5 is identical to that of the first embodiment, it will not be described again in the attached drawings and the following description, and the following embodiments will only focus on the heat exchange unit 53.
The second embodiment of the present invention is shown in FIG. 3. The heat exchange unit 53 further comprises a heat pipe 71 connecting with the heat absorption portion 531 and the heat dissipation portion 533. In detail, the heat conduction mechanism of the heat pipe 71 is that through the cycles of evaporation and condensation of a condensate liquid in the closed space, heat energy is absorbed at one end from the heat absorption portion 531 and then released at the other end to the heat dissipation portion 533.
The third embodiment of the present invention is shown in FIG. 4. The heat exchange unit 53 may further be provided with a cooling fan 73 disposed adjacent to the heat dissipation portion 533 to assist in dissipating the heat from the heat dissipation portion 533. This embodiment may also be combined with the second embodiment, i.e., both the heat pipe 71 and the cooling fan 73 are disposed. The possibilities of their combinations will be appreciated by those of ordinary skill in the art based on the above disclosures and, thus, will not be depicted in the attached drawings.
The fourth embodiment of the present invention is shown in FIG. 5. In this embodiment, the heat exchange unit 53 may further comprise a heat exchanger (HEX) 75 connecting with the heat dissipation portion 533. The HEX 75 is preferably a water cooling device for conducting heat outwards from the heat dissipation portion 533 rapidly. Similarly, this embodiment may also be combined with the second embodiment, i.e., the heat pipe 71 is further provided between the heat absorption portion 531 and the heat dissipation portion 533.
The fifth embodiment of the present invention is shown in FIG. 6. In this embodiment, the heat exchange unit 53 further comprises a thermoelectric cooler module 77 connecting with the heat absorption portion 531 and the heat dissipation portion 533 for conducting heat from the heat absorption portion 531 inside the body 51 to the heat dissipation portion 533 outside the body 51 rapidly. This embodiment may further be combined with the cooling fan 73 of the third embodiment and the HEX 75 of the fourth embodiment; in this case, apart from being conducted rapidly from the heat absorption portion 531 to the heat dissipation portion 533, the heat is further dissipated from the heat dissipation portion 533 to the outside.
In reference to FIG. 2, when the electronic device 3 is disposed inside the container 5, the electronic device 3 and the container 5 will together form an electronic apparatus assembly 9. Because the electronic device 3 is contained in the closed environment formed by the container 5, it is less liable to be influenced by the environment. The embodiments shown in FIGS. 3-6 can certainly be applied to the electronic apparatus assembly 9.
To make the container 5 suitable for accommodating an existing electronic device 3, the container 5 shall be openable, for example, having a door structure. After the electronic device 3 is placed therein, the container 5 may be closed and kept in this closed status. Additionally, because the electronic device may need to connect to a power source and signals, an electrical connector may be disposed inside the container 5 and extend to the outside of the housing 51 so that the electronic device 3 can electrically connect to the power source or to the signals indirectly via the electrical connector. Although these are not depicted in the attached drawings, they will be readily appreciated by those of ordinary skill in the art.
According to the above descriptions, by forming a closed space in the container, the electronic device disposed inside the container can be substantially totally isolated from the outside. This eliminates the need of installing a conventional filter screen and can further ensure cleanliness in the closed space, so the electronic device is almost free of influence from dust or foreign matters, thus effectively avoiding pollution or dust accumulation. Furthermore, through the arrangement of the heat exchange unit, effective heat dissipation of the electronic device is also achieved. All these factors can help in effectively maintaining the service life of the electronic device.
The above disclosure is related to the detailed technical contents and inventive features thereof. People skilled in this field may proceed with a variety of modifications and replacements based on the disclosures and suggestions of the invention as described without departing from the characteristics thereof. Nevertheless, although such modifications and replacements are not fully disclosed in the above descriptions, they have substantially been covered in the following claims as appended.

Claims

1. A container for accommodating an electronic device, comprising:

a body forming a closed space for receiving the electronic device; and

a heat exchange unit connecting with the body for guiding heat generated by the electronic device from the closed space to an exterior of the body.

2. The container as claimed in claim 1, wherein the heat exchange unit comprises a heat absorption portion and a heat dissipation portion thermally connecting with the heat absorption portion, the heat absorption portion being disposed inside the closed space and the heat dissipation portion being disposed outside the body.

3. The container as claimed in claim 2, wherein the closed space is provided with an airflow for flowing within the body.

4. The container as claimed in claim 3, wherein the body and the electronic device define an airflow channel therebetween, the airflow circulating along the airflow channel in the closed space.

5. The container as claimed in claim 4, further comprising a fan disposed in the closed space for conducting the airflow.

6. The container as claimed in claim 3, wherein the airflow delivers the heat generated from the electronic device to the heat absorption portion.

7. The container as claimed in claim 3, wherein the electronic device comprises a housing having an airflow inlet and an airflow outlet, the airflow entering the electronic device through the airflow inlet and departing the electronic device through the airflow outlet.

8. The container as claimed in claim 7, wherein the electronic device further comprises an intake fan and an exhaust fan, the intake fan being disposed at the airflow inlet for guiding the airflow into the electronic device, and the exhaust fan being disposed at the airflow outlet for guiding the airflow away from the electronic device.

9. The container as claimed in claim 2, wherein the heat exchange unit further comprises a heat pipe connecting with the heat absorption portion and the heat dissipation portion.

10. The container as claimed in claim 2, wherein the heat exchange unit further comprises a cooling fan being disposed adjacent to the heat dissipation portion.

11. The container as claimed in claim 2, wherein the heat exchange unit further comprises a heat exchanger (HEX) connecting with the heat dissipation portion.

12. The container as claimed in claim 11, wherein the heat exchanger is a water cooling device.

13. The container as claimed in claim 2, wherein the heat exchange unit further comprises a thermoelectric cooler module connecting with the heat absorption portion and the heat dissipation portion.

14. The container as claimed in claim 2, wherein the electronic device is a projector, the projector having a lens, the body further comprising a transparent portion disposed corresponding to the lens, and thereby a light beam from the lens is operatively projected outwards through the transparent portion.

15. An electronic apparatus assembly, comprising:

an electronic device;

a container comprising a body and a heat exchange unit, the body forming a closed space for receiving the electronic device, and the heat exchange unit connects with the body to guide heat generated by the electronic device from the closed space to an exterior of the body.