1306983 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種投影機，尤指利用於投影機中之散 熱裝置。 【先前技術】1306983 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a projector, and more particularly to a heat sink for use in a projector. [Prior Art]
請參閱圖一，係習知投影機2及其散熱裝置4之示意 圖。投影機2包含光學引擎6，光學引擎6包含一光閥 (light valve) 602，光閥602於操作過程中，光學引擎 6之光源8提供之光束不斷照射於光閥602,而會產生大量 的熱能，若不能即時消散，會使光閥602損壞。於習知技 術中，係裝設一散熱裝置4以消散光閥602所產生之熱能。 習知之散熱裝置4包含一散熱片402。其中，散熱片 402係直接連接於光閥602’利用傳導以增加光閥602的散 熱面積’並以自然對流(free convection)的方式散熱，若 散熱的效果不佳，設計者需增設一風扇4Q4，鄰近散熱片 402設置’用以產生空氣流，以強制對流（f〇rce⑺爪沈^丨㈤) 消散光閥602及散熱片402周圍的熱能。 然而，針對高瓦數等高功率之投影機2而言，光閥6〇2 所產生的熱能極大，而風扇404產生的強制對流所需之溫 差太小，故無法產生有效的熱傳遞，舉例來說，以5〇〇〇 流明（lumen)之投影機為例，光閥6〇2實際之溫度為65°C (即光束照射於光閥602之表面溫度），而散熱片402與光 閥602接觸面之溫度僅為53t，若環溫為35°C，則熱傳遞 所需之溫差僅為18°C (即強制對流所需之溫差），與實際 之溫差3(TC相較較小。若為此增加風扇4〇4的功率，會額 外產生噪音而令使用者不適，且也因此增加元件成本。並 且一般而言’增設風扇散熱最高僅可解決36〇〇流明（lumen) 以下的散熱需求’超過此流明數則須尋找其他的解決方 案’方能符合投影機高亮度的需求。 因此，本發明的目的在於提供一種投影機及其散熱裝 置，以解決上述問題。 【發明内容】 本發明之目的在提供一種投影機及其散熱裝置，可有 效消散光閥所產生的熱能。Referring to Figure 1, there is shown a schematic view of a conventional projector 2 and its heat sink 4. The projector 2 includes an optical engine 6. The optical engine 6 includes a light valve 602. During operation, the light beam provided by the light source 8 of the optical engine 6 is continuously irradiated to the light valve 602, and a large amount of light is generated. Thermal energy, if not dissipated immediately, will damage the light valve 602. In the prior art, a heat sink 4 is provided to dissipate the thermal energy generated by the light valve 602. The conventional heat sink 4 includes a heat sink 402. The heat sink 402 is directly connected to the light valve 602' by conduction to increase the heat dissipation area of the light valve 602 and is radiated in a free convection manner. If the heat dissipation effect is not good, the designer needs to add a fan 4Q4. Adjacent to the heat sink 402 is configured to generate a flow of air to force convection (f〇rce(7) claws (5)) to dissipate the thermal energy around the light valve 602 and the heat sink 402. However, for a projector 2 of high power such as high wattage, the heat energy generated by the light valve 6〇2 is extremely large, and the temperature difference required for forced convection generated by the fan 404 is too small, so that effective heat transfer cannot be produced, for example. For example, in the case of a 5 lumen projector, the actual temperature of the light valve 6〇2 is 65 ° C (that is, the surface temperature of the light beam is incident on the light valve 602), and the heat sink 402 and the light valve The temperature of the 602 contact surface is only 53t. If the ring temperature is 35°C, the temperature difference required for heat transfer is only 18°C (ie the temperature difference required for forced convection), and the actual temperature difference is 3 (TC is relatively small). If you increase the power of the fan 4〇4, it will generate additional noise and make the user uncomfortable, and thus increase the component cost. In general, the addition of the fan can only solve the problem of 36 lumens or less. The heat dissipation requirement 'more than this lumen number is required to find other solutions' to meet the high brightness requirements of the projector. Therefore, it is an object of the present invention to provide a projector and a heat sink thereof to solve the above problems. The purpose of the invention is to mention A projector and the heat sink, the heat can effectively dissipate the generated light valve.
' . I 本發明係關於一種投影機及其散熱裝置。投影機係具 有一光學引擎，該光學引擎包含一光閥，其中投影機係為 一數位光源處理(Digital Light Processing;DLP)之投影 機，該光閥係為一數位微鏡裝置(Digital MieiOmirror' Device;DMD)。該散熱裝置係包含一熱傳導裝置、一電子散 熱晶片（Thermoelectric coolers; TECs)、一 第一散熱片， 以及一風扇。. 該熱傳導裝置係包含一第一端以及一第二端，第一端 連接於該光閥。該電子散熱晶片係包含一冷端及一熱端， 該電子散熱晶片之冷端與第二端連接。該第一散熱片係與 熱端連接。其中，風扇係設置於鄰近第二端及第一散熱片 處，用以產生空氣流以消散該熱傳導裝置及該第一散熱片 之熱能。 1306983 因此’本發明之投影機及其散熱裝置，係利用電子散 熱晶片及熱傳導裝置的熱能傳遞，配合風扇產生之冷卻氣 流，可有效分散光閥及電子散熱晶片等二熱源，以有效率 地消散光閥所產生的熱能。 關於本發明之優點與精神可以藉由以下的發明詳述及 所附圖式得到進一步的瞭解。The invention relates to a projector and a heat sink therefor. The projector has an optical engine, and the optical engine includes a light valve, wherein the projector is a digital light processing (DLP) projector, and the light valve is a digital micromirror device (Digital MieiOmirror' Device; DMD). The heat sink comprises a heat transfer device, a thermoelectric coolers (TECs), a first heat sink, and a fan. The heat transfer device includes a first end and a second end, the first end being coupled to the light valve. The electronic heat dissipating chip comprises a cold end and a hot end, and the cold end of the electronic heat dissipating chip is connected to the second end. The first heat sink is coupled to the hot end. The fan is disposed adjacent to the second end and the first heat sink for generating an air flow to dissipate heat energy of the heat conduction device and the first heat sink. 1306983 Therefore, the projector of the present invention and the heat dissipating device thereof utilize the thermal energy transfer of the electronic heat dissipating chip and the heat conducting device, and cooperate with the cooling airflow generated by the fan to effectively disperse the two heat sources such as the light valve and the electronic heat dissipating chip to efficiently dissipate. The thermal energy generated by the light valve. The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.
【實施方式】 第一實施你丨[Embodiment] The first implementation of you
請參閱圖二，本發明第一實施例投影機3〇及其散熱裝 置32之示意圖。投影機3〇係具有一光源38及一光學引擎 34，光源38用以提供一光束至光學引擎34，光學引擎34 包含一光閥36及一投影鏡頭37，光閥36適於將光束轉換 成一影像光束’投影鏡頭37適用將影像光束形成之影像投 射於一螢幕（圖未示）上，投影機3〇係為一數位光源處理 (Digital Light Processing;DLP)之投影機’光閥 36 係為一數位微鏡裝置（Digital Micromirror Device;DMD)。散熱裝置32係包含一熱傳導裝置40、一電 子散熱晶片（Thermoelectric coolers ; TECs)42、一第一 散熱片44，以及一風扇46 熱傳導裝置40係包含一第一端4002以及一第二端 4004，熱傳導裝置40之第一端4002係連接於光閥36，熱 傳導裝置40係為'一散熱片。 電子散熱晶片42係包含一第三端4202以及一第四端 4204’電子散熱晶片42之第三端4202係與熱傳導裝置40 η 1306983 之第二端4004連接。第一散熱片44係與電子散熱晶片42 之第四端42〇4連接。藉此，可快速將光閥36所產生之熱 能傳導分散於整個散熱裝置32。本實施例，光閥36及電 子散熱晶片42之第三端42〇2係設於熱傳導裝置40之同一 表面上。Referring to FIG. 2, a schematic diagram of a projector 3A and a heat dissipating device 32 thereof according to a first embodiment of the present invention. The projector 3 has a light source 38 and an optical engine 34. The light source 38 is used to provide a light beam to the optical engine 34. The optical engine 34 includes a light valve 36 and a projection lens 37. The light valve 36 is adapted to convert the light beam into a light source. The image beam 'projection lens 37 is suitable for projecting the image formed by the image beam onto a screen (not shown), and the projector 3 is a digital light processing (DLP) projector 'light valve 36 is A Digital Micromirror Device (DMD). The heat dissipating device 32 includes a heat conducting device 40, an electronic heat sinks (TECs) 42, a first heat sink 44, and a fan 46. The heat conducting device 40 includes a first end 4002 and a second end 4004. The first end 4002 of the heat transfer device 40 is connected to the light valve 36, and the heat transfer device 40 is a heat sink. The electronic heat sink 42 includes a third end 4202 and a fourth end 4204. The third end 4202 of the electronic heat sink wafer 42 is coupled to the second end 4004 of the heat transfer device 40n 1306983. The first heat sink 44 is connected to the fourth end 42A of the electronic heat sink wafer 42. Thereby, the heat energy generated by the light valve 36 can be quickly dispersed throughout the heat sink 32. In this embodiment, the light valve 36 and the third end 42〇2 of the electronic heat sink wafer 42 are disposed on the same surface of the heat transfer device 40.
進一步’對電子散熱晶片42加以說明。請參閱圖七， 圖七係本發明電子散熱晶片42之示意圖。如前述之散熱裝 置32 ’其中第三端4202係為電子散熱晶片42之冷端，第 四端4204係為電子散熱晶片42之熱端。其中，電子散熱 晶片42係包含水平層狀排列之一冷端絕緣層4212、一冷 端金屬層4214、一半導體層4215、一熱端絕緣層4216、 以及一熱端金屬層4218 ’冷端絕緣層4212與熱端絕緣層 4216係分別包夾於冷端金屬層4214與熱端金屬層4218之 外侧，冷端金屬層4214與熱端金屬層4218係包夾半導體 層4215。半導體層4215係為N型半導體82與P型半導體Further, the electronic heat sink wafer 42 will be described. Referring to FIG. 7, FIG. 7 is a schematic diagram of the electronic heat dissipation chip 42 of the present invention. The third end 4202 is the cold end of the electronic heat sink wafer 42 and the fourth end 4204 is the hot end of the electronic heat sink wafer 42. The electronic heat dissipation chip 42 comprises a horizontal layered arrangement of a cold end insulating layer 4212, a cold end metal layer 4214, a semiconductor layer 4215, a hot end insulating layer 4216, and a hot end metal layer 4218 'cold end insulation. The layer 4212 and the hot end insulating layer 4216 are respectively sandwiched on the outer sides of the cold end metal layer 4214 and the hot end metal layer 4218, and the cold end metal layer 4214 and the hot end metal layer 4218 are sandwiched by the semiconductor layer 4215. The semiconductor layer 4215 is an N-type semiconductor 82 and a P-type semiconductor
84橫向間隔排列以組成之NP半導體層，目前此NP半導體 層主要可用碌化叙(Bismuth Tel luride)，加入不純物而形 成N型半導體82或P型半導體84。冷端絕緣層421?與熱 端絕緣層4216係為陶瓷材質所構成。當電子散熱晶片42 通上電源後，電子由負極出發，首先經過p型半導體84， 於此吸收冷端之熱能，到了 N型半導體82，又將熱能放出 於熱端’所以每經過一組N型半導體82與P型半導體84， 就會將熱能自冷端傳遞至熱端。值得注意的是，冷端絕緣 層4212與熱端絕緣層4216與其他物品接觸之表面可塗上 散熱膏，以利熱能之傳導。 1306983 其中，風扇46係設置於鄰近熱傳導裝置4〇之第二端 4004及第一散熱片44處，用以產生空氣流以消散熱傳導 裝置40及第一散熱片44之熱能。值得注意的是，於本發 明之各實施财，風扇可以減或是姐方式將傳導裝置 40及第一散熱片44之熱能排出。 本發明之散熱裝置32之散熱途徑為光閥36產生的熱 能經由熱傳導裳置4〇傳遞至電子散熱晶片42後，經由電 子散熱晶片42快速將進行熱能轉換至第一散熱片44，可 避免熱能累積於細3.6 ’導致細36的損害，然後透過 ，苐-散熱片42大面積地以自然對流散熱，再配合風扇邳 產生的強制對流，可有效消除光閥36產生的熱能。 篇"—實施何 請參閱圖三，本發明第二實施例投影機3〇及其散熱裝 置32之示忍圖。本發明第二實施例與第一實施例不同之處 f於’熱傳導裝置40係為-具有散熱鑌片51之第二散熱 工光闕36所產生之熱能係由第二散熱片50傳遞至電 巧…、晶片42，並由電子散熱晶片42作熱能轉換至第一 政”，、片44’再藉由風扇46同時冷卻第一散熱片44以及第 二散熱片50 〇 明參聰四’本發明第三實施例投影機3G及其散熱裝 圖。本發明第三實施顺第二實施例不同之處 當w—散熱片5〇中更包含—第一熱管(heatpipe)52。 在6 :皆52係設置於第二散熱片50 +，且第一熱管52 係自弟二散熱片50的第一端侧2延伸至第二端棚4。除 η 1306983 了别述的散熱過程外，第一熱管52能更快速地將光間邡 的熱能傳遞至電子賴晶片42。 第四實祐.你丨 请參閱囷五’本發明第四實施例投影機30及其散熱裝 置32之不意圖。本發明第四實施例與第一實施例不同之處 在於:熱傳導裝置4〇包含一第三散熱片6〇、一第二熱管 62、以及一第四散熱片64，第三散熱片60係連接光閥 36 ’第四散刻64係連接於電子散熱晶片42，第二熱管 62之二末端分別連接第三散熱片6〇以及第四散熱片64。 光間36所產生之熱能’係依序經過第三散熱片60、第二 熱管62、第四散熱片64傳遞至電子散熱晶片42。 I五實施何 睛參閱圖六，本發明第五實施例投影機3〇及其散熱裝 置32之示意圖。本發明第五實施例與第—實施例不同之處 在於，熱傳導裝置40為-第三熱f 7〇，第三熱管7〇之兩 末端分別連接賴36及電子賴晶#42。細36所產生 之熱能係_三熱管7〇錢舰以—端，並自電子散熱 =片42作熱能轉換至第一散熱片44，再藉由風扇46冷卻 第一散熱片44 〇 因此，本發明之投影機及錄熱裝置’係利用熱傳導 裝置迅速將光_局部舰料至p散熱纽（即電子 散熱晶片42)，以降低細之熱負荷，避免細累積太多 ，熱能而《，且電子賴W 42冷猶熱端的溫差較 大’可增進熱傳遞的效率’藉以可於短時_，有效地消 除光閥的熱能，並可減少風扇的熱負荷。 ，由以上紐㈣實關之詳述，歸魏更加清楚 =本侧讀f讀精神，純料战賴露的較佳具 體實施例來對本發明之範嘴加嫌制。概地，其目的 希望能各觀變及具相概的安胁本發明所欲 之專利範圍的範脅内β 【圖式簡單說明】 圖一係習知投影機及其散熱裝置之示意圖； 置之示意 置之示意 圖二係本發明第一實施例投影機及其散熱 圖； 圖三係本發明第二實施例投影機及其散熱 圖四 圖； 係本發明第三實施例投影機及其散熟骏置 之示意 置之·示意 圖五係本發明第四實施例投影機及其散熱 圖； …、裝 圖六 、係本發明第五實關投影機及其散熱裝置 之示意 圖 圖七係本發明電子散熱晶片之示意 【主要元件符號說明】 散熱片402 投影機2、30 散熱裝置4、32 光學引擎6、34 130698384 is arranged laterally spaced apart to form an NP semiconductor layer. Currently, the NP semiconductor layer is mainly used by Bismuth Tel luride, and an impurity is added to form an N-type semiconductor 82 or a P-type semiconductor 84. The cold-end insulating layer 421? and the hot-end insulating layer 4216 are made of a ceramic material. When the electronic heat sink 42 is powered on, the electrons start from the negative electrode and first pass through the p-type semiconductor 84, thereby absorbing the thermal energy of the cold end, reaching the N-type semiconductor 82, and placing the heat energy at the hot end' so that each passing a set of N The type semiconductor 82 and the P-type semiconductor 84 transfer thermal energy from the cold end to the hot end. It should be noted that the surface of the cold end insulating layer 4212 and the hot end insulating layer 4216 which are in contact with other articles may be coated with a thermal grease for heat conduction. 1306983, wherein the fan 46 is disposed adjacent to the second end 4004 of the heat conduction device 4 and the first heat sink 44 for generating air flow to dissipate the heat energy of the heat conducting device 40 and the first heat sink 44. It should be noted that, in the implementation of the present invention, the fan can discharge the thermal energy of the conducting device 40 and the first heat sink 44 in a reduced manner. The heat dissipation path of the heat dissipating device 32 of the present invention is such that the thermal energy generated by the light valve 36 is transferred to the electronic heat dissipating wafer 42 via the thermal conduction chip 4, and the thermal energy is quickly transferred to the first heat sink 44 via the electronic heat dissipating chip 42 to avoid heat energy. Accumulating in the fine 3.6' causes the damage of the thin 36, and then through, the heat sink 42 is radiated by natural convection over a large area, and the forced convection generated by the fan 可 can effectively eliminate the heat energy generated by the light valve 36. </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The second embodiment of the present invention differs from the first embodiment in that the heat transfer device 40 is configured to transfer heat generated by the second heat sink diaphragm 36 having the heat sink fins 51 to the second heat sink 50. The chip 42 is electrically transferred from the electronic heat sink 42 to the first heat, and the film 44' is simultaneously cooled by the fan 46 to the first heat sink 44 and the second heat sink 50. The third embodiment of the present invention differs from the second embodiment in that the fourth embodiment of the present invention differs from the second embodiment in that the w-heat sink 5 更 further includes a first heat pipe 52. The 52nd system is disposed on the second heat sink 50+, and the first heat pipe 52 extends from the first end side 2 of the second heat sink 50 to the second end booth 4. In addition to the heat dissipation process of η 1306983, the first The heat pipe 52 can transfer the thermal energy of the light to the electronic wafer 42 more quickly. Fourth, you can refer to the fifth embodiment of the projector 30 and the heat sink 32 thereof. The fourth embodiment of the invention is different from the first embodiment in that the heat conduction device 4 includes a third The heat sink 6〇, a second heat pipe 62, and a fourth heat sink 64, the third heat sink 60 is connected to the light valve 36. The fourth scatter 64 is connected to the electronic heat sink 42 and the second end of the second heat pipe 62. The third heat sink 6〇 and the fourth heat sink 64 are respectively connected. The heat energy generated by the light 36 is sequentially transmitted to the electronic heat sink wafer 42 through the third heat sink 60, the second heat pipe 62, and the fourth heat sink 64. The fifth embodiment of the present invention is different from the first embodiment in that the heat conduction device 40 is -the third. The heat f 7〇, the two ends of the third heat pipe 7〇 are respectively connected to the Lai 36 and the electronic Lai Jing #42. The heat energy generated by the thin 36 is the end of the heat exchanger 7 and the heat dissipation from the electron 42 The heat energy is transferred to the first heat sink 44, and the first heat sink 44 is cooled by the fan 46. Therefore, the projector and the heat recording device of the present invention use the heat conduction device to quickly light the local ship to the heat sink (ie, Electronic heat sinking chip 42) to reduce the thermal load of fineness and avoid fine accumulation too "There is a large temperature difference between the thermal and thermal ends of the electronic heating system, which can improve the efficiency of heat transfer," so that the heat energy of the light valve can be effectively eliminated and the heat load of the fan can be reduced. The details of the above New (four) real customs, more clearly to Wei = the side of the reading f reading spirit, pure material war Lai Lu's preferred embodiment to add to the scope of the invention. General, its purpose is expected to be able to change And the similarity of the patent scope of the present invention is within the scope of the invention. [Simplified illustration of the drawing] FIG. 1 is a schematic diagram of a conventional projector and a heat dissipating device thereof; FIG. 3 is a plan view of a projector and a heat dissipation diagram thereof according to a second embodiment of the present invention; FIG. 3 is a schematic view of a projector according to a third embodiment of the present invention and a schematic diagram thereof. The projector of the fourth embodiment of the present invention and the heat dissipation diagram thereof; FIG. 6 is a schematic diagram of the fifth actual projector of the present invention and the heat dissipating device thereof. FIG. 7 is a schematic diagram of the electronic heat dissipating chip of the present invention. 】 heat sink 402 projector 2, 30 heat sink 4, 32 optical engine 6, 34 1306983
光閥602、36 電子散熱晶片42 第一端4002 第三端4202 風扇404、46 第一熱管52 第二熱管62 第三熱管70 冷端金屬層4214 熱端絕緣層4216 N型半導體82 熱傳導裝置40 第一散熱片44 第二端4004 第四端4204 第二散熱片50 第三散熱片60 第四散熱片64 冷端絕緣層4212 半導體層4215 熱端金屬層4218 P型半導體84Light valve 602, 36 electronic heat sink chip 42 first end 4002 third end 4202 fan 404, 46 first heat pipe 52 second heat pipe 62 third heat pipe 70 cold end metal layer 4214 hot end insulation layer 4216 N type semiconductor 82 heat conduction device 40 First heat sink 44 second end 4004 fourth end 4204 second heat sink 50 third heat sink 60 fourth heat sink 64 cold end insulating layer 4212 semiconductor layer 4215 hot end metal layer 4218 P type semiconductor 84