US20070157627A1 - Projection apparatus provided with a heatsink - Google Patents
Projection apparatus provided with a heatsink Download PDFInfo
- Publication number
- US20070157627A1 US20070157627A1 US11/603,171 US60317106A US2007157627A1 US 20070157627 A1 US20070157627 A1 US 20070157627A1 US 60317106 A US60317106 A US 60317106A US 2007157627 A1 US2007157627 A1 US 2007157627A1
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- US
- United States
- Prior art keywords
- heat conduction
- conduction member
- section
- cooling fin
- cold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
- H04N9/3141—Constructional details thereof
- H04N9/3144—Cooling systems
Definitions
- the invention relates to a projection apparatus, and more particularly to a heatsink for use in the projection apparatus in order to dissipate heat generated due to operation of the projection apparatus.
- FIG. 1 is a top sectional view showing a conventional projection apparatus 2 and includes a light source 8 , an optical engine 6 and a heatsink 4 .
- the optical engine 6 includes a light valve 602 receiving the light rays emitted from the light source 8 continuously during operation of the conventional projection apparatus and becomes hot intensively. In case, the intensive heat of the light valve 602 is not properly dissipated, the light valve 602 is tending to be ruined.
- the heatsink 4 is used to dissipate the intensive heat from the light valve 602 .
- the heatsink 4 includes a cooling fin unit 402 mounted directly onto the light valve 602 so as to cause a free convection to lower the temperature of the outer surface of the light valve 602 .
- a fan 404 is employed to enhance the convection in order to lower the ambient temperature of the cooling fin unit 402 .
- Such type of heat dissipation method is known as “force convection”.
- the light valve 602 becomes intensively hot and the fan 404 provides a limited heat dissipating effect.
- the light valve 602 has a temperature of 65° C. at the outer surface thereof while a portion of the cooling fin unit 402 in contact with the outer surface of the light valve 602 has 53° C.
- the environmental temperature is 35° C.
- the rotation power of the fan 404 is increased.
- the increase in the rotation power generates noise in addition to extra production cost.
- utilization of the fan 404 eliminates the problems encountered by the projection apparatus having 3600 lumens below. Utilization the fan 404 cannot solve the heat dissipation problems encountered by the projection apparatus having 3600 lumens and above.
- the object of the present invention to provide a heatsink for use in a projection apparatus.
- the heatsink has a structure to effectively dissipate the intensive heat of the light valve generated during operation of the projection apparatus.
- a heatsink for cooling a light valve and includes: a heat conduction member having a first section for coupling to the light valve and a second section; a thermoelectric cooler having a cold end connected to the second section of the heat conduction member and a hot end; a first cooling fin unit connected to the hot end of the thermoelectric cooler; and a fan disposed adjacent to the second section of the heat conduction member and the first cooling fin unit for generating an airflow in order to lower temperature within the heatsink.
- a projection apparatus in a second aspect of the present invention, includes: an optical engine including a light valve; and a heatsink.
- the heatsink includes: a heat conduction member having a first section coupled to the light valve and a second section, a thermoelectric cooler having a cold end connected to the second section of the heat conduction member and a hot end, a first cooling fin unit connected to the hot end of the thermoelectric cooler, and a fan disposed adjacent to the second section of the heat conduction member and the first cooling fin unit for generating an airflow in order to lower temperature within the projection apparatus.
- FIG. 1 is a top sectional view showing a conventional projection apparatus with a heatsink
- FIG. 2 is a top sectional view showing the first embodiment of a projection apparatus of the present invention
- FIG. 3 is a fragmentary sectional view showing the second embodiment of the projection apparatus of the present invention.
- FIG. 4 is a fragmentary sectional view showing the third embodiment of the projection apparatus of the present invention.
- FIG. 5 is a fragmentary sectional view showing the fourth embodiment of the projection apparatus of the present invention.
- FIG. 6 is a fragmentary sectional view showing the fifth embodiment of the present invention.
- FIG. 7 is a fragmentary sectional view showing a thermoelectric cooler employed in the heatsink of the projection apparatus according to the present invention.
- FIG. 2 is a top sectional view showing the first embodiment of a projection apparatus 30 of the present invention, and includes a light source 38 , an optical engine 34 and a heatsink 32 .
- the light source 38 is capable of generating light rays for the optical engine 34 .
- the optical engine 34 includes a projection lens 37 and a light valve 36 that converts the light rays into image rays so that the projection lens 37 projects the image rays as an image onto a distal screen (not shown).
- the projection apparatus 30 in this embodiment is a Digital Light Processing projector while the light valve 36 is a Digital Micromirror Device.
- the heatsink 32 includes a heat conduction member 40 , a thermoelectric cooler 42 , a first cooling fin unit 44 and a fan 46 .
- the heat conduction member 40 has a first section 4002 coupled to the light valve 36 and a second section 4004 .
- a cooling element serves as the heat conduction member 40 in the first embodiment.
- the thermoelectric cooler 42 has a cold end 4202 connected to the second section 4004 of the heat conduction member 40 and a hot end 4204 .
- the first cooling fin unit 44 is connected to the hot end 4204 of the thermoelectric cooler 42 . Under this condition, convection is caused so as to guide the intensive heat from the light valve 36 toward the first cooling fin unit 44 when the projection apparatus 30 is under operation.
- the light valve 36 and the thermoelectric cooler 42 are mounted on the same side of the heat conduction member 40 .
- the thermoelectric cooler 42 includes a cold insulation layer 4212 defining the cold end 4202 , a cold metal layer 4214 , a semiconductor layer 4215 , a hot insulation layer 4216 defining the hot end 4204 , and a hot metal layer 4218 which are arranged horizontally.
- the cold and hot insulation layers 4212 4216 are disposed respectively outboard to the cold and hot metal layers 4214 , 4218 , which sandwich the semiconductor layer 4215 therebetween.
- the semiconductor layer 4215 preferably includes a plurality of vertically extending N-type semiconductor sections 82 and a plurality of vertically extending P-type semiconductor sections 84 . Each P-type semiconductor section 84 is disposed between adjacent pair of the N-type semiconductor sections 82 .
- the cold and hot insulation layers 4212 , 4216 are preferably made from a ceramic material.
- the thermoelectric cooler 42 When the thermoelectric cooler 42 is powered on, the electrons flow through the P-type sections 84 towards the N-type sections 82 in order to absorb the heat from the cold end toward the hot end. The heat is absorbed or convection is caused whenever the electrons pass through a set of N-type semiconductor section 82 and P-type semiconductor section 84 . It is noted that some dissipation paste is applied onto the cold and hot insulation layers 4212 , 4216 and also on other layers in order to enhance the smooth convection.
- the fan 46 is disposed adjacent to the second section 4004 of the heat conduction member 40 and the first cooling fin unit 44 for generating an airflow in order to lower temperature within the projection apparatus. In each embodiment of the present invention, the fan 46 exhausts or blows the heat effectively from the heat conduction member 40 and the first cooling fin unit 44 .
- the heat generated at the light valve 36 due to operation of the projection apparatus of the present invention is guided by the heat conduction member 40 toward the thermoelectric cooler 42 , and is later passed toward the first cooling fin unit 44 , thereby preventing the temperature of the outer surface of the light valve 36 from being raised. Since the first fin unit 44 has a large total outer surface, the heat is dissipated effectively into the ambient surrounding. In addition, the presence of the fan 46 enhances the heat dissipation ability.
- FIG. 3 is a fragmentary sectional view showing the second embodiment of the present invention.
- the second embodiment has the structure similar to the previous embodiment, except in the heat conduction member 40 .
- the heat conduction member 40 of the second embodiment preferably includes a second cooling fin unit 50 coupled to the light valve 36 and the cooling fins 51 extending outwardly from the second cooling fin unit 50 .
- the heat generated at the light valve 36 is guided by the second cooling fin unit 50 to the thermoelectric cooler 42 , which is latter guided toward the first cooling fin unit 44 .
- the fan 46 cools down the first and second fin units 44 and 50 .
- FIG. 4 is a fragmentary sectional view showing the third embodiment of the present invention, and has the structure similar to the second embodiment, except in the second cooling fin unit 50 .
- a first heat pipe 52 is embedded within the second cooling fin unit 50 in such a manner to extend through the first and second sections 4002 , 4004 thereof. The employment of the first heat pipe 52 accelerates the convection from the light valve 36 toward the thermoelectric cooler 42 .
- FIG. 5 is a fragmentary sectional view showing a the fourth embodiment of the present invention and has the structure similar to the first embodiment except in the heat conduction member 40 .
- the heat conduction member 40 includes a third cooling fin unit 60 coupled to the light valve 36 , a fourth cooling fin unit 64 connected to the cold end 4202 of the thermoelectric cooler 42 , and a second heat pipe 62 that is interposed between and that has two opposite ends connected to the third and fourth cooling fin units 60 , 64 respectively.
- the third and fourth cooling fin units 60 , 64 respectively define the first and second sections 4002 , 4004 of the heat conduction member 40 .
- FIG. 6 is a fragmentary sectional view showing the fifth embodiment of the present invention and has the structure similar to the first embodiment except in the heat conduction member 40 .
- the heat conduction member 40 is a third heat pipe 70 having two distal sections respectively defining the first and second sections, which are respectively connected to the light valve 36 , and the thermoelectric cooler 42 .
- the employment of the third heat pipe 70 quickens the convection from the light valve 36 toward the thermoelectric cooler 42 and later toward the first fin unit 44 .
- the fan 46 cools down the first fin unit 44 .
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Projection Apparatus (AREA)
Abstract
A heatsink for cooling a light valve, includes: a heat conduction member having a first section for coupling to the light valve and a second section; a thermoelectric cooler having a cold end connected to the second section of the heat conduction member and a hot end; a first cooling fin unit connected to the hot end of the thermoelectric cooler; and a fan disposed adjacent to the second section of the heat conduction member and the first cooling fin unit for generating an airflow in order to lower temperature within the heatsink.
Description
- The invention relates to a projection apparatus, and more particularly to a heatsink for use in the projection apparatus in order to dissipate heat generated due to operation of the projection apparatus.
-
FIG. 1 is a top sectional view showing aconventional projection apparatus 2 and includes alight source 8, an optical engine 6 and aheatsink 4. The optical engine 6 includes alight valve 602 receiving the light rays emitted from thelight source 8 continuously during operation of the conventional projection apparatus and becomes hot intensively. In case, the intensive heat of thelight valve 602 is not properly dissipated, thelight valve 602 is tending to be ruined. Theheatsink 4 is used to dissipate the intensive heat from thelight valve 602. - The
heatsink 4 includes acooling fin unit 402 mounted directly onto thelight valve 602 so as to cause a free convection to lower the temperature of the outer surface of thelight valve 602. In the event the free convection provides poor dissipation effect, afan 404 is employed to enhance the convection in order to lower the ambient temperature of thecooling fin unit 402. Such type of heat dissipation method is known as “force convection”. - For a
projection apparatus 2 using high watt as power source, thelight valve 602 becomes intensively hot and thefan 404 provides a limited heat dissipating effect. For example, in aprojection apparatus 2 with 5000 lumens, thelight valve 602 has a temperature of 65° C. at the outer surface thereof while a portion of thecooling fin unit 402 in contact with the outer surface of thelight valve 602 has 53° C. When the environmental temperature is 35° C., there is a large temperature difference of 18° C. between thecooling fin unit 402 and the environmental temperature. In order to minimize the temperature difference, the rotation power of thefan 404 is increased. However, the increase in the rotation power generates noise in addition to extra production cost. As a matter of fact, utilization of thefan 404 eliminates the problems encountered by the projection apparatus having 3600 lumens below. Utilization thefan 404 cannot solve the heat dissipation problems encountered by the projection apparatus having 3600 lumens and above. - It is the object of the present invention to provide a heatsink for use in a projection apparatus. The heatsink has a structure to effectively dissipate the intensive heat of the light valve generated during operation of the projection apparatus.
- In one aspect of the present invention, a heatsink is provided for cooling a light valve and includes: a heat conduction member having a first section for coupling to the light valve and a second section; a thermoelectric cooler having a cold end connected to the second section of the heat conduction member and a hot end; a first cooling fin unit connected to the hot end of the thermoelectric cooler; and a fan disposed adjacent to the second section of the heat conduction member and the first cooling fin unit for generating an airflow in order to lower temperature within the heatsink.
- In a second aspect of the present invention, a projection apparatus is provided and includes: an optical engine including a light valve; and a heatsink. The heatsink includes: a heat conduction member having a first section coupled to the light valve and a second section, a thermoelectric cooler having a cold end connected to the second section of the heat conduction member and a hot end, a first cooling fin unit connected to the hot end of the thermoelectric cooler, and a fan disposed adjacent to the second section of the heat conduction member and the first cooling fin unit for generating an airflow in order to lower temperature within the projection apparatus.
- Other aspects and advantages of the present invention as well as a more complete understanding thereof will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention. Moreover, it is intended that the scope of the invention be limited by the claims and not by the preceding summary or the following detailed description.
- The following discussion shall constitute a brief and general overview of the invention. More specific details involving particular embodiments, best modes, and other important features of the invention will again be recited in the Detailed Description of the Preferred Embodiments section set forth below. All scientific terms used throughout this discussion shall be construed in accordance with the traditional meanings attributed thereto by individuals skilled in the art to which this invention pertains unless a special definition is provided herein.
- Other features and advantages of this invention will become more apparent in the following detailed description of the preferred embodiments of this invention, with reference to the accompanying drawings, in which:
-
FIG. 1 is a top sectional view showing a conventional projection apparatus with a heatsink; -
FIG. 2 is a top sectional view showing the first embodiment of a projection apparatus of the present invention; -
FIG. 3 is a fragmentary sectional view showing the second embodiment of the projection apparatus of the present invention; -
FIG. 4 is a fragmentary sectional view showing the third embodiment of the projection apparatus of the present invention; -
FIG. 5 is a fragmentary sectional view showing the fourth embodiment of the projection apparatus of the present invention; -
FIG. 6 is a fragmentary sectional view showing the fifth embodiment of the present invention; and -
FIG. 7 is a fragmentary sectional view showing a thermoelectric cooler employed in the heatsink of the projection apparatus according to the present invention. -
FIG. 2 is a top sectional view showing the first embodiment of aprojection apparatus 30 of the present invention, and includes alight source 38, anoptical engine 34 and aheatsink 32. Thelight source 38 is capable of generating light rays for theoptical engine 34. Theoptical engine 34 includes aprojection lens 37 and alight valve 36 that converts the light rays into image rays so that theprojection lens 37 projects the image rays as an image onto a distal screen (not shown). Theprojection apparatus 30 in this embodiment is a Digital Light Processing projector while thelight valve 36 is a Digital Micromirror Device. Theheatsink 32 includes aheat conduction member 40, athermoelectric cooler 42, a firstcooling fin unit 44 and afan 46. - The
heat conduction member 40 has afirst section 4002 coupled to thelight valve 36 and asecond section 4004. A cooling element serves as theheat conduction member 40 in the first embodiment. - The
thermoelectric cooler 42 has acold end 4202 connected to thesecond section 4004 of theheat conduction member 40 and ahot end 4204. The firstcooling fin unit 44 is connected to thehot end 4204 of thethermoelectric cooler 42. Under this condition, convection is caused so as to guide the intensive heat from thelight valve 36 toward the firstcooling fin unit 44 when theprojection apparatus 30 is under operation. In this embodiment, thelight valve 36 and thethermoelectric cooler 42 are mounted on the same side of theheat conduction member 40. - Referring to
FIG. 7 , thethermoelectric cooler 42 includes acold insulation layer 4212 defining thecold end 4202, acold metal layer 4214, asemiconductor layer 4215, ahot insulation layer 4216 defining thehot end 4204, and ahot metal layer 4218 which are arranged horizontally. The cold andhot insulation layers 4212 4216 are disposed respectively outboard to the cold andhot metal layers semiconductor layer 4215 therebetween. Thesemiconductor layer 4215 preferably includes a plurality of vertically extending N-type semiconductor sections 82 and a plurality of vertically extending P-type semiconductor sections 84. Each P-type semiconductor section 84 is disposed between adjacent pair of the N-type semiconductor sections 82. Adding impurity into the Bismuth Telluride forms the present P-type and N-type semiconductor sections hot insulation layers thermoelectric cooler 42 is powered on, the electrons flow through the P-type sections 84 towards the N-type sections 82 in order to absorb the heat from the cold end toward the hot end. The heat is absorbed or convection is caused whenever the electrons pass through a set of N-type semiconductor section 82 and P-type semiconductor section 84. It is noted that some dissipation paste is applied onto the cold andhot insulation layers - The
fan 46 is disposed adjacent to thesecond section 4004 of theheat conduction member 40 and the firstcooling fin unit 44 for generating an airflow in order to lower temperature within the projection apparatus. In each embodiment of the present invention, thefan 46 exhausts or blows the heat effectively from theheat conduction member 40 and the firstcooling fin unit 44. - The heat generated at the
light valve 36 due to operation of the projection apparatus of the present invention is guided by theheat conduction member 40 toward thethermoelectric cooler 42, and is later passed toward the firstcooling fin unit 44, thereby preventing the temperature of the outer surface of thelight valve 36 from being raised. Since thefirst fin unit 44 has a large total outer surface, the heat is dissipated effectively into the ambient surrounding. In addition, the presence of thefan 46 enhances the heat dissipation ability. -
FIG. 3 is a fragmentary sectional view showing the second embodiment of the present invention. The second embodiment has the structure similar to the previous embodiment, except in theheat conduction member 40. Theheat conduction member 40 of the second embodiment preferably includes a secondcooling fin unit 50 coupled to thelight valve 36 and thecooling fins 51 extending outwardly from the secondcooling fin unit 50. The heat generated at thelight valve 36 is guided by the secondcooling fin unit 50 to thethermoelectric cooler 42, which is latter guided toward the firstcooling fin unit 44. Thefan 46 cools down the first andsecond fin units -
FIG. 4 is a fragmentary sectional view showing the third embodiment of the present invention, and has the structure similar to the second embodiment, except in the secondcooling fin unit 50. Afirst heat pipe 52 is embedded within the secondcooling fin unit 50 in such a manner to extend through the first andsecond sections first heat pipe 52 accelerates the convection from thelight valve 36 toward thethermoelectric cooler 42. -
FIG. 5 is a fragmentary sectional view showing a the fourth embodiment of the present invention and has the structure similar to the first embodiment except in theheat conduction member 40. Theheat conduction member 40 includes a thirdcooling fin unit 60 coupled to thelight valve 36, a fourthcooling fin unit 64 connected to thecold end 4202 of thethermoelectric cooler 42, and asecond heat pipe 62 that is interposed between and that has two opposite ends connected to the third and fourthcooling fin units cooling fin units second sections heat conduction member 40. -
FIG. 6 is a fragmentary sectional view showing the fifth embodiment of the present invention and has the structure similar to the first embodiment except in theheat conduction member 40. Theheat conduction member 40 is athird heat pipe 70 having two distal sections respectively defining the first and second sections, which are respectively connected to thelight valve 36, and thethermoelectric cooler 42. The employment of thethird heat pipe 70 quickens the convection from thelight valve 36 toward thethermoelectric cooler 42 and later toward thefirst fin unit 44. Thefan 46 cools down thefirst fin unit 44. - To summarize the above paragraphs, it is observable that due to employment of the
heatsink 32 in theprojection apparatus 30 of the present invention, the heat generated at thelight valve 36 is effectively guided to thethermoelectric cooler 42, thereby preventing damage of thelight valve 36 due to the raising temperature. Since the cold and hot insulation layers have a great temperature difference therebetween, the convection is quickening so as to reduce the burden to be carried by thefan 36. - While the present invention has been described in connection with what is considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
Claims (15)
1. A heatsink for cooling a light valve, comprising:
a heat conduction member having a first section for coupling to the light valve and a second section;
a thermoelectric cooler having a cold end connected to said second section of said heat conduction member and a hot end;
a first cooling fin unit connected to said hot end of said thermoelectric cooler; and
a fan disposed adjacent to said second section of said heat conduction member and said first cooling fin unit for generating an airflow in order to lower temperature within the heatsink.
2. The heatsink according to claim 1 , wherein said heat conduction member includes a cooling element.
3. The heatsink according to claim 1 , wherein said heat conduction member includes a second cooling fin unit and a first heat pipe embedded within said second cooling fin unit in such a manner to extend from said first section to said second section.
4. The heatsink according to claim 1 , wherein said heat conduction member includes a third cooling fin unit disposed to said first section for coupling to the light valve, a fourth cooling fin unit disposed to said second section for connecting to said cold end of said thermoelectric cooler and a second heat pipe that is interposed between and that has two opposite ends connected to said third and fourth cooling fin units respectively, said third and fourth cooling fin units respectively defining said first and second sections of said heat conduction member.
5. The heatsink according to claim 1 , wherein said heat conduction member is a third heat pipe having two distal sections respectively defining said first and second sections.
6. The heatsink according to claim 1 , wherein the light valve is a DMD (Digital Micromirror Device).
7. The heatsink according to claim 1 , wherein said thermoelectric cooler includes a cold insulation layer, a cold metal layer, a semiconductor layer, a hot insulation layer, and a hot metal layer which are arranged horizontally, said cold and hot insulation layers being disposed respectively outboard to said cold and hot metal layers, said cold and hot metal layers sandwiching said semiconductor layer therebetween, said cold and hot insulation layers being made from a ceramic material.
8. The heatsink according to claim 1 , wherein the light valve and said thermoelectric cooler are mounted on a same side of said heat conduction member.
9. A projection apparatus comprising:
an optical engine including a light valve; and
a heatsink including
a heat conduction member having a first section coupled to said light valve and a second section,
a thermoelectric cooler having a cold end connected to said second section of said heat conduction member and a hot end,
a first cooling fin unit connected to said hot end of said thermoelectric cooler, and
a fan disposed adjacent to said second section of said heat conduction member and said first cooling fin unit for generating an airflow in order to lower temperature within the projection apparatus.
10. The projection apparatus according to claim 9 , wherein said heat conduction member includes a cooling element.
11. The projection apparatus according to claim 9 , wherein said heat conduction member includes a second cooling fin unit and a first heat pipe embedded within said second cooling fin unit in such a manner to extend from said first section to second section.
12. The projection apparatus according to claim 9 , wherein said heat conduction member includes a third cooling fin unit disposed to said first section for coupling to the light valve, a fourth cooling fin unit disposed to said second section for connecting to said cold end of said thermoelectric cooler and a second heat pipe that is interposed between and that has two opposite ends connected to said third and fourth cooling fin units, said third and fourth cooling fin units respectively defining said first and second sections of said heat conduction member.
13. The projection apparatus according to claim 9 , wherein said heat conduction member is a third heat pipe having two distal sections respectively defining said first and second sections.
14. The projection apparatus according to claim 9 , wherein said light valve is a DMD (Digital Micromirror Device).
15. The projection apparatus according to claim 9 , wherein said thermoelectric cooler includes a cold insulation layer, a cold metal layer, a semiconductor layer, a hot insulation layer, and a hot metal layer which are arranged horizontally, said cold and hot insulation being disposed respectively outboard to said cold and hot metal layers, said cold and hot metal layers sandwiching said semiconductor layer therebetween, said cold and hot insulation layers being made from a ceramic material.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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TW95100958 | 2006-01-10 | ||
TW095100958A TW200727067A (en) | 2006-01-10 | 2006-01-10 | Projector and heat dissipation apparatus thereof |
Publications (1)
Publication Number | Publication Date |
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US20070157627A1 true US20070157627A1 (en) | 2007-07-12 |
Family
ID=38231443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/603,171 Abandoned US20070157627A1 (en) | 2006-01-10 | 2006-11-22 | Projection apparatus provided with a heatsink |
Country Status (2)
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US (1) | US20070157627A1 (en) |
TW (1) | TW200727067A (en) |
Cited By (7)
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US20070025107A1 (en) * | 2005-06-08 | 2007-02-01 | Martin Kavanagh | Heat transfer apparatus |
US20070139887A1 (en) * | 2005-12-21 | 2007-06-21 | Premier Image Technology Corporation | Portable projector using an LED and related heat dissipating system |
US20090046425A1 (en) * | 2007-08-09 | 2009-02-19 | Martin Kavanagh | Heat transfer apparatus |
CN101989030A (en) * | 2010-07-19 | 2011-03-23 | 深圳雅图数字视频技术有限公司 | Liquid crystal on silicon (LCOS) projector |
US20140085612A1 (en) * | 2012-09-27 | 2014-03-27 | Coretronic Corporation | Illumination system and projection apparatus |
US20170302895A1 (en) * | 2016-04-18 | 2017-10-19 | Panasonic Intellectual Property Management Co., Ltd. | Cooling device and projection image display device |
US20200081333A1 (en) * | 2018-09-07 | 2020-03-12 | Coretronic Corporation | Projection device |
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TWI405026B (en) | 2009-07-29 | 2013-08-11 | Qisda Corp | Projector and lens thereof |
JP2011033747A (en) * | 2009-07-31 | 2011-02-17 | Seiko Epson Corp | Projector, program, information storage medium and cooling control method |
CN112711163A (en) | 2019-10-25 | 2021-04-27 | 台达电子工业股份有限公司 | Projection device |
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US20070025107A1 (en) * | 2005-06-08 | 2007-02-01 | Martin Kavanagh | Heat transfer apparatus |
US7988301B2 (en) | 2005-06-08 | 2011-08-02 | Digital Projection Limited | Heat transfer apparatus |
US20070139887A1 (en) * | 2005-12-21 | 2007-06-21 | Premier Image Technology Corporation | Portable projector using an LED and related heat dissipating system |
US20090046425A1 (en) * | 2007-08-09 | 2009-02-19 | Martin Kavanagh | Heat transfer apparatus |
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US20140085612A1 (en) * | 2012-09-27 | 2014-03-27 | Coretronic Corporation | Illumination system and projection apparatus |
US9261760B2 (en) * | 2012-09-27 | 2016-02-16 | Coretronic Corporation | Projection apparatus having illumination system and associated ion fan |
US20170302895A1 (en) * | 2016-04-18 | 2017-10-19 | Panasonic Intellectual Property Management Co., Ltd. | Cooling device and projection image display device |
US10057552B2 (en) * | 2016-04-18 | 2018-08-21 | Panasonic Intellectual Property Management Co., Ltd. | Cooling device and projection image display device |
US20200081333A1 (en) * | 2018-09-07 | 2020-03-12 | Coretronic Corporation | Projection device |
US10824061B2 (en) * | 2018-09-07 | 2020-11-03 | Coretronic Corporation | Projection device applying heat dissipating module with a better heat dissipating effect |
Also Published As
Publication number | Publication date |
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TW200727067A (en) | 2007-07-16 |
TWI306983B (en) | 2009-03-01 |
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