US20140000851A1

US20140000851A1 - Heat-dissipating module for digital light processing projector

Info

Publication number: US20140000851A1
Application number: US13/831,339
Authority: US
Inventors: Hui-Hsiung Wang
Original assignee: Delta Electronics Inc
Current assignee: Delta Electronics Inc
Priority date: 2012-06-29
Filing date: 2013-03-14
Publication date: 2014-01-02
Also published as: TW201400972A

Abstract

A heat-dissipating module includes a thermal conduction structure, at least one heat pipe, and plural fins. The thermal conduction structure includes a connecting part. The connecting part has a first surface and a second surface opposed to the first surface. The first surface is contacted with a digital micromirror device. The heat pipe includes a penetrating part and a suspension arm. The penetrating part runs through the connecting part of the thermal conduction structure from the second surface to the first surface. The penetrating part is contacted with the digital micromirror device. The plural fins are contacted with the suspension arm. After the heat generated by the digital micromirror device is transferred to the suspension arm through the thermal conduction structure and the penetrating part, the heat is transferred from the plural fins to the plural fins and then dissipated to surroundings through the plural fins.

Description

FIELD OF THE INVENTION

The present invention relates to a heat-dissipating module, and more particularly to a heat-dissipating module for a digital micromirror device of a digital light processing projector.

BACKGROUND OF THE INVENTION

With rapid development of digitalized techniques, projectors become essential image display devices in business centers, homes, exhibition halls or other places. Generally, the projectors are classified into two types, i.e. a liquid crystal display (LCD) projector and a digital light processing (DLP) projector. Since the DLP projector has high contrast, rapid response speed and high reliability, the DLP projector becomes a predominant product of the contemporary display devices. Generally, the core element of a DLP projector comprises a main board and a digital micromirror device (DMD). The main board comprises a plurality of digital video signal processors. The digital micromirror device comprises a micromirror set. The micromirror set of the digital micromirror device is a principal display unit of the DLP projector.
During the projecting operation of the DLP projector is performed, since the light beam is collected on the digital micromirror device, a great deal of heat is generated. It is important to take a heat-dissipating measure to effectively remove the heat.
Generally, the heat-dissipating module for the digital micromirror device at least comprises a thermal conduction structure. The thermal conduction structure is attached on the surface of the digital micromirror device. After the heat from the digital micromirror device is transferred to the thermal conduction structure, the heat is further dissipated away to the surroundings through heat pipes (not shown), fins (not shown) or a cold plate (not shown).
FIG. 1A schematically illustrates a conventional thermal conduction structure of a heat-dissipating module applied to a digital micromirror device. As shown in FIG. 1A, the thermal conduction structure 1 comprises a base 10 and a connecting part 11. The base 10 and the connecting part 11 are integrally formed into a single-piece structure. Both of the base 10 and the connecting part 11 are made of aluminum for example. The connecting part 11 has a surface 11 a. The surface 11 a is contacted with the digital micromirror device. Consequently, the heat may be transferred from the digital micromirror device to the thermal conduction structure 1. The base 10 of the thermal conduction structure 1 also has a surface 10 a. The surface 10 a of the base 10 is opposed to the surface 11 a of the connecting part 11. Moreover, heat pipes (not shown) are contacted with or embedded into the surface 10 a of the base 10. Consequently, the heat may be transferred from the thermal conduction structure 1 to the heat pipes and further dissipated to the surroundings. From the above discussions, the heat generated by the digital micromirror device may be transferred to the heat pipes through the thermal conduction structure 1 and then dissipated to the surroundings. However, the heat-dissipating efficiency of the thermal conduction structure 1 is restricted by the material and thermal conductivity thereof.
FIG. 1B schematically illustrates another conventional thermal conduction structure of a heat-dissipating module applied to a digital micromirror device. As shown in FIG. 1B, the thermal conduction structure 1 comprises a base 10 and a connecting part 11. The connecting part 11 has a surface 11 a. The base 10 of the thermal conduction structure 1 also has a surface 10 a. The surface 10 a of the base 10 is opposed to the surface 11 a of the connecting part 11. The surface 11 a of the connecting part 11 is contacted with the digital micromirror device. Consequently, the heat may be transferred from the digital micromirror device to the thermal conduction structure 1. In the thermal conduction structure 1 of FIG. 1B, the base 10 and the connecting part 11 are made of different materials. For example, the base 10 is made of aluminum, and the connecting part 11 is made of copper. Similarly, the heat-dissipating efficiency of the thermal conduction structure 1 is restricted by the material and thermal conductivity thereof.
FIG. 1C schematically illustrates another conventional thermal conduction structure of a heat-dissipating module applied to a digital micromirror device. The base 10 is divided into a first portion 10 c and a second portion 10 b. The first portion 10 c of the base 10 and the connecting part 11 are made of the same material (e.g. copper). Moreover, the first portion 10 c and the connecting part 11 may be integrally formed into a single-piece structure. The second portion 10 b of the base 10 is made of aluminum. Similarly, the heat-dissipating efficiency of the thermal conduction structure 1 is restricted by the material and thermal conductivity thereof.
In the above-mentioned heat-dissipating module, the heat generated by the digital micromirror device is transferred to the heat pipes through the thermal conduction structure 1. The thermal conductivity of the thermal conduction structure 1 as shown in FIGS. 1A˜1C is ranged from 200 to 400. Namely, the heat-dissipating efficiency of the thermal conduction structure 1 is restricted by the material and thermal conductivity thereof. Since the thermal resistance of the thermal conduction structure fails to be further reduced, the overall heat-dissipating efficacy of the heat-dissipating module is unsatisfied.

SUMMARY OF THE INVENTION

The present invention provides a heat-dissipating module for a digital micromirror device of a digital light processing projector. The inventive heat-dissipating module comprises a thermal conduction structure and a heat pipe, wherein a penetrating part of the heat pipe runs through a connecting part of the thermal conduction structure so that the penetrating part of the heat pipe can be directly contacted with the digital micromirror device. Therefore, the heat-dissipating efficiency along the vertical direction is increased, the thermal spreading resistance is largely reduced, and the overall heat-dissipating efficiency of the heat-dissipating module is enhanced.
In accordance with an aspect of the present invention, there is provided a heat-dissipating module for a digital light processing projector. The digital light processing projector includes a digital micromirror device. The heat-dissipating module includes a thermal conduction structure, at least one heat pipe, and plural fins. The thermal conduction structure includes a connecting part. The connecting part has a first surface and a second surface opposed to the first surface. The first surface of the connecting part is contacted with the digital micromirror device. The heat pipe includes a penetrating part and a suspension arm. The suspension arm is connected with the penetrating part. The penetrating part runs through the connecting part of the thermal conduction structure from the second surface of the connecting part to the first surface of the connecting part. The penetrating part is contacted with the digital micromirror device. The plural fins are contacted with the suspension arm. After the heat generated by the digital micromirror device is transferred to the suspension arm of the heat pipe through the thermal conduction structure and the penetrating part of the heat pipe, the heat is transferred from the suspension arm to the plural fins and then dissipated to surroundings through the plural fins.
The above contents of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A schematically illustrates a conventional thermal conduction structure of a heat-dissipating module applied to a digital micromirror device;

FIG. 1B schematically illustrates another conventional thermal conduction structure of a heat-dissipating module applied to a digital micromirror device;

FIG. 1C schematically illustrates another conventional thermal conduction structure of a heat-dissipating module applied to a digital micromirror device;

FIG. 2A is a schematic perspective view illustrating a front side of a heat-dissipating module for a digital light processing projector according to a first embodiment of the present invention;

FIG. 2B is a schematic perspective view illustrating a rear side of the heat-dissipating module of FIG. 2A;

FIG. 2C is a schematic cross-sectional view illustrating the heat-dissipating module of FIG. 2A;

FIG. 2D is a schematic assembled view illustrating the heat-dissipating module of FIG. 2B;

FIG. 3 is a schematic cross-sectional view illustrating a heat-dissipating module for a digital light processing projector according to a second embodiment of the present invention;

FIG. 4 is a schematic perspective view illustrating the rear side of a heat-dissipating module for a digital light processing projector according to a third embodiment of the present invention; and

FIG. 5 is a schematic cross-sectional view illustrating a heat-dissipating module for a digital light processing projector according to a fourth embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The present invention will now be described more specifically with reference to the following embodiments. It is to be noted that the following descriptions of preferred embodiments of this invention are presented herein for purpose of illustration and description only. It is not intended to be exhaustive or to be limited to the precise form disclosed.
FIG. 2A is a schematic perspective view illustrating a front side of a heat-dissipating module for a digital light processing projector according to a first embodiment of the present invention. FIG. 2B is a schematic perspective view illustrating a rear side of the heat-dissipating module of FIG. 2A. As shown in FIGS. 2A and 2B, the heat-dissipating module 2 comprises a thermal conduction structure 20, at least one heat pipe 22, and plural fins 23. The thermal conduction structure 20 comprises a connecting part 21. The connecting part 21 has a first surface 21 a and a second surface 21 b. The first surface 21 a and the second surface 21 b are opposed to each other. The first surface 21 a of the connecting part 21 is contacted with a digital micromirror device (DMD) 3 of a digital light processing (DLP) projector (not shown).
In this embodiment, the at least one heat pipe 22 comprises two heat pipes 22 a and 22 b. The number of the heat pipes is not restricted. That is, the number of the heat pipes may be varied according to the practical requirements. Moreover, the heat pipe 22 a comprises a penetrating part 221 a and a suspension arm 225 a, and the heat pipe 22 b comprises a penetrating part 221 b and a suspension arm 225 b. The suspension arms 225 a and 225 b are connected with the penetrating parts 221 a and 221 b, respectively. Consequently, the heat may be transferred to the suspension arms 225 a and 225 b through the penetrating parts 221 a and 221 b. Moreover, the suspension arms 225 a and 225 b are contacted with the plural fins 23. Consequently, the heat may further transferred from the suspension arms 225 a and 225 b to the surroundings through the plural fins 23.
The two penetrating parts 221 a and 221 b run through the connecting part 21 downwardly from the second surface 21 b of the connecting part 21 to the first surface 21 a of the connecting part 21. Moreover, in this embodiment, the penetrating part 221 a has a terminal surface 220 a, and the penetrating part 221 b has a terminal surface 220 b. After the two penetrating parts 221 a and 221 b run through the connecting part 21 vertically, the terminal surfaces 220 a and 220 b are coplanar with the first surface 21 a of the connecting part 21. Consequently, the penetrating parts 221 a and 221 b may be directly contacted with the digital micromirror device 3 through the terminal surfaces 220 a and 220 b. Moreover, since the heat pipes 22 a and 22 b are made of the materials with high thermal conductivity, the heat can be quickly transferred to the plural fins 23 through the heat pipes 22 a and 22 b, and then dissipated to the surroundings.
In this embodiment, the suspension arm 225 a of the heat pipe 22 a comprises a first extension segment 222 a, a bent segment 223 a, and a second extension segment 224 a. Similarly, the suspension arm 225 b of the heat pipe 22 b comprises a first extension segment 222 b, a bent segment 223 b, and a second extension segment 224 b. The first extension segment 222 a is connected with the penetrating part 221 a, so that the heat from the penetrating part 221 a may be transferred to the first extension segment 222 a. Similarly, the first extension segment 222 b is connected with the penetrating part 221 b, so that the heat from the penetrating part 221 b may be transferred to the first extension segment 222 b. A first end of the bent segment 223 a is connected with the first extension segment 222 a, and a second end of the bent segment 223 a is connected with the second extension segment 224 a. Consequently, the heat from the first extension segment 222 a may be further transferred to the second extension segment 224 a through the bent segment 223 a. Similarly, a first end of the bent segment 223 b is connected with the first extension segment 222 b, and a second end of the bent segment 223 b is connected with the second extension segment 224 b. Consequently, the heat from the first extension segment 222 b may be further transferred to the second extension segment 224 b through the bent segment 223 b. Moreover, the first extension segments 222 a, 222 b and the second extension segments 224 a, 224 b run through the plural fins 23. Consequently, when the cooling liquid (not shown) within the heat pipes 22 a and 22 b flow through the heat pipes 22 a and 22 b, the heat may be further transferred from the first extension segments 222 a, 222 b and the second extension segments 224 a, 224 b of the heat pipes 22 a and 22 b to the plural fins 23. Moreover, due to the large surface of the plural fins 23, the heat exchange between the plural fins 23 and the ambient air is enhanced. In such way, the heat-dissipating efficacy is enhanced.
Please refer to FIGS. 2A and 2B again. In this embodiment, the first extension segment 222 a is substantially parallel with the second extension segment 224 a, and the first extension segment 222 b is substantially parallel with the second extension segment 224 b. The first extension segment 222 a of the heat pipe 22 a and the first extension segment 222 b of the heat pipe 22 b are extended in opposite directions. Consequently, the two bent segments 223 a and 223 b are located at two opposite sides of the connecting part 21 of the thermal conduction structure 20, and the two second extension segments 224 a and 224 b are located at other two opposite sides of the connecting part 21 of the thermal conduction structure 20. That is, the connecting part 21 of the thermal conduction structure 20 is enclosed by the bent segments 223 a, 223 b and the second extension segments 224 a, 224 b of the suspension arms 225 a, 225 b of the heat pipes 22 a and 22 b. Since the connecting part 21 of the thermal conduction structure 20 is enclosed by the heat pipes 22 a and 22 b, the two parallel first extension segments 222 a and 222 b run through the plural fins 23 in a staggered form, and the two parallel second extension segments 224 a and 224 b run through the plural fins 23 in a staggered form. Due to the above configurations, the overall volume of the heat-dissipating module 2 is reduced, and the layout area of the heat-dissipating module 2 on the DLP projector is decreased. Under this circumstance, the applications of the heat-dissipating module 2 are expanded.
FIG. 2C is a schematic cross-sectional view illustrating the heat-dissipating module of FIG. 2A. FIG. 2D is a schematic assembled view illustrating the heat-dissipating module of FIG. 2B. Please refer to FIGS. 2A˜2D. The digital micromirror device 3 comprises a digital micromirror chip 30 and a micromirror set 31. The micromirror set 31 is disposed on the digital micromirror chip 30. A surface 30 a of the digital micromirror chip 30 is contacted with the connecting part 21 of the thermal conduction structure 20 (see FIG. 2C). Consequently, the heart generated by the digital micromirror chip 30 can be transferred to the heat-dissipating module 2 through the connecting part 21. In addition, the two penetrating parts 221 a and 221 b of the heat pipes 22 a and 22 b run through the connecting part 21 of the thermal conduction structure 20 vertically (see FIGS. 2C and 2D). After the two penetrating parts 221 a and 221 b run through the connecting part 21 from the second surface 21 b to the first surface 21 a of the connecting part 21, the terminal surfaces 220 a and 220 b are coplanar with the first surface 21 a of the connecting part 21. After the heat-dissipating module 2 is contacted with the digital micromirror device 3, the penetrating parts 221 a and 221 b may be directly contacted with the digital micromirror device 3 through the terminal surfaces 220 a and 220 b. Consequently, the heat may be directly transferred to the penetrating parts 221 a and 221 b through the terminal surfaces 220 a and 220 b. Moreover, when the cooling liquid (not shown) within the heat pipes 22 a and 22 b flow through the heat pipes 22 a and 22 b, the heat may be transferred to the plural fins 23 through the first extension segments 222 a, 222 b, the bent parts 223 a, 223 b and the second extension segments 224 a, 224 b sequentially. Then, the heat is transferred from the plural fins 23 to the surroundings.
Since the at least one heat pipe 22 runs through the connecting part 21 to be contacted with the digital micromirror chip 30, the heat can be directly and efficiently transferred from the digital micromirror chip 30 to the at least one heat pipe 22. In addition, the heat is also transferred to the surroundings through the thermal conduction structure 20. Consequently, the heat-dissipating efficiency along the vertical direction of the at least one heat pipe is enhanced, the thermal spreading resistance is largely reduced, and the overall heat-dissipating efficiency of the heat-dissipating module is enhanced. When compared with the conventional heat-dissipating module of transferring the heat to the heat pipe through the thermal conduction structure, the heat-dissipating module of the present invention can directly transfer the heat to the fins through the heat pipe.
Please refer to FIG. 2C again. In some embodiments, an adhesive (not shown) is arranged between the connecting part 21 of the thermal conduction structure 20 and the digital micromirror chip 30 of the digital micromirror device 3. An example of the adhesive includes but is not limited to an insulated and thermally-conductive adhesive. The adhesive is used for facilitating connection between the connecting part 21 and the digital micromirror chip 30 while achieving the insulating and thermally-conducting purposes. In some embodiments, the connecting part 21 of the thermal conduction structure 20 is made of aluminum in order to reduce the cost and weight of the thermal conduction structure 20. In some other embodiments, the digital light processing (DLP) projector further comprises an active heat-dissipating mechanism (not shown). An example of the active heat-dissipating mechanism includes but is not limited to a fan. By using the active heat-dissipating mechanism to remove the heat from the plural fins 23, the overall heat-dissipating efficiency of the heat-dissipating module 2 is further enhanced.
FIG. 3 is a schematic cross-sectional view illustrating a heat-dissipating module for a digital light processing projector according to a second embodiment of the present invention. As shown in FIG. 3, the heat-dissipating module 4 comprises a thermal conduction structure 40, at least one heat pipe 43 and plural fins 44. The thermal conduction structure 40 comprises a connecting part 41. The connecting part 41 has a first surface 41 a and a second surface 41 b, wherein the first surface 41 a and the second surface 41 b are opposed to each other. The first surface 41 a of the connecting part 41 is contacted with a digital micromirror device (DMD) 5 of a digital light processing (DLP) projector (not shown).
In this embodiment, the at least one heat pipe 43 also comprises a penetrating part 431 and a suspension arm 432. In addition, the suspension arm 432 also comprises a first extension segment 433, a bent segment 434, and a second extension segment 435. The configurations of the connecting part 41 of the thermal conduction structure 40, the heat pipe 43 and the plural fins 44 are similar to those of the above embodiments, and are not redundantly described herein.
In this embodiment, the thermal conduction structure 40 further comprises a base 42. The base 42 is a flat plate, but is not limited to the flat plate. The base 42 has a third surface 42 a and a fourth surface 42 b, wherein the third surface 42 a and the fourth surface 42 b are opposed to each other. The third surface 42 a of the base 42 is connected with the second surface 41 b of the connecting part 41. In addition, the area of the third surface 42 a of the base 42 is greater than the area of the second surface 41 b of the connecting part 41 in order to increase the structural strength of the thermal conduction structure 40 and the base 42. In this embodiment, the penetrating part 431 of the heat pipe 43 runs through the base 42 vertically from the fourth surface 42 b of the base 42 to the first surface 42 a of the base 42, and then runs through the connecting part 41 from the second surface 41 b of the connecting part 41 to the first surface 41 a of the connecting part 41. In such way, the terminal surface 431 a of the penetrating part 431 is directly contacted with the digital micromirror device 5. Consequently, the heat is directly transferred to the heat pipe 43. Since the heat pipe 43 is made of the material with high thermal conductivity, the heat can be quickly transferred to the plural fins 44 through the heat pipe 43, and then dissipated to the surroundings. In other words, the heat-dissipating efficiency along the vertical direction of the heat pipe 43 is enhanced, the thermal spreading resistance is largely reduced, and the overall heat-dissipating efficiency of the heat-dissipating module 4 is enhanced.
FIG. 4 is a schematic perspective view illustrating the rear side of a heat-dissipating module for a digital light processing projector according to a third embodiment of the present invention. Like the above embodiment, the heat-dissipating module 4 comprises a thermal conduction structure 40, at least one heat pipe 43 and plural fins 44. The relationships between the connecting part 41, the first surface 41 a, the heat pipe 43, the penetrating part 431, the terminal surface 431 a and the plural fins 44 are similar to the above embodiment, and are not redundantly described herein.
In this embodiment, the thermal conduction structure 40 further comprises a base 42. The base 42 comprises a flat plate 420 and a frame 421. The flat plate 420 is enclosed by the frame 421. In addition, two edges of the flat plate 420 are connected to inner surfaces of the frame 421. The arrangement of the frame 421 may increase the structural strength of the flat plate 420 and support the plural fins 44. Moreover, as shown in FIG. 4, the frame 421 further comprises positioning structures 422 (e.g. through-holes). By penetrating screws through the positioning structures 422 and tightening the screws in the casing (not shown) of the digital light processing (DLP) projector, the frame 421 of the base 42 are fixed on the casing. In such way, the structural strength of the heat-dissipating module 4 and the base 42 is enhanced, and the heat-dissipating module 4 is securely fixed on the digital light processing (DLP) projector.
FIG. 5 is a schematic cross-sectional view illustrating a heat-dissipating module for a digital light processing projector according to a fourth embodiment of the present invention. As shown in FIG. 5, the heat-dissipating module 6 comprises a thermal conduction structure 60, at least one heat pipe 63 and plural fins 64. The configurations of the connecting part 61 of the thermal conduction structure 60, the heat pipe 63 and the plural fins 64 are similar to those of the above embodiments, and are not redundantly described herein.
In this embodiment, the thermal conduction structure 60 further comprises a base 62. The base 62 is a flat plate with plural heat-dissipating slices 62 c. The base 62 has a third surface 62 a and a fourth surface 62 b, wherein the third surface 62 a and the fourth surface 62 b are opposed to each other. The third surface 62 a of the base 62 is connected with the second surface 61 b of the connecting part 61. The plural heat-dissipating slices 62 c are extended from the fourth surface 62 b of the base 62 for facilitating the thermal conduction structure 60 to dissipate the heat. Similarly, the penetrating part 631 of the heat pipe 63 runs through the connecting part 61 vertically from the second surface 61 b of the connecting part 61 to the first surface 61 a of the connecting part 61. In such way, the terminal surface 631 a of the penetrating part 631 is directly contacted with the digital micromirror chip 70 of the digital micromirror device 7. Consequently, the heat can be directly and efficiently transferred from the digital micromirror chip 70 to the at least one heat pipe 63. Since the heat is further transferred to the surroundings through the thermal conduction structure 60, the heat-dissipating efficiency along the vertical direction of the at least one heat pipe 62 is enhanced, and the thermal spreading resistance is largely reduced. Moreover, due to the large areas of the plural fins 64 and the plural heat-dissipating slices 62 c, the efficacy of the heat exchange between the heat-dissipating module 6 and the ambient air is increased. Consequently, the overall heat-dissipating efficiency of the heat-dissipating module 6 is enhanced.
From the above descriptions, the present invention provides a heat-dissipating module for a digital light processing projector. The heat-dissipating module comprises a thermal conduction structure, at least one heat pipe, and plural fins. The thermal conduction structure comprises a connecting part. A penetrating part of the heat pipe runs through the connecting part of the thermal conduction structure from a second surface of the connecting part to a first surface of the connecting part. Consequently, the terminal surface of the penetrating part is coplanar with the first surface of the connecting part, and directly contacted with the digital micromirror device of the digital light processing projector. Since the heat pipe is made of the material with high thermal conductivity, the heat can be quickly transferred to the large-area fins through the suspension arm of the heat pipe, and then dissipated to the surroundings. In such way, the heat-dissipating efficiency along the vertical direction is increased, the thermal spreading resistance is largely reduced, and the overall heat-dissipating efficiency of the heat-dissipating module is enhanced. When compared with the conventional heat-dissipating module of transferring the heat to the heat pipe through the thermal conduction structure, the heat-dissipating module of the present invention can directly transfer the heat to the fins through the heat pipe.
While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.

Claims

What is claimed is:

1. A heat-dissipating module for a digital light processing projector, said digital light processing projector comprising a digital micromirror device, said heat-dissipating module comprising:

a thermal conduction structure comprising a connecting part, wherein said connecting part has a first surface and a second surface opposed to said first surface, wherein said first surface is contacted with said digital micromirror device;

at least one heat pipe comprising a penetrating part and a suspension arm, wherein said suspension arm is connected with said penetrating part, wherein said penetrating part runs through said connecting part of said thermal conduction structure from said second surface to said first surface, and said penetrating part is contacted with said digital micromirror device; and

a plurality of fins contacted with said suspension arm,

wherein after the heat generated by said digital micromirror device is transferred to said suspension arm of said heat pipe through said thermal conduction structure and said penetrating part of said heat pipe, the heat is transferred from said suspension arm to said plural fins and then dissipated to surroundings through said plural fins.

2. The heat-dissipating module according to claim 1, wherein said penetrating part of said heat pipe has a terminal surface, wherein said terminal surface of said penetrating part is coplanar with said first surface of said connecting part, and said terminal surface of said penetrating part is contacted with said digital micromirror device.

3. The heat-dissipating module according to claim 1, wherein said digital micromirror device comprises a digital micromirror chip, wherein said first surface of said connecting part and said penetrating part of said heat pipe are contacted with said digital micromirror chip.

4. The heat-dissipating module according to claim 1, wherein said suspension arm of said heat pipe comprises a first extension segment, a bent segment and a second extension segment, wherein said first extension segment is connected with said penetrating part, said bent segment is connected with said first extension segment and said second extension segment, and said first extension segment and said second extension segment are contacted with said plural fins.

5. The heat-dissipating module according to claim 4, wherein said first extension segment and said second extension segment are parallel with each other.

6. The heat-dissipating module according to claim 1, wherein said thermal conduction structure further comprises a base, wherein said base is connected with said connecting part, and said base has a third surface and a fourth surface opposed to said third surface, wherein said third surface of said base is connected with said second surface of said connecting part.

7. The heat-dissipating module according to claim 6, wherein after said penetrating part runs through said base from said fourth surface to said third surface, said penetrating part runs through said connecting part of said thermal conduction structure from said second surface to said first surface, and said penetrating part is contacted with said digital micromirror device.

8. The heat-dissipating module according to claim 6, wherein said base further comprises plural heat-dissipating slices, which are extended from said fourth surface of said base.

9. The heat-dissipating module according to claim 6, wherein said base further a frame for supporting said plural fins, and said frame has plural positioning structures for facilitating positioning said heat-dissipating module.

10. The heat-dissipating module according to claim 1, wherein said connecting part of said thermal conduction structure and said digital micromirror device are connected with each other through an adhesive, wherein said adhesive is an insulated and thermally-conductive adhesive.