US20090279251A1 - Heat dissipation device with heat pipe - Google Patents
Heat dissipation device with heat pipe Download PDFInfo
- Publication number
- US20090279251A1 US20090279251A1 US12/118,757 US11875708A US2009279251A1 US 20090279251 A1 US20090279251 A1 US 20090279251A1 US 11875708 A US11875708 A US 11875708A US 2009279251 A1 US2009279251 A1 US 2009279251A1
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- United States
- Prior art keywords
- heat
- fin unit
- base
- heat pipe
- fin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Definitions
- the present invention relates to heat dissipation devices, and particularly to a heat dissipation device having a heat pipe for cooling an electronic component, such as an integrated circuit package.
- a heat dissipation device in accordance with a preferred embodiment of the present invention is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure.
- the heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device.
- the first heat sink comprises a base attached to the first electronic device, a first fin unit mounted on the base and first and second heat pipes extending from the base outwardly.
- Second and third fin units engage with the first and second heat pipes, respectively.
- the first, second and third fin units are located adjacent to first, second and third openings defined by the computer enclosure, respectively.
- the second heat sink is located among the first, second and third fin units of the first heat sink.
- FIG. 1 is a partially exploded, isometric view of a heat dissipation device in accordance with a preferred embodiment of the present invention
- FIG. 2 is an exploded, isometric view of a first heat sink of the heat dissipation device of FIG. 1 ;
- FIG. 3 is a partially assembled view of the first heat sink of the heat dissipation device of FIG. 1 , viewed from a bottom aspect thereof;
- FIG. 4 is an assembled view of the heat dissipation device of FIG. 1 located in a computer enclosure.
- a heat dissipation device of a preferred embodiment of the invention is located in a computer enclosure 90 and is used for dissipating heat from electronic devices arranged therein.
- the enclosure 90 includes a first panel 700 defining a plurality of first ventilating openings 702 , a second panel 800 being perpendicular to the first panel 700 and defining a plurality of second ventilating openings 802 , and a third panel 900 being parallel to the first panel 700 and defining a plurality of third ventilating openings 902 .
- the second panel 800 interconnects the first panel 700 and the third panel 900 .
- the first ventilating openings 702 are used as an exhaust port.
- Electrical fans are mounted near the first ventilating openings 702 for helping expelling heated air in the computer enclosure 90 to an outside thereof through the first ventilating openings 702 .
- the second and third ventilating openings 802 , 902 are used as intake ports for facilitating cool air outside the computer enclosure 90 to enter the computer enclosure 90 .
- a CPU 300 and a video card 400 adjacent to the CPU 300 are mounted on a printed circuit board 600 located in the enclosure 90 .
- a GPU 404 is mounted on the video card 400 .
- a north bridge (not shown) is mounted on the printed circuit board 600 at a side of the GPU 404 .
- the heat dissipation device comprises a first heat sink 100 secured on the CPU 300 for dissipating heat generated by the CPU 300 , a second heat sink 200 mounted on the GPU 404 for dissipating heat generated by the GPU 404 , and a third heat sink 500 attached to the north bridge for dissipating heat generated by the north bridge.
- the first heat sink 100 includes a base 10 , a first fin unit 40 arranged on the base 10 , a second fin unit 50 located at a front side of an assembly of the base 10 and the first fin unit 40 , a third fin unit 60 located at a lateral side of the second fin unit 50 and the first fin unit 40 , a first heat pipe 20 interconnecting the base 10 and the third fin unit 60 and a second heat pipe 30 interconnecting the base 10 and the second fin unit 50 .
- the first fin unit 40 , the second fin unit 50 , the third fin unit 60 and the third heat sink 500 are located to surround the second heat sink 200 .
- the first heat sink 100 forms a loop structure encircling the GPU 404 .
- the base 10 is a metal plate having good heat conductivity, and includes a substantially rectangular body 12 and two spaced and parallel ears 14 extending outwardly and horizontally from two adjacent corners of the body 12 .
- a bottom of the base 10 defines a first straight groove 182 parallel to a lateral edge of body 12 for receiving the first heat pipe 20 therein, a second groove 184 adjacent and parallel to the first groove 182 and a third groove 186 extending from the second groove 184 in a direction outwardly away from the first groove 182 .
- the third groove 186 communicates with the second groove 184 .
- An obtuse angle is defined between the second groove 184 and the third groove 186 .
- the second and the third grooves 184 , 186 are used for cooperatively receiving corresponding portions of the second heat pipe 30 therein.
- a heat-absorbing board 80 is soldered on the bottom of the base 10 and attached to the CPU 300 by four fasteners 70 extending through four corners of the base 10 and fixed to the printed circuit board 600 for absorbing the heat generated by the CPU 300 .
- a bottom area of the heat-absorbing board 80 is smaller than a bottom area of the base 10 .
- the four fasteners 70 are used to extend through the printed circuit board 600 and threadedly engage with a back plate (not shown) located at a bottom of the printed circuit board 600 .
- the heat-absorbing board 80 can be omitted to make the base 10 be directly in intimately contact with the CPU 300 for dissipating the heat generated by the CPU 300 .
- the first fin unit 40 comprises a plurality of fins 42 . Two corners of the first fin unit 40 which are opposite to two ears 14 are cut away to define two receiving spaces 44 for receiving the two fasteners 70 .
- Each fin 42 is substantially rectangular and made from a metal sheet. Flanges (not labeled) perpendicularly extend from bottom and top edges of the fins 42 . The flanges separate the fins 42 at uniform intervals.
- the second fin unit 50 comprises a plurality of fins 52 .
- An portion of the second fin unit 50 which is close to the second heat sink 200 is cut away to define a receiving space 56 for partially receiving the second heat sink 200 therein.
- Each fin 52 is substantially L-shaped and parallel to each other.
- the fins 52 define a through hole 54 for receiving the second heat pipe 30 therein.
- the third fin unit 60 comprises a plurality of fins 62 , 68 .
- the fins 62 , 68 are parallel to each other and perpendicular to the fins 42 of the first fin unit 40 .
- Bottom faces of the fins 62 , 68 are level to each other.
- Top faces of the fins 68 are higher than top faces of the fins 62 .
- the fins 62 , 68 of the third fin unit 60 cooperatively define a through hole 64 for receiving the first heat pipe 20 therein.
- Flanges (not labeled) perpendicularly extend from bottom, top edges and around the through hole 64 of the third fin unit 60 . The flanges separate the fins 62 , 68 at uniform intervals.
- the first heat pipe 20 comprises a straight and flat evaporation section 22 , a condensation section 24 and a curved connecting section 26 interconnecting the condensation section 24 and the evaporation section 22 .
- the evaporation section 22 and the condensation section 24 are perpendicular to each other.
- the evaporation section 22 is received in the first groove 182 of the base 10 , and in intimate contact with the heat-absorbing board 80 to transfer the heat generated by the CPU 300 from the heat-absorbing board 80 to the third fin unit 60 .
- the second heat pipe 30 comprises a flat evaporation section 34 , a straight condensation section 32 and a connecting section 36 interconnecting the condensation section 32 and the evaporation section 34 .
- the evaporation section 34 includes a first straight evaporation section 342 parallel to the condensation section 32 and a second evaporation section 344 extending from the first straight evaporation section 342 towards the second fin unit 50 .
- the first evaporation section 342 and the second evaporation section 344 are in a same plane.
- An obtuse angle is defined between the first evaporation section 342 and the second evaporation section 344 .
- the first evaporation section 342 and the second evaporation section 344 are respectively received in the second groove 184 and the third groove 186 of the base 10 .
- the first evaporation section 342 and the second evaporation section 344 intimately engage with the heat-absorbing board 80 for transferring the heat generated by the CPU 300 from the base 10 to the second fin unit 50 .
- the second heat sink 200 comprises a base plate 202 in intimately contact with the GPU 404 , a plurality of fins 204 arranged on the base plate 202 and four fasteners 206 extending through the base plate 202 and the printed circuit board 600 to mount the second heat sink 200 on the GPU 404 .
- the fins 204 of the second heat sink 200 are partially received in the receiving space 56 of the second fin unit 50 .
- the second and third heat sinks 200 , 500 are respectively mounted on corresponding positions of the printed circuit board 600 .
- the first heat sink 100 is mounted around the second heat sink 200 .
- the connecting section 36 of the second heat pipe 30 of the first heat sink 100 is located between the second heat sink 200 and the third heat sink 500 .
- the first fin unit 40 is located adjacent to the third ventilating openings 902 .
- the second fin unit 50 is close to the first ventilating openings 702 .
- the second heat sink 200 is partially accommodated in the receiving space 56 of the second fin unit 50 .
- the third fin unit 60 is positioned adjacent to the second ventilating openings 802 .
- the heat-absorbing board 80 of the first heat sink 100 absorbs the heat from the CPU 300 .
- the heat in the heat-absorbing board 80 is absorbed by the base 10 and the evaporation sections 22 , 34 of the first, second heat pipes 20 , 30 .
- a portion of the heat in the base 10 is absorbed by the first fin unit 40 and is dissipated to ambient air.
- the other portion of the heat in the base 10 is absorbed by the evaporation sections 22 , 34 of the heat pipes 20 , 30 .
- the heat in the evaporation sections 22 , 34 is then transferred to the third and second fin units 60 , 50 via the heat pipes 20 , 30 .
- first, second and third fins 40 , 50 , 60 adjacent to the third, first and second ventilating openings 902 , 702 , 802 Due to the first, second and third fins 40 , 50 , 60 adjacent to the third, first and second ventilating openings 902 , 702 , 802 , a heat dissipation efficiency of the heat dissipation device is enhanced significantly.
- a room of the computer enclosure is efficiently utilized to enable the CPU 300 which generate the most heat can be sufficiently cooled.
- an airflow flowing from the third ventilating openings 902 to the first ventilating openings 702 can flow through not only the first fin unit 40 but also the second heat sink 200 and the second fin unit 50 .
- an airflow from the second ventilating openings 802 to the first ventilating openings 702 can flow through not only the third fin unit 60 but also the second heat sink 200 and the second fin unit 50 .
- the heat generated by the GPU 404 can also be effectively taken away to an outside of the computer enclosure 90 .
- the heat pipes 20 , 30 can be replaced by an integral heat pipe.
- the integral heat pipe has a middle evaporation section thermally engaging with the base 10 and two condensation sections extending from two opposite ends of the evaporation section to thermally connect with the second fin unit 50 and the third fin unit 60 , respectively.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention relates to heat dissipation devices, and particularly to a heat dissipation device having a heat pipe for cooling an electronic component, such as an integrated circuit package.
- 2. Description of Related Art
- It is well known that a large amount of heat is produced during operation of an electronic device in a computer system. The heat generated must be quickly removed to ensure normal operation of the electronic device. Typically, a heat dissipation device is attached to the electronic device to absorb the heat from the electronic device. The heat absorbed by the heat dissipation device is then dissipated to ambient air. However, with the increasing performance of the computer system, more and more heat-generating electronic devices, for example, CPUs and graphic processing units (GPUs), need to be crowded in the computer system simultaneously, meanwhile the heat generated by each of these electronic devices is greatly increased. At the same time, due to the compact fashion, the computer system has a limited space for receiving these electronic devices, which further deteriorates the heat dissipation problem of these electronic devices in the computer system.
- What is needed, therefore, is a heat dissipation device which has a great dissipating capability for electronic devices in a computer system whilst utilizes a room of the computer system efficiently.
- A heat dissipation device in accordance with a preferred embodiment of the present invention is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink comprises a base attached to the first electronic device, a first fin unit mounted on the base and first and second heat pipes extending from the base outwardly. Second and third fin units engage with the first and second heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings defined by the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink.
- Other advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
- Many aspects of the present heat dissipation device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present heat dissipation device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is a partially exploded, isometric view of a heat dissipation device in accordance with a preferred embodiment of the present invention; -
FIG. 2 is an exploded, isometric view of a first heat sink of the heat dissipation device ofFIG. 1 ; -
FIG. 3 is a partially assembled view of the first heat sink of the heat dissipation device ofFIG. 1 , viewed from a bottom aspect thereof; and -
FIG. 4 is an assembled view of the heat dissipation device ofFIG. 1 located in a computer enclosure. - Referring to
FIG. 1 andFIG. 4 , a heat dissipation device of a preferred embodiment of the invention is located in acomputer enclosure 90 and is used for dissipating heat from electronic devices arranged therein. Theenclosure 90 includes afirst panel 700 defining a plurality offirst ventilating openings 702, asecond panel 800 being perpendicular to thefirst panel 700 and defining a plurality ofsecond ventilating openings 802, and athird panel 900 being parallel to thefirst panel 700 and defining a plurality ofthird ventilating openings 902. Thesecond panel 800 interconnects thefirst panel 700 and thethird panel 900. Thefirst ventilating openings 702 are used as an exhaust port. Electrical fans (not shown) are mounted near the firstventilating openings 702 for helping expelling heated air in thecomputer enclosure 90 to an outside thereof through thefirst ventilating openings 702. The second and thirdventilating openings computer enclosure 90 to enter thecomputer enclosure 90. ACPU 300 and avideo card 400 adjacent to theCPU 300 are mounted on a printedcircuit board 600 located in theenclosure 90. AGPU 404 is mounted on thevideo card 400. A north bridge (not shown) is mounted on the printedcircuit board 600 at a side of theGPU 404. The heat dissipation device comprises afirst heat sink 100 secured on theCPU 300 for dissipating heat generated by theCPU 300, asecond heat sink 200 mounted on theGPU 404 for dissipating heat generated by theGPU 404, and athird heat sink 500 attached to the north bridge for dissipating heat generated by the north bridge. - Referring to
FIGS. 1-3 , thefirst heat sink 100 includes abase 10, afirst fin unit 40 arranged on thebase 10, asecond fin unit 50 located at a front side of an assembly of thebase 10 and thefirst fin unit 40, athird fin unit 60 located at a lateral side of thesecond fin unit 50 and thefirst fin unit 40, afirst heat pipe 20 interconnecting thebase 10 and thethird fin unit 60 and asecond heat pipe 30 interconnecting thebase 10 and thesecond fin unit 50. Thefirst fin unit 40, thesecond fin unit 50, thethird fin unit 60 and thethird heat sink 500 are located to surround thesecond heat sink 200. Thefirst heat sink 100 forms a loop structure encircling theGPU 404. - The
base 10 is a metal plate having good heat conductivity, and includes a substantiallyrectangular body 12 and two spaced andparallel ears 14 extending outwardly and horizontally from two adjacent corners of thebody 12. A bottom of thebase 10 defines a firststraight groove 182 parallel to a lateral edge ofbody 12 for receiving thefirst heat pipe 20 therein, asecond groove 184 adjacent and parallel to thefirst groove 182 and athird groove 186 extending from thesecond groove 184 in a direction outwardly away from thefirst groove 182. Thethird groove 186 communicates with thesecond groove 184. An obtuse angle is defined between thesecond groove 184 and thethird groove 186. The second and thethird grooves second heat pipe 30 therein. A heat-absorbingboard 80 is soldered on the bottom of thebase 10 and attached to theCPU 300 by fourfasteners 70 extending through four corners of thebase 10 and fixed to the printedcircuit board 600 for absorbing the heat generated by theCPU 300. A bottom area of the heat-absorbingboard 80 is smaller than a bottom area of thebase 10. The fourfasteners 70 are used to extend through the printedcircuit board 600 and threadedly engage with a back plate (not shown) located at a bottom of the printedcircuit board 600. In other embodiment, the heat-absorbingboard 80 can be omitted to make thebase 10 be directly in intimately contact with theCPU 300 for dissipating the heat generated by theCPU 300. - The
first fin unit 40 comprises a plurality offins 42. Two corners of thefirst fin unit 40 which are opposite to twoears 14 are cut away to define tworeceiving spaces 44 for receiving the twofasteners 70. Eachfin 42 is substantially rectangular and made from a metal sheet. Flanges (not labeled) perpendicularly extend from bottom and top edges of thefins 42. The flanges separate thefins 42 at uniform intervals. - The
second fin unit 50 comprises a plurality offins 52. An portion of thesecond fin unit 50 which is close to thesecond heat sink 200 is cut away to define a receivingspace 56 for partially receiving thesecond heat sink 200 therein. Eachfin 52 is substantially L-shaped and parallel to each other. Thefins 52 define a throughhole 54 for receiving thesecond heat pipe 30 therein. - The
third fin unit 60 comprises a plurality offins fins fins 42 of thefirst fin unit 40. Bottom faces of thefins fins 68 are higher than top faces of thefins 62. Thefins third fin unit 60 cooperatively define a throughhole 64 for receiving thefirst heat pipe 20 therein. Flanges (not labeled) perpendicularly extend from bottom, top edges and around the throughhole 64 of thethird fin unit 60. The flanges separate thefins - The
first heat pipe 20 comprises a straight andflat evaporation section 22, acondensation section 24 and a curved connectingsection 26 interconnecting thecondensation section 24 and theevaporation section 22. Theevaporation section 22 and thecondensation section 24 are perpendicular to each other. Theevaporation section 22 is received in thefirst groove 182 of thebase 10, and in intimate contact with the heat-absorbingboard 80 to transfer the heat generated by theCPU 300 from the heat-absorbingboard 80 to thethird fin unit 60. - The
second heat pipe 30 comprises aflat evaporation section 34, astraight condensation section 32 and a connectingsection 36 interconnecting thecondensation section 32 and theevaporation section 34. Theevaporation section 34 includes a firststraight evaporation section 342 parallel to thecondensation section 32 and asecond evaporation section 344 extending from the firststraight evaporation section 342 towards thesecond fin unit 50. Thefirst evaporation section 342 and thesecond evaporation section 344 are in a same plane. An obtuse angle is defined between thefirst evaporation section 342 and thesecond evaporation section 344. Thefirst evaporation section 342 and thesecond evaporation section 344 are respectively received in thesecond groove 184 and thethird groove 186 of thebase 10. Thefirst evaporation section 342 and thesecond evaporation section 344 intimately engage with the heat-absorbingboard 80 for transferring the heat generated by theCPU 300 from the base 10 to thesecond fin unit 50. - The
second heat sink 200 comprises abase plate 202 in intimately contact with theGPU 404, a plurality offins 204 arranged on thebase plate 202 and fourfasteners 206 extending through thebase plate 202 and the printedcircuit board 600 to mount thesecond heat sink 200 on theGPU 404. Thefins 204 of thesecond heat sink 200 are partially received in the receivingspace 56 of thesecond fin unit 50. - Referring also to
FIGS. 1-4 , in assembly of the heat dissipation device of this embodiment of the invention, the second andthird heat sinks circuit board 600. Thefirst heat sink 100 is mounted around thesecond heat sink 200. The connectingsection 36 of thesecond heat pipe 30 of thefirst heat sink 100 is located between thesecond heat sink 200 and thethird heat sink 500. Thefirst fin unit 40 is located adjacent to thethird ventilating openings 902. Thesecond fin unit 50 is close to thefirst ventilating openings 702. Thesecond heat sink 200 is partially accommodated in the receivingspace 56 of thesecond fin unit 50. Thethird fin unit 60 is positioned adjacent to thesecond ventilating openings 802. - In use of the heat dissipation device of this embodiment of the invention, the heat-absorbing
board 80 of thefirst heat sink 100 absorbs the heat from theCPU 300. The heat in the heat-absorbingboard 80 is absorbed by thebase 10 and theevaporation sections second heat pipes base 10 is absorbed by thefirst fin unit 40 and is dissipated to ambient air. The other portion of the heat in thebase 10 is absorbed by theevaporation sections heat pipes evaporation sections second fin units heat pipes third fins openings first heat sink 100, a room of the computer enclosure is efficiently utilized to enable theCPU 300 which generate the most heat can be sufficiently cooled. Furthermore, an airflow flowing from thethird ventilating openings 902 to thefirst ventilating openings 702 can flow through not only thefirst fin unit 40 but also thesecond heat sink 200 and thesecond fin unit 50. And an airflow from thesecond ventilating openings 802 to thefirst ventilating openings 702 can flow through not only thethird fin unit 60 but also thesecond heat sink 200 and thesecond fin unit 50. Thus, the heat generated by theGPU 404 can also be effectively taken away to an outside of thecomputer enclosure 90. - Understandingly and alternatively, the
heat pipes base 10 and two condensation sections extending from two opposite ends of the evaporation section to thermally connect with thesecond fin unit 50 and thethird fin unit 60, respectively. - It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples herein before described merely being preferred or exemplary embodiments of the invention.
Claims (18)
Priority Applications (1)
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US12/118,757 US7613001B1 (en) | 2008-05-12 | 2008-05-12 | Heat dissipation device with heat pipe |
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US12/118,757 US7613001B1 (en) | 2008-05-12 | 2008-05-12 | Heat dissipation device with heat pipe |
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US20090279251A1 true US20090279251A1 (en) | 2009-11-12 |
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US11300333B2 (en) * | 2017-04-25 | 2022-04-12 | Lg Electronics Inc. | Cold water generation module for water treatment apparatus |
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