WO2023240724A1

WO2023240724A1 - Heat dissipation device of ultra-high-power led spotlight

Info

Publication number: WO2023240724A1
Application number: PCT/CN2022/104963
Authority: WO
Inventors: 韦孟柳; 吴嘉勇; 王志强; 杨鹏飞
Original assignee: 深圳市骁阳技术有限公司
Priority date: 2022-06-17
Filing date: 2022-07-11
Publication date: 2023-12-21
Also published as: CN114992605A; CN114992605B

Abstract

A heat dissipation device of an ultra-high-power LED spotlight, comprising a first heat collection substrate (10), a second heat collection substrate (20), two first heat pipe assemblies (30), and a second heat pipe assembly (40). Hollow interiors formed by the two first heat pipe assemblies (30) and the second heat pipe assembly (40) are separately provided with a heat dissipation fin assembly (50) in the same heat dissipation direction, an evaporation section of each first heat pipe assembly (30) is connected to the first heat collection substrate (10), a condensation section of each first heat pipe assembly (30) and an evaporation section of the second heat pipe assembly (40) are separately connected to the second heat collection substrate (20), and heat generated by the LED spotlight is quickly transferred into air by means of the first heat pipe assemblies (30), the second heat pipe assembly (40) and the heat dissipation fin assemblies (50).

Description

A heat dissipation device for ultra-high-power LED spotlights

This application claims priority to the Chinese patent application with application number 202210689555.6, filed with the China Patent Office on June 17, 2022, the entire content of which is incorporated into this application by reference.

Technical field

This application relates to the field of LED lighting, in particular to a heat dissipation device for ultra-high-power LED spotlights.

Background technique

High-power LED spotlights are mostly used in photography and film. Currently, the high-power LED spotlights on the market include ARRI's Orbiter series, which has a maximum power of 500W and uses heat pipe cooling. The most powerful LED spotlight on the market is the LS from Aitus. 1200d Pro, its power is 1200W, and the heat dissipation method is also heat pipe.

Heat pipe radiators have heat dissipation limits due to the characteristics of the heat pipe itself. Because ultra-high-power LED spotlights dissipate large amounts of heat and the heat dissipation is very concentrated (i.e., the heat dissipation area is small), the heat dissipation performance of ordinary heat pipe radiators will be insufficient or even exceed the limit, and the heat generated by the spotlights cannot be dissipated in a timely manner. Take away, causing the LED spotlight to be overheated and damaged. Limited by the heat dissipation limit of the heat pipe, the current maximum power LED spotlight on the market is 1200W, and the market demands higher power LED spotlights to meet the needs of photography and film and television. Therefore, The heat dissipation problem of ultra-high-power LED spotlights has become a bottleneck technical problem in the development of the industry and requires an urgent breakthrough.

technical problem

In view of the above problems, the present application is proposed to provide a heat dissipation device for an ultra-high-power LED spotlight that overcomes the above problems or at least partially solves the problems.

Technical solutions

The heat dissipation device includes a first heat-collecting substrate with one end surface connected to the core plate of the LED spotlight, a second heat-collecting substrate spaced correspondingly to the other end surface of the first heat-collecting substrate, and is clamped on the Two first heat pipe assemblies are arranged symmetrically between the corresponding end surfaces of the first heat collecting substrate and the second heat collecting substrate and along the center line of the first heat collecting substrate and the second heat collecting substrate, and are clamped on the On the second heat pipe assembly on the other end surface of the second heat collecting substrate, the hollow interior formed by the two first heat pipe assemblies and the second heat pipe assembly is respectively provided with a heat dissipation fin assembly along the same heat dissipation direction. The first heat pipe The evaporation section of the assembly is connected to the first heat collection substrate, and the condensation section of the first heat pipe assembly and the evaporation section of the second heat pipe assembly are respectively connected to the second heat collection substrate.

Preferably, the first heat pipe assembly includes a plurality of evenly spaced first heat pipe components. The first heat pipe component includes a first heat pipe unit and a second heat pipe unit that are staggered and stacked at high and low levels. The first heat pipe unit and The evaporation section of the second heat pipe unit is clamped on the first heat collecting substrate, and the condensation sections of the first heat pipe unit and the second heat pipe unit are clamped on the second heat collecting substrate.

Preferably, it is characterized in that one of the heat dissipation fin components is connected to one end surface of the first heat collection substrate, and the other heat dissipation fin component is connected to one end surface of the second heat collection substrate. The heat dissipation fins are The component includes a plurality of evenly spaced heat dissipation fins, and a third heat pipe unit passing through each of the heat dissipation fins.

Preferably, the evaporation section of the third heat pipe unit is close to the first heat collecting substrate and/or the second heat collecting substrate.

Preferably, the second heat pipe assembly includes a plurality of evenly spaced second heat pipe components. The second heat pipe component includes a fourth heat pipe unit and a fifth heat pipe unit that are staggered and stacked at high and low levels. The fourth heat pipe unit and The evaporation section of the fifth heat pipe unit is clamped on the second heat collecting substrate.

Preferably, a support connection member is provided between the first heat pipe unit and the second heat pipe unit, or between the fourth heat pipe unit and the fifth heat pipe unit.

Preferably, a plurality of heat pipe fitting grooves penetrating both sides are spaced on the same side end surfaces of the first heat collecting substrate and the second heat collecting substrate, and the evaporation section of the first heat pipe assembly is clamped on In the heat pipe fitting groove of the first heat collecting substrate, the condensation section of the first heat pipe assembly and the evaporation section of the second heat pipe assembly are clamped in the heat pipe fitting groove of the second heat collecting substrate.

Preferably, it also includes a coaming plate connected to the sides of the first heat collecting substrate and the second heat collecting substrate, the first heat pipe assembly, the second heat pipe assembly and the heat dissipation fins. The components are all located within the enclosure.

Preferably, a fan device is provided outside the first heat pipe assembly and the second heat pipe assembly respectively, and the air outlet end of the fan device corresponds to the heat dissipation direction of the heat dissipation fin assembly.

An LED spotlight is also provided, which includes the heat dissipation device as described above.

This application has the following advantages:

In the embodiment of the present application, the device includes a first heat collecting substrate with one end surface connected to the core plate of the LED spotlight, and a second heat collecting substrate spaced correspondingly from the other end surface of the first heat collecting substrate. Thermal substrate, two first heat pipes clamped between the corresponding end surfaces of the first heat collecting substrate and the second heat collecting substrate and symmetrically arranged along the center line of the first heat collecting substrate and the second heat collecting substrate assembly, and a second heat pipe assembly clamped on the other end surface of the second heat collecting substrate. The hollow interior formed by the two first heat pipe assemblies and the second heat pipe assembly is respectively provided with a heat dissipation device along the same heat dissipation direction. Fin assembly, the evaporation section of the first heat pipe assembly is connected to the first heat collection substrate, the condensation section of the first heat pipe assembly and the evaporation section of the second heat pipe assembly are respectively connected to the second heat collection substrate Connection; part of the heat of the first heat collecting substrate is quickly transferred to the second heat collecting substrate through the phase change heat process of the first heat pipe assembly, and then condensed on the second heat collecting substrate through the phase change process of the second heat pipe assembly Part of the heat is converted into the air. At the same time, the heat dissipation fin assembly provided inside the first heat pipe assembly and the second heat pipe assembly enhances the conductive heat dissipation effect on the corresponding heat collecting substrate.

Description of the drawings

In order to explain the technical solution of the present application more clearly, the drawings needed to be used in the description of the present application will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application and are not useful in this field. Ordinary technicians can also obtain other drawings based on these drawings without exerting creative labor.

Figure 1 is a schematic diagram of the overall structure of a heat dissipation device for an ultra-high-power LED spotlight provided by an embodiment of the present application;

Figure 2 is a schematic exploded structural view of a heat dissipation device for an ultra-high-power LED spotlight provided by an embodiment of the present application;

Figure 3 is a schematic diagram of the installation structure of the heat pipe component of a heat dissipation device for an ultra-high-power LED spotlight provided by an embodiment of the present application;

Figure 4 is a schematic top structural view of a heat dissipation device for an ultra-high-power LED spotlight provided by an embodiment of the present application;

In the figure, 1. LED spotlight; 10. first heat collecting substrate; 20. second heat collecting substrate; 30. first heat pipe assembly; 31. first heat pipe unit; 32. second heat pipe unit; 40. second heat pipe Components; 41. Fourth heat pipe unit; 42. Fifth heat pipe unit; 43. Support connector; 50. Heat dissipation fin assembly; 51. Heat dissipation fins; 52. Third heat pipe unit; 60. Enclosure.

Embodiments of the invention

In order to make the purpose, features and advantages of the present application more obvious and understandable, the present application will be described in further detail below in conjunction with the accompanying drawings and specific implementation modes. Obviously, the described embodiments are part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

It should be noted that in any embodiment of the present application, the heat dissipation device mentioned can be used in the heat dissipation scenario of general-power LED spotlights. More preferably, the heat dissipation device can meet the heat dissipation requirements of ultra-high-power LED spotlights of 1200W-1800W. , effectively extending the service life of the ultra-high-power LED spotlight.

Referring to Figures 1-4, a heat dissipation device for an ultra-high-power LED spotlight provided by an embodiment of the present application is shown. The device includes a first heat-collecting substrate 10 with one end surface connected to the core plate of the LED spotlight 1. The second heat collecting substrate 20 is spaced correspondingly to the other end surface of the first heat collecting substrate 10 and is clamped between the corresponding end surfaces of the first heat collecting substrate 10 and the second heat collecting substrate 20 and along the Two first heat pipe assemblies 30 arranged symmetrically on the central line of the first heat collecting substrate 10 and the second heat collecting substrate 20 , and a second heat pipe assembly 40 clamped on the other end surface of the second heat collecting substrate 20 , the hollow interior formed by the first heat pipe assembly 30 and the second heat pipe assembly 40 is respectively provided with a heat dissipation fin assembly 50 along the same heat dissipation direction. The evaporation section of the first heat pipe assembly 30 and the first condenser The thermal substrate 10 is connected, and the condensation section of the first heat pipe assembly 30 and the evaporation section of the second heat pipe assembly 40 are respectively connected to the second heat collecting substrate 20 .

The device includes a first heat collecting substrate 10 with one end surface connected to the core plate of the LED spotlight 1, a second heat collecting substrate 20 spaced correspondingly to the other end surface of the first heat collecting substrate 10, and a card. Two first heat pipes are disposed between the corresponding end surfaces of the first heat collecting substrate 10 and the second heat collecting substrate 20 and are symmetrically arranged along the center line of the first heat collecting substrate 10 and the second heat collecting substrate 20 assembly 30, and the second heat pipe assembly 40 clamped on the other end surface of the second heat collecting substrate 20. The hollow interiors formed by the two first heat pipe assemblies 30 and the second heat pipe assembly 40 are respectively along the same A heat dissipation fin assembly 50 is provided in the heat dissipation direction. The evaporation section of the first heat pipe assembly 30 is connected to the first heat collecting substrate 10 . The condensation section of the first heat pipe assembly 30 and the evaporation section of the second heat pipe assembly 40 The sections are respectively connected to the second heat collecting substrate 20; after absorbing a large amount of heat from the LED spotlight 1 through the first heat collecting substrate 10, parts of the first heat collecting substrate 10 are converted into parts through the phase change heat process of the first heat pipe assembly 30. The heat is quickly transferred to the second heat collecting substrate 20, and then part of the heat condensed on the second heat collecting substrate 20 is transferred to the air through the phase change process of the second heat pipe assembly 40. At the same time, the heat pipe provided in the first heat pipe assembly 40 30 and the heat dissipation fin assembly 50 inside the second heat pipe assembly 40 enhance the conductive heat dissipation effect on the corresponding heat collecting substrate.

Below, the above-mentioned heat dissipation device for an ultra-high-power LED spotlight will be further described through the following embodiments.

In one embodiment of the present application, the first heat pipe assembly 30 includes a plurality of first heat pipe components evenly spaced, and the first heat pipe component includes a first heat pipe unit 31 and a second heat pipe unit 32 stacked in a staggered manner. , the evaporation section of the first heat pipe unit 31 and the second heat pipe unit 32 is clamped on the first heat collecting substrate 10, and the condensation section of the first heat pipe unit 31 and the second heat pipe unit 32 It is clamped on the second heat collecting substrate 20 .

It should be noted that the first heat pipe unit 31 and the second heat pipe unit 32 are stacked in a staggered manner, and there may be a certain gap between them, which effectively increases the unit heat dissipation area of the heat pipe component. Each first heat pipe component is arranged at intervals. , thus greatly improving the overall heat conduction area.

It can be understood that the first heat pipe unit 31 or the second heat pipe unit 32 is U-shaped, one section is the evaporation section, and the other section is the condensation section. The heat is transferred to the condensation section through the phase change of the evaporation section, that is, the first heat pipe assembly 30 can The heat of the first heat collecting substrate 10 is quickly transferred to the second heat collecting substrate 20; since the plurality of first heat pipe components are arranged at intervals, part of the heat is dissipated into the air during the heat transfer process.

In an embodiment of the present application, one of the heat dissipation fin components 50 is connected to one end surface of the first heat collection substrate 10 , and the other heat dissipation fin component 50 is connected to one end surface of the second heat collection substrate 20 , the heat dissipation fin assembly 50 includes a plurality of evenly spaced heat dissipation fins 51 and a third heat pipe unit 52 extending through each of the heat dissipation fins 51 .

It can be understood that only the above-mentioned heat pipe effect is not enough to conduct the heat of the heat collecting substrate to the maximum extent. The heat dissipation fin assembly 50 is added to accelerate the heat conduction efficiency to the heat collecting substrate; further, each heat dissipation fin 51 A third heat pipe unit 52 is provided above to improve the heat conduction efficiency of the heat dissipation fins 51 .

Specifically, the evaporation section of the third heat pipe unit 52 is attached to the first heat collecting substrate 10 and/or the second heat collecting substrate 20; three third heat pipes are arranged high and low on each heat dissipation fin assembly 50. Unit 52 accelerates the heat conduction efficiency of the heat collecting substrate through a combination of heat pipes and heat dissipation fins.

In one embodiment of the present application, the second heat pipe assembly 40 includes a plurality of evenly spaced second heat pipe components, and the second heat pipe components include a fourth heat pipe unit 41 and a fifth heat pipe unit 42 stacked in high and low positions. , the evaporation sections of the fourth heat pipe unit 41 and the fifth heat pipe unit 42 are clamped on the second heat collecting substrate 20 .

It should be noted that when most of the heat is accumulated on the second heat collecting substrate 20, the heat on the second heat collecting substrate 20 is quickly conducted to the air through the second heat pipe components arranged at even intervals in the second heat pipe assembly 40. Specifically, the evaporation sections of the fourth heat pipe unit 41 and the fifth heat pipe unit 42 of the second heat pipe component, which are staggered at high and low levels, are clamped on the second heat collecting substrate 20, and the second heat collecting substrate is quickly transformed through phase change. The heat on the first heat collecting substrate 10 is quickly conducted to the condensation section in contact with the air, and then the heat of the first heat collecting substrate 10 is rapidly exchanged or dissipated through heat pipe units with a multi-stage (at least two-stage) cascading design.

The fourth heat pipe unit 41 and the fifth heat pipe unit 42 are C-shaped, and the ends of the evaporation section and the ends of the condensation section are arranged correspondingly.

In an embodiment of the present application, a support connection 43 is provided between the first heat pipe unit 31 and the second heat pipe unit 32 or between the fourth heat pipe unit 41 and the fifth heat pipe unit 42 .

It can be understood that a stable staggered correspondence relationship between the first heat pipe unit 31 and the second heat pipe unit 32 or between the fourth heat pipe unit 41 and the fifth heat pipe unit 42 is maintained through the supporting connector 43. The gaps also help heat dissipate into the air.

In an embodiment of the present application, a plurality of heat pipe fitting grooves penetrating both sides are respectively provided on the same side end surfaces of the first heat collecting substrate 10 and the second heat collecting substrate 20. The first heat pipe The evaporation section of the assembly 30 is clamped in the heat pipe fitting groove of the first heat collecting substrate 10, and the condensation section of the first heat pipe assembly 30 and the evaporation section of the second heat pipe assembly 40 are clamped in the second heat collecting substrate 10. The heat pipes of the thermal substrate 20 fit into the slot.

It can be understood that the first heat pipe assembly 30 and the second heat pipe assembly 40 are embedded in the heat pipe fitting groove of the second heat collecting substrate 20 at the same time, so that heat can be directly conducted between the two, further speeding up the overall heat dissipation. efficiency.

In an embodiment of the present application, the device further includes a coaming plate 60, which is connected to the sides of the first heat collecting substrate 10 and the second heat collecting substrate 20. The first heat pipe The component 30 , the second heat pipe component 40 and the heat dissipation fin component 50 are all disposed in the enclosure 60 .

The above-mentioned enclosure plate 60 stabilizes the relative positional relationship between the first heat collecting substrate 10 and the second heat collecting substrate 20, and plays a certain role in the first heat pipe assembly 30, the second heat pipe assembly 40 and the heat dissipation fin assembly 50 located inside. Protective effects.

In one embodiment of the present application, a fan device (not shown) is provided outside the first heat pipe assembly 30 and the second heat pipe assembly 40 respectively. The air outlet end of the fan device is in contact with the heat dissipation fin assembly. 50 corresponding to the heat dissipation direction.

It can be understood that by disposing fan devices outside the first heat pipe assembly 30 and the second heat pipe assembly 40 respectively, the air outlet end of the fan device corresponds to the heat dissipation direction of the heat dissipation fin assembly 50, that is, the air outlet end of the fan device corresponds to the heat pipe. The gaps between the components and the heat dissipation fins 51 allow convection to be formed between the first heat pipe assembly 30 , the second heat pipe assembly 40 and the internal heat dissipation fin assembly 50 through the fan device, thereby accelerating the rate of convection heat transfer in the air. In summary, this application combines phase change heat, solid heat conduction, and convection heat transfer to enable the heat generated by LED spotlights to be dissipated faster and more effectively, solving the heat dissipation problem of ultra-high-power LED spotlights. , laying the foundation for the research and development of ultra-high-power LED spotlights of 1500W, 1800W, 2000W or even higher, and also accelerating the advent of ultra-high-power LED spotlights in the film, television, and photography industries.

Although preferred embodiments of the embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once the basic inventive concepts are understood. Therefore, the appended claims are intended to be construed to include the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present application.

Finally, it should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that these entities or any such actual relationship or sequence between operations. Furthermore, the terms "comprises," "comprises," or any other variation thereof are intended to cover a non-exclusive inclusion such that a process, method, article, or end device that includes a list of elements includes not only those elements, but also elements not expressly listed or other elements inherent to such process, method, article or terminal equipment. Without further limitation, an element defined by the statement "comprises a..." does not exclude the presence of additional identical elements in a process, method, article or terminal device including the stated element.

The heat dissipation device of an ultra-high-power LED spotlight provided by the present application has been introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the present application. The application method and its core idea; at the same time, for those of ordinary skill in the field, there will be changes in the specific implementation and application scope based on the ideas of this application. In summary, the contents of this specification should not be understood as a limitation on this application.

Claims

A heat dissipation device for an ultra-high-power LED spotlight, which is characterized in that it includes a first heat-collecting substrate with one end surface connected to the core plate of the LED spotlight, and a heat-collecting substrate spaced correspondingly to the other end surface of the first heat-collecting substrate. The second heat collecting substrate is clamped between the corresponding end surfaces of the first heat collecting substrate and the second heat collecting substrate and is symmetrically arranged along the center line of the first heat collecting substrate and the second heat collecting substrate. A first heat pipe assembly and a second heat pipe assembly clamped on the other end surface of the second heat collecting substrate. The hollow interiors formed by the two first heat pipe assemblies and the second heat pipe assembly are along the same heat dissipation direction. A heat dissipation fin assembly is provided, the evaporation section of the first heat pipe assembly is connected to the first heat collecting substrate, the condensation section of the first heat pipe assembly and the evaporation section of the second heat pipe assembly are respectively connected to the second heat pipe assembly. Thermal base plate connection.
The heat dissipation device according to claim 1, wherein the first heat pipe assembly includes a plurality of first heat pipe components evenly spaced, and the first heat pipe component includes first heat pipe units and a first heat pipe unit that are stacked in a staggered manner. Two heat pipe units, the evaporation sections of the first heat pipe unit and the second heat pipe unit are clamped on the first heat collecting substrate, and the condensation sections of the first heat pipe unit and the second heat pipe unit are clamped on the first heat collecting substrate. on the second heat collecting substrate.
The heat dissipation device according to claim 1, characterized in that one of the heat dissipation fin components is connected to an end surface of the first heat collection substrate, and the other heat dissipation fin component is connected to an end surface of the second heat collection substrate. The heat dissipation fin assembly includes a plurality of evenly spaced heat dissipation fins and a third heat pipe unit that penetrates each of the heat dissipation fins.
The heat dissipation device according to claim 3, wherein the evaporation section of the third heat pipe unit is attached to the first heat collecting substrate and/or the second heat collecting substrate.
The heat dissipation device according to claim 1, wherein the second heat pipe assembly includes a plurality of evenly spaced second heat pipe components, and the second heat pipe component includes a fourth heat pipe unit and a third heat pipe unit that are staggered at high and low levels. Five heat pipe units, the evaporation sections of the fourth heat pipe unit and the fifth heat pipe unit are clamped on the second heat collecting substrate.
The heat dissipation device according to claim 2 or 5, characterized in that there is a heat dissipation device between the first heat pipe unit and the second heat pipe unit, or between the fourth heat pipe unit and the fifth heat pipe unit. Support connectors.
The heat dissipation device according to claim 1, wherein a plurality of heat pipe fitting grooves penetrating both sides are respectively provided on the same side end surfaces of the first heat collecting substrate and the second heat collecting substrate, so The evaporation section of the first heat pipe assembly is clamped in the heat pipe fitting groove of the first heat collecting substrate, and the condensation section of the first heat pipe assembly and the evaporation section of the second heat pipe assembly are clamped in the second heat collecting substrate. The heat pipe of the thermal base plate fits into the slot.
The heat dissipation device according to claim 1, further comprising a enclosure plate connected to the sides of the first heat collecting substrate and the second heat collecting substrate, and the first heat pipe The assembly, the second heat pipe assembly and the heat dissipation fin assembly are all located in the enclosure.
The heat dissipation device according to claim 1, wherein a fan device is provided outside the first heat pipe assembly and the second heat pipe assembly, and the air outlet end of the fan device is in contact with the heat dissipation fin assembly. direction corresponding.
An LED spotlight, characterized by including the heat dissipation device according to any one of claims 1-5 and 7-9.