CN216868446U

CN216868446U - Graphene and polypropylene composite heat dissipation device and high-power LED lamp

Info

Publication number: CN216868446U
Application number: CN202123433589.9U
Authority: CN
Inventors: 马宝光; 胡敏锐; 何达帆; 卢家伟; 蔡倩莹
Original assignee: Jiangmen Guangrui New Material Technology Co ltd
Current assignee: Jiangmen Guangrui New Material Technology Co ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2022-07-01
Anticipated expiration: 2031-12-30

Abstract

The utility model belongs to the technical field of heat dissipation, and particularly relates to a graphene and polypropylene compounded heat dissipation device and a high-power LED lamp. The heat dissipation device comprises a heat dissipation base, a heat conduction membrane and a heat conduction plate, wherein the heat dissipation base, the heat conduction membrane and the heat conduction plate are arranged in a stacked mode and are relatively fixed, the heat conduction membrane is located between the heat dissipation base and the heat conduction plate, the heat conduction coefficient of the heat conduction membrane is larger than that of the heat dissipation base, the heat conduction coefficient of the heat conduction plate is larger than that of the heat dissipation base, and the heat conduction membrane conducts heat of the heat conduction plate to the heat dissipation base. The heat dissipation device provided by the utility model has excellent heat dissipation performance and lower manufacturing cost, and is more suitable for high-power LED lamps.

Description

Graphene and polypropylene composite heat dissipation device and high-power LED lamp

Technical Field

The utility model belongs to the technical field of heat dissipation, and particularly relates to a graphene and polypropylene compounded heat dissipation device and a high-power LED lamp.

Background

LEDs are light emitting diodes. The principle of the LED is that after the LED is normally electrified, electrons are diffused in a PN junction and energy release occurs, and the energy can be released to the external environment in the forms of light energy, heat energy and the like. With the development of the precision of electronic technology, the integration level of the LED is higher and higher, and the power required by people is higher and higher. In the working process of the LED, 15-25% of electric energy is generally converted into light energy, and the rest of electric energy is converted into heat energy. Calculated as 15% lower electrical-to-optical conversion efficiency, i.e. 85% of the electrical energy will be converted into thermal energy, e.g. a 1000W LED lamp, which converts 850W thermal energy. In addition, the failure reason of about 70% of high-power LED lamps is caused by overhigh temperature. Therefore, the heat dissipation of the high-power LED lamp is particularly important.

In terms of heat conducting materials, graphene has very good heat conducting properties. Pure defect-free single-layer graphene has a thermal conductivity as high as 5300W/(m × K), and is a carbon material having the highest thermal conductivity, and is higher than that of single-wall carbon nanotubes (3500W (m × K)) and multi-wall carbon nanotubes (3000W/(m × K)). When it is used as carrier, the thermal conductivity can reach 600-2200W/(m K). Further, metals are also excellent in heat conduction, such as 429, 401, 317, 237 and 80W/(m × K) for silver, copper, gold, aluminum and iron, respectively, but when applied to high power devices, it is difficult to satisfy heat dissipation requirements with simple metals, and many metals themselves are expensive. For example, when the aluminum heat sink is applied to heat dissipation of a high-power LED lamp, the heat conductivity of an aluminum heat sink is lower, the heat conductivity of a copper heat sink is better, but the aluminum heat sink is too heavy due to high density, and the prices of silver, copper, gold and the like are higher. Therefore, it is necessary to develop a heat dissipation device with excellent heat dissipation performance and lower cost, and it is more suitable for high power LED lamps.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects of the prior art, the utility model provides a graphene and polypropylene compounded heat dissipation device and a high-power LED lamp.

The utility model provides a graphene and polypropylene compounded heat dissipation device and a high-power LED lamp, which comprise a heat dissipation base, a heat conduction film and a heat conduction plate, wherein the heat dissipation base, the heat conduction film and the heat conduction plate are arranged in a laminated mode and are relatively fixed, the heat conduction film is positioned between the heat dissipation base and the heat conduction plate, the heat conduction coefficient of the heat conduction film is greater than that of the heat dissipation base, the heat conduction coefficient of the heat conduction plate is greater than that of the heat dissipation base, and the heat conduction film conducts the heat of the heat conduction plate to the heat dissipation base.

Preferably, the heat conduction membrane is a graphene heat conduction membrane, the lower surface of the graphene heat conduction membrane is fixedly connected with the upper surface of the heat dissipation base, and the upper surface of the graphene heat conduction membrane is fixedly connected with the lower surface of the heat conduction plate.

Preferably, the heat conduction membrane is made of graphene polypropylene composite material.

Preferably, the heat conduction plate and the heat dissipation base are made of solid metal materials with heat conduction coefficients of 80W/(mK) and the like.

Preferably, the heat-conducting plate is a heat-conducting copper plate, the heat-conducting copper plate is further provided with a mounting hole, and the mounting hole is used for mounting and fixing other equipment needing heat dissipation.

Preferably, the heat dissipation base is an aluminum heat sink made of metal aluminum, and an upper surface of the aluminum heat sink is fixedly connected with a lower surface of the heat conduction film.

Preferably, a plurality of radiating fins are formed at the lower end of the aluminum radiator, the radiating fins extend along the axial direction of the graphene-polypropylene composite radiating device, the plurality of radiating fins are arranged at intervals along the transverse direction, and the radiating fins exchange heat between heat conducted to the aluminum radiator and air.

The utility model further provides a high-power LED lamp which comprises an LED lamp assembly and any graphene and polypropylene compounded heat dissipation device, wherein the LED lamp assembly and the heat conduction plate are arranged in a laminated mode and are relatively fixed, the heat conduction plate is located on the backlight side of the LED lamp assembly, and the graphene and polypropylene compounded heat dissipation device is used for dissipating heat of the LED lamp assembly.

Preferably, the LED lamp assembly comprises a circuit board and LED lamp beads, the LED lamp beads are arranged on the circuit board, and the circuit board and the heat conducting plate are arranged in a stacked mode and are fixed relatively.

The heat dissipation device provided by the utility model has excellent heat dissipation performance and lower manufacturing cost, and is more suitable for high-power LED lamps.

Drawings

The foregoing and other objects, features and advantages of the utility model will be apparent from the following more particular description of preferred embodiments of the utility model, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intended to be drawn to scale in actual dimensions, emphasis instead being placed upon illustrating the principles of the utility model.

Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment;

FIG. 2 is a schematic diagram of a front view structure of a high power LED lamp provided by an embodiment;

fig. 3 is a schematic side view of a high power LED lamp according to an embodiment.

In the figure: LED banks spare 1, heat conduction copper 2, graphite alkene thermal film 3, aluminium radiator 4, fin 5, circuit board 6, LED lamp pearl 7.

Detailed Description

To facilitate an understanding of the utility model, reference will now be made to the following more complete description taken in conjunction with the accompanying drawings.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element and be integral therewith, or intervening elements may also be present. The terms "mounted," "one end," "the other end," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-3, the present invention provides a heat dissipation device, which includes a heat dissipation base, a heat conduction film, and a heat conduction plate, wherein the heat dissipation base, the heat conduction film, and the heat conduction plate are stacked and fixed relatively, the heat conduction film is located between the heat dissipation base and the heat conduction plate, the heat conduction coefficient of the heat conduction film is greater than the heat conduction coefficient of the heat dissipation base, the heat conduction coefficient of the heat conduction plate is greater than the heat conduction coefficient of the heat dissipation base, and the heat conduction film conducts the heat of the heat conduction plate to the heat dissipation base. The terms "upper and lower" and "transverse" in this application refer to the heat sink when in use with the thermally conductive plate on top. When the heat dissipation device is used, the LED lamp assembly 1 of equipment needing heat dissipation, such as high-power LED lamps and the like, is arranged on the heat conduction plate of the heat dissipation device, and the equipment needing heat dissipation conducts heat to the heat dissipation base through the heat conduction plate and the heat conduction film. The general heat dissipation base has a larger heat dissipation surface, and can quickly and effectively exchange heat with air to realize heat dissipation of equipment.

Referring to fig. 1-3, in a preferred embodiment, the heat conducting plate and the heat dissipating base are made of a solid metal material having a thermal conductivity of 80W/(m × K). The heat-conducting plate is heat conduction copper 2 in preferred scheme, and the heat dissipation base is aluminium radiator 4 that metallic aluminum made, and the heat conduction membrane is graphite alkene heat conduction membrane 3, and graphite alkene heat conduction membrane 3's lower surface is connected with aluminium radiator 4's upper surface fixed, and graphite alkene heat conduction membrane 3's upper surface is connected with heat conduction copper 2's lower surface fixed. In the single-layer graphene structure, each carbon atom has a p orbital which is not hybridized by sp2, wherein a p electron is not paired, in the single-layer graphene, m electrons in the carbon atoms are combined into a large pi bond with m central m electrons, and the delocalized electrons can freely move in a carbon atom plane layer, so that the graphene has good heat and electricity conducting property in the layer direction, and the plane heat conductivity coefficient of the graphite single crystal can reach 600-. Therefore, the high heat conduction potential of the graphene can greatly improve the heat dissipation problem of the electronic device. Due to the ultrahigh thermal conductivity of the graphene material in the planar two-dimensional direction, the heat dissipation effect of the aluminum heat sink 4 structure can be greatly improved, and compared with the aluminum heat sink 4 without the graphene, the LED heat dissipation device can be reduced by more than 10 ℃ by using the graphene material. And through the cooperation of aluminium radiator 4, graphite alkene thermal film 3 and heat conduction copper 2, adopt heat conduction copper 2 as the heat dissipation than the simple, the price is cheaper, the heat-radiating equipment of making is more light.

In a preferred embodiment, the heat conducting film 3 is made of graphene polypropylene composite. The graphene-polypropylene composite material comprises, by weight, 100 parts of polypropylene, 1-10 parts of modified graphene and 1-20 parts of rare earth complex, wherein the modified graphene contains amino and/or azide groups, the content of the amino and/or azide groups is 0.1% -5%, and the coordination number of the rare earth complex is 3-8. Please refer to the specific preparation method, the utility model of china CN202011626576.0, a polypropylene composite material and its preparation method.

Referring to fig. 1-3, in a preferred embodiment, a plurality of fins 5 are formed at the lower end of the aluminum heat sink 4, the fins 5 extend along the axial direction of the heat sink, the fins 5 are arranged at intervals along the transverse direction, and the fins 5 exchange heat with air by transferring heat to the aluminum heat sink 4. Further, the heat-conducting copper plate 2 is further provided with a mounting hole, and the mounting hole is used for mounting and fixing other equipment needing heat dissipation. The plurality of radiating fins 5 are arranged at intervals along the transverse direction, so that the radiating area of the aluminum-added radiator 4 is increased, ventilation circulation is facilitated, and disappearance of heat is accelerated.

Referring to fig. 1-3, another aspect of the present invention provides a high power LED lamp, which includes an LED lamp assembly 1 and any one of the heat dissipation devices described above, wherein the LED lamp assembly 1 is stacked and fixed with respect to a heat conducting plate, the heat conducting plate is located on a backlight side of the LED lamp assembly 1, and the heat dissipation device is used for dissipating heat of the LED lamp assembly 1. Further, LED banks spare 1 includes circuit board 6 and LED lamp pearl 7, and LED lamp pearl 7 sets up on circuit board 6, and circuit board 6 and the range upon range of setting of heat-conducting plate and relatively fixed. The backlight side refers to the side opposite to the light emitting end of the LED lamp bead 7. When the LED lamp is used, heat generated by the high-power LED lamp beads 7 is sequentially conducted to the graphene heat conducting film 3 and the aluminum radiator 4 through the heat conducting copper plate 2. The heat is quickly conducted to the air through the aluminum heat sink 4.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, reference to the description of the terms "preferred embodiment," "yet another embodiment," "other embodiments," or "specific examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims

1. The graphene and polypropylene compounded heat dissipation device is characterized by comprising a heat dissipation base, a heat conduction film and a heat conduction plate, wherein the heat dissipation base, the heat conduction film and the heat conduction plate are arranged in a stacked mode and are relatively fixed, the heat conduction film is located between the heat dissipation base and the heat conduction plate, the heat conduction coefficient of the heat conduction film is larger than that of the heat dissipation base, the heat conduction coefficient of the heat conduction plate is larger than that of the heat dissipation base, and the heat conduction film conducts heat of the heat conduction plate to the heat dissipation base.

2. The graphene-polypropylene composite heat dissipation device of claim 1, wherein the thermal conductive film is a graphene thermal conductive film, a lower surface of the graphene thermal conductive film is fixedly connected to an upper surface of the heat dissipation base, and an upper surface of the graphene thermal conductive film is fixedly connected to a lower surface of the thermal conductive plate.

3. The graphene-polypropylene composite heat dissipation device according to claim 2, wherein the heat conductive film is made of graphene-polypropylene composite material.

4. The graphene-polypropylene composite heat dissipation device according to claim 1, wherein the thermal conductive plate and the heat dissipation base are made of a solid metal material having a thermal conductivity of 80W/(m × K).

5. The graphene-polypropylene composite heat dissipation device of claim 1, wherein the heat conduction plate is a heat conduction copper plate, and the heat conduction copper plate is further provided with mounting holes for mounting and fixing other devices requiring heat dissipation.

6. The graphene-polypropylene composite heat dissipation device of claim 1, wherein the heat dissipation base is an aluminum heat sink made of aluminum, and an upper surface of the aluminum heat sink is fixedly connected to a lower surface of the heat conductive film.

7. The graphene-polypropylene composite heat dissipation device according to claim 6, wherein a plurality of fins are formed at a lower end of the aluminum heat sink, the fins extend in an axial direction of the graphene-polypropylene composite heat dissipation device, the fins are arranged at intervals in a transverse direction, and the fins exchange heat with air conducted to the aluminum heat sink.

8. A high-power LED lamp is characterized by comprising an LED lamp assembly and a graphene and polypropylene composite heat dissipation device according to any one of claims 1 to 6, wherein the LED lamp assembly and the heat conduction plate are arranged in a stacked mode and are relatively fixed, the heat conduction plate is located on the backlight side of the LED lamp assembly, and the graphene and polypropylene composite heat dissipation device is used for dissipating heat of the LED lamp assembly.

9. The high power LED lamp of claim 8, wherein the LED lamp assembly comprises a circuit board and LED lamp beads, the LED lamp beads are disposed on the circuit board, and the circuit board and the heat conducting plate are stacked and fixed relatively.