KR20150005755A - Heat discharging sheet and method for manufacturing the same - Google Patents

Heat discharging sheet and method for manufacturing the same Download PDF

Info

Publication number
KR20150005755A
KR20150005755A KR1020130078355A KR20130078355A KR20150005755A KR 20150005755 A KR20150005755 A KR 20150005755A KR 1020130078355 A KR1020130078355 A KR 1020130078355A KR 20130078355 A KR20130078355 A KR 20130078355A KR 20150005755 A KR20150005755 A KR 20150005755A
Authority
KR
South Korea
Prior art keywords
heat
graphene
layer
heat dissipation
inorganic particles
Prior art date
Application number
KR1020130078355A
Other languages
Korean (ko)
Other versions
KR102015915B1 (en
Inventor
변나미
이동욱
이성국
Original Assignee
엘지전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지전자 주식회사 filed Critical 엘지전자 주식회사
Priority to KR1020130078355A priority Critical patent/KR102015915B1/en
Priority to PCT/KR2014/005420 priority patent/WO2014208930A1/en
Priority to US14/779,507 priority patent/US10273395B2/en
Publication of KR20150005755A publication Critical patent/KR20150005755A/en
Application granted granted Critical
Publication of KR102015915B1 publication Critical patent/KR102015915B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a heat dissipation sheet, and more particularly, to a heat dissipation sheet using graphene and a manufacturing method thereof. The present invention provides a heat dissipation sheet comprising: a heat dissipation layer having a first side and a second side and including graphene and inorganic particles; An adhesive layer disposed on the first surface of the heat dissipation layer; And a protective layer on the second surface of the heat dissipation layer.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat dissipating sheet,

The present invention relates to a heat dissipation sheet, and more particularly, to a heat dissipation sheet using graphene and a manufacturing method thereof.

As materials composed of carbon atoms, fullerene, carbon nanotube, graphene, graphite and the like exist. Among them, graphene is a structure in which carbon atoms are composed of one layer on a two-dimensional plane.

In particular, graphene is not only very stable and excellent in electrical, mechanical and chemical properties, but it is also a good conductive material that can move electrons much faster than silicon and can carry much larger currents than copper, It has been proved through experiments that a method of separation has been discovered.

Such graphene can be formed in a large area and has electrical, mechanical and chemical stability as well as excellent conductivity, and thus is attracting attention as a basic material for electronic circuits.

In addition, since graphenes generally have electrical characteristics that vary depending on the crystal orientation of graphene of a given thickness, the user can express the electrical characteristics in the selected direction and thus design the device easily. Therefore, graphene can be effectively used for carbon-based electric or electromagnetic devices.

As described above, graphene is excellent in thermal conductivity and can be applied to a heat radiating material that emits heat.

SUMMARY OF THE INVENTION The present invention provides a heat-radiating sheet capable of effectively transmitting and discharging heat generated from a heat source and a method of manufacturing the same.

It is another object of the present invention to provide a heat-radiating sheet capable of improving thermal conductivity in a vertical direction, and a manufacturing method thereof.

According to a first aspect of the present invention, there is provided a heat dissipation sheet comprising: a heat dissipation layer having a first side and a second side and including graphene and inorganic particles; An adhesive layer disposed on the first surface of the heat dissipation layer; And a protective layer on the second surface of the heat dissipation layer.

Here, in the heat dissipation layer, inorganic particles may be distributed between the laminated structures of graphene.

In this case, the content of the inorganic particles may be 0.5 to 50 wt%, and the content of graphene may be 50 to 99.5 wt%.

On the other hand, at least one of the adhesive layer and the protective layer may include a heat conduction material.

Such a heat conduction material may include at least one of graphene, an inorganic material, a metal, and graphite.

Here, the inorganic particles may include at least one of h-BN, SiC, AlN, Al 2 O 3 , SiO 2, and MgO.

According to a second aspect of the present invention, there is provided a method of manufacturing a heat radiation sheet, comprising: preparing inorganic particles and a graphen material; Dispersing the inorganic particles and the graphene material in a solution to prepare a dispersion solution; And drying and then rolling the dispersion solution.

Here, the step of drying and rolling the dispersion solution may include a step of filtering the dispersion solution using a sieve.

On the other hand, the step of drying and rolling the dispersion solution comprises: coating the dispersion solution on the substrate; Drying the coating; And rolling the coating together with the substrate.

The present invention has the following effects.

First, the heat-radiating sheet of the present invention adheres to a heat source so that heat generated from a heat source can be efficiently discharged.

Specifically, the heat dissipation layer included in the heat dissipation sheet adheres to the heat source by means of the adhesive layer so as to release heat generated from the heat source. At this time, the adhesive layer adheres to the heat source to transfer heat generated from the heat source to the heat dissipation layer .

The heat-dissipating layer is capable of releasing the heat particularly in the lateral direction, thereby releasing heat generated from the heat source more effectively.

The grains contained in the heat dissipation layer are excellent in thermal conduction in the horizontal direction, and the inorganic particles positioned between the graphenes can be structured by connecting them so that heat conduction occurs through the respective layers of the graphenes.

These inorganic particles can greatly improve the thermal conductivity in the vertical direction by using thermal transfer by phonon (graphen), as compared with the case of graphene alone.

In other words, since heat transfer by phonons is not easy when each interlayer gap of graphene is present, inorganic particles act as an interlayer heat transfer material, which facilitates heat transfer by phonons.

Therefore, the thermal conductivity in the horizontal direction and the vertical direction can be greatly improved.

1 is a cross-sectional view showing an example of a heat-radiating sheet using graphene.
2 is a cross-sectional view showing another example of the heat-radiating sheet using graphene.
3 is a schematic view showing a state in which heat-radiating sheets are attached to a heat source to release heat.
4 is a schematic view showing an example of application of a heat-radiating sheet.
5 is a schematic view showing an example in which a heat-radiating sheet is used as a heat source in a solar cell.
6 is a schematic view showing an example in which a heat-radiating sheet is used as a heat source in a light-emitting diode illuminating device.
7 to 10 are schematic views showing a process of manufacturing the heat radiation layer of the heat radiation sheet.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. Rather, the intention is not to limit the invention to the particular forms disclosed, but rather, the invention includes all modifications, equivalents and substitutions that are consistent with the spirit of the invention as defined by the claims.

It will be appreciated that when an element such as a layer, region or substrate is referred to as being present on another element "on," it may be directly on the other element or there may be an intermediate element in between .

Although the terms first, second, etc. may be used to describe various elements, components, regions, layers and / or regions, such elements, components, regions, layers and / And should not be limited by these terms.

1 is a cross-sectional view showing an example of a heat-radiating sheet.

As shown in Fig. 1, the heat-radiating sheet 100 is provided with a heat-radiating layer 10 having a first surface 13 and a second surface 14. The heat-radiating layer 10 may have a property of transmitting or releasing heat.

The heat dissipation layer 10 may include graphene 11 and inorganic particles 12.

Here, the graphene 11 forms a two-dimensional layer structure, and the inorganic particles 12 can be distributed between the graphenes 11 constituting this layered structure.

In other words, the inorganic particles 12 can be distributed between the laminated structures of the graphenes 11.

At this time, since the heat dissipation layer 10 mainly has the characteristic of heat conduction, the graphen 11 having excellent thermal conductivity can be used as a main material.

The graphene 11 has a very high thermal conductivity, but as mentioned above, the graphene has a layered anisotropic arrangement so that the thermal conductivity in the horizontal direction is excellent, but the thermal conductivity in the vertical direction is low .

However, the inorganic particles 12 having an isotropic thermal conductivity are distributed between the laminated structures of the graphenes 11, so that the thermal conductivity in the vertical direction can be improved.

For this property, the content of the inorganic particles 12 may be 0.5 to 50 wt%, and the content of the graphene 11 may be 50 to 99.5 wt%.

The thickness of the heat dissipation layer 10 may be in the range of 5 to 100 탆 and the inorganic particles 12 may be placed between the graphenes 11 by stacking the graphenes 11 so as to have such thickness .

The adhesive layer 20 attached to the heat source 200 (see FIG. 3) may be disposed on the first surface 13 of the heat dissipation layer 10.

The adhesive layer 20 can effectively transfer the heat generated from the heat source to the heat dissipation layer 10 while minimizing the adhesion between the adhesive layer 20 and the heat source.

The matrix of the adhesive layer 20 may be mainly a polymeric material, but is not limited thereto.

When a polymer material is used as the matrix of the adhesive layer 20, various polymer resins such as a polyurethane resin, an epoxy resin, an acrylic resin, and a polymer resin may be used.

Here, the adhesive layer 20 may have a thickness ranging from several tens of nanometers to several hundreds of micrometers, and may have a thickness of 5 to 100 占 퐉 in order to effectively dissipate heat and adhere to a heat source.

More specifically, when the adhesive layer 20 has a thickness of 5 to 20 占 퐉, an optimum effect can be exhibited.

A protective layer 30 for protecting the heat dissipation layer 10 may be disposed on the second surface 14 of the heat dissipation layer 10.

The protective layer 30 may be coated on the heat dissipation layer 10 to prevent the material of the heat dissipation layer 10 from falling off.

However, it is possible to improve the radiation property in addition to the fall-off preventing property. Further, the insulation characteristic can be improved in some cases.

That is, the protective layer 30 may have a characteristic that the heat transmitted through the heat-dissipating layer 10 can be effectively radiated to the outside.

The protective layer 30 may be mainly made of a polymer material, but is not limited thereto.

When a polymer material is used for the protective layer 30, various polymer resins such as polyurethane resin, epoxy resin, acrylic resin, polymer resin, PET, and PT can be used.

The protective layer 30 may have a thickness ranging from several tens of nanometers to several hundreds of micrometers in consideration of the protective property of the heat dissipation layer 10 and the heat radiation to the outside. In order to effectively dissipate heat and adhere to a heat source The thickness may be between 5 and 100 mu m.

More specifically, when the protective layer 30 has a thickness of 5 to 20 占 퐉, optimum effects can be exhibited.

2, the heat conductive material 21, 31 may be included in at least one of the adhesive layer 20 and the protective layer 30 in order to improve the thermal conductivity.

The heat generated from the heat source can be more effectively transmitted to the heat dissipation layer 10 through the adhesive layer 20 when the heat conductive material 21 is included in the adhesive layer 20. [

The heat conduction material 21 may include at least one of graphene, an inorganic material, a metal, and graphite.

More specifically, these heat conductive material 21 is, well in addition to the pin, may include minerals, graphite (graphite), such as metals, BN, AiN, Al 2 O 3 and MgO, such as Cu and Al, the addition of carbon And may include a carbon nano tube (CNT).

As described above, when the thermally conductive material 21 is included in the adhesive layer 20, the thermally conductive material 21 may be mixed with the polymer material constituting the adhesive layer 20 at a weight ratio of 10 to 90 wt% have.

The protective layer 30 may also include a thermally conductive material 31 that can further improve the conductivity of the heat through the protective layer 30. [

Accordingly, the heat conductive material 31 included in the protective layer 30 may allow heat to be more effectively discharged through the protective layer 20 or heat exchange with the outside.

The heat conduction material 31 may be the same as the heat conduction material 21 included in the adhesive layer 20.

Fig. 3 schematically shows a state in which the heat-radiating sheet is attached to a heat source to release heat.

As described above, the heat-radiating sheet 100 is attached to the heat source 200 so that heat generated from the heat source 200 can be efficiently discharged.

The heat dissipation layer 10 including the graphene 11 and the inorganic particles 12 adheres to the heat source 200 to emit heat generated from the heat source 200. At this time, 200 so that the heat generated from the heat source 200 can be effectively transmitted to the heat dissipation layer 10. [

As mentioned above, the graphene 11 is a material composed of a single layer of hexagonal carbon atoms, and is rich in pi electrons on the plane side, and thus has excellent thermal conductivity and electrical conductivity.

Since the graphene 11 has a very high thermal conductivity of about 3000 to 5000 W / mK, it can effectively emit heat transmitted from the heat source through the heat-dissipating layer 10, .

Since the graphene 11 is produced by laminating and compressing powders obtained from the graphene oxide, it has an anisotropic arrangement, and the thermal conductivity in the horizontal direction is excellent as 300 to 1000 W / mK. However, the graphene 11 has a relatively low thermal conductivity (2 to 5 W / mk).

At this time, the inorganic particles 12 located between the graphenes 11 can be structured by connecting them through the respective layers of the graphenes 11 so that the thermal conductivity in the vertical direction is greatly improved .

The thermal conductivity of the inorganic particles 12 in the vertical direction can be greatly improved by the heat transfer phenomenon by phonons.

That is, if there is an interlayer gap between the graphenes 11, heat transfer by phonons is not easy, so that the inorganic particles 12 act as an interlayer heat transfer material and heat transfer by phonons is facilitated .

The thermal conductivity in the vertical direction can be improved by several to several tens W / mK due to the connection structure of the inorganic particles 12 and the graphenes 11.

The inorganic particles (12) include h-BN, SiC, AlN, Al 2 O 3, SiO 2 and MgO, etc., but may be used, and the like.

Among them, hexagonal boron nitride (h-BN) has a thermal conductivity of about 600 W / mK, and SiC has a thermal conductivity of 7 to 12 W / mK. AlN, Al 2 O 3, and MgO each have a thermal conductivity of 19, 24 to 35, and 45 to 60 W / mK.

Accordingly, the inorganic particles 12 can be formed by selecting the material having the thermal conductivity according to the application target of the heat-radiating sheet 100, and these materials may be mixed with each other in some cases.

As described above, when the adhesive layer 20 includes the heat transfer material 21, since the heat transfer material 21 has a good thermal conductivity, the heat generated by the heat source 200 can be more efficiently transferred to the heat dissipation layer 10).

The heat-dissipating layer 10 can emit heat especially in the lateral direction, and can more effectively emit heat generated in the heat source 200. [

At this time, the heat transferred to the protective layer 30 may be released to the outside through the protective layer 30. [

In addition, when the heat transfer material 31 is included in the protective layer 30, the heat transfer material 31 is excellent in thermal conductivity and can be effectively discharged through the protective layer 30.

In addition, heat exchange from the outside air through the protective layer 30 can also occur.

In general, the adhesive layer 20 and the protective layer 30 include an oxide filler for improving the thermal conductivity. However, since the oxide filler is heavy in weight and low in thermal conductivity, it is required to add a high content to improve the thermal conductivity to a certain degree It has been difficult to apply it to a product having a thickness of several to several tens of micrometers.

However, the adhesive layer 20 or the protective layer 30 including the heat transfer materials 21 and 31 described above can transmit or emit heat more effectively without such a problem.

4 shows an example in which the heat-radiating sheet 100 is used in an application such as a TV using a flat panel display as an example of application of the heat-radiating sheet.

4 shows a state in which the heat radiation sheet 100 is attached to the driving unit 200 as a heat source and the display panel 300 is placed on the heat radiation sheet 100. [

The driving unit 200 is usually provided with a metal frame such as an aluminum (SUS) frame. The heat-radiating sheet 100 may be attached to the metal frame.

The metal frame has a characteristic that the heat generated in the driving unit 200 does not spread well in the horizontal direction but transmits heat in the advancing direction. Accordingly, the heat transmitted from the driving unit 200 can be radiated through the heat-radiating sheet 100 in a horizontal direction.

4, heat can be emitted from the heat radiation sheet 100 to the display panel 300 side without being released.

At this time, heat emitted from the display panel 300 may be discharged through the heat-radiating sheet 100.

On the other hand, as shown in Figs. 5 and 6, such a heat-radiating sheet 100 can be used for a solar cell and a light-emitting diode lighting apparatus.

5 shows an example in which the heat-radiating sheet 100 described above is used as a heat source 200 in a solar cell.

The solar cell 210 includes a solar cell 210 between the lower buffer layer member 220 and the upper buffer layer 230. The solar cell 210 includes a transparent substrate 240, To electrical energy.

The conversion process of the energy in which such light energy is converted into electric energy has a limited efficiency, and some of this energy can be released into heat.

Therefore, it is important to effectively discharge such heat. By attaching the heat-radiating sheet 100 to the lower side of the lower cushioning member 220, So that it can be effectively released through the use of the apparatus.

6 shows an example in which a heat-radiating sheet is used in a light-emitting diode lighting device.

2. Description of the Related Art Recently, light emitting diodes (LEDs) have been increasingly used, and in particular, they have been used as lamps capable of replacing lamps such as conventional fluorescent lamps and incandescent lamps and lighting devices using the same.

In contrast to solar cells, these LEDs convert electrical energy into light energy. In this case, the energy conversion process is limited in efficiency, and some of this energy can be released into heat.

Accordingly, it may be important to effectively discharge the heat emitted from the light emitting diode package 250 by attaching the heat radiation sheet 100 to the lower side of the light emitting diode package 250 used in the light emitting diode lighting apparatus.

This is because the emission of heat can extend the life of the light emitting diode chip and reduce the overall heat generated in the lighting apparatus.

The light emitting diode package 250 is mounted on the case 260 and the lens unit 270 and the light guide unit 280 are provided on the light emitting diode package 250 so that heat is hardly emitted to the front side. to be.

Therefore, the heat radiation sheet 100 can be provided by thermally connecting the lower side of the light emitting diode package 250.

At this time, since the light emitting diode package 250 often includes a heat sink on the lower side, the heat radiation sheet 100 can be directly attached to such a heat sink.

In addition, the heat-radiating sheet 100 can be attached to any place where heat can be generated.

The heat dissipation layer 10 of the heat dissipation sheet 100 including the graphene 11 and the inorganic particles 12 can be manufactured using the dispersion solution of the inorganic particles 12 and the graphen material.

Hereinafter, the manufacturing process of the heat dissipation layer 10 of the heat dissipation sheet 100 will be described in detail with reference to FIGS. 7 to 10. FIG.

First, as shown in Fig. 7, a graphen material 11a and inorganic particles 12 are prepared and dispersed in a solution contained in a container 40 to prepare a dispersion solution 50. [

As mentioned above, the graphen material 11a can be produced by reducing graphene oxide.

Oxidized graphene refers to a state in which carbon particles are oxidized by an acid. Oxidative graphene is usually produced by oxidizing graphite with a strong acid such as sulfuric acid. In some cases, a mixture of sulfuric acid and hydrogen peroxide can be used for oxidation.

Graphite has a plate-like structure. When a strong acid is added to such graphite, it is oxidized. Graphene oxide is a state in which such a graphite is chemically prepared in a small particle state.

Since the graphene oxide has non-conductive non-conductive characteristics and thermal conductivity of several tens W / mK, heat generated from the heat source can be effectively transmitted.

As described above, such graphene grains can be made of graphene material 11a through a reduction process.

The graphen material 11a or the inorganic particles 12 may be used as the heat transfer materials 21 and 31 included in the adhesive layer 20 and the protective layer 30. [

Next, the heat dissipation layer 10 can be manufactured by drying and rolling the dispersion solution 50 in which the graphene material 11a and the inorganic particles 12 are dispersed, produced by the above process.

The process of drying the dispersion solution (50) to form a membrane can be largely accomplished by the following two methods.

First, as shown in FIG. 8, the process of coating the base material 60 with the dispersed solution 50 in which the graphen material 11a and the inorganic particles 12 thus produced are dispersed to fabricate the film 51 .

Alternatively, as shown in Fig. 9, the membrane 51 can be produced by filtering the dispersion solution 50 in which the graphen material 11a and the inorganic particles 12 are dispersed by using the filter 70 have.

After the film 51 is formed using the dispersion solution 50 as described above, the heat-radiating layer 10 can be manufactured by rolling using a pair of rollers as shown in Fig.

In this rolling process, the graphen material 11a and the inorganic particles 12 are mixed with each other to form a structure in which the inorganic particles 12 are distributed between the layers between the multi-layer structures of the graphenes 11.

When the adhesive layer 20 and the protective layer 30 are attached or directly formed on the first surface and the second surface of the heat dissipation layer 10 manufactured in the above-described process, the heat dissipation sheet 100 as shown in FIG. Can be produced.

It should be noted that the embodiments of the present invention disclosed in the present specification and drawings are only illustrative of specific examples for the purpose of understanding and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

10: heat sink layer 11: graphene
12: inorganic particle 13: first side
14: second side 20: adhesive layer
21: heat transfer material 30: protective layer
31: heat transfer material 100: heat radiation sheet
200: heat source, driving unit 300: display panel

Claims (9)

In the heat-radiating sheet,
A heat dissipation layer having a first side and a second side and including graphene and inorganic particles;
An adhesive layer disposed on the first surface of the heat dissipation layer; And
And a protective layer disposed on the second surface of the heat dissipation layer. The heat-radiating sheet according to claim 1, wherein the heat dissipation layer has the inorganic particles distributed between the laminated structures of the graphenes. The heat-radiating sheet according to claim 1, wherein the content of the metal particles is 0.5 to 50 wt%, and the content of the graphene is 50 to 99.5 wt%. The heat-radiating sheet according to claim 1, wherein at least one of the pressure-sensitive adhesive layer and the protective layer comprises a heat conductive material. The heat-radiating sheet according to claim 4, wherein the heat conductive material comprises at least one of graphene, an inorganic material, a metal, and graphite. The heat-radiating sheet according to claim 1, wherein the inorganic particles include at least one of h-BN, SiC, AlN, Al 2 O 3 , SiO 2, and MgO. A method of manufacturing a heat-radiating sheet,
Preparing an inorganic particle and a graphen material;
Dispersing the inorganic particles and the graphene material in a solution to prepare a dispersion solution; And
And drying and then rolling the dispersion solution. 8. The method of manufacturing a heat dissipation sheet according to claim 7, wherein the step of drying and rolling the dispersion solution comprises filtering the dispersion solution using a sieve. 8. The method of claim 7, wherein the drying and rolling the dispersion solution further comprises:
Coating the dispersion solution on a substrate;
Drying the coating; And
And rolling the coating together with the substrate.
KR1020130078355A 2013-06-26 2013-07-04 Heat discharging sheet and method for manufacturing the same KR102015915B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020130078355A KR102015915B1 (en) 2013-07-04 2013-07-04 Heat discharging sheet and method for manufacturing the same
PCT/KR2014/005420 WO2014208930A1 (en) 2013-06-26 2014-06-19 Heat discharging sheet and method for manufacturing the same
US14/779,507 US10273395B2 (en) 2013-06-26 2014-06-19 Heat discharging sheet and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130078355A KR102015915B1 (en) 2013-07-04 2013-07-04 Heat discharging sheet and method for manufacturing the same

Publications (2)

Publication Number Publication Date
KR20150005755A true KR20150005755A (en) 2015-01-15
KR102015915B1 KR102015915B1 (en) 2019-08-29

Family

ID=52477336

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130078355A KR102015915B1 (en) 2013-06-26 2013-07-04 Heat discharging sheet and method for manufacturing the same

Country Status (1)

Country Link
KR (1) KR102015915B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9853487B2 (en) 2015-10-13 2017-12-26 Samsung Electro-Mechanics Co., Ltd. Magnetic field shielding sheet and wireless power charging apparatus including the same
RU2717762C1 (en) * 2019-04-01 2020-03-25 Сергей Валерьевич Александров Device for automatic welding of convection sections of hot-water boilers

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030152764A1 (en) * 2002-02-06 2003-08-14 Bunyan Michael H. Thermal management materials having a phase change dispersion
KR20120073792A (en) * 2010-12-27 2012-07-05 율촌화학 주식회사 Heat radiating sheet
KR20120129789A (en) * 2011-05-17 2012-11-28 율촌화학 주식회사 Back sheet for solar cell module and solar cell module comprising the same
JP5146402B2 (en) * 2009-05-19 2013-02-20 トヨタ自動車株式会社 Method for forming carbon particle-containing coating, heat transfer member, power module, and vehicle inverter

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030152764A1 (en) * 2002-02-06 2003-08-14 Bunyan Michael H. Thermal management materials having a phase change dispersion
JP5146402B2 (en) * 2009-05-19 2013-02-20 トヨタ自動車株式会社 Method for forming carbon particle-containing coating, heat transfer member, power module, and vehicle inverter
KR20120073792A (en) * 2010-12-27 2012-07-05 율촌화학 주식회사 Heat radiating sheet
KR20120129789A (en) * 2011-05-17 2012-11-28 율촌화학 주식회사 Back sheet for solar cell module and solar cell module comprising the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9853487B2 (en) 2015-10-13 2017-12-26 Samsung Electro-Mechanics Co., Ltd. Magnetic field shielding sheet and wireless power charging apparatus including the same
RU2717762C1 (en) * 2019-04-01 2020-03-25 Сергей Валерьевич Александров Device for automatic welding of convection sections of hot-water boilers

Also Published As

Publication number Publication date
KR102015915B1 (en) 2019-08-29

Similar Documents

Publication Publication Date Title
US10273395B2 (en) Heat discharging sheet and method for manufacturing the same
TWI460265B (en) Radiating composite material and light emitting diode having same thereof
KR20140093457A (en) Heat discharging sheet
EP2929573B1 (en) A lighting unit and a luminaire
KR102154522B1 (en) Heat discharging sheet and method for manufacturing the same
KR20160070243A (en) Heat-discharging sheet
US20110001418A1 (en) High heat dissipation electric circuit board and manufacturing method thereof
KR101034046B1 (en) Printed circuit board having expended graphite sheet and led lamp
WO2011150755A1 (en) Led with honeycomb radiating heat dissipating device
KR102015915B1 (en) Heat discharging sheet and method for manufacturing the same
KR101824986B1 (en) Lighting device
KR102092675B1 (en) Heat discharging sheet and method for manufacturing the same
KR20150002191A (en) Heat discharging sheet and method for manufacturing the same
KR101894522B1 (en) method for fabricating heat-disspating PCB using carbon-based materal for LED lighting
KR20140094294A (en) Heat discharging sheet of electrically insulative
JP7288101B2 (en) Heat-conducting structures and electronic devices
CN111769191B (en) Ultraviolet LED chip heat dissipation composite substrate
TW201445082A (en) Light emitting device
KR102150440B1 (en) Heat discharging sheet and method for manufacturing the same
KR20140088360A (en) Heat discharging sheet using graphene
CN216868446U (en) Graphene and polypropylene composite heat dissipation device and high-power LED lamp
KR101510109B1 (en) Thermal radiation sheet of thin layer type
KR101282103B1 (en) Light emitting diode illuination device
KR20160078802A (en) Metal encapculation with excellent heat emission property, the method for preparing thereof and flexible device packaged by the same
KR20200094298A (en) A heat-radiating material having an insulating function and a heat-radiating function, and a heat-radiating sheet comprising the same

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right