CN212252545U - Heat dissipation device and light source system - Google Patents

Abstract

An embodiment of the utility model provides a heat abstractor, including heat conduction base plate, upper heat dissipation mechanism and lower floor's heat dissipation mechanism, the heat conduction base plate includes relative first base plate face and second base plate face. The upper-layer heat dissipation mechanism comprises a plurality of groups of upper-layer heat dissipation fin groups arranged at intervals, and the upper-layer heat dissipation fin groups are arranged on the first substrate surface. The lower-layer radiating mechanism comprises a lower-layer radiating fin group and a lower-layer wind shielding structure, the lower-layer radiating fin group is installed on the surface of the second substrate and provided with a middle air inlet, the lower-layer radiating fin group comprises a plurality of lower-layer radiating fins which are arranged at intervals, the middle air inlet penetrates through each lower-layer radiating fin, and the lower-layer wind shielding structure is arranged at one end, away from the surface of the second substrate, of the lower-layer radiating fin group. The utility model provides a heat abstractor is through setting up upper heat dissipation mechanism and lower floor's heat dissipation mechanism to lower floor's heat dissipation mechanism is equipped with the middle part air intake, has promoted heat abstractor's heat dispersion. The embodiment of the utility model provides a still provide a light source system.

Description

Heat dissipation device and light source system

Technical Field

The utility model relates to a radiator technical field particularly, relates to a heat abstractor and light source system.

Background

With the development of science and technology, electrical appliances have been applied to various technical fields, and are also visible everywhere in daily life of people, and the electrical appliances can generate heat in the use process, and the service life of the electrical appliances can be seriously shortened due to the accumulation of heat.

The radiator has the main function of continuously guiding and radiating heat generated by heating elements such as electric appliances in the working process to the environment, so that the temperature of the heating elements is kept in a required range, and the service life of the heating elements is prolonged.

Most of existing radiators improve the heat radiation performance of the radiators by simply increasing the area of the radiators, but the radiators are heavy due to the fact that the radiators are simply increased, and the installation space required by the radiators is increased due to the fact that the size of the radiators is increased.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the utility model is to provide a heat abstractor and light source system to solve above-mentioned problem. The embodiment of the utility model provides an above-mentioned purpose is realized through following technical scheme.

In a first aspect, an embodiment of the present invention provides a heat dissipation apparatus, including heat conduction substrate, upper heat dissipation mechanism and lower heat dissipation mechanism, the heat conduction substrate includes relative first substrate face and second substrate face. The upper-layer heat dissipation mechanism comprises a plurality of groups of upper-layer heat dissipation fin groups arranged at intervals, and the upper-layer heat dissipation fin groups are arranged on the first substrate surface. The lower-layer radiating mechanism comprises a lower-layer radiating fin group and a lower-layer wind shielding structure, the lower-layer radiating fin group is installed on the surface of the second substrate and provided with a middle air inlet, the lower-layer radiating fin group comprises a plurality of lower-layer radiating fins which are arranged at intervals, the middle air inlet penetrates through each lower-layer radiating fin, and the lower-layer wind shielding structure is arranged at one end, away from the surface of the second substrate, of the lower-layer radiating fin group.

In one embodiment, the upper heat dissipation mechanism further includes an upper wind shielding plate disposed at an end of the upper heat dissipation fin set away from the first substrate surface.

In one embodiment, the upper heat dissipating fin set includes a plurality of upper heat dissipating fins arranged in parallel and spaced apart from each other, and each of the upper heat dissipating fins is partially covered by the upper wind shielding sheet.

In one embodiment, the plurality of lower fins are parallel to each other and the plurality of upper fins are parallel to the plurality of lower fins.

In one embodiment, the heat conducting substrate is provided with a plurality of heat pipe embedding grooves, the upper heat dissipation mechanism further comprises a plurality of upper heat dissipation pipes, the upper heat dissipation pipes are arranged in a staggered mode and are spaced from each other, one end of each upper heat dissipation pipe is installed in each heat pipe embedding groove, and the other end of each upper heat dissipation pipe penetrates through the upper heat dissipation fins.

In one embodiment, the lower heat dissipation mechanism further includes a plurality of first lower heat dissipation tubes and a plurality of second lower heat dissipation tubes, the first lower heat dissipation tubes and the second lower heat dissipation tubes are respectively exposed at two opposite sides of the lower heat dissipation fin set, the first lower heat dissipation tubes pass through a portion of the lower heat dissipation fins in the lower heat dissipation fin set, and the second lower heat dissipation tubes pass through a portion of the lower heat dissipation fins in the lower heat dissipation fin set.

In one embodiment, one end of the first lower-layer radiating pipe is connected with the heat conducting substrate, and the other end of the first lower-layer radiating pipe penetrates through part of the lower-layer radiating fins in the lower-layer radiating fin group; one end of the second lower-layer radiating tube is connected with the heat conducting substrate, and the other end of the second lower-layer radiating tube penetrates through part of the lower-layer radiating fins in the lower-layer radiating fin group.

In one embodiment, the length direction of the first lower radiating pipe is parallel to the length direction of the second lower radiating pipe and parallel to the length direction of the middle air inlet.

In one embodiment, the lower wind shielding structure includes a first lower wind shielding sheet and a second lower wind shielding sheet, the first lower wind shielding sheet and the second lower wind shielding sheet are respectively located at two opposite sides of the middle air inlet, and each of the lower heat dissipation fins is partially covered by the first lower wind shielding sheet and partially covered by the second lower wind shielding sheet.

In an embodiment, the lower heat dissipation mechanism further includes at least one first fan and at least one second fan, the at least one first fan and the at least one second fan are respectively installed on two opposite sides of the lower heat dissipation fin set, and the middle air inlet is located between the at least one first fan and the at least one second fan.

In a second aspect, the present invention further provides a light source system, which includes a light source device and any one of the heat dissipation devices, wherein at least one light source locking hole is formed on the first substrate surface, and the light source device is installed on the first substrate surface and located between the upper heat dissipation fin sets of the plurality of sets through the at least one light source locking hole.

In an embodiment, the light source system further includes a light box, the light box includes a first side surface, a second side surface and a third side surface, the first side surface is opposite to the second side surface, the third side surface is connected between the first side surface and the second side surface, the first side surface is provided with a plurality of first through holes, the second side surface is provided with a plurality of second through holes, the third side surface is provided with a plurality of third through holes, the plurality of first through holes and the plurality of second through holes respectively correspond to opposite sides of the lower-layer heat dissipation fin group, and the plurality of third through holes correspond to the middle air inlet.

Compared with the prior art, the utility model provides a heat abstractor and light source system is through setting up upper heat dissipation mechanism and lower floor's heat dissipation mechanism to lower floor's heat dissipation mechanism is equipped with the middle part air intake, on the basis that does not increase the heat abstractor volume, has promoted heat abstractor's heat dispersion, thereby has prolonged light source system's life.

These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a heat dissipation device (not including a first fan and a second fan) according to an embodiment of the present invention at a viewing angle.

Fig. 2 is a schematic structural diagram of a heat dissipation device (not including a first fan and a second fan) at another viewing angle according to an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a heat dissipation device (not including a first fan and a second fan) at another viewing angle according to an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a heat dissipation device (not including a first fan and a second fan) at yet another viewing angle according to an embodiment of the present invention.

Fig. 5 is a schematic view of a split structure of a light source system according to an embodiment of the present invention.

Fig. 6 is a schematic view of an assembly structure of a light source system according to an embodiment of the present invention.

Detailed Description

In order to facilitate understanding of the embodiments of the present invention, the embodiments of the present invention will be described more fully below with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Referring to fig. 1, fig. 2 and fig. 3, an embodiment of the invention provides a heat dissipation apparatus 10, including a heat conductive substrate 11, an upper heat dissipation mechanism 13 and a lower heat dissipation mechanism 15, where the heat conductive substrate 11 includes a first substrate surface 112 and a second substrate surface 114 opposite to each other. The upper heat dissipation mechanism 13 includes a plurality of sets of upper heat dissipation fin sets 132 arranged at intervals, and the upper heat dissipation fin sets 132 are mounted on the first substrate surface 112. The lower heat dissipation mechanism 15 includes a lower heat dissipation fin set 151 and a lower wind shielding structure 153, the lower heat dissipation fin set 151 is installed on the second substrate surface 114, and a middle air inlet 1513 is formed in the lower heat dissipation fin set 151, the lower heat dissipation fin set 151 includes a plurality of lower heat dissipation fins 1512 arranged at intervals, the middle air inlet 1513 penetrates through each lower heat dissipation fin 1512, and the lower wind shielding structure 153 is disposed at one end of the lower heat dissipation fin set 132 away from the second substrate surface 114.

In the present embodiment, the heat conductive substrate 11 has a substantially rectangular plate-like structure and can be used for mounting a heat generating element. In other embodiments, the heat conducting substrate 11 may also be adapted to the shape of the heat generating element. In this embodiment, the plurality of sets of upper heat dissipating fin sets 132 are disposed around the heating element, and the heat conducting substrate 11 is adapted to the heating element, so as to reduce the distance between the upper heat dissipating fin sets 132 and the heating element, thereby facilitating the heat generated by the heating element to be transferred to the plurality of sets of upper heat dissipating fin sets 132, and to be transferred to the external environment through the plurality of sets of upper heat dissipating fin sets 132. As an example, when the heat generating element is circular or hexagonal, the heat conductive substrate 11 may be substantially circular or hexagonal. Meanwhile, the overall shape of the heat sink 10 may also be a shape corresponding to the heat conductive substrate 11, for example, the heat sink 10 may have a circular arc surface or a hexagonal prism side surface. As another example, when the volume of the heat generating element is reduced, the heat dissipating device 10 may also be reduced in volume accordingly. The overall shape of the heat sink 10 corresponds to the shape of the heat conductive substrate 11, and the installation space required for the heat sink 10 can be reduced, thereby reducing the volume of the entire light source system. In the present embodiment, the heat generating element may be a light source for emitting light; in other embodiments, the heating element may be another element such as a processor. Since Al or Cu has a high thermal conductivity and a low price, the thermal conductive substrate 11 in this embodiment may be an Al or Cu substrate.

The first substrate surface 112 may contact the upper heat dissipation mechanism 13 to transfer heat on the heat conducting substrate 11 to the upper heat dissipation mechanism 13, and then the heat is dissipated to the external environment through the upper heat dissipation mechanism 13, thereby implementing the heat dissipation function of the upper heat dissipation mechanism 13.

The first substrate surface 112 is provided with at least one light source locking hole 1121, and the at least one light source locking hole 1121 can be used for a fastener to penetrate through, so as to implement the installation of the light source.

The second substrate surface 114 is opposite to the first substrate surface 112 and is configured to contact the lower heat dissipation mechanism 15, so that heat on the heat conduction substrate 11 can be transferred to the lower heat dissipation mechanism 15, and then dissipated to the external environment through the lower heat dissipation mechanism 15, thereby implementing the heat dissipation function of the lower heat dissipation mechanism 15.

The heat conducting substrate 11 is provided with a plurality of heat pipe embedding grooves 116, and the plurality of heat pipe embedding grooves 116 are all long-shaped and are arranged at intervals along the width direction of the rectangular heat conducting substrate 11, and extend from two ends of the rectangular heat conducting substrate 11 to the middle respectively. In the present embodiment, the number of the heat pipe burying grooves 116 is twelve. In other embodiments, the number of the heat pipe burying grooves 116 may be other numbers, and may be set according to actual situations.

The upper heat dissipating fin groups 132 are spaced apart from each other along the length direction of the heat conducting substrate 11 and the width direction of the heat conducting substrate 11, and may be configured to transfer heat of the heat conducting substrate 11 to the external environment. In other embodiments, the number of the upper heat dissipating fin groups 132 may also be three, five or more.

In the present embodiment, the upper heat dissipating fin set 132 includes a plurality of upper heat dissipating fins 1321, and the plurality of upper heat dissipating fins 1321 are parallel to each other and are arranged at intervals along the length direction of the heat conducting substrate 11. Since the upper heat dissipating fins 1321 are spaced from each other, the contact area between the upper heat dissipating fins 1321 and the environment is large, which is favorable for dissipating the heat transferred to the upper heat dissipating fin group 132.

In this embodiment, the upper heat dissipation mechanism 13 further includes a plurality of upper heat dissipation pipes 134 and a plurality of upper wind shielding plates 136, and the upper heat dissipation pipes 134 can transfer heat on the heat conduction substrate 11 to the upper heat dissipation fins 1321, and finally, transfer the heat to the external environment through the upper heat dissipation fins 1321. The plurality of upper wind-blocking sheets 136 are disposed at an end of the plurality of groups of upper heat dissipating fin groups 132 away from the first substrate surface 112, and each upper wind-blocking sheet 136 partially covers each upper heat dissipating fin 1321 in each group of upper heat dissipating fin groups 132. In this embodiment, the upper wind-shielding sheet 136 is a rectangular sheet structure, and the upper wind-shielding sheet 136 can be used for shielding the air flow, preventing the air flow from flowing upwards from the direction perpendicular to the heat-conducting substrate 11, facilitating the air flow to flow out along the width direction of the heat-conducting substrate 11, and further effectively exchanging heat quickly. The upper wind shielding plate 136 may be mounted to the upper heat dissipating fin group 132 by welding. In the embodiment, each set of upper heat dissipating fin set 132 corresponds to three upper heat dissipating tubes 134 and one upper wind blocking plate 136, i.e. the upper heat dissipating mechanism 13 includes twelve upper heat dissipating tubes 134 and four upper wind blocking plates 136, and each upper heat dissipating tube 134 corresponds to one heat pipe embedding slot 116.

In other embodiments, the air flow can be prevented from flowing out upwards from the direction perpendicular to the heat conducting substrate 11 by the splicing of the upper heat dissipating fins 1321, where the splicing refers to that the fastening plates are fastened between two adjacent upper heat dissipating fins 1321 to fill the gap between two adjacent upper heat dissipating fins 1321, and the fastening of the fastening plates and the upper heat dissipating fins 1321 can achieve the wind shielding effect, that is, the splicing of the upper heat dissipating fins 1321 can also achieve the function of the upper wind shielding sheet 136.

The plurality of upper radiating pipes 134 are arranged in a staggered manner and spaced apart from each other along the width direction of the heat conductive substrate 11, one end of each upper radiating pipe 134 is installed in the heat pipe burying groove 116, and the other end thereof penetrates through the plurality of upper radiating fins 1321. Specifically, the upper layer radiating pipe 134 is a substantially U-shaped pipe structure, and includes an evaporation end 1341, a connection pipe 1343 and a condensation end 1345 connected in sequence, wherein the evaporation end 1341 has a length greater than that of the condensation end 1345, and can be installed in a central region of the heat conducting substrate 11. The condensation end 1345 is mounted on at least one upper heat dissipating fin set 132, and specifically, the condensation end 1345 may be welded to the plurality of upper heat dissipating fins 1321 through a fin penetrating process, so as to fixedly connect the upper heat dissipating tube 134 and the upper heat dissipating fins 1321. The connection pipe 1343 is exposed to the external environment, and thus, it is possible to achieve heat dissipation to the outside. In this embodiment, the upper layer heat dissipation pipe 134 may be a copper pipe. In other embodiments, the upper layer of heat dissipation pipes 134 may also be aluminum pipes or other pipes made of materials with high thermal conductivity.

Referring to fig. 2 and 4, the lower heat dissipation fins 1512 are parallel to each other and spaced apart from each other along the length direction of the heat conductive substrate 11, and the lower heat dissipation fins 1512 are parallel to the upper heat dissipation fins 1321. Because the plurality of lower heat dissipating fins 1512 are spaced apart from each other, the contact area between the lower heat dissipating fins 1512 and the environment is large, which is beneficial for dissipating the heat transferred to the lower heat dissipating mechanism 15.

The lower wind shielding structure 153 includes a first lower wind shielding sheet 1531 and a second lower wind shielding sheet 1532, the first lower wind shielding sheet 1531 and the second lower wind shielding sheet 1532 are substantially rectangular sheet structures and are respectively located at two opposite sides of the middle air inlet 1513, that is, the middle air inlet 1513 simultaneously penetrates through three surfaces of the lower heat dissipating fin group 151, and each of the lower heat dissipating fins 1512 is partially covered by the first lower wind shielding sheet 1531 and partially covered by the second lower wind shielding sheet 1532. Therefore, the first lower wind-shielding sheet 1531 and the second lower wind-shielding sheet 1532 may be configured to shield the airflow, so as to prevent the airflow from flowing downward in a direction perpendicular to the heat-conducting substrate 11, and thus the airflow flows out along the width direction of the heat-conducting substrate 11, and the heat exchange is more efficient and rapid.

The lower heat dissipating mechanism 15 further includes a plurality of first lower heat dissipating tubes 155 and a plurality of second lower heat dissipating tubes 156, the first lower heat dissipating tubes 155 and the second lower heat dissipating tubes 156 are respectively exposed at two opposite sides of the lower heat dissipating fin set 151, the first lower heat dissipating tubes 155 pass through a portion of the lower heat dissipating fins 1512 in the lower heat dissipating fin set 151, and the second lower heat dissipating tubes 156 pass through a portion of the lower heat dissipating fins 1512 in the lower heat dissipating fin set 151. In this embodiment, the length direction of the first lower heat pipe 155 is parallel to the length direction of the second lower heat pipe 156 and parallel to the length direction of the middle air inlet 1513.

In the embodiment, the first lower-layer heat pipe 155 is substantially rectangular, and one end of the first lower-layer heat pipe 155 in the length direction is connected to the heat conducting substrate 11, and the other end thereof penetrates through a part of the lower-layer heat fins 1512 in the lower-layer heat fin set 151; both ends of the width direction are exposed to the external environment, so that heat dissipation can be facilitated. The first lower heat pipes 155 are soldered to the lower heat fins 1512 using a fin-through process. The shape and structure of the second lower heat pipe 156 are the same as those of the first lower heat pipe 155, one end of the second lower heat pipe 156 in the length direction is connected to the heat conductive substrate 11, the other end is inserted into a part of the lower heat fins 1512 in the lower heat fin set 151, and the second lower heat pipe 156 is also welded to the lower heat fins 1512 by a fin-penetrating process.

Referring to fig. 2 and 4, the extension line of each connecting pipe 1343 is located between two adjacent first lower radiating pipes 155 or between two adjacent second lower radiating pipes 156, that is, the upper radiating pipe 134, the first lower radiating pipe 155 and the second lower radiating pipe 156 are arranged in a staggered manner, i.e., staggered from left to right and staggered from top to bottom, so as to reduce the mutual influence among the radiating pipes, and facilitate the heat dissipation of the upper radiating pipe 134, the first lower radiating pipe 155 and the second lower radiating pipe 156. In this embodiment, a middle air inlet 1513 is disposed between the first lower heat dissipation tubes 155 and the second lower heat dissipation tubes 156, the middle air inlet 1513 is disposed along the length direction of the heat conduction substrate 11, and the middle air inlet 1513 can be used for passing air flow, so as to ensure that the lower heat dissipation fin set 151 can have sufficient air inlet amount and turbulent effect of air, and facilitate heat dissipation of the lower heat dissipation fin set 151.

Referring to fig. 1, 2 and 5, the lower heat dissipation mechanism 15 further includes at least one first fan 157 and at least one second fan 158, and the middle air inlet 1513 is located between the at least one first fan 157 and the at least one second fan 158. In this embodiment, at least one first fan 157 and a plurality of first lower heat pipes 155 are respectively installed on two adjacent sides of the lower heat fin set 151, and at least one second fan 158 and a plurality of second lower heat pipes 156 are respectively installed on the other two adjacent sides of the lower heat fin set 151, that is, at least one first fan 157 and at least one second fan 158 are respectively installed on two opposite sides of the lower heat fin set 151, specifically, the first lower heat pipes 155 and the second lower heat pipes 156 are respectively exposed on two opposite sides of the lower heat fin set 151; the at least one first fan 157 and the at least one second fan 158 are respectively mounted on the other two opposite sides of the lower heat sink fin set 151. The at least one first fan 157 may be used to exhaust air to the outside to transfer the heat of the lower heat dissipating fin group 151 to the outside along with the air flow. The at least one second fan 158 may also be used to exhaust air outwards, and form a convection effect with the at least one first fan 157 to accelerate the heat dissipation of the lower heat dissipation fin set 151. In the present embodiment, the number of the first fan 157 and the second fan 158 is two. In other embodiments, the number of the first fan 157 and the second fan 158 may also be one, three, or more.

To sum up, the utility model provides a heat abstractor 10 is through setting up upper heat dissipation mechanism 13 and lower floor's heat dissipation mechanism 15 to lower floor's heat dissipation mechanism 15 is equipped with middle part air intake 1513, on the basis that does not increase heat abstractor 10 volume, and the heat can be fast through heat conduction base plate 11, upper radiating tube 134 conducts to upper heat radiation fins 1321, can also be fast through heat conduction base plate 11, first lower floor's cooling tube 155 conduction to lower floor's heat radiation fins 1512, has promoted heat abstractor 10's heat dispersion.

Referring to fig. 2, 5 and 6, an embodiment of the invention further provides a light source system 1, which includes a light source device 20 and a heat sink 10, wherein the light source device 20 is mounted on the first substrate surface 112 and located between the upper heat sink fin sets 132.

The light source device 20 is mounted on the first substrate surface 112 of the heat conducting substrate 11 through at least one light source locking hole 1121. In the present embodiment, the light source device 20 is a high power LED light source, and as an example, the power of the light source device 20 may be 1000w or more. In other embodiments, the light source device 20 may be any other light source.

The light source system 1 further includes a light box 30, and in the present embodiment, the light box 30 is substantially a rectangular parallelepiped housing structure with one end open, and may correspond to the shape of the heat sink 11. In other embodiments, when the heat sink 11 has a spherical shape, an ellipsoidal shape, or a hexagonal prism shape, the light box 30 may have a spherical shape, an ellipsoidal shape, or a hexagonal prism shape with one end open. The specific shape of the lamp box 30 can be designed according to the actual shape of the heat dissipation device 11 to correspond to the shape and the size of the heat dissipation device 11, so that the lamp box 30 can be attached to the heat dissipation device 11 as much as possible, and the gap between the lamp box 30 and the heat dissipation device 11 is reduced as much as possible, so that the airflow entering from the lamp box 30 can directly enter the heat dissipation device 11 without flowing in the gap between the lamp box 30 and the heat dissipation device 11, thereby avoiding the occurrence of the airflow disorder phenomenon, and further increasing the heat dissipation effect of the heat dissipation device 10.

The light box 30 includes a first side 31, a second side 32, a third side 33 and a bottom 34, wherein the first side 31 is opposite to the second side 32, the third side 33 is connected between the first side 31 and the second side 32, and the bottom 34 is connected to the first side 31, the second side 32 and the third side 33. In this embodiment, the first side surface 31 has a plurality of first through holes 312, the second side surface 32 has a plurality of second through holes 322, and the third side surface 33 has a plurality of third through holes 332. In other embodiments, the third through hole 332 may be opened on both the third side surface 33 and the bottom surface 34. In other embodiments, the third through hole 332 may also be opened on the third side surface 33, the surface opposite to the third side surface 33, and the bottom surface 34, i.e., the third through hole 332 may also correspond to the middle air inlet 1513. This arrangement can prevent the air flow from being disturbed, and increase the air intake of the third through hole 332, thereby improving the heat dissipation performance of the heat dissipation device 10 and prolonging the service life of the light source system 1. In this embodiment, the first through holes 312, the second through holes 322, and the third through holes 332 are all parallel long holes. In other embodiments, the first, second, and third through holes 312, 322, 332 may also be a plurality of spaced circular, triangular, or rectangular holes. The first through holes 312 and the second through holes 322 correspond to two opposite sides of the lower heat dissipating fin set 151, respectively, and the third through holes 332 correspond to the middle air inlet 1513, that is, the air flow can enter the heat dissipating device 10 from the third through holes 332, and pass through the middle air inlet 1513, wherein a portion of the air flow flows out from the first through holes 312 through the first lower heat dissipating fins and takes away the heat in the heat dissipating device 10, and another portion of the air flow flows out from the second through holes 322 through the second lower heat dissipating fins and takes away the heat in the heat dissipating device 10. The light source device 20 provided by the embodiment can effectively increase the air volume, and can effectively and quickly exchange heat compared with the traditional direct-up and direct-down air duct.

To sum up, the utility model provides a light source system 1, through setting up upper heat dissipation mechanism 13 and lower floor's heat dissipation mechanism 15, on the basis that does not increase heat abstractor 10 volume, light source device 20's heat can be fast through heat conduction base plate 11, upper heat dissipation pipe 134 conducts to upper heat dissipation fin 1321, can also be fast through heat conduction base plate 11, first lower heat dissipation pipe 155 conducts to lower floor's heat dissipation fin 1512, and lower floor's heat dissipation mechanism 15 is equipped with middle part air intake 1513, a plurality of third through holes 332 that correspond with air intake 1513 are seted up to lamp house 30, can realize effectively dispelling the heat fast to light source device 20, the heat dispersion of heat abstractor 10 has been promoted, light source device 20's temperature has effectively been reduced, thereby light source system 1's life has been prolonged.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (12)

1. A heat dissipating device, comprising:

a heat-conducting substrate including a first substrate surface and a second substrate surface which are opposite to each other;

the upper-layer heat dissipation mechanism comprises a plurality of groups of upper-layer heat dissipation fin groups arranged at intervals, and the upper-layer heat dissipation fin groups are arranged on the first substrate surface; and

lower floor's heat dissipation mechanism, including lower floor's radiating fin group and lower floor's wind structure, lower floor's radiating fin group install in the second base plate face, and set up the middle part air intake, lower floor's radiating fin group includes a plurality of interval arrangement's lower floor's radiating fin, the middle part air intake runs through every lower floor's radiating fin, lower floor's wind structure set up in lower floor's radiating fin group keeps away from the one end of second base plate face.

2. The heat dissipating device as claimed in claim 1, wherein the upper heat dissipating mechanism further comprises an upper wind shielding plate disposed at an end of the upper heat dissipating fin group away from the first substrate surface.

3. The heat dissipating device of claim 2, wherein said upper set of fins comprises a plurality of upper fins arranged in parallel and spaced apart relation to each other, each of said upper fins being partially covered by said upper windshield.

4. The heat sink of claim 3, wherein the plurality of lower fins are parallel to each other and the plurality of upper fins are parallel to the plurality of lower fins.

5. The heat dissipating device as claimed in claim 3, wherein the heat conducting substrate is provided with a plurality of heat pipe burying grooves, the upper heat dissipating mechanism further comprises a plurality of upper heat dissipating pipes, the upper heat dissipating pipes are arranged in a staggered manner and spaced apart from each other, one end of each of the upper heat dissipating pipes is mounted in the heat pipe burying grooves, and the other end of each of the upper heat dissipating pipes is inserted into the upper heat dissipating fins.

6. The heat dissipating device of claim 1, wherein the lower heat dissipating mechanism further comprises a plurality of first lower heat dissipating tubes and a plurality of second lower heat dissipating tubes, the first lower heat dissipating tubes and the second lower heat dissipating tubes being exposed to opposite sides of the lower set of heat dissipating fins, respectively, the first lower heat dissipating tubes passing through a portion of the lower set of heat dissipating fins, the second lower heat dissipating tubes passing through a portion of the lower set of heat dissipating fins.

7. The heat dissipating device as claimed in claim 6, wherein one end of the first lower heat dissipating pipe is connected to the heat conductive substrate, and the other end of the first lower heat dissipating pipe penetrates through a part of the lower heat dissipating fins in the lower heat dissipating fin group; one end of the second lower-layer radiating pipe is connected with the heat conducting substrate, and the other end of the second lower-layer radiating pipe penetrates through part of lower-layer radiating fins in the lower-layer radiating fin group.

8. The heat dissipating device of claim 6, wherein the length direction of the first lower pipe is parallel to the length direction of the second lower pipe and parallel to the length direction of the middle inlet.

9. The heat dissipating device of claim 1, wherein the lower wind shielding structure comprises a first lower wind shielding plate and a second lower wind shielding plate, the first lower wind shielding plate and the second lower wind shielding plate are respectively located at two opposite sides of the central air inlet, and each of the lower heat dissipating fins is partially covered by the first lower wind shielding plate and partially covered by the second lower wind shielding plate.

10. The heat dissipating device of claim 1, wherein the lower heat dissipating mechanism further comprises at least one first fan and at least one second fan, the at least one first fan and the at least one second fan are respectively mounted on opposite sides of the lower heat dissipating fin set, and the middle air inlet is located between the at least one first fan and the at least one second fan.

11. A light source system, comprising a light source device and the heat sink device as claimed in any one of claims 1 to 10, wherein the first substrate surface is provided with at least one light source locking hole, and the light source device is mounted on the first substrate surface and located between the sets of upper heat sink fin sets through the at least one light source locking hole.

12. The light source system according to claim 11, further comprising a light box, wherein the light box includes a first side, a second side, and a third side, the first side is opposite to the second side, the third side is connected between the first side and the second side, the first side is provided with a plurality of first through holes, the second side is provided with a plurality of second through holes, the third side is provided with a plurality of third through holes, the plurality of first through holes and the plurality of second through holes respectively correspond to opposite sides of the lower fin group, and the plurality of third through holes correspond to the middle air inlet.

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