CN107180805B - Chip packaging structure - Google Patents
Chip packaging structure Download PDFInfo
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- CN107180805B CN107180805B CN201610136225.9A CN201610136225A CN107180805B CN 107180805 B CN107180805 B CN 107180805B CN 201610136225 A CN201610136225 A CN 201610136225A CN 107180805 B CN107180805 B CN 107180805B
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- chip
- refrigeration module
- thermoelectric refrigeration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of integrated circuits and discloses a chip packaging structure. The present invention includes: the thermoelectric refrigeration module comprises a chip, a thermoelectric refrigeration module and a packaging body; thermoelectric refrigeration module and chip all are located the packaging body, and thermoelectric refrigeration module has relative heat absorption surface and radiating surface, and the heat absorption surface is laminated in the one side of chip, and radiating surface exposes in packaging body surface. The invention can overcome the problem of poor passive heat dissipation efficiency in the prior art, thereby further improving the heat dissipation efficiency and the working performance of the chip.
Description
Technical Field
The invention relates to the technical field of integrated circuits, in particular to a chip packaging structure.
Background
With the rapid development of microelectronics and communication technologies, electronic devices are increasingly closely related to the work and life of people. In recent years, portable devices such as smart phones have also been rapidly developed. Along with the rapid promotion of smart mobile phone application performance, if a large amount of heat energy that during operation release such as radio frequency chip, baseband chip, graphics processing chip in the cell-phone distributes away in time, can lead to the chip high temperature, influence electronic equipment's stability, still can lead to the chip to burn down when serious.
As shown in fig. 1, a chip 1 in a conventional chip package structure is generally covered by a package body 2 formed by a molding compound and isolated from the outside. And the thermal conductivity of the material of the package itself, such as epoxy resin, is only 0.2 watts per meter per kelvin (unit: W/(m.k)), where K represents the kelvin temperature, and the thermal conductivity of the package itself is poor.
The traditional chip cooling mode mainly adopts a passive cooling mode, namely a refrigerating device or a system for cooling the surface of a package body of a chip is arranged in the electronic equipment, and the refrigerating device or the system can be designed and selected according to the size of the package surface of the chip, the heat productivity of the chip and the available installation space in the electronic equipment. However, the passive heat dissipation method is not only complex in structure and high in cost, but also the chip itself is still hot and cold due to the installation outside the package, and the heat dissipation efficiency is difficult to improve, so that the heat dissipation requirements of light and thin electronic devices such as smart phones cannot be met.
Disclosure of Invention
The invention aims to provide a chip packaging structure to overcome the problem of poor passive heat dissipation efficiency in the prior art, so that the heat dissipation efficiency and the working performance of a chip are further improved.
In order to solve the above technical problems, an embodiment of the present invention provides a chip package structure, including: the thermoelectric refrigeration module comprises a chip, a thermoelectric refrigeration module and a packaging body; the thermoelectric refrigeration module and the chip are both positioned in the packaging body, the thermoelectric refrigeration module is provided with a heat absorption surface and a heat dissipation surface which are opposite, the heat absorption surface is attached to one surface of the chip, and the heat dissipation surface is exposed on the surface of the packaging body.
Compared with the prior art, the thermoelectric refrigeration module and the chip are directly arranged in the packaging body, the heat absorption surface of the thermoelectric refrigeration module is attached to the heating surface of the chip, and the heat dissipation surface of the thermoelectric refrigeration module is exposed on the surface of the packaging body, so that the heating surface of the chip is directly dissipated by utilizing the flexible refrigeration performance of the thermoelectric refrigeration module. The embodiment of the invention eliminates the phenomena of internal heat and external cold of the chip and poor heat dissipation effect caused by low heat conduction efficiency of plastic packaging materials such as epoxy resin and the like in the traditional refrigeration scheme, so that the chip is cooled by a straight cold source, the chip is cooled more effectively, the stability of the chip in long-time work is improved, and the power consumption of the chip is reduced.
Preferably, the chip and the surface attached to the heat absorption surface are provided with signal contacts, and the signal contacts are electrically connected to the packaging body through wires, so that the chip can be cooled while a signal is led out from one surface of the chip, and the flexibility of the chip packaging structure is improved.
Preferably, the chip is flip-chip mounted on the package body, and the chip has a first surface and a second surface opposite to each other, the first surface is attached to the heat absorbing surface, and the second surface is electrically connected to the package body. The chip is inversely arranged on the packaging body, so that the combination area of the heat absorption surface of the thermoelectric refrigeration module and the chip can be increased, and the heat dissipation efficiency is further improved.
Preferably, the chip packaging structure further includes a heat conduction member, and the heat absorption surface of the thermoelectric refrigeration module is fixed to the chip through the heat conduction member.
Preferably, the heat conducting piece is heat conducting glue, so that the thermoelectric refrigeration module can be conveniently fixed on the chip, and the heat conducting efficiency between the chip and the thermoelectric refrigeration module can be further improved.
Preferably, the heat absorbing surface has a center position corresponding to a center position of the chip, so that heat energy released from the chip can be uniformly dissipated.
Drawings
FIG. 1 is a schematic diagram of a prior art chip package structure;
FIG. 2 is a schematic structural diagram of a chip package structure according to a first embodiment of the present invention;
fig. 3 is a schematic structural diagram of a chip package structure according to a second embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solutions claimed in the claims of the present application can be implemented without these technical details and with various changes and modifications based on the following embodiments.
In the existing chip packaging structure, the chip is radiated by heat exchange between heat conduction of the plastic packaging material and external air. In the embodiment of the invention, the thermoelectric refrigeration module is added in the packaging body and is combined with the chip so as to realize active heat dissipation, namely, the heat generated by the chip is directly and physically conducted to the cold source of the thermoelectric refrigeration module connected with the chip, so that more effective heat dissipation effect is realized. The chip packaging structure can directly replace the scheme of a traditional chip packaging structure with an additional passive heat dissipation device. Therefore, the present invention has more advantages, such as higher cost of additional passive heat dissipation devices (e.g. heat sink and fan), and additional power consumption; meanwhile, the required space is also large; in addition, the traditional packaging heat dissipation mode causes internal heat and external cold, and the chip heat dissipation efficiency is low, but the heat dissipation mode of the embodiment of the invention causes the internal heat and the external heat, and the chip is not easy to heat up, thereby having better heat dissipation efficiency and better heat dissipation effect. Therefore, the chip packaging structure has better application performance in the current highly integrated product application (such as a product with higher requirement on the volume of a mobile phone).
A first embodiment of the present invention relates to a chip package structure, which can be widely applied to various chip packages, including but not limited to: a baseband chip, an audio and video processing chip, an image sensing chip and the like. As shown in fig. 2, the chip package structure includes: chip 1, packaging body 2 and thermoelectric refrigeration module 3. The thermoelectric refrigeration module 3 is connected to a power supply circuit (not shown) of the chip 1, and obtains a suitable direct current from the power supply circuit of the chip 1, and the magnitude of the direct current introduced into the thermoelectric refrigeration module determines the refrigeration capacity of the thermoelectric refrigeration module according to the thermoelectric refrigeration principle, so that the thermoelectric refrigeration module can have a suitable cooling capacity by optimizing the impedance of the thermoelectric refrigeration module, and can release less joule heat. The thermoelectric refrigeration module 3 and the chip 1 are both located in the package 2. The thermoelectric refrigeration module 3 has a heat absorption surface and a heat dissipation surface opposite to each other, the heat absorption surface is attached to one surface of the chip 1, and the heat dissipation surface is exposed on the surface of the package body 2. Namely, the thermoelectric refrigeration module is stacked on the chip, and the thermoelectric refrigeration module 3 and the chip 1 are encapsulated by the packaging body 2. The package body in this embodiment may be made of a conventional plastic package material, such as epoxy resin. The packaging body plays a certain supporting role for the thermoelectric refrigeration module and has a certain protection effect on the chip. Preferably, the chip package structure of the present embodiment further includes a heat conducting member 4, the heat absorbing surface of the thermoelectric refrigeration module 2 is fixed to the chip 1 through the heat conducting member 4, and preferably, the heat conducting member can be made of a heat conducting adhesive, and the heat conducting adhesive can fix the thermoelectric refrigeration module to the chip, and can enhance the physical heat conducting capability between the chip and the heat absorbing surface of the thermoelectric refrigeration module, thereby improving the heat dissipation efficiency.
The chip packaging structure of the embodiment is suitable for various chip packaging processes. The chip package structure of the present embodiment will be described by taking a chip manufactured by a Wire-Bonding (Wire-Bonding) process as an example. Specifically, in the present embodiment, a signal contact is disposed on a surface of the chip 1 attached to the heat absorbing surface, and the signal contact is electrically connected to the package through a wire. In practical application, the signal contact of chip sets up in the edge on chip surface usually, can be fixed in the surface of chip with thermoelectric refrigeration module earlier to make thermoelectric refrigeration module dodge and open the signal contact, and make the position of reserving out the wire between thermoelectric refrigeration module and the chip, the rethread wire is connected to the packaging body respectively with the signal contact, the packaging body has the signal pin that can be connected with external circuit. In other words, the thermoelectric refrigeration module is embedded in the package body in a manner that the heat absorption surface of the thermoelectric refrigeration module is attached to the chip 1, and the positions of the signal contacts and the wires are reserved on the surface of the chip 1 attached to the heat absorption surface.
Preferably, the center position of the heat absorbing surface of the thermoelectric refrigeration module in the embodiment corresponds to the center position of the chip, so that the heat energy released by the chip can be uniformly dissipated.
The thermoelectric cooling module 3 in the present embodiment includes: a hot side substrate 30, a cold side substrate 31, an upper baffle 32, a lower baffle 33, a heat sink 34, and at least one thermocouple pair 35. The upper baffle 32 and the lower baffle 33 are disposed at two ends of the thermocouple pair 35, the upper baffle 32 and the lower baffle 33 are disposed between the cold end substrate 31 and the hot end substrate 30, and the heat sink 34 is disposed on the hot end substrate 30. The heat sink 34 is exposed to the package 2 as a heat dissipation surface of the thermoelectric cooling module 3, and the cold-side substrate 31 is attached to the chip 1 as a heat absorption surface of the thermoelectric cooling module 3. In practical applications, the hot end substrate 30 and the cold end substrate 31 are preferably ceramic substrates, and the ceramic substrates have good insulating property and heat conducting property. The upper baffle 32 and the lower baffle 33 can be made of copper, aluminum, gold or other metal into thin sheets and connected to a power supply circuit of the thermoelectric refrigeration module. It should be noted that the thermoelectric refrigeration module of the present embodiment includes a plurality of thermocouple pairs, and the thermocouple pairs are all connected in parallel between the hot-side substrate and the cold-side substrate. The number of thermocouple pairs may be set according to the amount of heat generated by the chip. When the thermoelectric refrigeration module comprises a plurality of thermocouple pairs, the current in each thermocouple pair in the thermoelectric refrigeration module is in a series connection mode, and the heat conduction is in a parallel connection mode, so that stronger energy supply capacity can be provided, and the heat dissipation requirements of different chips can be met.
When the chip is in operation, because the supply circuit of chip can provide suitable direct current to thermoelectric refrigeration module, and thermoelectric refrigeration module gets electric back, can make the cold junction base plate heat absorption, and the hot junction base plate generates heat to can directly absorb a large amount of heat energy that the chip produced, and give off the encapsulation body outside through the fin.
Therefore, in the chip packaging structure of the embodiment, the thermoelectric refrigeration module is packaged on the chip, so that when the chip works, the thermoelectric refrigeration module automatically conducts heat energy, a large amount of heat energy released by the chip is directly conducted to the surface of the packaging body, the whole chip packaging structure is internally cooled and externally heated, the temperature of the chip is not easily increased, and the heat dissipation efficiency is better. Compared with the prior art, the active heat dissipation device has the advantages that the active heat dissipation can be performed on the chip, the heat dissipation efficiency is improved, and the overall power consumption of the chip can be further reduced due to the fact that the working temperature of the chip is reduced.
A second embodiment of the present invention relates to a chip packaging structure. The second embodiment is substantially the same as the first embodiment, and mainly differs therefrom in that: in the first embodiment, the chip in the chip package structure performs signal transmission by using a wire bonding process, and the position of a signal contact needs to be reserved on the surface, to which the chip is attached, of the chip and the heat absorption surface. In the second embodiment of the present invention, the chip is flip-chip mounted on the package, so that the bonding area between the chip and the thermoelectric cooling module can be increased as much as possible, and the heat dissipation efficiency can be further improved.
As shown in fig. 3, the chip 1 in the present embodiment is flip-chip mounted on the package 2. The chip 1 has a first surface 10 and a second surface 11 opposite to each other, the first surface 10 is attached to the heat absorption surface of the thermoelectric refrigeration module, and the second surface 11 is electrically connected to the package 2. Namely, the leading-out position of the signal contact of the chip is back to the joint surface of the chip and the thermoelectric refrigeration module. It should be noted that the signal contacts of the chip in the chip package structure of the present embodiment may be connected to the bonding pads through wires or directly connected to the bonding pads through bump structures.
Because in the chip packaging structure of this embodiment, the signal contact of chip is located the first surface of chip and thermoelectric refrigeration module laminating in the second surface of chip to make the setting of signal contact can not account for the heat conduction area between the heat absorption surface of thermoelectric refrigeration module and the chip, and then make the heat absorption surface of thermoelectric refrigeration module match with the area of the first surface of chip, make the heat conduction area between thermoelectric refrigeration module and the chip obtain improving, further improve the radiating efficiency.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.
Claims (3)
1. A chip package structure adapted for use in an electronic device, comprising: the thermoelectric refrigeration module comprises a chip, a thermoelectric refrigeration module and a packaging body;
the thermoelectric refrigeration module and the chip are both positioned in the packaging body, the thermoelectric refrigeration module is provided with a heat absorption surface and a heat dissipation surface which are opposite, the heat absorption surface is attached to one surface of the chip, and the heat dissipation surface is exposed on the surface of the packaging body;
the chip is inversely arranged on the packaging body and is provided with a first surface and a second surface which are opposite, the first surface is attached to the heat absorption surface, and the second surface is electrically connected with the packaging body; wherein a center position of the heat absorbing surface corresponds to a center position of the chip;
the thermoelectric refrigeration module includes: the thermoelectric module comprises a hot end substrate, a cold end substrate, an upper flow deflector, a lower flow deflector, a radiating fin and a plurality of thermoelectric couple pairs, wherein the plurality of thermoelectric couple pairs are connected between the hot end substrate and the cold end substrate in parallel;
the upper flow deflector and the lower flow deflector are arranged at two ends of the thermocouple pair, the upper flow deflector and the lower flow deflector are positioned between the cold end substrate and the hot end substrate, and the radiating fin is arranged on the hot end substrate and exposed to the packaging body; the cold end substrate is attached to the chip; the upper flow deflector and the lower flow deflector are made of metal sheets, and the hot end substrate and the cold end substrate are made of ceramic substrates;
the thermoelectric refrigeration module acquires direct current from a power supply circuit of the chip, and controls the refrigeration capacity of the thermoelectric refrigeration module by the size of the direct current introduced into the thermoelectric refrigeration module and by changing the impedance of the thermoelectric refrigeration module; after the thermoelectric refrigeration module is electrified, the cold-end substrate absorbs heat, and the hot-end substrate heats and emits heat to the outside of the packaging body through the radiating fins;
the chip packaging structure further comprises a heat conducting piece, the heat absorbing surface of the thermoelectric refrigeration module is fixed on the chip through the heat conducting piece, and the heat conducting piece is made of heat conducting glue.
2. The chip package structure of claim 1,
the chip with the one side of heat absorption surface laminating is equipped with the signal contact, the signal contact pass through wire electric connection in the packaging body.
3. The chip package structure according to claim 1, wherein the package body is made of epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610136225.9A CN107180805B (en) | 2016-03-10 | 2016-03-10 | Chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610136225.9A CN107180805B (en) | 2016-03-10 | 2016-03-10 | Chip packaging structure |
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| CN107180805A CN107180805A (en) | 2017-09-19 |
| CN107180805B true CN107180805B (en) | 2020-11-13 |
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| CN201610136225.9A Active CN107180805B (en) | 2016-03-10 | 2016-03-10 | Chip packaging structure |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110783288B (en) * | 2019-09-29 | 2021-10-22 | 华进半导体封装先导技术研发中心有限公司 | Chip heat dissipation packaging structure |
| CN112490208A (en) * | 2020-12-31 | 2021-03-12 | 合肥祖安投资合伙企业(有限合伙) | Chip packaging structure with inductor |
| CN113257761B (en) * | 2021-02-24 | 2024-05-07 | 北京时代民芯科技有限公司 | Active heat dissipation structure of flip chip device and interconnection method |
| US11444001B1 (en) | 2021-05-07 | 2022-09-13 | Western Digital Technologies, Inc. | Thermoelectric semiconductor device and method of making same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030011159A (en) * | 2001-07-28 | 2003-02-07 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package |
| CN101641787A (en) * | 2007-03-23 | 2010-02-03 | 丰田自动车株式会社 | Semiconductor device and electric vehicle |
| CN102800636A (en) * | 2012-08-28 | 2012-11-28 | 中国科学院微电子研究所 | Electronic component package and manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7915081B2 (en) * | 2006-03-31 | 2011-03-29 | Intel Corporation | Flexible interconnect pattern on semiconductor package |
| KR101928005B1 (en) * | 2011-12-01 | 2019-03-13 | 삼성전자주식회사 | Thermoelectric cooling packages and thermal management methods thereof |
| CN104576912A (en) * | 2013-10-22 | 2015-04-29 | 张红碧 | Thermopile and automobile exhaust waste heat generation and refrigeration device employing same |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030011159A (en) * | 2001-07-28 | 2003-02-07 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package |
| CN101641787A (en) * | 2007-03-23 | 2010-02-03 | 丰田自动车株式会社 | Semiconductor device and electric vehicle |
| CN102800636A (en) * | 2012-08-28 | 2012-11-28 | 中国科学院微电子研究所 | Electronic component package and manufacturing method thereof |
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Effective date of registration: 20221107 Address after: 266500 No. 687, Binhai street, Huangdao District, Qingdao, Shandong Patentee after: Chenxin Technology Co.,Ltd. Address before: 200233 4 building, No. 333, No. 41, Qinjiang Road, Shanghai, Xuhui District Patentee before: LEADCORE TECHNOLOGY Co.,Ltd. Patentee before: DATANG SEMICONDUCTOR DESIGN Co.,Ltd. |
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Address after: Room 102, Building 16, No. 1699, the Pearl River Road, Huangdao District, Qingdao, Shandong 266499 Patentee after: Chenxin Technology Co.,Ltd. Address before: 266500 No. 687, Binhai street, Huangdao District, Qingdao, Shandong Patentee before: Chenxin Technology Co.,Ltd. |