CN211654811U - Radiating structure of chip packaging - Google Patents
Radiating structure of chip packaging Download PDFInfo
- Publication number
- CN211654811U CN211654811U CN202021855692.5U CN202021855692U CN211654811U CN 211654811 U CN211654811 U CN 211654811U CN 202021855692 U CN202021855692 U CN 202021855692U CN 211654811 U CN211654811 U CN 211654811U
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- chip
- semiconductor refrigeration
- heat dissipation
- refrigeration piece
- square flat
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Abstract
The utility model provides a radiating structure of chip package, including the PCB board of bottom, the PCB board is as the base plate, and the square flat pin-free encapsulation chip of surface connection on the PCB board, square flat pin-free encapsulation chip upper surface connection semiconductor refrigeration piece, the cold side of semiconductor refrigeration piece and the front of square flat pin-free encapsulation chip paste together, and the hot surface material is connected to the hot side of semiconductor refrigeration piece, hot surface material upper surface connection fin. The utility model discloses a semiconductor refrigeration piece transmits the one end of chip with high temperature through the endothermic function of itself, and the other end passes through the fin heat dissipation, and heat absorption is exothermic on one side, lets chip temperature reduce rapidly, and on high temperature transmission arrived thermal interface material, the temperature on the thermal interface is through the fin heat dissipation again, and it can reduce the temperature of chip itself 20 ℃ or even lower, makes the chip radiating effect more obvious fast.
Description
Technical Field
The utility model relates to a chip package heat dissipation field specifically is a radiating structure of chip package.
Background
In the prior art, a chip packaging heat dissipation structure is formed by directly connecting a PCB (printed circuit board) with a square Flat QFN (Quad Flat No-lead) packaging chip, wherein QFN is an abbreviation of Quad Flat No-lead, a heat sink is directly connected to the back of the chip through heat-conducting glue, and then the heat sink is connected with a fan to dissipate heat for the chip through the heat sink. The chip temperature heat dissipation is slow, and the chip is in high temperature state for a long time, and this current situation does not give off the temperature of chip rapidly, has certain limitation on the radiating effect of chip.
SUMMERY OF THE UTILITY MODEL
In view of the above shortcomings of the prior art, the present invention is directed to a heat sink directly mounted on a package chip through a thermal conductive adhesive to dissipate heat, so as to solve the problems of over-high temperature and slow heat dissipation.
In order to realize the purpose of the utility model, the utility model discloses technical scheme as follows:
the utility model provides a radiating structure of chip package, PCB board 1 including the bottom, PCB board 1 is as the base plate, and the surface connection is no pin encapsulation chip 2 for square flat on PCB board 1, and the surface connection semiconductor refrigeration piece 3 is gone up to no pin encapsulation chip 2 for square flat, and the cold side of semiconductor refrigeration piece 3 is in the same place with the front of no pin encapsulation chip for square flat paste, and thermal interface material 4 is connected to the hot face of semiconductor refrigeration piece 3, and thermal interface material 4 upper surface connection fin 5.
Preferably, the pads on the front surface of the PCB 1 and the pads on the back surface of the quad flat non-leaded package chip 2 are integrally soldered by solder paste.
Preferably, the cold surface of the semiconductor refrigeration sheet 3 and the front surface of the square flat pin-free packaging chip 2 are adhered together through a heat conducting glue.
Preferably, the hot surface of the semiconductor refrigeration sheet 3 is connected with the thermal interface material 4 through a heat-conducting glue.
Preferably, the thermal interface material 4 and the heat sink are fixed by a thermally conductive adhesive.
Preferably, the thermal interface material 4 is a silicone grease material.
Preferably, the heat sink 5 is an aluminum extruded heat sink.
The utility model discloses a theory of operation does: the utility model discloses a semiconductor refrigeration piece has the function that makes the heat flow in the other end from the one end of component, and the semiconductor refrigeration piece transmits the one end of chip with the high temperature of component, and the other end passes through the fin heat dissipation, and heat absorption is exothermic on one side, lets the chip temperature reduce rapidly, and on high temperature transmission thermal interface material, the heat dissipation of temperature rethread fin on the thermal interface.
The utility model has the advantages that: the temperature of the chip can be reduced by 20 ℃ or even lower, so that the heat dissipation effect of the chip is faster and more obvious.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
The packaging structure comprises a PCB (printed circuit board) 1, a square flat pin-free packaging chip 2, a semiconductor refrigerating piece 3, a thermal interface material 4 and a radiating piece 5.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
As shown in fig. 1, the present embodiment provides a chip package heat dissipation structure, including PCB board 1 of bottom, PCB board 1 is as the base plate, the square flat pin-free packaged chip 2 of surface connection on PCB board 1, the semiconductor chilling plate 3 of surface connection on the square flat pin-free packaged chip 2, semiconductor chilling plate 3 is TEC, the cold side of semiconductor chilling plate 3 is pasted together with the front of square flat pin-free packaged chip, thermal interface material 4 is connected to the hot side of semiconductor chilling plate 3, heat sink 5 is connected to the upper surface of thermal interface material 4.
In this embodiment, the pads on the front surface of the PCB board 1 and the pads on the back surface of the quad flat non-leaded package chip 2 are soldered together by solder paste.
The cold surface of the semiconductor refrigeration piece 3 is adhered to the front surface of the square flat pin-free packaging chip 2 through heat conducting glue.
The hot surface of the semiconductor refrigeration sheet 3 is connected with the thermal interface material 4 through heat-conducting glue.
The thermal interface material 4 and the radiating fin are fixed through heat conducting glue.
The thermal interface material 4 is a silicone grease material, is a silicone grease with high thermal conductivity coefficient, and is a silicone rubber which is easy to cling to the surface before curing. The material mainly comprises a silicone oil substrate, ZnO and Ag materials, and has the advantages of high heat conductivity coefficient, easy adhesion to the surface, no need of curing, thickness of 2mil and heat conductivity coefficient of 3-5W/m.K.
The heat sink 5 is an aluminum extruded heat sink.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (7)
1. A radiating structure of chip package, its characterized in that: PCB board (1) including the bottom, PCB board (1) is as the base plate, the square flat pin-free encapsulation chip of surface connection (2) on PCB board (1), square flat pin-free encapsulation chip (2) upper surface connection semiconductor refrigeration piece (3), the cold side of semiconductor refrigeration piece (3) is in the same place with the front of square flat pin-free encapsulation chip (2) is pasted, hot interface material (4) are connected to the hot side of semiconductor refrigeration piece (3), hot interface material (4) upper surface connection fin (5).
2. The chip package heat dissipation structure of claim 1, wherein: and the bonding pad on the front surface of the PCB (1) and the bonding pad on the back surface of the square flat pin-free packaging chip (2) are welded into a whole through soldering paste.
3. The chip package heat dissipation structure of claim 1, wherein: the cold surface of the semiconductor refrigeration piece (3) is adhered to the front surface of the square flat pin-free packaging chip (2) through heat-conducting glue.
4. The chip package heat dissipation structure of claim 1, wherein: the hot surface of the semiconductor refrigerating sheet (3) is connected with the thermal interface material (4) through heat-conducting glue.
5. The chip package heat dissipation structure of claim 1, wherein: the thermal interface material (4) and the radiating fin (5) are fixed through heat conducting glue.
6. The chip package heat dissipation structure of claim 1, wherein: the thermal interface material (4) is a silicone grease material.
7. The chip package heat dissipation structure of claim 1, wherein: the radiating fins (5) are aluminum extruded radiating fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021855692.5U CN211654811U (en) | 2020-08-31 | 2020-08-31 | Radiating structure of chip packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021855692.5U CN211654811U (en) | 2020-08-31 | 2020-08-31 | Radiating structure of chip packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211654811U true CN211654811U (en) | 2020-10-09 |
Family
ID=72690395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021855692.5U Active CN211654811U (en) | 2020-08-31 | 2020-08-31 | Radiating structure of chip packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211654811U (en) |
-
2020
- 2020-08-31 CN CN202021855692.5U patent/CN211654811U/en active Active
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