CN208336277U

CN208336277U - A kind of novel high-power white light LEDs heat-dissipation packaging structure

Info

Publication number: CN208336277U
Application number: CN201820450426.0U
Authority: CN
Inventors: 杨东升
Original assignee: Zhejiang Jing Ying Technology Co Ltd
Current assignee: Zhejiang Jing Ying Technology Co Ltd
Priority date: 2018-04-02
Filing date: 2018-04-02
Publication date: 2019-01-04
Anticipated expiration: 2028-04-02

Abstract

The utility model discloses a kind of novel high-power white light LEDs heat-dissipation packaging structures, its structure includes structural body, sealing resin, phosphor powder layer, LED wafer, the structural body is equipped with plastic lens, the plastic lens has filler, the filler is mutually fixedly connected with plastic lens, the filler has conducting wire, the conducting wire is equipped with phosphor powder layer, sealing resin is equipped with by the phosphor powder layer, the sealing resin is mutually fixedly connected with phosphor powder layer, plumb joint is equipped on the right side of the sealing resin, the plumb joint is mutually fixedly connected with substrate, the phosphor powder layer has equipped with LED wafer, the LED wafer is mutually fixedly connected with phosphor powder layer, the LED wafer has pedestal, the pedestal is mutually fixedly connected with LED wafer, novel high-power white light LEDs heat dissipation envelope The thermal grease and heat-conducting plate that the substrate of assembling structure has, heat-conducting plate have cooling fin, can conduct the heat on heat-conducting plate, economic and practical is stronger, energy conservation and environmental protection.

Description

A kind of novel high-power white light LEDs heat-dissipation packaging structure

Technical field

The utility model relates to cooling encapsulation technical field, specially a kind of novel high-power white light LEDs cooling encapsulation knot Structure.

Background technique

LED (semiconductor light-emitting-diode) encapsulates the encapsulation for referring to luminescence chip, has more very much not compared to integrated antenna package Together.The encapsulation of LED is not only required to protection wick, but also being capable of light transmission.So the encapsulation of LED has spy to encapsulating material Different requirement.

The performance of the heat dissipation of LED heat-dissipation packaging structure in the prior art is poor, and heat dissipation effect is not obvious enough, for a long time Using its service life can be shortened, therefore need to research and develop a kind of novel high-power white light LEDs heat-dissipation packaging structure.

Utility model content

The purpose of this utility model is to provide a kind of novel high-power white light LEDs heat-dissipation packaging structures, solve background The problem of proposed in technology.

To achieve the above object, the utility model provides the following technical solutions: a kind of novel high-power white light LEDs heat dissipation envelope Assembling structure, structure include structural body, sealing resin, phosphor powder layer, LED wafer, conducting wire, plumb joint, the structural body It is equipped with plastic lens, the plastic lens has filler, and the filler is mutually fixedly connected with plastic lens, described to fill out It fills object and has conducting wire, the conducting wire is equipped with phosphor powder layer, is equipped with sealing resin, the sealing resin by the phosphor powder layer It is mutually fixedly connected with phosphor powder layer, plumb joint is equipped on the right side of the sealing resin, the plumb joint is mutually fixedly connected with substrate, institute It states phosphor powder layer to have equipped with LED wafer, the LED wafer is mutually fixedly connected with phosphor powder layer, and the LED wafer has Pedestal, the pedestal are mutually fixedly connected with LED wafer, and the pedestal has substrate, and the pedestal is mutually fixedly connected with substrate, The substrate has thermal grease, and the thermal grease is mutually fixedly connected with substrate, and the thermal grease has heat-conducting plate, The heat-conducting plate is mutually fixedly connected with thermal grease, and the heat-conducting plate has fixing buckle, and the fixing buckle is mutually solid with heat-conducting plate Fixed connection, the cooling fin are equipped with fixed strip, and the fixed strip is mutually fixedly connected with cooling fin, and the cooling fin is equipped with electricity Machine, the motor are mutually fixedly connected with cooling fin, and the motor is equipped with flabellum, and sent flabellum is mutually fixedly connected with motor.

As a kind of preferred embodiment of the utility model, the heat-conducting plate is using fine copper metal block.

As a kind of preferred embodiment of the utility model, the fixed strip and fixing buckle phase dismantling connection.

As a kind of preferred embodiment of the utility model, the cooling fin is using aluminum alloy material.

As a kind of preferred embodiment of the utility model, the motor is using miniature brushless direct-current motor.

Compared with prior art, the beneficial effects of the utility model are as follows:

1. the thermal grease and heat-conducting plate that are had by substrate of the novel high-power white light LEDs heat-dissipation packaging structure, The heat that LED wafer generates can be passed to away, the effect of heat dissipation is more obvious.

2. the novel high-power white light LEDs heat-dissipation packaging structure bottom is equipped with cooling fin, cooling fin is by the warm on heat-conducting plate Amount drives the rotation of flabellum by motor, heat is conducted, the effect of heat dissipation is more obvious, increases making for LED wafer With the service life, economic and practical is stronger, energy conservation and environmental protection.

Detailed description of the invention

Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other spies of the utility model Sign, objects and advantages will become more apparent upon:

Fig. 1 is a kind of structural schematic diagram of the substrate of novel high-power white light LEDs heat-dissipation packaging structure of the utility model；

Fig. 2 is a kind of structural representation of the LED wafer of novel high-power white light LEDs heat-dissipation packaging structure of the utility model Figure；

Fig. 3 is a kind of structure chart of the cooling fin of novel high-power white light LEDs heat-dissipation packaging structure of the utility model.

In figure: structural body -1, sealing resin -2, phosphor powder layer -3, LED wafer -4, conducting wire -5, plumb joint -6, insulation Film -7, substrate -8, pedestal -9, plastic lens -10, filler -11, thermal grease -12, heat-conducting plate -13, fixing buckle -14, heat dissipation Piece -15, flabellum -16, fixed strip -17, motor -18.

Specific embodiment

To be easy to understand the technical means, creative features, achievement of purpose, and effectiveness of the utility model, below In conjunction with specific embodiment, the utility model is further described.

Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of novel high-power white light LEDs cooling encapsulation Structure, structure include structural body 1, sealing resin 2, phosphor powder layer 3, LED wafer 4, conducting wire 5, plumb joint 6, the structure Ontology 1 is equipped with plastic lens 10, and the plastic lens 10 has filler 11, the filler 11 and 10 phase of plastic lens It is fixedly connected, the filler 11 has conducting wire 5, and the conducting wire 5 is equipped with phosphor powder layer 3, is equipped with by the phosphor powder layer 3 Sealing resin 2, the sealing resin 2 are fixedly connected with 3 phase of phosphor powder layer, and plumb joint 6, institute are equipped on the right side of the sealing resin 2 It states plumb joint 6 to be fixedly connected with 8 phase of substrate, the phosphor powder layer 3 has equipped with LED wafer 4, the LED wafer 4 and fluorescence 3 phase of bisque is fixedly connected, and the LED wafer 4 has pedestal 9, and the pedestal 9 is fixedly connected with 4 phase of LED wafer, the base Seat 9 has substrate 8, and the pedestal 9 is fixedly connected with 8 phase of substrate, and the substrate 8 has thermal grease 12, the heat dissipation Silica gel 12 is fixedly connected with 8 phase of substrate, and the thermal grease 12 has heat-conducting plate 13, the heat-conducting plate 13 and thermal grease 12 It is mutually fixedly connected, the heat-conducting plate 13 has fixing buckle 14, and the fixing buckle 14 is fixedly connected with 13 phase of heat-conducting plate, described to dissipate Backing 15 is equipped with fixed strip 17, and the fixed strip 17 is fixedly connected with 15 phase of cooling fin, and the cooling fin 15 is equipped with motor 18, the motor 18 is fixedly connected with 15 phase of cooling fin, and the motor 18 is equipped with flabellum 16, sent flabellum 16 and 18 phase of motor It is fixedly connected.

Referring to Fig. 1, the heat-conducting plate 13 is using fine copper metal block, the thermal conductivity of copper is good, low in cost.

Referring to Fig. 1, the fixed strip 17 and 14 phase dismantling connection of fixing buckle, connection is more fastened.

Referring to Fig. 1, the cooling fin 15, using aluminum alloy material, the thermal diffusivity of aluminium is very fast.

Referring to Fig. 1, the motor 18 is using miniature brushless direct-current motor 18, noise is small, long service life.

A kind of novel high-power white light LEDs heat-dissipation packaging structure described in the utility model is had by substrate 8 Thermal grease 12 and heat-conducting plate 13, for heat-conducting plate 13 using fine copper metal block, the thermal conductivity of copper is good, low in cost, can be by LED The heat that chip 4 generates passes to away, and the effect of heat dissipation is more obvious, and the heat on heat-conducting plate 13 is passed through motor by cooling fin 15 18 drive the rotation of flabellum 16, and heat is conducted, and for cooling fin 15 using aluminum alloy material, the thermal diffusivity of aluminium is very fast, The effect of heat dissipation is more obvious, and for motor 18 using miniature brushless direct-current motor 18, noise is small, and long service life increases The service life of LED wafer 4, economic and practical is stronger, energy conservation and environmental protection.

The structural body 1 of the utility model, sealing resin 2, phosphor powder layer 3, LED wafer 4, conducting wire 5, plumb joint 6, insulation Film 7, substrate 8, pedestal 9, plastic lens 10, filler 11, thermal grease 12, heat-conducting plate 13, fixing buckle 14, cooling fin 15, fan Leaf 16, fixed strip 17, motor 18, component are universal standard part or component as known to those skilled in the art, structure and original Reason is all that this technology personnel can learn by technical manual or know by routine experiment method that the utility model solved asks Topic is that the performance of the heat dissipation of existing LED heat-dissipation packaging structure is poor, and heat dissipation effect is not obvious enough, and use for a long time can shorten it The problems such as service life, the utility model are combined with each other by above-mentioned component, the thermal grease that is had by substrate and are led Hot plate can pass to away the heat that LED wafer generates, and the effect of heat dissipation is more obvious, and cooling fin is by the heat on heat-conducting plate The rotation that flabellum is driven by motor, heat is conducted, the effect of heat dissipation is more obvious, increases the use of LED wafer In the service life, economic and practical is stronger, energy conservation and environmental protection.

The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above, for For those skilled in the art, it is clear that the present invention is not limited to the details of the above exemplary embodiments, and without departing substantially from this In the case where the spirit or essential attributes of utility model, the utility model can be realized in other specific forms.Therefore, no matter From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the utility model is by institute Attached claim rather than above description limit, it is intended that will fall within the meaning and scope of the equivalent elements of the claims All changes are embraced therein.It should not treat any reference in the claims as limiting related right It is required that.

In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art The other embodiments being understood that.

Claims

1. a kind of novel high-power white light LEDs heat-dissipation packaging structure, structure includes structural body (1), sealing resin (2), glimmering Light bisque (3), LED wafer (4), conducting wire (5), plumb joint (6), it is characterised in that: it is saturating that the structural body (1) is equipped with plastics Mirror (10), the plastic lens (10) have filler (11), and mutually fixation connects the filler (11) with plastic lens (10) It connects, the filler (11) has conducting wire (5), and the conducting wire (5) is equipped with phosphor powder layer (3), and the phosphor powder layer (3) is other Equipped with sealing resin (2), the sealing resin (2) is mutually fixedly connected with phosphor powder layer (3), sets on the right side of the sealing resin (2) Have plumb joint (6), the plumb joint (6) is mutually fixedly connected with substrate (8), and the phosphor powder layer (3) has equipped with LED wafer (4), the LED wafer (4) is mutually fixedly connected with phosphor powder layer (3), and the LED wafer (4) has pedestal (9), the base Seat (9) is mutually fixedly connected with LED wafer (4), and the pedestal (9) has substrate (8), and the pedestal (9) is mutually solid with substrate (8) Fixed connection, the substrate (8) have thermal grease (12), and the thermal grease (12) is mutually fixedly connected with substrate (8), described Thermal grease (12) has heat-conducting plate (13), and the heat-conducting plate (13) is mutually fixedly connected with thermal grease (12), described thermally conductive Plate (13) has fixing buckle (14), and the fixing buckle (14) is mutually fixedly connected with heat-conducting plate (13)；

Cooling fin (15) is equipped with fixed strip (17), and the fixed strip (17) is mutually fixedly connected with cooling fin (15), the heat dissipation Piece (15) is equipped with motor (18), and the motor (18) is mutually fixedly connected with cooling fin (15), and the motor (18) is equipped with fan Leaf (16), sent flabellum (16) are mutually fixedly connected with motor (18).

2. a kind of novel high-power white light LEDs heat-dissipation packaging structure according to claim 1, it is characterised in that: described to lead Hot plate (13) is using fine copper metal block.

3. a kind of novel high-power white light LEDs heat-dissipation packaging structure according to claim 1, it is characterised in that: described solid Determine item (17) and fixing buckle (14) phase dismantling connection.

4. a kind of novel high-power white light LEDs heat-dissipation packaging structure according to claim 1, it is characterised in that: described to dissipate Backing (15) is using aluminum alloy material.

5. a kind of novel high-power white light LEDs heat-dissipation packaging structure according to claim 1, it is characterised in that: the electricity Machine (18) is using miniature brushless direct-current motor (18).