CN221057401U - Small-sized metal ceramic surface-mounted SOP (silicon on insulator) packaging four-transistor array - Google Patents
Small-sized metal ceramic surface-mounted SOP (silicon on insulator) packaging four-transistor array Download PDFInfo
- Publication number
- CN221057401U CN221057401U CN202322692961.0U CN202322692961U CN221057401U CN 221057401 U CN221057401 U CN 221057401U CN 202322692961 U CN202322692961 U CN 202322692961U CN 221057401 U CN221057401 U CN 221057401U
- Authority
- CN
- China
- Prior art keywords
- transistor array
- small
- sop
- wiring pin
- ceramic surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002184 metal Substances 0.000 title claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 33
- 239000000919 ceramic Substances 0.000 title claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 12
- 239000012212 insulator Substances 0.000 title description 2
- 229910052710 silicon Inorganic materials 0.000 title description 2
- 239000010703 silicon Substances 0.000 title description 2
- 239000011195 cermet Substances 0.000 claims abstract description 5
- 238000005538 encapsulation Methods 0.000 claims abstract description 5
- 238000003491 array Methods 0.000 claims abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000741 silica gel Substances 0.000 claims description 10
- 229910002027 silica gel Inorganic materials 0.000 claims description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims 2
- 238000007906 compression Methods 0.000 claims 2
- 238000003466 welding Methods 0.000 abstract description 12
- 238000001125 extrusion Methods 0.000 abstract description 8
- 230000001681 protective effect Effects 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 210000001503 joint Anatomy 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- -1 4J29 Chemical class 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses a small-sized metal ceramic surface-mounted SOP packaging four-transistor array, which comprises a transistor array main body and a clamping protection component, wherein a protective shell is arranged outside the transistor array main body, lead components are arranged at the upper end and the lower end of the transistor array main body, each lead component comprises a wiring pin and a limiting fixing hole, the inside of each wiring pin is provided with the limiting fixing hole, and the clamping protection component is arranged at the front end of each wiring pin. This four transistor arrays of SOP encapsulation are pasted to small-size cermet table compares with current transistor array, protects through setting up joint protection subassembly in the wiring pin outside of both sides, prevents collision extrusion harm, improves the practicality of equipment, sets up in the outside of wiring pin and installs subassembly and fastening assembly additional and fasten and install the connection, can carry out the pin extension in the use, improves welding convenience, improves the suitability of equipment through convenient joint.
Description
Technical Field
The utility model relates to the technical field of metal ceramic surface mounting, in particular to a small metal ceramic surface mounting SOP packaging four-transistor array.
Background
At present, the power circuit ceramic integrated packaging shell mainly adopts iron-nickel low expansion coefficient metals such as 4J29, 4J34 and the like as a ring frame, the cover plate adopts an iron-nickel alloy, the base plate has an alumina multi-layer structure, the heat conductivity is low, the bottom surface is partially embedded with a metal block for heat conduction, the heat dissipation of a part of non-sealing chip is realized by bonding a metal sheet on the top of the chip for heat dissipation, the packaging transistor is an element which is formed by packaging a bare chip and can be directly welded on a circuit board, and the transistors can be sequenced into an array.
The patent document of publication No. CN209747496U discloses a metal ceramic surface-mounted packaging transistor array with a flow guiding structure, in the use process, the device comprises a substrate, a flow guiding structure and a fixing mechanism, wherein connecting rods are arranged on two sides of the substrate, one side of each connecting rod is connected with a stop block, the flow guiding structure is arranged outside the substrate, a connecting frame is arranged on one side of the flow guiding structure, the fixing mechanism is arranged below the connecting frame, a transistor is arranged above the substrate, and a shell is arranged outside the transistor. This metal ceramic surface-mount packaging transistor array with water conservancy diversion structure is convenient for install is provided with the water conservancy diversion structure, carries out effectual water conservancy diversion to the liquid that the device top remained and discharges, prevents to accumulate on the device to lead to the device to receive corruption etc. that influence the result of use of device, be provided with fixed establishment, be convenient for when fixing a position the device, protect device and equipment junction, effectually protect the device, loading and unloading are convenient moreover, prevent the device skew.
Above-mentioned in through setting up the water conservancy diversion structure, prevent that liquid from remaining, avoid influencing the result of use of device, at the fixed in-process of array, connect fixedly through a plurality of pins at both ends, because the pin is thinner, so in transportation or holding the in-process, all can not avoid producing certain extrusion collision to lead to the pin to warp, influence subsequent welding work, lead to influencing availability factor, to above-mentioned condition, now provide small-size cermet table and paste SOP encapsulation four transistor array.
Disclosure of utility model
The utility model aims to provide a small-sized metal ceramic surface-mounted SOP packaging four-transistor array so as to solve the problems in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a four transistor arrays of small-size cermet table subsides SOP encapsulation, includes transistor array main part and joint protection subassembly, transistor array main part's outside is provided with the protecting crust, and transistor array main part's upper and lower both ends all are provided with the lead wire subassembly, the lead wire subassembly includes wiring pin and spacing fixed orifices, and the inside of wiring pin has seted up spacing fixed orifices, joint protection subassembly sets up in the front end of wiring pin.
Further, the clamping protection component comprises a baffle and a lifting column, and the middle part of the front end of the baffle is provided with the lifting column.
The lifting column is convenient to press, fix and lift for storage.
Further, the clamping protection component further comprises a clamping frame and a silica gel pad, the rear end of the baffle is connected with the clamping frame, and the silica gel pad is adhered to the inner side of the clamping frame.
The joint frame and wiring pin one-to-one, the silica gel pad improves barrier propterty.
Further, the top of wiring pin is connected with installs the subassembly additional, and installs the inboard of subassembly additional and be provided with fastening component.
Further, the additional assembly comprises additional metal strips and buffer pads, and the left end and the right end of the inner side of the additional metal strips are respectively provided with the buffer pads.
And the metal strip is additionally arranged and connected with the wiring pin in a sliding way.
Further, the fastening assembly comprises a fastening screw and an adjusting rotating rod, and the rear end of the fastening screw is connected with the adjusting rotating rod.
Further, fastening assembly still includes stripper plate and location inserted bar, the rear end of adjusting the dwang is provided with, and stripper plate's rear end middle part is provided with the location inserted bar.
Furthermore, the adjusting rotating rod is rotationally connected with the extrusion plate, and the extrusion plate is welded with the positioning inserting rod.
And the adjusting rotating rod and the extruding plate rotate relatively, then the fastening screw is in threaded connection with the metal strip, the extruding plate can be driven to move backwards, and the wire pin is clamped and fixed.
Compared with the prior art, the utility model has the beneficial effects that: through set up joint protection subassembly in the wiring pin outside of both sides and protect, prevent collision extrusion harm, improve equipment's practicality, set up in the outside of wiring pin and install subassembly and fastening assembly additional and fasten and install the connection additional, can carry out the pin extension in the use, improve welding convenience, improve equipment's suitability through convenient joint.
1. In the use process, the transistor array main body is used, the wiring pins on two sides can be connected, then the front ends of the wiring pins are provided with the baffle plates for protection, the rear ends of the baffle plates are provided with the plurality of groups of clamping frames, the wiring pins can be directly clamped, the silica gel pads are extruded outside the wiring pins for protection, the stability of connection and fastening can be improved, meanwhile, the lifting and pulling of the device can be facilitated through the lifting and pulling columns, the protection performance of the device is improved, and the practicability of the device is improved.
2. In the use process, the wire connecting pins are required to be welded, then the wire connecting pins are required to be welded, the wire connecting pins are suitable for different environments or different welding equipment, the metal strips are sleeved outside the wire connecting pins, then the inner extrusion plate connecting positioning inserting rods are inserted into the limiting fixing holes, the fastening screws are screwed to move the top wall of the metal strips, so that the extrusion plate extrudes the wire connecting pins downwards, the connection compactness of the inner buffer pad can be improved, the pins can be extended in the use process, the welding convenience is improved, and the applicability of the equipment is improved through convenient clamping.
Drawings
FIG. 1 is a schematic diagram of the front view of a small-sized metal-ceramic surface-mount SOP-packaged four-transistor array according to the present utility model;
FIG. 2 is a schematic view of a partial perspective structure of a clamping protection assembly of a small-sized metal ceramic surface-mounted SOP-packaged four-transistor array according to the present utility model;
Fig. 3 is a schematic view of a partial bottom view of an attachment assembly and a fastening assembly of a small-sized metal-ceramic surface-mount SOP-packaged four-transistor array according to the present utility model.
In the figure: 1. a transistor array body; 2. a protective shell; 3. a lead assembly; 301. a wiring pin; 302. limiting and fixing holes; 4. the clamping protection component; 401. a baffle; 402. a clamping frame; 403. a silica gel pad; 404. lifting the column; 5. adding an assembly; 501. adding metal strips; 502. a cushion pad; 6. a fastening assembly; 601. a fastening screw; 602. adjusting the rotating rod; 603. an extrusion plate; 604. positioning the inserted link.
Detailed Description
As shown in fig. 1 and 2, the small-sized metal ceramic surface-mounted SOP packaging four-transistor array comprises a transistor array main body 1 and a clamping protection component 4, wherein the protecting shell 2 is arranged outside the transistor array main body 1, the lead component 3 is arranged at the upper end and the lower end of the transistor array main body 1, the lead component 3 comprises wiring pins 301 and limiting fixing holes 302, the limiting fixing holes 302 are formed in the wiring pins 301, the clamping protection component 4 is arranged at the front ends of the wiring pins 301, the clamping protection component 4 comprises a baffle 401 and a lifting column 404, the middle part of the front end of the baffle 401 is provided with the lifting column 404, the clamping protection component 4 further comprises a clamping frame 402 and a silica gel pad 403, the rear end of the baffle 401 is connected with the clamping frame 402, the silica gel pad 403 is adhered to the inner side of the clamping frame 402, the main body is used through the transistor array main body 1 in the use process, the wiring pins 301 at the two sides can be connected, then the front ends of the wiring pins 301 are provided with the baffle 401, the baffle 401 is arranged at the front ends of the plurality of the wiring pins 301, the rear ends of the baffle 401 are provided with the baffle 401, the rear ends of the baffle 401 are provided with the clamping frame 404, the clamping frame 402 can be directly connected with the clamping frame 301, and the practical performance of the lifting protection device can be improved, and the lifting performance can be improved, and the lifting and the performance can be improved.
As shown in fig. 1 and 3, the top of the wiring pin 301 is connected with an additional assembly 5, and the inner side of the additional assembly 5 is provided with a fastening assembly 6, the additional assembly 5 comprises an additional metal strip 501 and a buffer pad 502, the left and right ends of the inner side of the additional metal strip 501 are respectively provided with a buffer pad 502, the fastening assembly 6 comprises a fastening screw 601 and an adjusting rotating rod 602, the rear end of the fastening screw 601 is connected with the adjusting rotating rod 602, the fastening assembly 6 further comprises a pressing plate 603 and a positioning inserting rod 604, the rear end of the adjusting rotating rod 602 is provided with the pressing plate 603, the middle part of the rear end of the pressing plate 603 is provided with the positioning inserting rod 604, the adjusting rotating rod 602 is in rotary connection with the pressing plate 603, the pressing plate 603 and the positioning inserting rod 604 are in welding, in the use process, the welding is needed through the butt wire pin 301 to achieve the purpose, then the outer side of the wiring pin 301 is sleeved with the pressing plate 603 for increasing the length of the wiring pin 301 in the welding process, the pressing plate 603 is connected with the positioning inserting rod 604, the pressing plate is connected with the positioning inserting rod 302, the pressing plate is screwed into the fixing hole 302, and the inner side of the pressing plate is screwed down, and the welding device is convenient to extend the pressing plate is screwed down, and the welding performance of the pressing plate is improved.
To sum up, when using this small-size cermet surface mount SOP encapsulation four transistor array, at first, use through transistor array main part 1, the wiring pin 301 of both sides can be connected, then at the front end of a plurality of wiring pins 301, be provided with baffle 401 and protect, the rear end of baffle 401 is provided with multiunit joint frame 402, but direct joint wiring pin 301, let silica gel pad 403 crowded in wiring pin 301 outside protect, can improve the stability of connection fastening, the accessible is carried out the lift post 404 and is convenient for draw, then need weld through butt joint pin 301, then use purpose for increasing wiring pin 301 length in the welding process, then can be with the outside of installing metal strip 501 cover at wiring pin 301 for the use of increasing welding equipment, then inside stripper 603 connection locating pin 604 is inserted in spacing fixed orifices 302, screw down the stripper plate 603 extrudees wiring pin 301 at the roof of installing metal strip 501, adjust the stripper 602 and then install the opposite rotation between metal strip 501, can carry out the screw thread movement to the inside of the stripper plate 603, the relative rotation between the stripper plate 603, can carry out the high-speed glass die joint pin 502, the connection is convenient and high-speed glass die joint table, the connection is realized, the butt joint table is convenient for the metal strip is welded, the butt joint pin is easy to carry out, the improvement, the relative connection of the butt joint pin is easy to move, and easy-joint table is easy to install, and can be welded.
Claims (8)
1. The utility model provides a four transistor arrays of small-size cermet table subsides SOP encapsulation, includes transistor array main part (1) and joint protection subassembly (4), its characterized in that, the outside of transistor array main part (1) is provided with protecting crust (2), and the upper and lower both ends of transistor array main part (1) all are provided with lead wire subassembly (3), lead wire subassembly (3) are including wiring pin (301) and spacing fixed orifices (302), and spacing fixed orifices (302) have been seted up to the inside of wiring pin (301), joint protection subassembly (4) set up in the front end of wiring pin (301).
2. The small-sized metal ceramic surface-mounted SOP package four-transistor array according to claim 1, characterized in that the clamping protection component (4) comprises a baffle plate (401) and a lifting column (404), and the lifting column (404) is arranged in the middle of the front end of the baffle plate (401).
3. The small-sized metal ceramic surface-mounted SOP (on-package) four-transistor array according to claim 2, characterized in that the clamping protection component (4) further comprises a clamping frame (402) and a silica gel pad (403), the rear end of the baffle plate (401) is connected with the clamping frame (402), and the silica gel pad (403) is adhered to the inner side of the clamping frame (402).
4. The small-sized metal ceramic surface-mounted SOP packaging four-transistor array according to claim 1, wherein the top ends of the wiring pins (301) are connected with an additional assembly (5), and the inner side of the additional assembly (5) is provided with a fastening assembly (6).
5. The small-sized metal ceramic surface-mounted SOP package four-transistor array according to claim 4, wherein the mounting component (5) comprises a mounting metal strip (501) and buffer pads (502), and the buffer pads (502) are arranged at the left and right ends of the inner side of the mounting metal strip (501).
6. The small form factor surface mount SOP package four transistor array of claim 4, characterized in that the fastening assembly (6) includes a fastening screw (601) and an adjusting rotation rod (602), and the rear end of the fastening screw (601) is connected with the adjusting rotation rod (602).
7. The small-sized metal ceramic surface-mounted SOP package four-transistor array according to claim 6, characterized in that the fastening assembly (6) further comprises a squeeze plate (603) and a positioning insert rod (604), the rear end of the adjusting rotating rod (602) is provided with the squeeze plate (603), and the middle of the rear end of the squeeze plate (603) is provided with the positioning insert rod (604).
8. The array of four transistors packaged in a small form factor SOP package of claim 7, wherein the adjustment rotation lever (602) is rotationally coupled to the compression plate (603), and the compression plate (603) is welded to the positioning plunger (604).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322692961.0U CN221057401U (en) | 2023-10-09 | 2023-10-09 | Small-sized metal ceramic surface-mounted SOP (silicon on insulator) packaging four-transistor array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322692961.0U CN221057401U (en) | 2023-10-09 | 2023-10-09 | Small-sized metal ceramic surface-mounted SOP (silicon on insulator) packaging four-transistor array |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221057401U true CN221057401U (en) | 2024-05-31 |
Family
ID=91199779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322692961.0U Active CN221057401U (en) | 2023-10-09 | 2023-10-09 | Small-sized metal ceramic surface-mounted SOP (silicon on insulator) packaging four-transistor array |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221057401U (en) |
-
2023
- 2023-10-09 CN CN202322692961.0U patent/CN221057401U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7495323B2 (en) | Semiconductor package structure having multiple heat dissipation paths and method of manufacture | |
| JP3542311B2 (en) | Semiconductor device | |
| CN1961415A (en) | Flexible leadframe structure and method for forming integrated circuit packages | |
| CN221057401U (en) | Small-sized metal ceramic surface-mounted SOP (silicon on insulator) packaging four-transistor array | |
| US7528013B1 (en) | Method for fabricating high performance leadframe in electronic package | |
| CN116564917B (en) | Semiconductor packaging substrate structure and manufacturing process thereof | |
| CN101091247A (en) | Dual flat non-leaded semiconductor package | |
| CN214336701U (en) | Semiconductor chip packaging module structure with low thermal resistance | |
| US20110068451A1 (en) | Multi-chip semiconductor connector | |
| CN212412041U (en) | Semiconductor chip packaging structure | |
| CN212648213U (en) | Positioning device for IC packaging element | |
| CN214256108U (en) | QFN packaging structure of power conversion module | |
| JP2532826B2 (en) | Method for manufacturing resin-sealed semiconductor device | |
| CN213692025U (en) | Radiating multichip packaging structure of reinforcing | |
| CN208460754U (en) | A kind of multi-chip PQFN encapsulating structure | |
| CN202394862U (en) | Power module | |
| JPH04174547A (en) | Surface-mounting type power semiconductor device | |
| CN220934052U (en) | Semiconductor packaging substrate | |
| CN220233182U (en) | Semiconductor integrated circuit lead frame | |
| CN218499446U (en) | Integrated circuit board mounting base | |
| CN219393384U (en) | Semiconductor package with built-in reinforcing structure | |
| CN216980534U (en) | Semiconductor packaging structure | |
| CN220127808U (en) | Semiconductor welding protection jig | |
| CN220796722U (en) | High-performance heat dissipation chip | |
| CN112151513A (en) | Power die package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |