CN212412041U

CN212412041U - Semiconductor chip packaging structure

Info

Publication number: CN212412041U
Application number: CN202021371838.9U
Authority: CN
Inventors: 张琪敏; 何稳
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-07-12
Filing date: 2020-07-12
Publication date: 2021-01-26
Anticipated expiration: 2030-07-12

Abstract

The utility model discloses a semiconductor chip packaging structure, belonging to the chip packaging technical field, comprising a circuit carrier plate, a bonding pad is connected above the circuit carrier plate, a frame is connected on the upper side of the bonding pad close to the outer side, the middle position above the bonding pad is connected with a semiconductor chip main body, the upper part of the frame is connected with a heat conducting plate, the utility model is provided with an adjusting stud, a guiding chute, a lower pressing plate, an adjusting screw groove, a guiding slide bar, a supporting rotating plate, an upper pressing plate, a rotating motor and an accommodating cavity, according to the size of the semiconductor chip main body, a switch of a rotating motor in the accommodating cavity is started, the rotating motor drives a supporting rotating plate to further drive an adjusting stud to rotate in an adjusting screw groove, a lower pressing plate moves a buffer layer to move downwards, meanwhile, a guide sliding groove moves downwards along a guide sliding rod, the lower pressing plate is effectively guided and limited, and the semiconductor chip main bodies with different heights can be pressed tightly.

Description

Semiconductor chip packaging structure

Technical Field

The utility model belongs to the technical field of the chip package, concretely relates to semiconductor chip packaging structure.

Background

A semiconductor chip is a semiconductor device which is made by etching and wiring on a semiconductor wafer and can realize a certain function, not only is a silicon chip, but also commonly comprises gallium arsenide (gallium arsenide is toxic, so that some inferior circuit boards do not decompose the gallium arsenide) and germanium and other semiconductor materials, and in the production process of the semiconductor chip, a packaging structure is required to be used for packaging the semiconductor chip.

The Chinese patent application No. CN201921619782.1 discloses a semiconductor chip packaging structure, the semiconductor chip main body is placed in a frame and packaged, the stability between a bonding pad and a circuit carrier plate can be improved through the arrangement of an adhesive layer, the insufficient solder is not easy to generate after packaging, the stability and the quality of the packaging structure are improved, a buffer layer in the frame also has a certain buffer function, the effect of pressure reduction is achieved through deformation, and the transportation work of the semiconductor chip main body after packaging is facilitated; through setting up heat dissipation mechanism at the frame top, set up protruding cylinder at dull and stereotyped upper surface, can effectually distribute away the heat that semiconductor chip main part during operation produced, heat-conduction efficiency is high for the semiconductor chip main part is favorable to using for a long time.

The above patent has the following problems: 1. the thickness of a pressing plate of the existing semiconductor chip packaging structure is inconvenient to adjust, so that the existing semiconductor chip packaging structure is not suitable for semiconductor chips with different heights and has higher limitation; 2. the existing semiconductor chip packaging structure dissipates heat through the heat-conducting plate and the raised cylinder, the upper end of the raised cylinder is still in a sealing structure, and the heat dissipation effect is poor.

SUMMERY OF THE UTILITY MODEL

To solve the problems set forth in the background art described above. The utility model provides a semiconductor chip packaging structure, it is good to have semiconductor chip and the radiating effect who is applicable to not co-altitude, and can effectively dirt-proof characteristics.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor chip packaging structure comprises a circuit carrier plate, wherein a bonding pad is connected above the circuit carrier plate, a frame is connected to the outer side of the bonding pad, a semiconductor chip main body is connected to the middle position of the upper part of the bonding pad, a heat-conducting plate is connected above the frame, a flat plate is connected above the heat-conducting plate, a plurality of protruding cylinders are connected above the flat plate, an upper pressing plate is connected to the middle position of the lower part of the flat plate, a containing cavity is formed in the upper pressing plate, a rotating motor is installed in the containing cavity, a supporting rotating plate is connected below the rotating motor, an adjusting stud is connected below the supporting rotating plate, a lower pressing plate is connected below the upper pressing plate, an adjusting screw groove is formed in the lower pressing plate and corresponds to the adjusting stud, and guide slide bars are connected below the upper pressing plate and on two sides of the adjusting stud, the inside of holding down plate just corresponds the position department of direction slide bar and has seted up the direction spout, the below of holding down plate is connected with the buffer layer.

Preferably, both sides of the guide slide bar are connected with limiting slide blocks by the lower portion, limiting slide grooves are formed in the positions, corresponding to the limiting slide blocks, in the lower pressing plate, and the limiting slide blocks are connected in the limiting slide grooves in a sliding mode.

Preferably, a plurality of first heat dissipation holes are uniformly formed in the flat plate and at positions below the raised columns, and third heat dissipation holes are formed in the upper plate of the raised columns and at positions corresponding to the first heat dissipation holes.

Preferably, a plurality of second heat dissipation holes are uniformly formed in the upper pressure plate and above the rotating motor, and the second heat dissipation holes correspond to the first heat dissipation holes in the position one to one.

Preferably, the top of protruding cylinder is connected with dustproof subassembly, dustproof subassembly includes hollow spliced pole, standing groove, dust screen, frame type joint groove and frame type joint spare, the dust screen is located the top of a plurality of third louvre, the outside of dust screen is connected with hollow spliced pole, the standing groove has been seted up to the inside position department that just corresponds hollow spliced pole of upper plate of protruding cylinder, the below of hollow spliced pole is connected with frame type joint spare, the inside position department that just corresponds frame type joint spare of upper plate of protruding cylinder has seted up frame type joint groove, the inside of joint in frame type joint groove is stabilized to frame type joint spare.

Preferably, the inner side wall of the adjusting screw groove is provided with an internal thread, the outer side wall of the adjusting stud is provided with an external thread, and the internal thread and the external thread are meshed with each other.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a set up the adjusting stud, the direction spout, the holding down plate, the adjusting screw groove, the direction slide bar, support and change the board, the top board, the rotating electrical machines and hold the chamber, according to the size of semiconductor chip main part, the switch that holds intracavity inside rotating electrical machines is started, the rotating electrical machines drives to support and changes the board and then drive the inside rotation of adjusting the stud at the adjusting screw groove, the holding down plate moves the buffer layer and moves down, and simultaneously, the direction spout moves down along the direction slide bar, play effectual direction limiting displacement to the holding down plate, can realize the function that can compress tightly the semiconductor chip main part of co-altitude not.

2. The utility model discloses a set up spacing slider and spacing spout, when the direction spout moves down along the direction slide bar, spacing spout moves down along spacing slider, plays effectual limiting displacement to the direction slide bar, avoids direction slide bar slippage direction spout, and then avoids adjusting the double-screw bolt to break away from the condition appearance of adjusting the spiral shell groove.

3. The utility model discloses a set up first louvre and third louvre, the radiating efficiency is guaranteed through first louvre, in proper order again through the inner chamber and the third louvre of protruding cylinder to the inside heat of being convenient for.

4. The utility model discloses a set up the second louvre, heat second louvre, first louvre that the rotating electrical machines during operation of being convenient for produced, in proper order again through the inner chamber and the third louvre of protruding cylinder in time discharge, guarantee in time to discharge the heat that the rotating electrical machines during operation produced to ensure the more stable work of rotating electrical machines.

5. The utility model discloses a setting includes the dustproof subassembly of hollow spliced pole, standing groove, dust screen, frame type joint groove and frame type joint spare, only need connect the hollow spliced pole joint to the inside of standing groove when the installation, simultaneously, frame type joint spare joint to the inside in frame type joint groove for the dust screen is stable to be placed, and then plays effectual dustproof function, avoids the dust to carry out the condition appearance that inside blockked up heat dissipation channel, has effectively guaranteed the radiating efficiency.

Drawings

Fig. 1 is a schematic structural view of a cross section of the present invention;

fig. 2 is an enlarged schematic structural view of a point a in fig. 1 according to the present invention;

fig. 3 is an enlarged schematic structural view of the utility model at the point B in fig. 1;

fig. 4 is an enlarged schematic structural view of the present invention at C in fig. 3;

in the figure: 1. a circuit carrier board; 2. a frame; 3. a heat conducting plate; 4. a raised cylinder; 5. a flat plate; 6. a first heat dissipation hole; 7. a semiconductor chip body; 8. a pad; 9. adjusting the stud; 10. a limiting slide block; 11. a guide chute; 12. a lower pressing plate; 13. adjusting a screw groove; 14. a buffer layer; 15. a guide slide bar; 16. a limiting chute; 17. supporting the rotating plate; 18. an upper pressure plate; 19. a second heat dissipation hole; 20. a rotating electric machine; 21. an accommodating chamber; 22. a dust-proof assembly; 221. a hollow connecting column; 222. a placement groove; 223. a dust screen; 224. a frame-shaped clamping groove; 225. a frame-shaped clamping piece; 23. and a third heat dissipation hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides the following technical solutions: a semiconductor chip packaging structure comprises a circuit carrier plate 1, a bonding pad 8 is connected above the circuit carrier plate 1, a frame 2 is connected to the upper side of the bonding pad 8 close to the outer side, a semiconductor chip main body 7 is connected to the upper middle position of the bonding pad 8, a heat conducting plate 3 is connected above the frame 2, a flat plate 5 is connected above the heat conducting plate 3, a plurality of protruding cylinders 4 are connected above the flat plate 5, an upper pressing plate 18 is connected to the lower middle position of the flat plate 5, a containing cavity 21 is formed inside the upper pressing plate 18, a rotating motor 20 is installed inside the containing cavity 21, a supporting rotating plate 17 is connected below the rotating motor 20, an adjusting stud 9 is connected below the supporting rotating plate 17, a lower pressing plate 12 is connected below the upper pressing plate 18, an adjusting screw groove 13 is formed inside the lower pressing plate 12 and at the position corresponding to the adjusting stud 9, guide sliding rods 15 are connected below the upper pressing plate 18 and at the two sides of, a guide sliding chute 11 is arranged in the lower press plate 12 and at a position corresponding to the guide sliding rod 15, and a buffer layer 14 is connected below the lower press plate 12.

Specifically, both sides of the guide sliding rod 15 are connected with the limiting sliding blocks 10 by the lower portions, the limiting sliding grooves 16 are formed in the lower pressing plate 12 and correspond to the limiting sliding blocks 10, and the limiting sliding blocks 10 are connected to the limiting sliding grooves 16 in a sliding mode.

By adopting the technical scheme, when the guide sliding groove 11 moves downwards along the guide sliding rod 15, the limiting sliding groove 16 moves downwards along the limiting sliding block 10, an effective limiting effect is achieved on the guide sliding rod 15, the guide sliding rod 15 is prevented from slipping off the guide sliding groove 11, and the adjusting stud 9 is prevented from being separated from the adjusting screw groove 13.

Specifically, a plurality of first heat dissipation holes 6 are uniformly formed in the flat plate 5 at positions below the protruding columns 4, and third heat dissipation holes 23 are formed in the upper plate of the protruding columns 4 at positions corresponding to the first heat dissipation holes 6.

By adopting the technical scheme, the internal heat can be discharged in time through the first heat dissipation holes 6 and the inner cavity of the protruding column body 4 and the third heat dissipation holes 23 in sequence, and the heat dissipation efficiency is ensured.

Specifically, a plurality of second heat dissipation holes 19 are uniformly formed in the upper plate 18 at positions above the rotating electrical machine 20, and the second heat dissipation holes 19 correspond to the first heat dissipation holes 6 at the positions one by one.

Through adopting above-mentioned technical scheme, the heat second louvre 19, the first louvre 6 that the rotating electrical machines 20 during operation of being convenient for produced, in time discharge through the inner chamber and the third louvre 23 of protruding cylinder 4 in proper order again, guarantee in time discharge the heat that the rotating electrical machines 20 during operation produced to ensure the more stable work of rotating electrical machines 20.

Specifically, the top of protruding cylinder 4 is connected with dustproof subassembly 22, dustproof subassembly 22 includes hollow spliced pole 221, standing groove 222, the dust screen 223, frame type joint groove 224 and frame type joint spare 225, the dust screen 223 is located the top of a plurality of third louvre 23, the outside of dust screen 223 is connected with hollow spliced pole 221, standing groove 222 has been seted up to the inboard inside position department that just corresponds hollow spliced pole 221 of protruding cylinder 4, the below of hollow spliced pole 221 is connected with frame type joint spare 225, frame type joint groove 224 has been seted up to the inboard inside of protruding cylinder 4 and the position department that corresponds frame type joint spare 225, the inside of joint in frame type joint groove 224 is stabilized to frame type joint spare 225.

Through adopting above-mentioned technical scheme, only need be with hollow spliced pole 221 joint to the inside of standing groove 222 when the installation, simultaneously, frame type joint spare 225 joint to frame type joint groove 224's inside for dust screen 223 is stably placed, and then plays effectual dustproof function, avoids the dust to carry out the inside condition appearance that blocks up heat dissipation channel, has effectively guaranteed the radiating efficiency.

Specifically, the inner side wall of the adjusting screw groove 13 is provided with an internal thread, the outer side wall of the adjusting stud 9 is provided with an external thread, and the internal thread and the external thread are meshed with each other.

The utility model discloses the structure and the principle of well circuit support plate, frame, heat-conducting plate, protruding cylinder, flat board, semiconductor chip main part and pad and how to encapsulate the operation and show in the semiconductor chip packaging structure that chinese patent application number is CN201921619782.1 discloses.

The utility model discloses a theory of operation and use flow: when the utility model is used, firstly, the hollow connecting column 221 is clamped into the placing groove 222, meanwhile, the frame-shaped clamping piece 225 is clamped into the frame-shaped clamping groove 224, so that the dust screen 223 is stably placed, then, according to the size of the semiconductor chip main body 7, the switch of the rotating motor 20 in the accommodating cavity 21 is started, the rotating motor 20 drives the supporting rotating plate 17 and further drives the adjusting stud 9 to rotate in the adjusting screw groove 13, the lower pressing plate 12 drives the buffer layer 14 to move downwards, meanwhile, the guiding sliding groove 11 moves downwards along the guiding sliding rod 15, an effective guiding and limiting function is performed on the lower pressing plate 12, the limiting sliding groove 16 moves along the limiting slider 10, an effective limiting function is performed on the guiding sliding rod 15, the condition that the guiding sliding rod 15 slips off the guiding sliding groove 11 is avoided, and further the adjusting stud 9 is prevented from breaking away from the adjusting screw groove 13 is avoided, after the semiconductor chip main body 7 is pressed, the switch of the rotating electrical machine 20 is turned off, when the rotating electrical machine 20 works, the heat generated by the rotating electrical machine is discharged in time through the second heat dissipation hole 19, the first heat dissipation hole 6, the inner cavity of the protruding column body 4 and the third heat dissipation hole 23 in sequence, meanwhile, the heat inside the frame 2 is discharged in time through the first heat dissipation hole 6, the inner cavity of the protruding column body 4 and the third heat dissipation hole 23 in sequence, and the dust screen 223 plays an effective dustproof function.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor chip packaging structure comprises a circuit carrier plate (1), and is characterized in that: the upper side of the circuit carrier plate (1) is connected with a pad (8), the upper side of the pad (8) is connected with a frame (2) by the outer side, the upper middle position of the pad (8) is connected with a semiconductor chip main body (7), the upper side of the frame (2) is connected with a heat conducting plate (3), the upper side of the heat conducting plate (3) is connected with a flat plate (5), the upper side of the flat plate (5) is connected with a plurality of convex cylinders (4), the lower middle position of the flat plate (5) is connected with an upper pressing plate (18), a containing cavity (21) is formed in the upper pressing plate (18), a rotating motor (20) is installed in the containing cavity (21), a supporting rotating plate (17) is connected to the lower side of the rotating plate (17), an adjusting stud (9) is connected to the lower side of the supporting rotating plate (17), and a lower pressing plate (12) is connected to the, the novel adjustable bolt is characterized in that an adjusting screw groove (13) is formed in the lower pressing plate (12) and corresponds to the position of an adjusting stud (9), guide slide rods (15) are connected to the two sides, located on the adjusting stud (9), of the lower pressing plate (18), guide slide grooves (11) are formed in the lower pressing plate (12) and correspond to the position of the guide slide rods (15), and a buffer layer (14) is connected to the lower pressing plate (12).

2. The semiconductor chip package structure of claim 1, wherein: the guide sliding rod is characterized in that limiting sliding blocks (10) are connected to the two sides of the guide sliding rod (15) close to the lower portion, limiting sliding grooves (16) are formed in the lower pressing plate (12) and correspond to the limiting sliding blocks (10), and the limiting sliding blocks (10) are connected to the limiting sliding grooves (16) in a sliding mode.

3. The semiconductor chip package structure according to claim 2, wherein: a plurality of first heat dissipation holes (6) are uniformly formed in the flat plate (5) and at positions below the raised columns (4), and third heat dissipation holes (23) are formed in the upper plate of the raised columns (4) and correspond to the first heat dissipation holes (6).

4. The semiconductor chip package structure according to claim 3, wherein: the inner part of the upper pressure plate (18) and the position above the rotating motor (20) are uniformly provided with a plurality of second heat dissipation holes (19), and the second heat dissipation holes (19) are in one-to-one correspondence with the first heat dissipation holes (6) at the position.

5. The semiconductor chip package structure according to claim 4, wherein: the top of protruding cylinder (4) is connected with dustproof subassembly (22), dustproof subassembly (22) include hollow spliced pole (221), standing groove (222), dust screen (223), frame type joint groove (224) and frame type joint spare (225), dust screen (223) are located the top of a plurality of third louvre (23), the outside of dust screen (223) is connected with hollow spliced pole (221), standing groove (222) have been seted up to the upper plate inside of protruding cylinder (4) and the position department that corresponds hollow spliced pole (221), the below of hollow spliced pole (221) is connected with frame type joint spare (225), frame type joint groove (224) have been seted up to the upper plate inside of protruding cylinder (4) and the position department that corresponds frame type joint spare (225), the joint is stabilized in the inside of frame type joint groove (224) in frame type joint spare (225).

6. The semiconductor chip package structure according to claim 5, wherein: the inner side wall of the adjusting screw groove (13) is provided with an internal thread, the outer side wall of the adjusting stud (9) is provided with an external thread, and the internal thread and the external thread are meshed with each other.