CN218006791U - Interconnection-intercommunication-based multi-system integrated heat dissipation circuit board - Google Patents
Interconnection-intercommunication-based multi-system integrated heat dissipation circuit board Download PDFInfo
- Publication number
- CN218006791U CN218006791U CN202221675685.6U CN202221675685U CN218006791U CN 218006791 U CN218006791 U CN 218006791U CN 202221675685 U CN202221675685 U CN 202221675685U CN 218006791 U CN218006791 U CN 218006791U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- board body
- positive
- interconnection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A multi-system integrated heat dissipation circuit board based on interconnection and intercommunication comprises a fixed seat, clamping structures, locking structures, heat dissipation structures and a circuit board base layer, wherein the clamping structures are arranged on the left side and the right side inside the fixed seat; the device clamps and fixes the circuit board body through the clamping structure and the locking structure, so that the phenomenon of loosening and dislocation of the circuit board body caused by external force during working is reduced, the time for clamping and locking the circuit board body by the device is effectively reduced, and the working efficiency is improved; the circuit board body is subjected to double heat dissipation by arranging the heat dissipation fins and the heat dissipation strips, so that heat generated by the circuit board body can be effectively dissipated; still increase the crushing resistance, heat resistance and the waterproof nature of circuit board body through setting up rubber fiber crushing resistance layer, insulating layer and waterproof insulation coating film, prevent that the circuit board body from softening because of long-time work, improving the life of circuit board body.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a based on interconnection multisystem integrated heat dissipation circuit board.
Background
The integrated circuit board is a carrier for carrying integrated circuits, and is made up by using semiconductor production process to make many transistors, resistors and capacitors on a small single-crystal silicon chip, and combining them into a complete electronic circuit by means of multilayer wiring or tunnel wiring.
But current integrated circuit board is carrying out the during operation, is in the intensification environment for a long time very easily ageing, and heat resistance is low, and life is not high, and the circuit board generally is that the screw is fixed simultaneously, when needs maintain the dismantlement, very time-wasting to the staff is improper still very easily causes the circuit board to damage or fracture hard, and compressive property is not high. In order to solve the above problems, the present application provides an interconnection-based multi-system integrated heat dissipation circuit board.
SUMMERY OF THE UTILITY MODEL
Objects of the invention
For solving the technical problem that exists among the background art, the utility model provides a based on interconnection multisystem integrated heat dissipation circuit board, effectual solved current integrated circuit board when carrying out the during operation, it is ageing very easily in the intensification environment for a long time, the heat resistance is low, and life is not high, the circuit board generally is that the screw goes on fixing simultaneously, when needs are maintained and are dismantled, very waste time, and the staff just causes the circuit board to damage or fracture very easily by force improper, the not high problem of compressive property.
(II) technical scheme
In order to solve the problem, the utility model provides a based on interconnection multisystem integration heat dissipation circuit board, including fixing base, clamping structure, locking structure, heat radiation structure and circuit board basic unit, the inside left and right sides of fixing base all is provided with clamping structure, and the clamping structure upside is provided with the locking structure, and the inside downside of fixing base is provided with heat radiation structure.
Preferably, the clamping structure comprises a first positive and negative threaded rod, a first threaded sleeve, a first rotary table, a movable seat, a clamping block, tension springs, a support plate, a first through groove, guide posts and a circuit board body, wherein a first positive and negative threaded rod is arranged inside the fixing seat, the left side and the right side of the first positive and negative threaded rod are in threaded connection with the first threaded sleeve, the right end of the first positive and negative threaded rod penetrates through the fixing seat and is provided with the first rotary table, the movable seat is arranged on the upper side of the first threaded sleeve, the clamping block is arranged on the inner side of the movable seat, the left end and the right end of the inner part of the fixing seat are provided with a plurality of tension springs, the support plate is arranged on the upper side of the inner part of the fixing seat, the first through groove is arranged on each of the left side and the right side of the support plate, the plurality of guide posts are arranged on the upper sides of the guide posts;
through adopting above-mentioned technical scheme, press from both sides tight fixed, easy operation to circuit board body both sides.
Preferably, the locking structure comprises a second positive and negative threaded rod, a second rotary table, a second threaded sleeve, a first connecting block, a pressing plate and a second through groove, the second positive and negative threaded rod is arranged in the movable seat, the upper end of the second positive and negative threaded rod penetrates through the movable seat and is provided with the second rotary table, the upper side of the second positive and negative threaded rod is in threaded connection with the second threaded sleeve, the first connecting block is arranged on the inner side of the second threaded sleeve, the pressing plate is arranged on the inner side of the first connecting block, and the second through groove is arranged on the upper part of the inner side of the movable seat;
through adopting above-mentioned technical scheme, realize compressing tightly the circuit board body, prevent that the circuit board body from receiving external force influence and not hard up phenomenon to produce.
Preferably, the heat dissipation structure comprises a third threaded sleeve, a second connecting block, a push plate, a third through groove, a buffering spring rod, a heat dissipation sheet, a heat conduction plate, a fourth through groove and heat dissipation strips, the lower side of the second positive and negative threaded rod is in threaded connection with the third threaded sleeve, the inner side of the third threaded sleeve is provided with the second connecting block, the inner side of the second connecting block is provided with the push plate, the lower part of the inner side of the movable seat is provided with the third through groove, the left side and the right side of the bottom end inside the fixed seat are both provided with the buffering spring rod, the upper side of the buffering spring rod is provided with the heat dissipation sheet, the upper side of the heat dissipation sheet is provided with the heat conduction plate, the middle part of the support plate is provided with the fourth through groove, and the lower side of the heat dissipation sheet is provided with the plurality of heat dissipation strips;
through adopting above-mentioned technical scheme, dispel the heat to the circuit board body, prevent that the circuit board body from producing a large amount of heats and damaging under being in high temperature environment for a long time at the during operation.
Preferably, the circuit board body comprises a circuit board base layer, a rubber fiber pressure-resistant layer, a heat-insulating layer and a waterproof insulating coating, wherein the rubber fiber pressure-resistant layer is arranged on one side of the circuit board base layer, the heat-insulating layer is arranged on one side of the circuit board base layer away from the circuit board base layer, and the waterproof insulating coating is arranged on one side of the heat-insulating layer away from the circuit board base layer;
through adopting above-mentioned technical scheme, the crushing resistance and the waterproof nature of effectual increase circuit board body increase the heat resistance of circuit board body simultaneously, prevent that the circuit board body from appearing the phenomenon of softening because of long-time work.
Preferably, the pressing plate is positioned on the upper side of the circuit board body, and the pushing plate is positioned on the lower side of the radiating fin;
preferably, a rubber pad is sleeved outside the clamping block;
through adopting above-mentioned technical scheme, increased the stability of clamp splice to circuit board body centre gripping.
Preferably, anti-skidding sleeves are sleeved outside the first rotating disc and the second rotating disc;
through adopting above-mentioned technical scheme, antiskid cover can effectually avoid the user to slide when the control carousel.
The above technical scheme of the utility model following profitable technological effect has:
the clamping structure is arranged to clamp and fix two sides of the circuit board body, so that the operation is simple, the phenomenon of loosening and dislocation of the circuit board body caused by external force during working is reduced, and the loss of the work is prevented;
the device realizes the compaction of the circuit board body by arranging the locking structure, prevents the circuit board body from loosening under the influence of external force, effectively reduces the time for clamping and locking the circuit board body by the device and improves the working efficiency;
the device is characterized in that the heat dissipation structure is arranged to dissipate heat of the circuit board body, the heat is effectively conducted to the heat dissipation fins and the heat dissipation strips from the heat conduction plate, and is dissipated into the air through the heat dissipation fins and the heat dissipation strips, the circuit board body for the interconnection and intercommunication multiple systems is easy to generate a large amount of heat to cause damage in long-time work, and the heat dissipation fins and the heat dissipation strips are arranged to perform double heat dissipation on the circuit board body, so that the heat generated by the circuit board body can be effectively dissipated, and the service life of the circuit board body for the interconnection and intercommunication multiple systems is prolonged;
this device is through setting up compressive resistance, heat resistance and the waterproof nature that rubber fiber compressive layer, insulating layer and waterproof insulation coating film can effectual increase circuit board body, prevents that circuit board body from appearing the phenomenon of softening because of long-time work, the effectual life who improves circuit board body.
Drawings
Fig. 1 is the utility model provides a structural schematic based on interconnection multisystem integrated heat dissipation circuit board.
Fig. 2 is a top view of the multi-system integrated heat dissipation circuit board based on interconnection provided by the present invention without a circuit board body.
Fig. 3 is a side view of the movable seat 5 in the multi-system integrated heat dissipation circuit board based on interconnection and intercommunication provided by the utility model.
Fig. 4 is a cross-sectional view of a circuit board body in an interconnection-based multi-system integrated heat dissipation circuit board.
Fig. 5 is an enlarged view of a part a of the interconnection-based multi-system integrated heat dissipation circuit board of the present invention.
Fig. 6 is an enlarged view of B in the interconnection-based multi-system integrated heat dissipation circuit board.
Reference numerals: 1. a fixed seat; 2. a first positive and negative threaded rod; 3. a first threaded sleeve; 4. a first turntable; 5. a movable seat; 6. a clamping block; 7. a tension spring; 8. a carrier plate; 9. a first through groove; 10. a guide post; 11. a circuit board body; 12. a second positive and negative threaded rod; 13. a second turntable; 14. a second threaded sleeve; 15. a first connection block; 16. pressing a plate; 17. a second through groove; 18. a third thread bush; 19. a second connecting block; 20. pushing the plate; 21. a third through groove; 22. a buffer spring lever; 23. a heat sink; 24. a heat conducting plate; 25. a fourth through groove; 26. a heat dissipating strip; 27. a circuit board base layer; 28. a rubber fiber pressure resistant layer; 29. a thermal insulation layer; 30. and (5) waterproof insulation coating.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1-6, the utility model provides a based on interconnection intercommunication multi-system integrated heat dissipation circuit board, including fixing base 1, clamping structure, locking structure, heat radiation structure and circuit board basic unit 27, the inside left and right sides of fixing base 1 all is provided with clamping structure, and the clamping structure upside is provided with locking structure, and the inside downside of fixing base 1 is provided with heat radiation structure.
In an alternative embodiment, the clamping structure includes a first positive and negative threaded rod 2, a first thread bushing 3, a first rotary table 4, a movable seat 5, a clamping block 6, tension springs 7, a support plate 8, a first through groove 9, a guide post 10 and a circuit board body 11, the fixed seat 1 is internally provided with the first positive and negative threaded rod 2, the first positive and negative threaded rod 2 is connected with the first thread bushing 3 through threads on the left and right sides, the right end of the first positive and negative threaded rod 2 runs through the fixed seat 1 and is provided with the first rotary table 4, the first thread bushing 3 is provided with the movable seat 5 on the upper side, the movable seat 5 is internally provided with the clamping block 6, the clamping block 6 is externally sleeved with a rubber pad, the fixed seat 1 is internally provided with a plurality of tension springs 7 on the left and right ends, the fixed seat 1 is internally provided with the support plate 8 on the upper side, the support plate 8 on the left and right sides is provided with the first through groove 9, the support plate 8 on the upper side is provided with a plurality of guide posts 10, the circuit board body 11 is provided with the circuit board body 11 on the guide post 10, the first rotary table 4 drives the first positive and the first rotary table 2 to rotate, thereby driving the two first thread bushings 3 to move to the inner side, the first thread bushing 5 drives the fixed seat 11 to clamp the fixed circuit board body 11.
In an optional embodiment, the locking structure includes a second positive and negative threaded rod 12, a second rotary table 13, a second threaded sleeve 14, a first connecting block 15, a pressing plate 16 and a second through groove 17, the second positive and negative threaded rod 12 is arranged inside the movable seat 5, the second rotary table 13 is arranged on the upper end of the second positive and negative threaded rod 12 in a penetrating manner through the movable seat 5, the anti-slip sleeves are sleeved outside the first rotary table 4 and the second rotary table 13, the second threaded sleeve 14 is connected to the upper side of the second positive and negative threaded rod 12 in a threaded manner, the first connecting block 15 is arranged inside the second threaded sleeve 14, the pressing plate 16 is arranged inside the first connecting block 15, the pressing plate 16 is located on the upper side of the circuit board body 11, the second through groove 17 is arranged on the upper portion inside of the movable seat 5, the second rotary table 13 drives the second positive and negative threaded rod 12 to rotate, the second positive and negative threaded rod 12 drives the second threaded sleeve 14 and the first connecting block 15 to move downwards, so as to drive the pressing plate 16 to move downwards, and thus to realize the pressing of the circuit board body 11.
In an optional embodiment, the heat dissipation structure includes a third threaded sleeve 18, a second connecting block 19, a push plate 20, a third through groove 21, a buffer spring rod 22, a heat sink 23, a heat conduction plate 24, a fourth through groove 25 and heat sink strips 26, the third threaded sleeve 18 is threaded on the lower side of the second positive and negative threaded rod 12, the second connecting block 19 is disposed on the inner side of the third threaded sleeve 18, the push plate 20 is disposed on the inner side of the second connecting block 19, the third through groove 21 is disposed on the lower portion of the inner side of the movable seat 5, the buffer spring rod 22 is disposed on each of the left and right sides of the bottom end inside the fixed seat 1, the heat sink 23 is disposed on the upper side of the buffer spring rod 22, the push plate 20 is located on the lower side of the heat sink 23, the heat conduction plate 24 is disposed on the upper side of the heat sink 23, the fourth through groove 25 is disposed in the middle portion of the carrier plate 8, the lower side of the heat sink 23 is disposed with a plurality of heat sink strips 26, the second positive and negative threaded rod 12 drives the third threaded sleeve 18 and the second connecting block 19 to move upward, thereby driving the push plate 20 to move the push plate 20 to push the heat sink 23 to move upward, thereby driving the heat conduction plate 24 to move upward to move the heat conduction plate to move tightly contact with the lower end of the circuit board 11, thereby effectively dissipating heat dissipation structure.
In an alternative embodiment, the circuit board body 11 includes a circuit board base layer 27, a rubber fiber compression layer 28, a thermal insulation layer 29 and a waterproof insulation coating film 30, the rubber fiber compression layer 28 is disposed on one side of the circuit board base layer 27, the thermal insulation layer 29 is disposed on one side of the circuit board base layer 27 away from the circuit board base layer 27, and the waterproof insulation coating film 30 is disposed on one side of the thermal insulation layer 29 away from the circuit board base layer 27.
The utility model discloses a theory of operation does: when the circuit board clamping device is used, the circuit board body 11 is placed on the guide post 10, then the first rotating disc 4 is rotated, the first rotating disc 4 drives the first positive and negative threaded rods 2 to rotate, so as to drive the two first threaded sleeves 3 to move inwards, the first threaded sleeves 3 drive the movable seat 5 to move towards the circuit board body 11, so as to drive the clamping blocks 6 to clamp and fix two sides of the circuit board body 11, the operation is simple, the phenomenon that the circuit board body 11 is loosened and dislocated due to external force during working is reduced, the loss caused to work is prevented, rubber pads are sleeved outside the clamping blocks 6, the stability of the clamping blocks 6 for clamping the circuit board body 11 can be increased, after the circuit board body 11 is clamped and fixed, the second rotating disc 13 is rotated, the second rotating disc 13 drives the second positive and negative threaded rods 12 to rotate, and the second positive and negative threaded rods 12 drives the second threaded sleeves 14 and the first connecting blocks 15 to move downwards, thereby driving the pressing plate 16 to move downwards, thereby realizing the compression of the circuit board body 11, preventing the circuit board body 11 from being loosened due to the influence of external force, effectively reducing the time for clamping and locking the circuit board body 11 by the device, having high efficiency, driving the third threaded sleeve 18 and the second connecting block 19 to move upwards while the second positive and negative threaded rod 12 rotates, thereby driving the push plate 20 to move upwards, the push plate 20 pushes the heat sink 23 to move upwards, thereby driving the heat conducting plate 24 to move upwards, the heat conducting plate 24 moves upwards to be attached to the lower end of the circuit board body 11, thereby effectively dissipating heat of the circuit board body 11, effectively conducting heat from the heat conducting plate 24 to the heat sink 23 and the heat dissipating strip 26, dissipating heat to the air through the heat sink 23 and the heat dissipating strip 26, preventing the circuit board body 11 from generating a large amount of heat and being damaged when being in a high temperature environment for a long time during operation, thereby increase circuit board body 11's life, it can effectual improvement fin 23 stability that reciprocates to set up buffer spring pole 22 at fin 23 downside, simultaneously at circuit board body 11 during operation, rubber fiber compressive layer 28 can effectual reinforcing circuit board basic unit 27's resistance to compression and wearability, set up the effectual heat resistance that increases circuit board basic unit 27 of insulating layer 29 resistance to compression simultaneously, circuit board body 11's life is prolonged, waterproof insulating coating 30 can effectual promotion circuit board body 11's waterproof nature simultaneously, prevent circuit board body 11 from working and damaging in the place that humidity is lower, when needs maintain the dismantlement to circuit board body 11, rethread control second carousel 13, second carousel 13 drives the rotation of second positive and negative threaded rod 12, thereby drive clamp plate 16 rebound, drive heat-conducting plate 24 downstream simultaneously, then control first carousel 4 again, first carousel 4 drives first positive and negative 2 and rotates, thereby drive two first thread bush 3 and movable seat 5 and move to the outside, with this can the person of facilitating the use maintain and dismantle circuit board body 11, moreover, and is simple structure, the person's operation is facilitated.
It should be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modifications, equivalents, improvements and the like which are made without departing from the spirit and scope of the present invention should be considered within the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (8)
1. The utility model provides a based on interconnection multisystem integration heat dissipation circuit board, includes fixing base (1), clamping structure, locking structure, heat radiation structure and circuit board basic unit (27), its characterized in that, the inside left and right sides of fixing base (1) all is provided with clamping structure, and the clamping structure upside is provided with locking structure, and the inside downside of fixing base (1) is provided with heat radiation structure.
2. The interconnection-based multi-system integrated heat dissipation circuit board as claimed in claim 1, wherein the clamping structure comprises a first positive and negative threaded rod (2), a first threaded sleeve (3), a first rotary table (4), a movable seat (5), a clamping block (6), a tension spring (7), a carrier plate (8), a first through groove (9), a guide post (10) and a circuit board body (11), the first positive and negative threaded rod (2) is arranged inside the fixed seat (1), the first threaded sleeve (3) is in threaded connection with the left and right sides of the first positive and negative threaded rod (2), the first rotary table (4) is arranged at the right end of the first positive and negative threaded rod (2) in a manner of penetrating through the fixed seat (1), the movable seat (5) is arranged on the upper side of the first threaded sleeve (3), the clamping block (6) is arranged on the inner side of the movable seat (5), the left and right ends of the fixed seat (1) are provided with the plurality of tension springs (7), the carrier plate (8) is arranged on the inner side of the fixed seat (1), the left and right sides of the support plate (8) is provided with the first through groove (9), the upper side of the carrier plate (8) is provided with the plurality of the guide post (10), and the guide post (11) is arranged on the upper side of the guide post (10).
3. The interconnection-intercommunication-based multi-system integrated heat dissipation circuit board as claimed in claim 2, wherein the locking structure comprises a second positive and negative threaded rod (12), a second rotary plate (13), a second threaded sleeve (14), a first connecting block (15), a pressing plate (16) and a second through groove (17), the second positive and negative threaded rod (12) is arranged inside the movable seat (5), the second rotary plate (13) is arranged at the upper end of the second positive and negative threaded rod (12) in a manner of penetrating through the movable seat (5), the second threaded sleeve (14) is in threaded connection with the upper side of the second positive and negative threaded rod (12), the first connecting block (15) is arranged inside the second threaded sleeve (14), the pressing plate (16) is arranged inside the first connecting block (15), and the second through groove (17) is arranged on the upper portion of the inner side of the movable seat (5).
4. The interconnection-intercommunication-based multi-system integrated heat dissipation circuit board as claimed in claim 1, wherein the heat dissipation structure comprises a third threaded sleeve (18), a second connecting block (19), a push plate (20), a third through groove (21), a buffer spring rod (22), a heat dissipation fin (23), a heat conduction plate (24), a fourth through groove (25) and heat dissipation strips (26), the third threaded sleeve (18) is in threaded connection with the lower side of the second positive and negative threaded rod (12), the second connecting block (19) is arranged on the inner side of the third threaded sleeve (18), the push plate (20) is arranged on the inner side of the second connecting block (19), the third through groove (21) is arranged on the lower portion of the inner side of the movable seat (5), the buffer spring rods (22) are arranged on the left and right sides of the bottom end inside the fixed seat (1), the heat dissipation fin (23) is arranged on the upper side of the buffer spring rod (22), the heat conduction plate (24) is arranged on the upper side of the heat dissipation fin (23), the fourth through groove (25) is arranged in the middle of the support plate (8), and the heat dissipation fin (26) is arranged on the lower side of the heat dissipation fin (23).
5. The interconnection-based multi-system integrated heat dissipation circuit board according to claim 2, wherein the circuit board body (11) comprises a circuit board base layer (27), a rubber fiber compression layer (28), a heat insulation layer (29) and a waterproof insulation coating film (30), the rubber fiber compression layer (28) is arranged on one side of the circuit board base layer (27), the heat insulation layer (29) is arranged on one side of the circuit board base layer (27) far away from the circuit board base layer (27), and the waterproof insulation coating film (30) is arranged on one side of the heat insulation layer (29) far away from the circuit board base layer (27).
6. The interconnection-based multi-system integrated heat dissipation circuit board according to claim 3, wherein the pressing plate (16) is located on the upper side of the circuit board body (11), and the pushing plate (20) is located on the lower side of the heat sink (23).
7. The interconnection-based multi-system integrated heat dissipation circuit board as claimed in claim 2, wherein a rubber pad is sleeved outside the clamping block (6).
8. The interconnection-based multi-system integrated heat dissipation circuit board according to claim 2, wherein anti-slip sleeves are sleeved on the outer portions of the first rotating disc (4) and the second rotating disc (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221675685.6U CN218006791U (en) | 2022-06-30 | 2022-06-30 | Interconnection-intercommunication-based multi-system integrated heat dissipation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221675685.6U CN218006791U (en) | 2022-06-30 | 2022-06-30 | Interconnection-intercommunication-based multi-system integrated heat dissipation circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218006791U true CN218006791U (en) | 2022-12-09 |
Family
ID=84311951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221675685.6U Active CN218006791U (en) | 2022-06-30 | 2022-06-30 | Interconnection-intercommunication-based multi-system integrated heat dissipation circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218006791U (en) |
-
2022
- 2022-06-30 CN CN202221675685.6U patent/CN218006791U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113115559B (en) | Heat dissipation device and heat dissipation method based on shape memory alloy | |
| CN106910691B (en) | The radiator structure and packaging technology of IGBT module in power converter | |
| CN209914215U (en) | Clamping and fixing structure for mounting circuit board | |
| CN218006791U (en) | Interconnection-intercommunication-based multi-system integrated heat dissipation circuit board | |
| CN208662787U (en) | A kind of circuit board clamp | |
| CN100347637C (en) | Auxiliary supporting structure of circuit board | |
| CN211506370U (en) | Electronic computer hard disk fixing device | |
| CN210073507U (en) | Double-layer heat dissipation structure of wire-wound resistor | |
| CN211629133U (en) | Integrated high-power LED thermoelectric separation support | |
| CN108601200B (en) | Multilayer printed circuit board | |
| CN206338773U (en) | A kind of Novel LED light | |
| CN220647904U (en) | LED lamp chip installation fastening assembly | |
| CN208028038U (en) | Switching tube cooling clamper | |
| CN220823632U (en) | Folding radiator | |
| CN218920853U (en) | Concave copper foil radiating fin | |
| CN216119757U (en) | Ceramic substrate for potentiometer with hole | |
| CN218336992U (en) | LED driver with built-in overvoltage protection | |
| KR101472995B1 (en) | Manufacturing method of cooling fin structure | |
| CN217011293U (en) | Circuit board that soft or hard combines | |
| CN216055243U (en) | Power module of parallel output of integral transformer | |
| CN220233175U (en) | Clamping mechanism and heat dissipation box using same | |
| CN217849925U (en) | Intelligent monitoring core processing module | |
| CN206596327U (en) | A kind of graphite heat conducting medium | |
| CN220272471U (en) | Sorting type storage chip packaging structure | |
| CN207765476U (en) | A kind of light emitting diode with heat-conductive composite material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |