CN220272471U - Sorting type storage chip packaging structure - Google Patents
Sorting type storage chip packaging structure Download PDFInfo
- Publication number
- CN220272471U CN220272471U CN202321900137.3U CN202321900137U CN220272471U CN 220272471 U CN220272471 U CN 220272471U CN 202321900137 U CN202321900137 U CN 202321900137U CN 220272471 U CN220272471 U CN 220272471U
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- fixedly connected
- plate
- upper cover
- heat
- lower seat
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 238000003825 pressing Methods 0.000 claims description 16
- 230000006835 compression Effects 0.000 claims description 8
- 238000007906 compression Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a sorting type storage chip packaging structure in the field of storage chip packaging, which comprises a lower seat, an upper cover and a chip body, wherein the upper cover is fixedly connected to the top of the lower seat, the chip body is fixedly connected to the middle part of the top of an inner cavity of the lower seat, a power interface is arranged in the middle part of the left part of the front side of the lower seat, a data interface is arranged in the middle part of the right part of the front side of the lower seat, and a heat dissipation mechanism is fixedly connected to the top of the upper cover.
Description
Technical Field
The utility model relates to the technical field of memory chip packaging, in particular to a sorting type memory chip packaging structure.
Background
The memory chip is a specific application of the concept of an embedded system chip in the memory industry. Thus, both system chips and memory chips enable multi-functionality and high performance, as well as support for multiple protocols, multiple hardware and different applications, by embedding software in a single chip.
The prior memory chip is usually arranged in the shell when packaged, but the prior packaging structure has poor heat dissipation effect, cannot conduct heat of the chip, easily causes overhigh temperature of the chip, and reduces the service life.
Disclosure of Invention
The utility model aims to provide a sorting type storage chip packaging structure, which aims to solve the problems that the prior storage chip packaging structure is poor in heat dissipation effect, heat of the chip cannot be conducted, the temperature of the chip is easily overhigh, and the service life is reduced when the chip is usually placed in a shell in the prior storage chip packaging process.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a letter sorting formula memory chip packaging structure, includes lower seat, upper cover and chip body, upper cover fixed connection in lower seat top, chip body fixed connection in lower seat inner chamber top middle part, power source has been seted up at lower seat front side left part middle part, lower seat front side right part middle part has seted up data interface, upper cover top fixedly connected with cooling mechanism, cooling mechanism includes heat conduction fin, heat-conducting plate, heating panel, connecting seat, standing groove, placing plate, mounting bracket, heat dissipation fan, installation chamber, reset spring, cardboard and arm-tie, upper cover top evenly runs through fixed connection and has heat conduction fin, heat conduction fin bottom fixedly connected with heat-conducting plate, heat conduction fin top fixedly connected with heating panel, side fixedly connected with connecting seat around the upper cover top, the standing groove has been seted up on the connecting seat top, the inside swing joint of standing groove has the placing plate, the opposite side fixedly connected with mounting bracket of placing plate, side fixedly connected with mounting bracket about inner chamber bottom side middle part fixedly connected with heat-conducting fin, heat dissipation fan fixedly connected with side left and right side, the side fixedly connected with cardboard is connected with top, the side fixedly connected with top of reset spring.
As a further description of the above technical solution:
the bottom of the heat conducting plate is attached to the top of the chip body, and the input end of the heat radiating fan is electrically connected with the output end of an external power supply.
As a further description of the above technical solution:
the bottom area of the placing plate is equal to the bottom area of the placing groove, the left side and the right side of the top of the connecting seat penetrate through the top of the mounting cavity to form a notch, and the pulling plate is positioned inside the notch.
As a further description of the above technical solution:
the clamping plate is in sliding connection with the inside of the installation cavity, and the outer side of the clamping plate is attached to the inner side of the installation cavity.
As a further description of the above technical solution:
the utility model discloses a clamping mechanism, including upper cover bottom four corners limit position department, upper cover bottom four corners limit position department fixedly connected with hold-down mechanism, hold-down mechanism includes sleeve, hold-down spring, spacing dish, connecting rod and clamp plate, upper cover bottom four corners limit position department fixedly connected with sleeve, sleeve inner chamber top middle part fixedly connected with hold-down spring, hold-down spring bottom fixedly connected with spacing dish, spacing dish bottom middle part fixedly connected with connecting rod, connecting rod bottom fixedly connected with clamp plate.
As a further description of the above technical solution:
the limiting disc is in sliding clamping connection with the inner cavity of the sleeve, and a rubber pad is fixedly connected to the bottom of the pressing plate.
Compared with the prior art, the utility model has the beneficial effects that:
1. this letter sorting formula memory chip packaging structure, the heat that produces when using passes through the heat conduction board and transmits to on the heat conduction fin, and the heat dissipation is carried out on the heating panel to the retransmission, through the start-up of radiator fan, take out the heat on the heating panel to promote the heat dispersion of encapsulation chip, avoid the chip temperature too high to lead to life to reduce, and through the pulling arm-tie, drive the cardboard shrink, remove to placing the fixed of board, thereby be convenient for dismantle the mounting bracket, conveniently dismantle the clearance maintenance to the radiator fan.
2. This letter sorting formula memory chip packaging structure, when the encapsulation, make the upper cover fixed to make clamp plate and chip body top contact, press the upper cover, make the connecting rod drive spacing dish at the inside removal of sleeve, extrude compression spring, through compression spring's reaction force, make the clamp plate extrude the chip body, thereby guarantee the stability after the chip body encapsulation, hoisting device's practicality.
Drawings
FIG. 1 is a schematic diagram of the whole structure of a sort-type memory chip package structure according to the present utility model;
fig. 2 is a schematic diagram of a heat conducting plate structure of a sorting type memory chip package structure according to the present utility model;
FIG. 3 is a schematic diagram of a return spring mounting structure of a sort-type memory chip package structure according to the present utility model;
fig. 4 is a schematic structural diagram of a pressing mechanism of a sorting type memory chip packaging structure according to the present utility model.
In the figure: 100. a lower seat; 110. a power interface; 120. a data interface; 200. an upper cover; 300. a chip body; 400. a heat dissipation mechanism; 410. a heat conduction fin; 420. a heat conductive plate; 430. a heat dissipation plate; 440. a connecting seat; 450. a placement groove; 460. placing a plate; 470. a mounting frame; 480. a heat dissipation fan; 490. a mounting cavity; 491. a return spring; 492. a clamping plate; 493. pulling a plate; 500. a compressing mechanism; 510. a sleeve; 520. a compression spring; 530. a limiting disc; 540. a connecting rod; 550. and (5) pressing plates.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The utility model provides a sort type memory chip packaging structure, which improves the heat dissipation capacity of a packaged chip, avoids the reduction of service life caused by overhigh chip temperature, and referring to fig. 1-4, and comprises a lower seat 100, an upper cover 200 and a chip body 300;
referring to fig. 2 again, the lower base 100 is used for installing and fixing the upper cover 200 and the chip body 300;
referring to fig. 2 again, the upper cover 200 is fixedly connected to the top of the lower seat 100, encapsulates the chip body 300, the chip body 300 is fixedly connected to the middle of the top of the inner cavity of the lower seat 100, the middle of the left portion of the front side of the lower seat 100 is provided with the power interface 110 for supplying power to the chip body 300, the middle of the right portion of the front side of the lower seat 100 is provided with the data interface 120 for data transmission, and the top of the upper cover 200 is fixedly connected with the heat dissipation mechanism 400;
referring again to fig. 2-3, the heat dissipation mechanism 400 includes a heat conduction fin 410, a heat conduction plate 420, a heat dissipation plate 430, a connection base 440, a placement groove 450, a placement plate 460, a mounting bracket 470, a heat dissipation fan 480, a mounting cavity 490, a return spring 491, a clamping plate 492, and a pull plate 493;
referring to fig. 2 again, the top of the upper cover 200 is uniformly and fixedly connected with heat conducting fins 410, the bottom of the heat conducting fins 410 is fixedly connected with a heat conducting plate 420, the top of the heat conducting fins 410 is fixedly connected with a heat dissipating plate 430, the front side and the rear side of the top of the upper cover 200 are fixedly connected with connecting seats 440, and the left side and the right side of the top of the connecting seats 440 are provided with placing grooves 450;
referring to fig. 3 again, the placing plate 460 is movably connected inside the placing groove 450, the mounting frame 470 is fixedly connected to opposite sides of the front and rear placing plate 460, the heat dissipation fan 480 is fixedly connected to the middle part of the left and right sides of the bottom of the inner cavity of the mounting frame 470, the mounting cavity 490 is formed inside the placing groove 450, the reset spring 491 is fixedly connected to the middle part of the right side of the mounting cavity 490, the clamping plate 492 is fixedly connected to the left end of the reset spring 491, and the pull plate 493 is fixedly connected to the middle part of the right side of the top of the clamping plate 492.
In summary, the heat generated during use is transferred to the heat conducting fin 410 through the heat conducting plate 420, and then transferred to the heat dissipating plate 430 for dissipating heat, and the heat on the heat dissipating plate 430 is brought out through the start of the heat dissipating fan 480, so that the heat dissipating capability of the packaged chip is improved, the service life of the packaged chip is prevented from being reduced due to the overhigh temperature of the chip, and the clamping plate 492 is driven to shrink by pulling the pulling plate 493, so that the fixing of the placing plate 460 is relieved, the mounting frame 470 is conveniently detached, and the heat dissipating fan 480 is conveniently detached, cleaned and overhauled.
Referring to fig. 2 again, the bottom of the heat conducting plate 420 is attached to the top of the chip body 300, and the input end of the heat dissipating fan 480 is electrically connected to the output end of the external power source.
Referring to fig. 3 again, the bottom area of the placement plate 460 is equal to the bottom area of the placement groove 450, a notch is formed at the top of the mounting cavity 490 by the left and right sides of the top of the connection seat 440, and the pull plate 493 is located inside the notch.
Referring again to fig. 3, the catch plate 492 is slidably coupled to the interior of the mounting cavity 490, and the outside of the catch plate 492 engages the inside of the mounting cavity 490.
Referring to fig. 4 again, the pressing mechanism 500 is fixedly connected to the four corners and the edges of the bottom of the upper cover 200, the pressing mechanism 500 includes a sleeve 510, a pressing spring 520, a limiting plate 530, an attachment rod 540 and a pressing plate 550, the four corners and the edges of the bottom of the upper cover 200 are fixedly connected to the sleeve 510, the pressing spring 520 is fixedly connected to the middle of the top of the inner cavity of the sleeve 510, the limiting plate 530 is fixedly connected to the bottom of the pressing spring 520, the attachment rod 540 is fixedly connected to the middle of the bottom of the limiting plate 530, and the pressing plate 550 is fixedly connected to the bottom of the attachment rod 540.
Referring to fig. 4 again, the limiting plate 530 is slidably engaged with the inner cavity of the sleeve 510, and a rubber pad is fixedly connected to the bottom of the pressing plate 550.
To sum up, when packaging, the upper cover 200 is fixed, so that the pressing plate 550 contacts with the top of the chip body 300, the upper cover 200 is pressed, the connecting rod 540 drives the limiting plate 530 to move inside the sleeve 510, the compression spring 520 is extruded, the pressing plate 550 extrudes the chip body 300 through the reaction force of the compression spring 520, and therefore, the stability of the chip body 300 after packaging is ensured, and the practicability of the device is improved.
When the packaging structure is used specifically, when a person in the technical field is packaged, glue is smeared on the edge of the top of the lower seat 100, the upper cover 200 is aligned with the lower seat 100, the pressing plate 550 is contacted with the top of the chip body 300, the upper cover 200 is pressed, the connecting rod 540 drives the limiting plate 530 to move inside the sleeve 510, the compression spring 520 is pressed, the chip body 300 is pressed by the pressing plate 550 through the reaction force of the compression spring 520, the stability of the packaged chip body 300 is guaranteed, meanwhile, the bottom of the heat conducting plate 420 is contacted with the top of the chip body 300, packaging is completed, then when the packaging structure is used, generated heat is transferred onto the heat conducting fins 410 through the heat conducting plate 420 and then transferred onto the heat radiating plate 430 for radiating, the heat is taken out through the heat radiating fan 480, when the heat radiating fan 480 is required to be overhauled and cleaned, the pulling plate 493 is used for driving the clamping plate 492 to shrink inside the mounting cavity, the fixing of the placing plate 460 is released, the placing plate 460 is pulled 470 is moved out from the inside the mounting groove 450, the fixing of the mounting bracket 470 is released, and the mounting plate 470 and the heat is removed 470 and the radiating fan 480 is convenient for overhauling and cleaning.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.
Claims (6)
1. A sort type memory chip packaging structure is characterized in that: including lower seat (100), upper cover (200) and chip body (300), upper cover (200) fixed connection in lower seat (100) top, chip body (300) fixed connection in lower seat (100) inner chamber top middle part, power source interface (110) have been seted up at lower seat (100) front side left part middle part, data interface (120) have been seted up at lower seat (100) front side right part middle part, upper cover (200) top fixedly connected with cooling mechanism (400), cooling mechanism (400) include heat conduction fin (410), heat conduction board (420), heating panel (430), connecting seat (440), standing groove (450), standing plate (460), mounting bracket (470), heat dissipation fan (480), installation cavity (490), reset spring (491), cardboard (492) and arm-tie (493), even fixedly connected with heat conduction fin (410) are run through at upper cover (200) top, heat conduction fin (410) bottom fixedly connected with board (420), heat dissipation board (430) are fixedly connected with heat dissipation board (430) top, upper cover (200) top fixedly connected with front side rear side (440) standing groove (440), the utility model discloses a rack, including rack (470), mounting groove (450), inside swing joint of rack (450) place board (460), front and back portion place board (460) opposite side fixedly connected with mounting bracket (470), side middle part fixedly connected with heat dissipation fan (480) about mounting bracket (470) inner chamber bottom, mounting chamber (490) have been seted up to rack (450) inboard, mounting chamber (490) right side middle part fixedly connected with reset spring (491), reset spring (491) left end fixedly connected with cardboard (492), cardboard (492) top right side middle part fixedly connected with arm-tie (493).
2. The sortable memory chip package structure as defined in claim 1, wherein: the bottom of the heat conducting plate (420) is attached to the top of the chip body (300), and the input end of the heat radiating fan (480) is electrically connected with the output end of an external power supply.
3. The sortable memory chip package structure as defined in claim 1, wherein: the bottom area of the placing plate (460) is equal to the bottom area of the placing groove (450), the left side and the right side of the top of the connecting seat (440) penetrate through the top of the mounting cavity (490) to form a notch, and the pulling plate (493) is positioned inside the notch.
4. The sortable memory chip package structure as defined in claim 1, wherein: the clamping plate (492) is slidably connected inside the mounting cavity (490), and the outer side of the clamping plate (492) is attached to the inner side of the mounting cavity (490).
5. The sortable memory chip package structure as defined in claim 1, wherein: the utility model discloses a compression mechanism, including upper cover (200) bottom four corners limit position department fixedly connected with hold-down mechanism (500), hold-down mechanism (500) include sleeve (510), hold-down spring (520), spacing dish (530), connecting rod (540) and clamp plate (550), upper cover (200) bottom four corners limit position department fixedly connected with sleeve (510), sleeve (510) inner chamber top middle part fixedly connected with hold-down spring (520), hold-down spring (520) bottom fixedly connected with spacing dish (530), spacing dish (530) bottom middle part fixedly connected with connecting rod (540), connecting rod (540) bottom fixedly connected with clamp plate (550).
6. The sortable memory chip package structure as defined in claim 5, wherein: the limiting disc (530) is slidably clamped in the inner cavity of the sleeve (510), and a rubber pad is fixedly connected to the bottom of the pressing plate (550).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321900137.3U CN220272471U (en) | 2023-07-19 | 2023-07-19 | Sorting type storage chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321900137.3U CN220272471U (en) | 2023-07-19 | 2023-07-19 | Sorting type storage chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220272471U true CN220272471U (en) | 2023-12-29 |
Family
ID=89316476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321900137.3U Active CN220272471U (en) | 2023-07-19 | 2023-07-19 | Sorting type storage chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220272471U (en) |
-
2023
- 2023-07-19 CN CN202321900137.3U patent/CN220272471U/en active Active
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