CN213277647U - High-power plug-in resistor based on packaging structure - Google Patents
High-power plug-in resistor based on packaging structure Download PDFInfo
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- CN213277647U CN213277647U CN202021642861.7U CN202021642861U CN213277647U CN 213277647 U CN213277647 U CN 213277647U CN 202021642861 U CN202021642861 U CN 202021642861U CN 213277647 U CN213277647 U CN 213277647U
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- pin
- groove
- heat
- packaging shell
- resistor
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 51
- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims abstract description 14
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 9
- 230000006872 improvement Effects 0.000 description 9
- 238000005538 encapsulation Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model relates to the technical field of resistors, in particular to a high-power plug-in resistor based on a packaging structure, which comprises a packaging shell, a placement cavity arranged on the packaging shell, a chip body arranged in the placement cavity, and a first pin and a second pin which are connected with the chip body, wherein the first pin and the second pin both extend to the outside of the packaging shell; a through groove is formed in one side face of the packaging shell and communicated to the placement cavity, insulating heat-conducting glue is filled in the through groove, epoxy resin is filled in the placement cavity, a metal frame is attached to one face, located on the through groove, of the packaging shell, and a plurality of radiating grooves are formed in one face, away from the packaging shell, of the metal frame; the utility model discloses set up metal crate, decompressed the heat-conducting glue in the cooperation and realized high-speed heat transfer, promoted the radiating effect of structure to can guarantee the quick heat conduction heat dissipation of the heat that produces in high-power use, and then promote the stability of resistance operation.
Description
Technical Field
The utility model relates to a resistor technical field especially relates to a high-power plug-in components resistor based on packaging structure.
Background
The plug-in resistor is a commonly used element on the circuit board, and has the advantages that firstly, the plug-in resistor is large in size and large in bearing current, the plug-in resistor is larger than the patch resistor in size but large in bearing current, the performance of the plug-in resistor is more stable than that of the patch, and the plug-in resistor is suitable for working in severe environments. Typically for high power product applications. And secondly, the soldering tin is stable and not easy to fall off, a through hole is needed, the soldering tin area is large and stable, the stability is good, and the worry that the soldering tin falls off in the using process is avoided.
The existing plug-in resistor has some defects in practical use. If the heat transfer and radiation structure is not good, the stability is poor in high-power use, rapid heat transfer and radiation cannot be realized, and further improvement can be made on the heat radiation structure of the plug-in resistor.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a set up metal crate, decompress the heat-conducting glue in the cooperation and realize high-speed heat transfer, promote the radiating effect of structure to can guarantee the heat that produces in high-power use fast heat conduction heat dissipation, and then promote the high-power plug-in components resistor based on packaging structure of the stability of resistance operation.
The utility model adopts the technical proposal that: a high-power plug-in resistor based on a packaging structure comprises a packaging shell, a mounting cavity arranged in the packaging shell, a chip body arranged in the mounting cavity, and a first pin and a second pin which are connected with the chip body, wherein the first pin and the second pin both extend to the outside of the packaging shell;
the technical scheme is further improved in that a through groove is formed in one side face of the packaging shell and communicated to a placement cavity, insulating heat-conducting glue is filled in the through groove, epoxy resin is filled in the placement cavity, a metal frame is attached to one face, located in the through groove, of the packaging shell, and a plurality of radiating grooves are formed in one face, away from the packaging shell, of the metal frame;
the packaging shell is further improved in the scheme that a plurality of fine holes are uniformly distributed on the surface, away from the through groove, of the packaging shell, and the fine holes are communicated to the placement cavity.
The further improvement of the scheme is that the packaging shell is integrally formed, and a packaging cover plate is arranged at the position of the opening of the corresponding mounting cavity.
The package cover plate is provided with two groups of pin grooves, and the first pins and the second pins respectively penetrate through the two groups of pin grooves.
The further improvement of the scheme is that a convex strip block is arranged in the arrangement cavity, a clamping groove is formed in the convex strip block, and the clamping groove clamps and fixes the chip body.
The further improvement of the scheme is that the mounting cavity is provided with a first guide groove and a second guide groove, and the first guide groove and the second guide groove are communicated with the clamping groove.
The further improvement of the above scheme is that a first connecting part is installed in the first guide groove, and the first connecting part is connected with the first pin.
The further improvement of the above scheme is that a second connecting part is installed in the second guide groove, and the second connecting part is connected with the second pin.
The further improvement of the above scheme is that the first pin is provided with a first tight insertion part corresponding to the pin slot, and the second pin is provided with a second tight insertion part corresponding to the pin slot.
The metal frame comprises a heat conduction layer attached to the insulating heat conduction glue and a heat dissipation layer in composite connection with the heat conduction layer, and the heat dissipation groove is formed in the heat dissipation layer.
The further improvement to the above scheme is that the heat conduction layer is a copper heat conduction layer, the heat dissipation layer is an aluminum heat dissipation layer, and the heat conduction layer and the heat dissipation layer are combined through metallurgy.
The utility model has the advantages that:
compare traditional plug resistance, the utility model is suitable for a high-power resistance uses, installs the resistance chip body in the encapsulation casing, plays the guard action, sets up the pin simultaneously and is used for pegging graft the use, and has still set up metal crate, decompresses the heat conducting resin in the cooperation and realizes high-speed heat transfer, promotes the radiating effect of structure to can guarantee the quick heat conduction heat dissipation of the heat that produces in high-power use, and then promote the stability of resistance operation. Specifically, set up encapsulation casing, set up in encapsulation casing settle the chamber, install in settle the chip body in chamber and with the first pin and the second pin of chip body coupling, first pin and second pin all extend to encapsulation casing outside, set up through the encapsulation casing of integrative structure and settle the chamber and be used for the installation of chip body, simple to operate, stable in structure is reliable.
In addition, a through groove is formed in one side face of the packaging shell, the through groove is communicated to the placement cavity, insulating heat-conducting glue is filled in the through groove, epoxy resin is filled in the placement cavity, a metal frame is attached to one face, located in the through groove, of the packaging shell, and a plurality of radiating grooves are formed in one face, away from the packaging shell, of the metal frame; a plurality of pores are uniformly distributed on one surface of the packaging shell, which is far away from the through groove, the pores are communicated to the placement cavity, the through groove is specially used for filling insulating heat-conducting glue, so that the structure is separated from epoxy resin, heat is transmitted to the insulating heat-conducting glue through the epoxy resin in the heating process of the chip body, the heat-conducting contact area is larger, the coverage range is wider, and the heat-radiating effect is further ensured under the action of the metal frame matched with the heat-radiating groove; the fine holes are further formed, the other side can be used for heat dissipation through the fine hole structure, the totally-enclosed situation is prevented, and the stability of high-power use is improved.
Drawings
Fig. 1 is a schematic perspective view of the plug-in resistor of the present invention;
FIG. 2 is an exploded view of the interposer resistor of FIG. 1;
FIG. 3 is an exploded view of the insert resistor of FIG. 1 from another perspective;
FIG. 4 is a schematic diagram of a metal frame of the interposer resistor of FIG. 2;
fig. 5 is a schematic diagram of an internal structure of the plug resistor of fig. 1.
Description of reference numerals: the package comprises a package shell 100, a through groove 110, a metal frame 120, a heat dissipation groove 121, a heat conduction layer 122, a heat dissipation layer 123, a fine hole 130, a mounting cavity 200, a package cover plate 210, a pin groove 211, a convex strip block 220, a clamping groove 221, a first guide groove 230, a first connecting portion 231, a second guide groove 240, a second connecting portion 241, a chip body 300, a first pin 400, a first clamping portion 410, a second pin 500 and a second clamping portion 510.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1 to 5, a high power package resistor based on a package structure includes a package housing 100, a mounting cavity 200 formed in the package housing 100, a chip body 300 mounted in the mounting cavity 200, and a first lead 400 and a second lead 500 connected to the chip body 300, where the first lead 400 and the second lead 500 both extend to the outside of the package housing 100.
The packaging shell 100 is provided with a packaging cover plate 210 in an integrally formed mode and in a position corresponding to the opening of the mounting cavity 200, and is further improved in that the packaging cover plate 210 is provided with two groups of pin grooves 211, the first pins 400 and the second pins 500 respectively penetrate through the two groups of pin grooves 211, the packaging cover plate 210 can be used for packaging the opening of the mounting cavity 200, the stability of the structure is improved, the pin grooves 211 are further arranged to allow the pins to penetrate, and the stability of the structure is improved. In addition, first pin 400 is provided with first tight portion 410 of inserting corresponding to pin groove 211, second pin 500 is provided with second tight portion 510 of inserting corresponding to pin groove 211, through the effect of inserting tight portion, guarantees the fixed effect of pin and encapsulation apron 210, and structural stability further promotes.
A through groove 110 is formed in one side surface of the package housing 100, the through groove 110 is communicated with the placement cavity 200, the through groove 110 is filled with insulating heat-conducting glue, the placement cavity 200 is filled with epoxy resin, a metal frame 120 is attached to one surface, located in the through groove 110, of the package housing 100, and a plurality of heat dissipation grooves 121 are formed in one surface, away from the package housing 100, of the metal frame 120; a plurality of pores 130 are uniformly distributed on one surface of the package shell 100 away from the through groove 110, the pores 130 are communicated with the mounting cavity 200, the through groove 110 is specially used for filling insulating heat-conducting glue, so that the structure is separated from epoxy resin, heat is transmitted to the insulating heat-conducting glue through the epoxy resin in the heating process of the chip body 300, the heat-conducting contact area is larger, the coverage range is wider, and the heat-radiating effect is further ensured under the action of the metal frame 120 matched with the heat-radiating groove 121; the fine holes 130 are further formed, the structure of the fine holes 130 can be used for radiating heat on the other side, the totally-closed condition is prevented, and the stability of high-power use is improved.
Place and be provided with protruding strip piece 220 in the chamber 200, centre gripping groove 221 has been seted up to protruding strip piece 220, centre gripping groove 221 is fixed with chip body 300 centre gripping, fixes chip body 300 through centre gripping groove 221 cooperation protruding strip piece 220, and is fixed effectual, and structural strength is high, promotes stability.
The arrangement cavity 200 is provided with a first guide groove 230 and a second guide groove 240, the first guide groove 230 and the second guide groove 240 are communicated with the clamping groove 221, the improvement is that a first connecting part 231 is installed in the first guide groove 230, the first connecting part 231 is connected with the first pin 400, a second connecting part 241 is installed in the second guide groove 240, the second connecting part 241 is connected with the second pin 500, and the connecting part is used for a switching part between the pin and the chip body 300, so that the connection process is more stable and reliable, and the situations of instability or excessive heating and the like in direct contact are prevented.
The utility model is suitable for a high-power resistance uses, installs resistance chip body 300 in packaging shell 100, plays the guard action, sets up the pin simultaneously and is used for pegging graft the use, and has still set up metal crate 120, decompresses the heat conducting resin in the cooperation and realizes high-speed heat transfer, promotes the radiating effect of structure to can guarantee the quick heat conduction heat dissipation of the heat that produces in high-power use, and then promote the stability of resistance operation. Specifically, the packaging shell 100, the placement cavity 200 arranged on the packaging shell 100, the chip body 300 arranged on the placement cavity 200, and the first pin 400 and the second pin 500 connected with the chip body 300 are arranged, the first pin 400 and the second pin 500 both extend to the outside of the packaging shell 100, the placement cavity 200 is arranged on the packaging shell 100 through an integral structure, and the packaging shell 300 is used for mounting the chip body 300, so that the packaging shell is convenient to mount, and is stable and reliable in structure.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A high-power plug-in resistor based on packaging structure, its characterized in that: the packaging structure comprises a packaging shell, a mounting cavity arranged in the packaging shell, a chip body arranged in the mounting cavity, and a first pin and a second pin which are connected with the chip body, wherein the first pin and the second pin both extend to the outside of the packaging shell;
a through groove is formed in one side face of the packaging shell and communicated to the placement cavity, insulating heat-conducting glue is filled in the through groove, epoxy resin is filled in the placement cavity, a metal frame is attached to one face, located in the through groove, of the packaging shell, and a plurality of radiating grooves are formed in one face, away from the packaging shell, of the metal frame;
and a plurality of fine holes are uniformly distributed on the surface of the packaging shell, which is far away from the through groove, and the fine holes are communicated to the mounting cavity.
2. The package based high power package resistor of claim 1, wherein: the packaging shell is integrally formed, and a packaging cover plate is arranged at the position of the packaging shell corresponding to the opening of the mounting cavity.
3. The package based high power package resistor of claim 2, wherein: the packaging cover plate is provided with two groups of pin grooves, and the first pins and the second pins respectively penetrate through the two groups of pin grooves.
4. The package based high power package resistor of claim 1, wherein: the placing cavity is internally provided with a convex strip block, the convex strip block is provided with a clamping groove, and the clamping groove is used for clamping and fixing the chip body.
5. The package based high power package resistor of claim 4, wherein: the mounting cavity is provided with a first guide groove and a second guide groove, and the first guide groove and the second guide groove are communicated with the clamping groove.
6. The package based high power package resistor of claim 5, wherein: first connecting portion are installed in the first guide way, first connecting portion with first pin is connected.
7. The package based high power package resistor of claim 6, wherein: and a second connecting part is arranged in the second guide groove and connected with the second pin.
8. The package based high power package resistor of claim 3, wherein: the first pins are provided with first tight inserting portions corresponding to the pin grooves, and the second pins are provided with second tight inserting portions corresponding to the pin grooves.
9. The package based high power package resistor of claim 1, wherein: the metal frame comprises a heat conduction layer attached to the insulating heat conduction glue and a heat dissipation layer in composite connection with the heat conduction layer, and the heat dissipation groove is formed in the heat dissipation layer.
10. The package based high power package resistor of claim 9, wherein: the heat-conducting layer is copper heat-conducting layer setting, the heat dissipation layer is aluminium system heat dissipation layer setting, through metallurgical bonding between heat-conducting layer and the heat dissipation layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021642861.7U CN213277647U (en) | 2020-08-07 | 2020-08-07 | High-power plug-in resistor based on packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021642861.7U CN213277647U (en) | 2020-08-07 | 2020-08-07 | High-power plug-in resistor based on packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213277647U true CN213277647U (en) | 2021-05-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021642861.7U Expired - Fee Related CN213277647U (en) | 2020-08-07 | 2020-08-07 | High-power plug-in resistor based on packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213277647U (en) |
-
2020
- 2020-08-07 CN CN202021642861.7U patent/CN213277647U/en not_active Expired - Fee Related
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210525 |
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| CF01 | Termination of patent right due to non-payment of annual fee |