CN212851200U - Radiator, PCB board and electronic equipment - Google Patents
Radiator, PCB board and electronic equipment Download PDFInfo
- Publication number
- CN212851200U CN212851200U CN202022149527.4U CN202022149527U CN212851200U CN 212851200 U CN212851200 U CN 212851200U CN 202022149527 U CN202022149527 U CN 202022149527U CN 212851200 U CN212851200 U CN 212851200U
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- pcb board
- heat sink
- heat
- boss
- radiator
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a radiator, PCB board and electronic equipment, wherein, a radiator for the PCB board, include: the radiating piece, the one side that faces of radiating piece the PCB board has the boss, the boss embedding the inslot of PCB board. The utility model discloses technical scheme solves effectively among the prior art because hot silica gel or heat conduction silicone grease use after for a long time and under the high temperature easy ageing after the heat-sinking capability reduce or lose not enough.
Description
Technical Field
The utility model relates to a PCB board heat dissipation equipment technical field, in particular to radiator, PCB board and electronic equipment.
Background
Today's electronic devices have integrated circuits, and high temperatures are a rival of integrated circuits. The high temperature can not only cause the unstable operation of the system and shorten the service life, but also possibly burn some parts. The heat that causes the high temperature comes from inside the sound integrated circuit.
The PCB board and the radiator are in direct contact with each other through heat-conducting silica gel or heat-conducting silicone grease to conduct heat. The heat-conducting silica gel or the heat-conducting silicone grease is easy to age after being used for a long time and at high temperature, can dry so as to increase heat-conducting resistance, has certain volatility and is inconvenient to paint; the radiator is arranged close to the shell of the power device (power amplifier tube), and the extrusion degree is different, so that the heat radiation is uneven, and the power device (power amplifier tube) is burnt out.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a radiator, PCB board and electronic equipment aims at solving the not enough technical problem of prior art radiator heat-sinking capability.
In order to achieve the above object, the utility model provides a radiator for the PCB board, a serial communication port, include:
the radiating piece, the one side that faces of radiating piece the PCB board has the boss, the boss embedding the inslot of PCB board.
Optionally, the boss does not extend out of a side of the PCB board facing away from the heat sink to form a solder paste filled gap.
Optionally, the boss is clearance fit or transition fit with the slot.
Optionally, the heat sink further comprises: the glue fixing layer is arranged on the surface, facing the PCB, of the heat dissipation piece.
Optionally, the utility model also provides a PCB board, including aforementioned radiator.
Optionally, one side of the PCB that deviates from the heat sink is provided with a power amplifier tube, the power amplifier tube includes a heat dissipation pin pad, the heat dissipation pin pad set up in the power amplifier tube towards one side of the PCB.
Optionally, the groove is opened at a heat dissipation pin pad of the power amplifier tube.
Optionally, the cross-sectional area of the slot is 1/2 to 3/4 of the cross-sectional area of the heat sink pin pad.
Optionally, the boss and the heat dissipation pin pad are connected by solder paste.
Optionally, the utility model also provides an electronic equipment, including aforementioned radiator or aforementioned PCB board.
The utility model discloses technical scheme is through protruding the stretching to the PCB inboard directly of the boss with the radiating piece to can be connected the heat dissipation pin pad of power amplifier tube with this boss, so that the heat that the power amplifier tube produced passes through the boss transmission of radiating piece and comes out, does benefit to the heat dissipation of power amplifier tube, can solve effectively among the prior art because heat silica gel or heat conduction silicone grease use after long-time and under the high temperature easy ageing after the heat-sinking capability reduce or lose not enough.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is an assembly schematic diagram of a heat sink, a PCB board and a power amplifier tube according to the present invention;
fig. 2 is a schematic diagram of a preferred structure of a heat dissipation member according to the present invention;
fig. 3 is a schematic diagram of an optimal structure of a PCB board according to the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
500 | |
| 200 | |
100a | Boss |
| 300 | Glue- |
200a | Trough |
| 400 | Solder paste |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a radiator for PCB board 200, it is shown with reference to figure 1, the radiator includes:
the heat sink 100 has a protrusion 100a on a side of the heat sink 100 facing the PCB 200, and the protrusion 100a is inserted into a groove 200a of the PCB 200.
The technical scheme of the utility model through with the boss 100a of radiating piece 100 directly protruding to the PCB inboard in, thereby can be connected the heat dissipation pin pad of power amplifier tube 500 with this boss 100a, so that the heat that power amplifier tube 500 produced transmits out through the boss 100a of radiating piece 100, do benefit to power amplifier tube 500's heat dissipation, can solve effectively among the prior art because heat silica gel or heat conduction silicone grease use after for a long time and the high temperature easy after heat-sinking ability reduce or lose not enough.
Optionally, the boss 100a does not extend out of a side of the PCB board 200 facing away from the heat sink 100 to form a solder paste filling gap; in a specific implementation process, the height of the boss 100a is smaller than the depth of the groove 200 a; during assembly, the boss 100a does not penetrate through the heat sink 100, that is, the boss 100a does not exceed the surface of the PCB away from the heat sink 100, on one hand, the boss 100a can be effectively prevented from propping against the power amplifier tube 500, and on the other hand, the boss 100a and the groove 200a can form a solder paste filling gap for solder paste filling, so that the boss 100a can be connected with a heat dissipation pin and a bonding pad of the power tube together through solder paste. The heat conductivility of tin cream is superior to heat conduction silica gel, and phenomenons such as ageing can not appear, consequently the utility model provides a heat-sinking capability of radiator can remain throughout during power amplifier tube is in service.
Optionally, the boss 100a is clearance fit or transition fit with the slot 200 a. In the specific implementation process, the shape of the lug boss of the radiator is equal to the size of the square groove; in terms of assembly tolerances, the boss 100a is a clearance fit or transition fit with the slot 200a, facilitating extension of the boss 100a to the slot 200 a.
Optionally, the heat sink further includes a glue fixing layer 300, and the glue fixing layer 300 is disposed on a surface of the heat sink 100 facing the PCB board 200; in a specific implementation process, the adhesive layer 300 may be thermosetting adhesive, and after the boss 100a extends to the groove 200a, the heat sink 100 and the PCB 200 are firmly bonded by the thermosetting adhesive. Most of the heat of the power amplifier tube 500 is conducted to the boss 100a through the heat dissipation pin of the power tube, so that the heat at the rest of the PCB is small and dispersed, and the temperature encountered by the glue-fixing layer 300 does not cause the aging phenomenon in the service process of the power amplifier tube or the temperature encountered by the glue-fixing layer 300 causes the aging speed to be very slow.
The utility model discloses still provide a PCB board, this PCB board has the radiator, and the concrete structure of this radiator refers to above-mentioned embodiment, because the radiator has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here.
Optionally, one side of the PCB 200 facing away from the heat sink 100 is provided with a power amplifier tube 500, the power amplifier tube 500 includes a heat dissipation pin pad, and the heat dissipation pin pad is disposed on one side of the power amplifier tube 500 facing the PCB 200. In the specific implementation process, the boss 100a of the heat dissipation member 100 directly protrudes into the PCB, so that the heat dissipation pin pad of the power amplification tube 500 can be connected with the boss 100a, heat generated by the power amplification tube 500 is transferred out through the boss 100a of the heat dissipation member 100, heat dissipation of the power amplification tube 500 is facilitated, and the defects that heat dissipation capability is reduced or lost after thermal silica gel or thermal silicone grease is used for a long time and is easy to age at high temperature in the prior art can be effectively overcome.
Optionally, the groove 200a is opened at a heat dissipation pin pad of the power amplifier tube 500. In the specific implementation process, a square groove is formed in the center of the heat dissipation pin pad of the power amplifier tube 500, so that heat dissipation is facilitated.
Optionally, the cross-sectional area of the slot 200a is 1/2-3/4 of the cross-sectional area of the heat sink pin pad. In a specific implementation, the cross-sectional area of the groove 200a is 2/3 of the cross-sectional area of the heat dissipation pin pad.
Optionally, the boss 100a and the heat sink pin pad are connected by solder paste 400. The heat conductivility of tin cream is superior to heat conduction silica gel, and phenomenons such as ageing can not appear, consequently the utility model provides a heat-sinking capability of radiator can remain throughout during power amplifier tube is in service.
The utility model discloses an in the preferred concrete implementation process: a square groove 200a is formed in the center of a heat dissipation pin pad of a high-power amplifier tube in the PCB 200, and the size of the groove is 2/3 of the pin pad. The size of the boss 100a of the heat sink is equal to that of the square groove 200a, the heat sink 100 is bonded with the PCB 200 by using thermosetting adhesive, the boss 100a of the heat sink 100 is matched with the square groove 200, and the boss 100a cannot exceed the surface of the PCB, so that the boss 100 is prevented from propping against the power amplifier tube 500 and cannot be normally welded, and the bonding is firm through a rapid pressing process. When the power tube is welded by a solder paste process, the lug boss of the radiator is connected with the bonding pad and is connected with the radiating pin of the power tube, so that heat is led out of the PCB. The groove is formed in the pin bonding pad of the high-power amplifier tube, the boss 100a of the radiator is overlapped with the groove 200a, and the radiator is connected with the pin of the high-power amplifier tube through a solder paste process, so that heat-conducting silica gel or heat-conducting silicone grease is not needed, the radiator is more fully contacted with the heat-radiating metal pin of the power tube, and heat radiation is facilitated.
A Printed Circuit Board (PCB), which is also called a Printed Circuit Board (PCB), is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. The radiator is a heat dissipation device used on a high-power PCB.
The conventional radiator is contacted with the shell part of the high-power tube, heat is conducted through direct contact installation of heat-conducting silica gel or heat-conducting silicone grease, and the radiating tube foot part of the high-power tube is directly contacted for conduction through a tin paste and tin paste process, so that the radiating of the high-power tube is facilitated.
The utility model also provides an electronic equipment, including the radiator, the concrete structure of this radiator refers to above-mentioned embodiment, because electronic equipment has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here.
The above is only the optional embodiment of the present invention, and not the scope of the present invention is limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.
Claims (10)
1. A heat sink for a PCB board, the heat sink comprising:
the radiating piece, the one side that faces of radiating piece the PCB board has the boss, the boss embedding the inslot of PCB board.
2. The heat sink of claim 1, wherein the bosses do not extend beyond a side of the PCB board facing away from the heat sink to form solder paste filled gaps.
3. The heat sink of claim 2, wherein the bosses are clearance fit or transition fit with the slots.
4. The heat sink of any one of claims 1-3, wherein the heat sink further comprises:
the glue fixing layer is arranged on the surface, facing the PCB, of the heat dissipation piece.
5. A PCB board comprising the heat sink of any one of claims 1-3.
6. The PCB board of claim 5, wherein a side of the PCB board facing away from the heat sink is provided with a power amplifier tube,
the power amplifier tube comprises a heat dissipation pin bonding pad, and the heat dissipation pin bonding pad is arranged on one side of the power amplifier tube, which faces the PCB.
7. The PCB board of claim 6, wherein the slot opens at a heat sink pin pad of the power tube.
8. The PCB board of claim 7, wherein the cross-sectional area of the slot is 1/2 through 3/4 of the cross-sectional area of the heat sink pin pad.
9. The PCB board of any one of claims 6-8, wherein the bosses and the heat sink pin pads are connected by solder paste.
10. An electronic device characterized by comprising the heat sink according to any one of claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022149527.4U CN212851200U (en) | 2020-09-25 | 2020-09-25 | Radiator, PCB board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022149527.4U CN212851200U (en) | 2020-09-25 | 2020-09-25 | Radiator, PCB board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212851200U true CN212851200U (en) | 2021-03-30 |
Family
ID=75151003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022149527.4U Active CN212851200U (en) | 2020-09-25 | 2020-09-25 | Radiator, PCB board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212851200U (en) |
-
2020
- 2020-09-25 CN CN202022149527.4U patent/CN212851200U/en active Active
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