CN210866173U

CN210866173U - High-power LED device

Info

Publication number: CN210866173U
Application number: CN201922191504.7U
Authority: CN
Inventors: 张炳忠; 刘新
Original assignee: Shenzhen Runwo Automation Engineering Co ltd
Current assignee: Shenzhen Runwo Automation Engineering Co ltd
Priority date: 2019-12-09
Filing date: 2019-12-09
Publication date: 2020-06-26
Anticipated expiration: 2029-12-09

Abstract

The utility model discloses a high-power LED device, which comprises a plurality of substrates, LED chips electrically connected with the substrates, and insulating sheets for insulating the substrates from each other; the insulation sheets are arranged on the outer sides of the substrates so as to enable adjacent substrates to be mutually insulated; the substrate is connected with a power supply to enable the LED chip to be conducted. The utility model discloses with LED chip beading on the base plate to the copper of gold layer is plated to the base plate, makes LED chip radiating efficiency high. Under the same LED chip packaging density, compared with the prior art, the current drive can be improved by 1.5 times, and the drive power can be obviously improved.

Description

High-power LED device

Technical Field

The utility model relates to a LED technical field, the more specifically high-power LED device that says so.

Background

The conventional high-power LED COB package is generally to package an LED on a substrate (including substrates of aluminum, copper, aluminum nitride and the like), then fix the substrate on a heat dissipation assembly, and the heat dissipation assembly transfers heat generated during the operation of the LED to a heat dissipation medium in a heat conduction manner to achieve the heat dissipation and cooling effects of the LED. Since the thermal conductivity between the substrate insulating layer and the heat dissipating assembly and the substrate is low, the heat transfer efficiency of the final LED is very low, and if it is desired that the LED operates at a higher power per unit light emitting area, it is necessary to increase the thermal conductivity between the LED and the heat dissipating assembly, thereby increasing the heat dissipating efficiency.

The existing substrate is used for single heat conduction only for the LED chip and cannot be used for other purposes, so that the structure of the LED device is complex.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art not enough, provide a high-power LED device.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a high-power LED device comprises a plurality of substrates, LED chips electrically connected with the substrates, and insulating sheets for insulating the substrates from each other; the insulation sheets are arranged on the outer sides of the substrates so as to enable adjacent substrates to be mutually insulated; the substrate is connected with a power supply to enable the LED chip to be conducted.

The further technical scheme is as follows: the substrate comprises a positive electrode substrate connected with a positive electrode of a power supply and a negative electrode substrate connected with a negative electrode of the power supply; one wiring terminal of the LED chip is connected with the anode substrate or the cathode substrate, and the other wiring terminal of the LED chip is connected with the cathode substrate or the anode substrate.

The further technical scheme is as follows: the positive electrode substrate and the negative electrode substrate are mutually overlapped and arranged, and the positive electrode substrate and the negative electrode substrate are insulated through an insulating sheet.

The further technical scheme is as follows: the substrate is a copper plate; and a gold plating layer is arranged on the outer side of the copper plate.

The further technical scheme is as follows: the LED chip is arranged on the end face of the substrate; the LED chip is welded on the end face of the anode substrate or the cathode substrate through solder paste to form a terminal, and the other terminal of the LED chip is connected with the adjacent cathode substrate or the anode substrate through a lead.

The further technical scheme is as follows: the positive electrode substrate is provided with a convex part; the negative electrode substrate is provided with a concave part; when the positive electrode substrate and the negative electrode substrate are mutually overlapped, the concave part is matched with the convex part.

The further technical scheme is as follows: the outer sides of the plurality of substrates are mutually superposed and extend in the transverse direction, so that mounting planes are formed on two sides of the plurality of substrates; the mounting plane is provided with a heat dissipation plate.

The further technical scheme is as follows: and an optical component is arranged on the outer side of the LED chip.

The further technical scheme is as follows: and a fixing seat is arranged at one end of the substrate far away from the LED chip so as to fix the substrates.

The further technical scheme is as follows: one end of the substrate, which is far away from the LED chip, is provided with two connector lugs; one of the connector lug is connected with the positive electrode substrate, and the other connector lug is connected with the negative electrode substrate.

Compared with the prior art, the utility model beneficial effect be: the utility model discloses with LED chip beading on the base plate to the copper of gold layer is plated to the base plate, makes LED chip radiating efficiency high. Under the same LED chip packaging density, compared with the prior art, the current drive can be improved by 1.5 times, and the drive power can be obviously improved.

The foregoing is a summary of the present invention, and other objects, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments, which is provided for the purpose of illustration and understanding of the present invention.

Drawings

Fig. 1 is a three-dimensional structure diagram of a high-power LED device according to the present invention;

fig. 2 is a side view of a high power LED device of the present invention;

FIG. 3 is a three-dimensional structure view and a partial enlarged view of the high-power LED device of the present invention with a portion of the heat sink removed;

fig. 4 is an assembly view and a partial enlarged view of a substrate of a high power LED device according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and the following detailed description.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "secured" are to be construed broadly and can, for example, be connected or detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.

Drawings 1 to 4 are drawings of the utility model.

The present embodiment provides a high power LED device, please refer to fig. 1 to 3, which includes a plurality of substrates 10, LED chips 11 electrically connected to the substrates 10, and insulating sheets 12 for insulating the substrates 10 from each other. The insulating sheet 12 is disposed outside the substrates 10 to insulate the adjacent substrates 10 from each other. The substrate 10 is connected to a power supply to turn on the LED chip 11. The insulating sheet 12 is wrapped outside the substrate 10 so that the substrate 10 is insulated.

The insulating sheet 12 may be a resin or other insulating material capable of bonding the adjacent substrates 10 together.

Referring to fig. 1 to 3, the substrate 10 includes a positive substrate 101 connected to a positive electrode of a power supply, and a negative substrate 102 connected to a negative electrode of the power supply. One terminal of the LED chip 11 is connected to the positive electrode substrate 101 or the negative electrode substrate 102, and the other terminal is connected to the negative electrode substrate 102 or the positive electrode substrate 101. The LED chip 11 is connected between the positive electrode substrate 101 and the negative electrode substrate 102 so as to form a circuit.

The positive electrode substrate 101 and the negative electrode substrate 102 are disposed to be superimposed on each other, and the positive electrode substrate 101 and the negative electrode substrate 102 are insulated from each other by an insulating sheet 12.

The LED chip 11 is provided on an end surface of the substrate 10. The LED chip 11 is soldered to an end surface of the positive substrate 101 or the negative substrate 102 by solder paste to form one terminal, and the other terminal of the LED chip 11 is connected to the adjacent negative substrate 102 or the positive substrate 101 by a wire. The lower ends of the negative electrode substrate 102 and the positive electrode substrate 101 are fixed by screws, so that the negative electrode substrate 102 and the positive electrode substrate 101 are overlapped with each other to form a whole.

Preferably, the end surface of the LED chip 11 fixed to the substrate 10 is a large end, has a large area, and can be used not only as a heat dissipation end but also as an electrode end. The LED chip 11 is fixed on the positive electrode substrate 101, the positive electrode substrate 101 is electrified, heat of the LED chip 11 in the working process is conducted to the positive electrode substrate 101 through the end face of the positive electrode substrate 101, and a lead arranged on the side edge of the LED chip 11 is connected with the adjacent negative electrode substrate 102, so that the LED chip 11 forms a loop. The substrate 10 functions as an electrode and also functions as a heat conductor. The LED chips 11 are connected to the positive electrode substrate 101 at one end and the negative electrode substrate 102 at the other end, so that the LED chips 11 are connected in parallel between the positive electrode substrate 101 and the negative electrode substrate 102.

Referring to fig. 3 to 4, the positive substrate 101 has a protrusion 1011, and the negative substrate 102 has a recess 1021. When the positive substrate 101 and the negative substrate 102 are stacked, the concave portion 1021 and the convex portion 1011 match with each other.

Alternatively, the negative electrode substrate 102 is provided with a convex portion 1011, and the positive electrode substrate 101 is provided with a concave portion 1021.

Referring to fig. 1 to 4, the outer sides of the plurality of substrates 10 are stacked and extend in a transverse direction, so that mounting planes 13 are formed on two sides of the plurality of substrates 10, and the mounting planes 13 are provided with heat dissipation plates 14. Since the convex portions 1011 of the positive electrode substrates 101 are engaged with the concave portions 1021 of the negative electrode substrates 102, the two positive electrode substrates 101 and the negative electrode substrates 102 are stacked in opposite directions and expanded to the left and right sides, so that the two sides of the substrate 10 form a plane, i.e., the mounting plane 13. The heat sink 14 is closely attached to the mounting surface 13, so that heat of the substrate 10 can be conducted to the heat sink 14, and thus, the heat on the substrate 10 can be taken away. The heat dissipation plate 14 may be air-cooled or water-cooled.

Preferably, the substrate 10 is a copper plate, and a gold plating layer is disposed on the outer side of the copper plate.

In order to improve the utilization rate of the LED light, an optical assembly 15 is disposed outside the LED chip 11. The optical element 17 is made of transparent materials, so that light rays emitted by the LED chip 11 can be better diffused, and the utilization rate is improved.

Referring to fig. 1 to 3, a fixing base 16 is disposed at an end of the substrate 10 away from the LED chip 11, so that the substrates 10 are fixed to each other. The fixing base 16 is provided with a mounting groove so that the positive electrode substrate 101 and the negative electrode substrate 102 are inserted into the mounting groove after being stacked. The fixing portion 16 is provided with a fixing hole for locking the stacked positive electrode substrate 101 and negative electrode substrate 102.

One end of the substrate 10, which is far away from the LED chip 11, is provided with two connector lugs 17; one of the terminals 17 is connected to the positive electrode substrate 101, and the other terminal 17 is connected to the negative electrode substrate 102.

After the LED chip 11 is powered on, the LED chip 11 generates a large amount of heat. The LED chip 11 of the device is directly welded on the substrate 10, the generated heat can be conducted to the substrate 10, and the heat of the substrate 10 is radiated from the radiator 14. The substrate 10 not only serves as a conductor of heat conduction but also serves as an electrode of the LED chip 11 for supplying power to the LED chip 11.

The LED chip 11 is directly soldered on the copper substrate 10, and the solder between the substrate 10 and the LED chip 11 is solder paste. The solder paste comprises tin, silver and copper. The thermal conductivity of tin, silver and red copper is 67, 429 and 407W/M K respectively, so that the thermal conductivity of the solder is better than 67W/M K. Other formulations of solder having higher thermal conductivity may also be used. The thermal conductivity of the existing better aluminum-based circuit board is less than 8W/M K.

Compared with the prior art, the utility model discloses with LED chip beading on the base plate to the copper of gold layer is plated to the base plate, makes LED chip radiating efficiency high. Under the same LED chip packaging density, compared with the prior art, the current drive can be improved by 1.5 times, and the drive power can be obviously improved.

The technical content of the present invention is further described by the embodiments only, so that the reader can understand it more easily, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation according to the present invention is protected by the present invention. The protection scope of the present invention is subject to the claims.

Claims

1. A high-power LED device is characterized by comprising a plurality of substrates, LED chips electrically connected with the substrates, and insulating sheets for insulating the substrates from each other; the insulation sheets are arranged on the outer sides of the substrates so as to enable adjacent substrates to be mutually insulated; the substrate is connected with a power supply to enable the LED chip to be conducted.

2. The high power LED device as claimed in claim 1, wherein the substrate comprises a positive substrate connected to the positive electrode of the power supply, a negative substrate connected to the negative electrode of the power supply; one wiring terminal of the LED chip is connected with the anode substrate or the cathode substrate, and the other wiring terminal of the LED chip is connected with the cathode substrate or the anode substrate.

3. The high power LED device as claimed in claim 2, wherein the positive substrate and the negative substrate are stacked on each other and insulated by an insulating sheet.

4. A high power LED device according to claim 3, wherein said substrate is a copper plate; and a gold plating layer is arranged on the outer side of the copper plate.

5. The high power LED device as claimed in claim 3, wherein the LED chip is disposed on the end surface of the substrate; the LED chip is welded on the end face of the anode substrate or the cathode substrate through solder paste to form a terminal, and the other terminal of the LED chip is connected with the adjacent cathode substrate or the anode substrate through a lead.

6. A high power LED device according to claim 3, wherein the anode substrate is provided with a protrusion; the negative electrode substrate is provided with a concave part; when the positive electrode substrate and the negative electrode substrate are mutually overlapped, the concave part is matched with the convex part.

7. The high power LED device as claimed in claim 1, wherein the outer sides of the plurality of substrates are stacked and extended in a transverse direction so that the two sides of the plurality of substrates form a mounting plane; the mounting plane is provided with a heat dissipation plate.

8. The high power LED device as claimed in claim 1, wherein the LED chip is provided with an optical component on the outer side.

9. The high power LED device as claimed in claim 1, wherein the substrate is provided with a fixing base at an end thereof away from the LED chip, so that the plurality of substrates are fixed to each other.

10. The high power LED device as claimed in claim 1, wherein the substrate is provided with two terminals at an end thereof remote from the LED chip; one of the connector lug is connected with the positive electrode substrate, and the other connector lug is connected with the negative electrode substrate.