CN213636605U

CN213636605U - Substrate for preparing high-heat-dissipation laser device

Info

Publication number: CN213636605U
Application number: CN202022901904.5U
Authority: CN
Inventors: 李坤; 孙雷蒙; 杨丹
Original assignee: Huayinxin Wuhan Technology Co ltd
Current assignee: Huayinxin Wuhan Technology Co ltd
Priority date: 2020-12-04
Filing date: 2020-12-04
Publication date: 2021-07-06
Anticipated expiration: 2030-12-04

Abstract

The utility model relates to the field of laser devices, and provides a substrate for preparing a high-heat-dissipation laser device, which is provided with a first surface and a second surface opposite to the first surface, wherein the substrate is provided with at least one accommodating groove which runs through the substrate; the accommodating groove comprises a groove wall, wherein the end of the groove wall close to the first surface is recessed to form a first positioning step, and the first positioning step is used for supporting and fixing the laser chip, so that the light-emitting surface of the laser chip faces the second surface, and the non-light-emitting surface faces the first surface; the space of the containing groove between the plane where the first surface is located and the non-light-emitting surface of the laser chip is used for arranging the metal radiator, so that the non-light-emitting surface of the laser chip can be directly connected to the metal radiator through a gold-tin soldering sheet, the metal radiator can directly radiate heat, and heat radiation is not required to be conducted through other media. Therefore, when using the utility model discloses a during base plate preparation laser device, can show the heat dispersion that promotes laser device.

Description

Substrate for preparing high-heat-dissipation laser device

Technical Field

The utility model relates to a laser device field more specifically relates to a base plate for preparing high heat dissipation laser device.

Background

The cooling and packaging of laser chips are important links for manufacturing high-power semiconductor lasers, and laser beam shaping and laser integration technologies are main ways for obtaining kilowatt-level and kilowatt-level lasers. Because the high-power semiconductor laser has high output power and small light emitting area, the heat density generated during the operation is very high, when the chip is overheated, the laser is quenched, and the high-power laser output is limited. The existing heat dissipation structure of the laser device has the disadvantages that multiple layers of media exist between the laser chip and the radiator, the heat dissipation effect can be reduced, and the application in scenes with higher heat dissipation requirements is difficult to meet.

SUMMERY OF THE UTILITY MODEL

The utility model provides a base plate for preparing high heat dissipation laser device to the heat radiation structure who solves current laser device makes its difficult meeting carry out the problem of using in the scene that the heat dissipation requirement is higher.

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model provides a base plate for preparing high heat dissipation laser device, the base plate has first surface and the second surface relative with the first surface, be equipped with at least one on the base plate from the first surface towards the second surface direction sunken and run through the accepting groove that the second surface formed; the accommodating groove comprises a groove wall, the end of the groove wall close to the first surface is recessed to form a first positioning step, and the first positioning step is used for supporting and fixing the laser chip so that the light emitting surface of the laser chip faces the second surface; and a space of the accommodating groove between the plane where the first surface is located and the non-light-emitting surface of the laser chip is used for arranging a metal radiator.

Preferably, a first through groove which is recessed from the first surface towards the second surface and penetrates through the second surface is formed in the periphery of each accommodating groove; the first positioning step comprises a supporting surface for supporting and fixing the laser chip; the substrate is also provided with a second through groove which is sunken from the supporting surface to the second surface and penetrates through the second surface; conductive materials are filled in the first through groove and the second through groove.

Preferably, the first through groove is arranged along a direction perpendicular to the first surface; and/or

The second through groove is arranged in a direction perpendicular to the second surface.

Preferably, the substrate is provided with two first through grooves arranged at intervals and two second through grooves arranged at intervals, and planes where the two first through grooves are located and planes where the two second through grooves are located are parallel or overlapped.

Preferably, the end of the groove wall close to the second surface is recessed to form a second positioning step, and the second positioning step is used for supporting and fixing a lens.

Preferably, the substrate further comprises a side wall connecting the first surface and the second surface, a first buckle part is arranged on the side wall, and the first buckle part is used for being connected with a second buckle part on the protection cover in a matching manner.

Preferably, the first buckling piece is a clamping groove formed by sinking from the side wall.

Preferably, a circuit is further formed on the second surface, and the circuit is electrically connected with the laser chip and the metal heat sink.

Preferably, the substrate is further provided with a serial port, and the circuit is electrically connected with the serial port.

Preferably, the substrate is provided with 6 accommodating grooves.

Compared with the prior art, the utility model provides an in the base plate for preparing high heat dissipation laser device, first location step is used for supporting fixed laser chip, makes laser chip's play plain noodles (the face that chip positive electrode is located) face the second surface, and laser chip's non-play plain noodles (the face that chip negative electrode is located) face first surface; and the containing groove area surrounded by the non-light-emitting surface of the laser chip and the plane of the first surface of the substrate is used for arranging the metal radiator, so that the non-light-emitting surface of the laser chip can be directly connected to the metal radiator through a gold-tin soldering sheet, and the heat is directly radiated through the metal radiator without other media such as silver paste, the substrate, heat-conducting silicone grease and the like. Therefore, when using the utility model discloses a during base plate preparation laser device, can show the heat dispersion that promotes laser device.

Drawings

Fig. 1 is a schematic top view of a laser device according to an embodiment of the present invention;

FIG. 2 is a schematic sectional view taken along the line A-A in FIG. 1;

fig. 3 is a schematic cross-sectional view of the substrate for fabricating a high heat dissipation laser device in fig. 2;

reference numerals: a substrate 100; a first surface 10; a second surface 11; a positive electrode line 111; a positive electrode lead-out wiring 1111; a negative electrode wiring 112; a negative lead-out line 1121; a housing groove 12; the tank wall 121; a first positioning step 122; a support surface 1221; a second positioning step 123; a first through groove 13; a second through slot 14; a positive serial port 15; a negative serial port 16; a side wall 17; a first fastener 171; a laser chip 200; a light-emitting surface 201; a non-light-emitting surface 202; a metal heat sink 300; a lens 400; a non-metallic cover 500; a second fastener 501; gold-tin solder tab 600.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The problem of using in the scene that the heat radiation requirement is higher is made its difficult satisfaction to the heat radiation structure in order to solve current laser device, the utility model provides a base plate for preparing high heat dissipation laser device. Fig. 1-3 are cross-sectional views of a substrate for manufacturing a high heat dissipation laser device according to an embodiment of the present invention, in which fig. 3 is a schematic cross-sectional view of the substrate, fig. 1 is a schematic top view of the laser device after the substrate is manufactured into the laser device, and fig. 2 is a schematic cross-sectional view along a direction a-a in fig. 1. As shown in fig. 1-3, the substrate 100 has a first surface 10 and a second surface 11 opposite to each other, and at least one receiving groove 12 is formed on the substrate 100 and is recessed from the first surface 10 toward the second surface 11 and penetrates through the second surface 11. Specifically, the accommodating groove 12 includes a groove wall 121, an end of the groove wall 121 close to the first surface 10 is recessed to form a first positioning step 122, and the first positioning step 122 is used for supporting and fixing the laser chip 200, so that the light emitting surface 201 of the laser chip 200 faces the second surface 11. The space between the first surface 10 and the non-light-emitting surface 202 of the laser chip 200 in the receiving cavity 12 is used for disposing the metal heat sink 300.

In the substrate 100 for manufacturing a high heat dissipation laser device provided in this embodiment, the first positioning step 122 is used to support and fix the laser chip 200, such that the light emitting surface 201 (the surface where the chip positive electrode is located) of the laser chip 200 faces the second surface 11, and the non-light emitting surface 202 (the surface where the chip negative electrode is located) of the laser chip 200 faces the first surface 10; moreover, the receiving groove area formed by the plane surrounded by the non-light-emitting surface 202 of the laser chip 200 and the first surface 10 of the substrate 100 is used for disposing the metal heat sink 300, so that the non-light-emitting surface 202 of the laser chip 200 can be directly connected to the metal heat sink 300 through, for example, a gold-tin soldering sheet, so as to directly dissipate heat through the metal heat sink 300 without performing heat dissipation through other media such as silver paste, the substrate, and heat-conducting silicone grease. Therefore, when the laser device is manufactured using the substrate 100 of the present embodiment, the heat dissipation performance of the laser device can be significantly improved.

Optionally, the substrate in the present invention is a ceramic substrate. Further, it is obtained by sintering aluminum nitride powder by using a high-temperature sintering technique.

With reference to fig. 2-3, in another embodiment of the present invention, on the basis of the above embodiment, a first through groove 13 is formed on the periphery of each receiving groove 12 and is recessed from the first surface 10 toward the second surface 11 and penetrates through the second surface 11, and the first through groove 13 is filled with a conductive material, such as copper. The first positioning step 122 includes a supporting surface 1221 for supporting the laser chip 200, and preferably, in the present embodiment, the laser chip 200 is a vertical cavity surface emitting laser chip, and thus, the supporting surface 1221 for supporting the vertical cavity surface emitting laser chip is parallel to the first surface 10. It should be noted that, in other embodiments of the present invention, the shape of the supporting surface 1221 may be designed correspondingly according to the type of the laser chip 200, and is not described herein again. The substrate 100 is further provided with a second through-groove 14 recessed from the supporting surface 1221 toward the second surface 11 and penetrating through the second surface 11, and the second through-groove 14 is also filled with a conductive material, such as copper. In this embodiment, the positive electrode of the laser chip 200 may be connected to the substrate 100 through, for example, a gold-tin soldering tab 600, and then led out to the second surface 11 through the conductive material in the second through groove 14; the negative electrode of the laser chip 200 may be connected to the metal heat sink 300 through, for example, a gold-tin solder tab 600, and the metal heat sink 300 is in turn soldered to the substrate 100, so that the negative electrode may be led out to the second surface 11 through the conductive material in the first through groove 13 on the substrate 100. That is, the lines of the laser chips 200 provided in the respective housing grooves 12 are independent from each other and do not interfere with each other, and independent drive control can be realized.

In this embodiment, as shown in fig. 1, 6 receiving grooves 12 are provided in the substrate 100. In other embodiments, different numbers of receiving slots 12 may be provided according to actual requirements.

Further, as shown in fig. 1, a circuit is formed on the second surface 11, and the circuit is electrically connected to the laser chip and the metal heat sink. Specifically, the lines include a positive electrode line 111 and a negative electrode line 112, wherein the positive electrode end of the laser chip 200 is led out through the conductive material in the second through groove 14 to the positive electrode line 111, and the negative electrode end of the laser chip 200 is led out through the conductive material in the first through groove 13 to the negative electrode line 112.

Further, serial ports are further arranged on the substrate 100, specifically, the serial ports include an anode serial port 15 and a cathode serial port 16, the anode serial port 15 is electrically connected with the anode line 111, and the cathode serial port 16 is electrically connected with the cathode line 112.

On the basis of the above embodiment, in another preferred embodiment of the present invention, as shown in fig. 2 to 3, two first through grooves 13 symmetrically spaced and two second through grooves 14 symmetrically spaced are provided on the substrate 100, and the plane of the two first through grooves 13 is parallel to or overlaps the plane of the two second through grooves 14, as in the present embodiment, the two planes overlap each other. Through the arrangement mode, the situation of crossing when the positive and negative electrodes of the laser chip 200 are led out can be avoided, and meanwhile, more attractive routing can be arranged on the second surface 11. For example, as shown in fig. 1, the positive electrode wiring 111 includes positive electrode lead-out wirings 1111 for connecting the conductive materials in the two second through grooves 14, and the negative electrode wiring 112 includes negative electrode lead-out wirings 1121 for connecting the conductive materials in the two first through grooves 13. When the plane of the two first through grooves 13 is parallel to or overlaps with the plane of the two second through grooves 14, the negative lead-out line 1121 and the positive lead-out line 1111 are arranged oppositely, so that on one hand, the situation that the negative lead-out line 1121 and the positive lead-out line 1111 are crossed is avoided, on the other hand, the situation that the positive line 111 and the negative line 112 are crossed is also avoided, and meanwhile, routing on the second surface 11 is more attractive.

Further, in the preferred embodiment, the negative electrode lead-out wire 1121 and the positive electrode lead-out wire 1111 are both in a half-square shape. In other embodiments, the negative lead wire 1121 and the positive lead wire 1111 may also be configured to be semicircular or have any other suitable shape.

2-3, preferably, the first through slots 13 are disposed in a direction perpendicular to the first surface 10. The second through grooves 14 are disposed in a direction perpendicular to the second surface 11.

Further, as shown in fig. 2 and 3, in another embodiment of the present invention, the end of the groove wall 121 close to the second surface 11 is recessed to form a second positioning step 123, and the second positioning step 123 is used to support a fixed lens 400, such as a quartz lens, for example.

Further, as shown in fig. 2 and 3, the substrate 100 further includes a sidewall 17 connecting the first surface 10 and the second surface 11. The non-metal cover 500 is usually required to be installed on the first surface 10 side of the substrate 100 for protection, and in order to facilitate the installation of the non-metal cover, a first locking member 171 is arranged on the side wall 17, and the first locking member 171 is used for being matched and connected with a second locking member 501 on the non-metal cover 500. As in the present embodiment, the first locking member 171 is a slot recessed from the sidewall 17, and the second locking member 501 is a lock capable of engaging with the slot. More specifically, the slots may be arranged in a circle around the side wall 17, or may be arranged in a dotted, short stripe shape, arranged in a uniform or non-uniform manner on the side wall 17.

In a preferred embodiment of the present invention, a laser device including the substrate 100 is prepared, wherein a gold-tin soldering sheet is sandwiched between the laser chip 200 and the metal heat sink 300, a gold-tin soldering sheet is sandwiched between the laser chip 200 and the first positioning step 122, and a gold-tin soldering sheet is sandwiched between the metal heat sink 300 and the substrate 100. Among the present laser chip packaging scheme, there is multilayer medium (silver glue, base plate, heat conduction silicone grease) between laser chip and the radiator, has reduced the holistic heat conductivity of laser packaging device, and laser chip junction temperature Tj is close 150 ℃ under the test operating condition, adopts the utility model provides a base plate packaging laser chip tests its laser chip junction temperature Tj and equals 105 ℃ under operating condition, and is visible, the utility model provides a substrate structure can be favorable to the heat dissipation of laser chip, promotes laser device's heat dispersion.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A substrate for preparing a high heat dissipation laser device is provided with a first surface and a second surface opposite to the first surface, and is characterized in that at least one containing groove which is sunken from the first surface to the second surface and penetrates through the second surface is arranged on the substrate; the accommodating groove comprises a groove wall, the end of the groove wall close to the first surface is recessed to form a first positioning step, and the first positioning step is used for supporting and fixing the laser chip so that the light emitting surface of the laser chip faces the second surface; and a space of the accommodating groove between the plane where the first surface is located and the non-light-emitting surface of the laser chip is used for arranging a metal radiator.

2. The substrate according to claim 1, wherein a first through groove is formed on a periphery of each of the receiving grooves, and the first through groove is recessed from the first surface toward the second surface and penetrates through the second surface; the first positioning step comprises a supporting surface for supporting and fixing the laser chip; the substrate is also provided with a second through groove which is sunken from the supporting surface to the second surface and penetrates through the second surface; conductive materials are filled in the first through groove and the second through groove.

3. The substrate of claim 2, wherein the first through slot is disposed in a direction perpendicular to the first surface; and/or

4. The substrate according to claim 2, wherein two first through grooves are provided at an interval and two second through grooves are provided at an interval, and a plane in which the two first through grooves are provided and a plane in which the two second through grooves are provided are parallel to or overlap each other.

5. The substrate of claim 1, wherein the groove wall is recessed near the second surface end to form a second positioning step for supporting a stationary lens.

6. The baseplate of claim 1, further comprising a sidewall connecting the first surface and the second surface, wherein the sidewall is provided with a first latch for mating connection with a second latch on a protective cover.

7. The substrate of claim 6, wherein the first latch is a slot recessed from the sidewall.

8. The substrate of claim 1, wherein a trace is formed on the second surface, the trace electrically connecting the laser chip and the metal heat spreader.

9. The substrate according to claim 8, wherein a serial port is further disposed on the substrate, and the circuit is electrically connected to the serial port.

10. The substrate according to claim 1, wherein 6 receiving grooves are formed on the substrate.