CN212230411U - A new type of integrated circuit packaging structure - Google Patents

Abstract

The utility model discloses a novel integrated circuit packaging structure, which comprises an integrated circuit main board and a casing. The casing comprises a bottom casing and a heat-conducting cover plate. The bottom casing is provided with a rectangular accommodating cavity, and four end corners of the accommodating cavity are respectively provided with There is an elastic support table, the elastic support table is provided with an L-shaped positioning groove, and the integrated circuit main board is erected on the elastic support table; Boss; a number of pins are arranged under the main board of the integrated circuit, and pin through holes are arranged at the bottom of the accommodating cavity; an annular installation groove is arranged at the opening of the bottom case, and an annular installation platform is arranged on the heat conduction cover; the surface of the main board of the integrated circuit is also installed A heat-conducting block is provided with a limit slot on the heat-conducting cover plate; a plurality of heat dissipation holes are respectively opened on two symmetrical sides of the accommodating cavity, and the heat dissipation holes are arranged under the main board of the integrated circuit. The technical scheme of the utility model improves the traditional integrated circuit packaging structure, and improves its structural stability and heat dissipation efficiency.

Description

A new type of integrated circuit packaging structure

technical field

The utility model relates to the technical field of integrated circuit packaging, in particular to a novel integrated circuit packaging structure.

Background technique

An integrated circuit is a tiny electronic device or component. Using a certain process, components and wirings such as transistors, resistors, capacitors and inductors required in a circuit are interconnected, fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a package. , into a microstructure with the required circuit functions. The existing integrated circuit packaging structure has poor stability, and when the integrated circuit is subjected to external force, the integrated circuit mainboard packaged inside is prone to loosening, which affects its service life. At the same time, the existing integrated circuit has high power and obvious heat generation, and the existing integrated circuit packaging structure is not easy to dissipate heat, so that the heat accumulation cannot be quickly dissipated, and the service life is shortened, or even directly burned.

Therefore, the prior art has shortcomings and needs to be improved.

Utility model content

The main purpose of this utility model is to propose a new type of integrated circuit packaging structure, which aims to improve the traditional integrated circuit packaging structure and improve its structural stability and heat dissipation efficiency.

In order to achieve the above purpose, a novel integrated circuit packaging structure proposed by the present invention includes an integrated circuit mainboard and a casing for encapsulating the integrated circuit mainboard. The spliced bottom case and the heat-conducting cover plate, the bottom case is provided with a rectangular accommodating cavity for installing the integrated circuit main board, and an elastic support table is respectively provided at the four end corners of the accommodating cavity, and the elastic support An L-shaped positioning groove is defined on the side of the platform close to the accommodating cavity, and the integrated circuit main board is erected on the elastic support platform; the heat conduction cover plate is provided with an elastic pressing platform corresponding to the elastic support platform one-to-one respectively. , the ends of the elastic pressing table are respectively provided with L-shaped positioning bosses that are adapted and connected with the L-shaped positioning grooves one by one, and the integrated circuit main board is clipped between the elastic supporting table and the elastic pressing table; A number of pins are arranged under the integrated circuit mainboard, and a number of via holes adapted to the pins are opened at the bottom of the accommodating cavity; The heat conduction cover plate is provided with an annular installation platform which is adapted and clamped with the annular installation groove; a heat conduction block is also installed on the surface of the integrated circuit main board, and the heat conduction cover plate is provided with a limit corresponding to the heat conduction block a groove; a plurality of heat dissipation holes are respectively opened on two symmetrical sides of the accommodating cavity, and the heat dissipation holes are arranged under the integrated circuit mainboard.

Preferably, the elastic support table, the elastic pressing table and the L-shaped positioning boss are all configured as an integral molding structure of the superior force glue.

Preferably, the heat dissipation holes of the two side surfaces are symmetrically arranged, and the heat dissipation holes of any one of the side surfaces are evenly distributed in a "one" shape along the length direction of the side surfaces.

Preferably, the thermally conductive block is configured as a thermally conductive silica gel block.

Preferably, the annular installation groove and the annular installation platform are bonded by thermally conductive glue.

Compared with the prior art, the utility model has the beneficial effects of improving the packaging structure of the traditional integrated circuit, improving the stability of the integrated circuit mainboard packaging and the overall heat dissipation effect of the integrated circuit, and ensuring its service life.

Among them, the elastic support table is arranged at the four corners of the accommodating groove of the bottom case, and the corresponding elastic pressure table is arranged on the cover plate, and the integrated circuit main board is pressed between the elastic support table and the elastic pressure table in the vertical direction, and the elastic The L-shaped positioning groove and the L-shaped positioning boss are clamped between the support table and the elastic pressing table, and the four end corners of the integrated circuit main board are respectively abutted with the L-shaped positioning bosses, so as to limit the integrated circuit main board from the horizontal direction. In this way, from the horizontal and vertical directions, the integrated circuit board is pressed and limited by the elastic body to ensure the stability of the package of the integrated circuit board. At the same time, when receiving external force, the elastic body will rely on its own elastic deformation to absorb the external force. , Buffer protection for the integrated circuit motherboard to improve its service life.

Further, the pins at the bottom of the integrated circuit motherboard are correspondingly penetrated into the via holes at the bottom of the bottom case, so that the heat generated by the integrated circuit motherboard can be transferred to the bottom case, and the heat exchange between the bottom case and the external air is carried out to dissipate heat, and the bottom case can be dissipated. The symmetrical sides of the bottom of the shell are provided with cooling holes, which can form air convection, speed up the air flow under the integrated circuit motherboard, and quickly transfer the heat generated by the integrated circuit motherboard from the cooling holes to the outside air to improve the heat dissipation efficiency. At the same time, the heat generated above the mainboard of the integrated circuit can also be transferred to the heat-conducting cover plate through the heat-conducting block, and the heat-conducting cover plate and the external air exchange heat for heat dissipation, which further accelerates heat dissipation, thereby greatly improving the overall heat dissipation efficiency of the integrated circuit and ensuring its service life.

Description of drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are just some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained based on the structures shown in these drawings without any creative effort.

1 is a cross-sectional view of the integrated circuit packaging structure of the present invention;

2 is an exploded view of the integrated circuit packaging structure of the present invention;

3 is a schematic diagram of the structure of the bottom casing of the present invention;

FIG. 4 is a schematic structural diagram of a heat-conducting cover plate of the present invention;

The realization, functional characteristics and advantages of the purpose of the present utility model will be further described with reference to the accompanying drawings in conjunction with the embodiments.

Detailed ways

A novel integrated circuit packaging structure proposed in this embodiment, referring to FIG. 1 to FIG. 4 , includes an integrated circuit mainboard 1 and a casing for encapsulating the integrated circuit mainboard 1 , the casing is arranged in a rectangular shape, and the The casing includes a bottom shell 2 and a heat conducting cover plate 3 that are spliced to each other. The bottom shell 2 is provided with a rectangular accommodating cavity 21 for installing the integrated circuit main board 1. The four end corners of the accommodating cavity 21 are respectively An elastic support table 22 is provided, and an L-shaped positioning groove 23 is defined on the side of the elastic support table 22 close to the accommodating cavity 21. The integrated circuit main board 1 is erected on the elastic support table 22; the heat conduction cover plate 3. There is an elastic pressing table 31 corresponding to the elastic support table 22 one-to-one, and the ends of the elastic pressing table 31 are respectively provided with L-shaped positioning protrusions that are fitted and snapped with the L-shaped positioning grooves 23 one-to-one. Table 32, the integrated circuit motherboard 1 is clamped between the elastic support table 22 and the elastic pressing table 31; a number of pins 11 are arranged under the integrated circuit motherboard 1, and a number of pins 11 are arranged at the bottom of the accommodating cavity 21 A via hole 24 adapted to the pin 11; an annular installation groove 25 is provided at the opening of the bottom case 2 along its circumferential direction, and the heat conduction cover plate 3 is provided with an adapter card for the annular installation groove 25 A heat-conducting block 4 is also installed on the surface of the integrated circuit main board 1, and the heat-conducting cover plate 3 is provided with a limit groove 34 corresponding to the heat-conducting block 4; the accommodating cavity 21 contains A plurality of heat dissipation holes 26 are respectively opened on two symmetrical sides, and the heat dissipation holes 26 are arranged under the integrated circuit motherboard 1 .

It should be noted that this embodiment is an improvement on the packaging structure of the integrated circuit motherboard, and the working principle and circuit connection mode of the integrated circuit are conventional technical means in the field, and will not be repeated here. This embodiment improves the package structure of the traditional integrated circuit, improves the stability of the package of the integrated circuit motherboard and the overall heat dissipation effect of the integrated circuit, and ensures its service life.

Among them, the elastic support table 22 is arranged at the four corners of the accommodating groove of the bottom case 2, and the corresponding elastic pressure table 31 is arranged on the cover plate, and the integrated circuit main board 1 is pressed against the elastic support table 22 and the elastic pressure table in the vertical direction. 31, and between the elastic support table 22 and the elastic pressing table 31 through the L-shaped positioning groove 23 and the L-shaped positioning boss 32, the four end corners of the integrated circuit motherboard 1 are respectively connected with the L-shaped positioning boss 32. abutting, so as to limit the integrated circuit main board 1 from the horizontal direction. In this way, from the horizontal and vertical directions, the integrated circuit main board 1 is pressed and limited by the elastic body, so as to ensure the stability of the packaging of the integrated circuit main board 1, and at the same time , When subjected to external force, the elastic body absorbs the external force by its own elastic deformation, buffers and protects the integrated circuit main board 1, and improves its service life.

Further, the pins 11 under the integrated circuit motherboard 1 are correspondingly penetrated in the via holes 24 at the bottom of the bottom case 2, so that the heat generated by the integrated circuit motherboard 1 can be transferred to the bottom case 2, and the heat generated by the integrated circuit motherboard 1 can be transmitted to the bottom case 2 through the bottom case 2 and the outside air. Heat is exchanged for heat dissipation, and cooling holes 26 are opened on the symmetrical sides of the bottom of the bottom case 2, which can form air convection, speed up the air flow under the integrated circuit motherboard 1, and quickly transfer the heat generated by the integrated circuit motherboard 1 from the cooling holes 26 to the outside. In the air, improve the heat dissipation efficiency. At the same time, the heat generated above the integrated circuit main board 1 can also be transferred to the heat conduction cover plate 3 through the heat conduction block 4, and the heat exchange and heat dissipation are carried out with the external air through the heat conduction cover plate 3, which further accelerates the heat dissipation, thereby greatly improving the overall heat dissipation of the integrated circuit. efficiency to ensure its service life.

During installation, the integrated circuit mainboard 1 is first erected on the four elastic support platforms 22 in the accommodating cavity 21 . At this time, the pins 11 of the integrated circuit mainboard 1 are respectively inserted into the via holes 24 one by one. Then, install one end of the thermally conductive block 4 in the limiting groove 34 of the thermally conductive cover plate 3 by sticking thermally conductive adhesive or other connection methods in the prior art. In this embodiment, the thermally conductive adhesive is used for fixing way to improve thermal conductivity. Then, the heat-conducting cover plate 3 equipped with the heat-conducting blocks 4 is installed on the bottom case 2. Specifically, the L-shaped positioning bosses 32 of the heat-conducting cover plate 3 are inserted into the L-shaped positioning grooves 23 one by one, and the annular mounting platform 33 is inserted into the L-shaped positioning grooves 23. In the annular installation groove 25, after the heat conduction cover plate 3 is installed in place, the heat conduction block 4 just abuts the top of the integrated circuit main board 1, the elastic pressing table 31 presses the integrated circuit main board 1 from above, the L-shaped positioning boss 32 and the integrated circuit main board The four corners of 1 are in contact with each other, thereby limiting and pressing the integrated circuit main board 1 .

Further, the elastic support table 22, the elastic pressing table 31 and the L-shaped positioning boss 32 are all set as an integral molding structure of the superior force glue, which is convenient to process, the superior force glue has good elasticity and mechanical properties, and is resistant to wear and tear. While ensuring the stable installation of the integrated circuit, the service life of the integrated circuit is long, and the overall manufacturing cost and use cost are reduced.

Further, the heat dissipation holes 26 on the two sides are symmetrically arranged, and the heat dissipation holes 26 on any one of the sides are evenly distributed in the shape of "one" along the length direction of the side surface, and the heat dissipation holes 26 are symmetrically arranged, which can be Further increase the air circulation rate and speed up the heat dissipation.

Further, the thermally conductive block 4 is configured as a thermally conductive silica gel block, which can speed up the heat transfer between the integrated circuit main board 1 and the thermal conductive cover plate 3 , and the thermally conductive silica gel block is an elastic material, which can play a role in the integrated circuit motherboard 1 . Protective action to prevent wear or crush of the integrated circuit motherboard 1 .

Further, the annular installation groove 25 and the annular installation platform 33 are bonded by thermally conductive glue, so as to ensure the installation stability and sealing between the thermally conductive cover plate 3 and the bottom case 2, and at the same time, the bottom case 2 can be installed. The heat transfer between the heat conduction cover plate 3 and the heat conduction cover plate 3 increases the heat dissipation area and accelerates the heat dissipation.

The above are only the preferred embodiments of the present utility model, and are not intended to limit the scope of the present utility model patent. Any equivalent structure or equivalent process transformation made by using the contents of the present utility model description and accompanying drawings, or directly or indirectly applied to other related The technical fields of the present invention are similarly included in the scope of patent protection of the present invention.

Claims (5)

1. A novel integrated circuit packaging structure comprises an integrated circuit mainboard and a shell for packaging the integrated circuit mainboard, and is characterized in that the shell is arranged in a rectangular shape and comprises a bottom shell and a heat-conducting cover plate which are spliced with each other, a rectangular accommodating cavity for mounting the integrated circuit mainboard is formed in the bottom shell, an elastic supporting table is respectively arranged at four end corners of the accommodating cavity, an L-shaped positioning groove is formed in one side, close to the accommodating cavity, of the elastic supporting table, and the integrated circuit mainboard is erected on the elastic supporting table; the heat conducting cover plate is provided with elastic pressing tables which correspond to the elastic supporting tables one by one respectively, the end parts of the elastic pressing tables are provided with L-shaped positioning bosses which are in one-to-one adaptive clamping connection with the L-shaped positioning grooves respectively, and the integrated circuit mainboard is clamped between the elastic supporting tables and the elastic pressing tables; a plurality of pins are arranged below the integrated circuit mainboard, and a plurality of through holes matched with the pins are formed in the bottom of the accommodating cavity; an annular mounting groove is formed in the opening of the bottom shell along the circumferential direction of the opening, and an annular mounting table which is in adaptive clamping connection with the annular mounting groove is arranged on the heat conduction cover plate; the surface of the integrated circuit mainboard is also provided with a heat-conducting block, and the heat-conducting cover plate is provided with a limiting groove corresponding to the heat-conducting block; a plurality of heat dissipation holes are formed in two symmetrical side faces of the accommodating cavity respectively and are formed below the integrated circuit mainboard.

2. The package structure of claim 1, wherein the elastic support platform, the elastic pressing platform and the L-shaped positioning boss are all configured as an integral molding structure of acrylic adhesive.

3. The package structure of claim 1, wherein the heat dissipation holes of two of the side surfaces are symmetrically arranged, and the heat dissipation holes of any one of the side surfaces are uniformly distributed in a shape of a Chinese character 'yi' along the length direction of the side surface.

4. The novel integrated circuit package structure of claim 1, wherein the thermal conduction block is configured as a thermal conductive silicone block.

5. The novel integrated circuit package structure of claim 1, wherein the annular mounting groove and the annular mounting platform are bonded by a thermally conductive adhesive.

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