CN211629133U - Integrated high-power LED thermoelectric separation support - Google Patents
Integrated high-power LED thermoelectric separation support Download PDFInfo
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- CN211629133U CN211629133U CN201921672733.4U CN201921672733U CN211629133U CN 211629133 U CN211629133 U CN 211629133U CN 201921672733 U CN201921672733 U CN 201921672733U CN 211629133 U CN211629133 U CN 211629133U
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- fixedly connected
- power led
- support
- integrated high
- thermoelectric separation
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Abstract
The utility model relates to a LED support technical field specifically is an integrated high-power LED thermoelectric separation support, including the basic supporting baseplate, the basic braced bottom plate's basic braced frame of top fixedly connected with, basic braced frame's inside fixedly connected with corner backup pad, the functional recess has been seted up at basic braced frame's top, the spacing fixture block of one side fixedly connected with of basic braced frame, spacing recess has been seted up to the inside of spacing fixture block. This integrated high-power LED thermoelectric separation support through being provided with the corner backup pad, and the high district that generates heat of NULL is kept away from to the corner backup pad for it is smooth and easy to dispel the heat around the NULL, has improved the radiating effect of this support greatly, through being provided with the function through-hole, has further improved the radiating effect of this support, through being provided with dustproof sleeve, reduces dust NULL's influence, through being provided with spacing fixture block and spacing card strip, has improved the practicality of this support greatly.
Description
Technical Field
The utility model relates to a LED support technical field specifically is an integrated high-power LED thermoelectric separation support.
Background
Only 15-25% of the electric energy of the ED chip is converted into light energy, and the rest is converted into heat energy. If the heat energy can not be dissipated to the surrounding environment in time, the temperature of the chip can be increased, so that the light effect is reduced, the service life of the chip is reduced, and the color rendering property and other properties are changed; this is particularly true for high power LEDs.
Most of the traditional high-power LED chips are provided with a radiator at the bottom of an aluminum substrate for radiating; but the heat dissipation effect of a single product which can reach the power of more than 5W is not obvious; meanwhile, the existing high-power product is a single high-power chip, so that the area where heat is generated is concentrated, and the heat dissipation effect is uneven.
The utility model discloses an integrated high-power LED thermoelectric separation support that discloses in china utility model patent application laid-open specification CN 204927339U, this integrated high-power LED thermoelectric separation support, though, the type makes up into high-power chip through little chip, the heat that can avoid high-power chip to give out light after giving out light, make heat distribution wider, easily go out the faster diffusion of heat through the radiator, thereby improve the life of product, however, this integrated high-power LED thermoelectric separation support, be big chip with little chip combination, will support all chips, blend stop strip increase in quantity, the space reduces, stop the heat dissipation again from another angle, moreover, it is stable to use dust to pile up influence circuits such as can produce static for a long time, consequently, need improve.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides an integrated high-power LED thermoelectric separation support through corner backup pad, high-efficient heat dissipation copper and functional through-hole, has solved the problem that proposes among the above-mentioned background art.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: an integrated high-power LED thermoelectric separation bracket comprises a basic supporting bottom plate, a basic supporting frame is fixedly connected with the top of the basic supporting bottom plate, the interior of the basic supporting frame is fixedly connected with a corner supporting plate, the top of the basic supporting frame is provided with a functional groove, one side of the basic supporting frame is fixedly connected with a limiting fixture block, a limiting groove is arranged inside the limiting fixture block, one side of the basic supporting frame, which is far away from the limiting clamping block, is fixedly connected with a limiting clamping strip, two ends of the limiting clamping strip are both fixedly connected with a limiting lug, the bottom of the foundation support bottom plate is provided with a functional through hole, the top of the foundation support bottom plate is fixedly connected with a central support column, the top fixedly connected with high-efficient heat dissipation copper of center support post, the top fixedly connected with dustproof sleeve of basic supporting baseplate.
Optionally, the limiting clamping block is matched with the limiting clamping strip, and the limiting groove is matched with the limiting projection.
Optionally, the central support column is provided with a plurality of heat dissipation through holes inside.
Optionally, a mounting through hole is formed in the foundation support base plate, and a fixing bolt is arranged in the mounting through hole.
Optionally, the inner wall of the mounting through hole is provided with a forward thread, the inner wall of the fixing bolt is provided with a reverse thread, and the forward thread is matched with the reverse thread.
Optionally, a heat dissipation channel is formed at the bottom of the foundation support base plate.
Optionally, the functional through hole is located at the center of the base support bottom plate.
Optionally, the diameter of the central supporting column is larger than that of the dust-proof sleeve.
(III) advantageous effects
The utility model provides an integrated high-power LED thermoelectric separation support possesses following beneficial effect:
(1) in the use process of the integrated high-power LED thermoelectric separation bracket, the integrated chip is placed in the basic support frame, four corner support plates in the basic support frame support four corners of the integrated chip, the contact between the corner support plates and the concentrated high-heating area is reduced, the central support column in the basic support frame supports the central part of the integrated chip, the support stability is increased, the high-efficiency heat-dissipation copper plate at the top of the central support column directly contacts the central position of the integrated chip, used for quickly conducting and conveying the heat of the chip, the functional through hole arranged at the bottom of the basic supporting bottom plate is used for being matched with the heat dissipation through hole for heat dissipation, the dustproof sleeve is used for isolating and blocking dust, through being provided with the corner backup pad, the high district that generates heat of integrated chip is kept away from to the corner backup pad for it is smooth and easy to dispel the heat around the integrated chip, has improved the radiating effect of this support greatly.
(2) This integrated high-power LED thermoelectric separation support, in the use, through being provided with high-efficient heat dissipation copper, high-efficient heat dissipation copper supports NULL's central point, when supporting and conduct a large amount of heats that NULL produced sparse, the radiating effect of this support has greatly been improved, through being provided with the function through-hole, make support inside link up from top to bottom, increase the mobility of support inside air, the radiating effect of this support has further been improved, through being provided with dustproof sleeve, when carrying out the heat dissipation, stop external dust, reduce dust NULL's influence, through being provided with spacing fixture block and spacing card strip, can be used for the concatenation to use, the practicality of this support has been improved greatly.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a top view of the present invention;
fig. 3 is a cross-sectional view of the heat dissipating through-hole of the present invention;
fig. 4 is a bottom view of the foundation support bottom plate of the present invention.
In the figure: 1-foundation support bottom plate, 2-foundation support frame, 3-corner support plate, 4-functional groove, 5-limiting fixture block, 6-limiting groove, 7-limiting fixture strip, 8-limiting bump, 9-functional through hole, 10-central support column, 11-high-efficiency heat dissipation plate, 12-dustproof sleeve, 13-heat dissipation through hole, 14-installation through hole, 15-fixing bolt and 16-heat dissipation channel.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1 to 4, the present invention provides a technical solution: the integrated chip heat dissipation device comprises a foundation support base plate 1, wherein a foundation support frame 2 is fixedly connected to the top of the foundation support base plate 1, a corner support plate 3 is fixedly connected to the inside of the foundation support frame 2, the corner support plate 3 supports four corners of an integrated chip to avoid a heat dissipation dense area and improve the heat dissipation effect, a functional groove 4 is formed in the top of the foundation support frame 2 to facilitate installation of the integrated chip, a limiting fixture block 5 is fixedly connected to one side of the foundation support frame 2, the limiting fixture block 5 is matched with the limiting fixture strip 7 to splice the bracket, a limiting groove 6 is formed in the limiting fixture block 5, a limiting fixture strip 7 is fixedly connected to one side of the foundation support frame 2 away from the limiting fixture block 5, limiting convex blocks 8 are fixedly connected to two ends of the limiting fixture strip 7, a functional through hole 9 is formed in the bottom of the foundation support base plate 1 and used for heat dissipation, and a, the top of a central support column 10 is fixedly connected with a high-efficiency heat dissipation copper plate 11, the top of a foundation support base plate 1 is fixedly connected with a dustproof sleeve 12, a limiting clamping block 5 is matched with a limiting clamping strip 7, a limiting groove 6 is matched with a limiting lug 8, the inside of the central support column 10 is provided with a plurality of heat dissipation through holes 13, the inside of the foundation support base plate 1 is provided with an installation through hole 14, the inside of the installation through hole 14 is provided with a fixing bolt 15, the inner wall of the installation through hole 14 is provided with a forward thread, the inner wall of the fixing bolt 15 is provided with a reverse thread, the forward thread is matched with the reverse thread, the bottom of the foundation support base plate 1 is provided with a heat, four corners of the integrated chip are supported, the functional through hole 9 is located in the center of the basic supporting bottom plate 1, and the diameter of the central supporting column 10 is larger than that of the dustproof sleeve 12.
During the use, place the NULL in basic braced frame 2, four corner backup pads 3 in the basic braced frame 2 support four angles of NULL, reduce corner backup pad 3 and the contact of concentrating high-heat-generating area, central stay post 10 in the basic braced frame 2 supports the central part of NULL, increase support stability, the central point of 11 direct contact NULL of high-efficient heat dissipation copper at central stay post 10 top puts, be used for carrying out the conduction with the heat of chip fast and carry, function through-hole 9 that basic braced bottom plate 1 bottom was seted up is used for cooperating heat dissipation through-hole 13 to dispel the heat, dust sleeve 12 is used for keeping off dust with separating.
In conclusion, when the integrated high-power LED thermoelectric separation bracket is used, an integrated chip is placed in a basic supporting frame 2, four corner supporting plates 3 in the basic supporting frame 2 support four corners of the integrated chip, the contact between the corner supporting plates 3 and a concentrated high-heat-generation area is reduced, a central supporting column 10 in the basic supporting frame 2 supports the central part of the integrated chip, the supporting stability is improved, a high-efficiency heat-dissipation copper plate 11 at the top of the central supporting column 10 is directly contacted with the central position of the integrated chip for rapidly conducting and conveying the heat of the chip, a functional through hole 9 formed at the bottom of a basic supporting bottom plate 1 is used for matching with a heat-dissipation through hole 13 for heat dissipation, a dustproof sleeve 12 is used for blocking dust, and the corner supporting plates 3 are arranged to be far away from the high-heat-generation area of the integrated chip, so that the heat dissipation, the heat dissipation effect of the bracket is greatly improved; through being provided with high-efficient heat dissipation copper 11, high-efficient heat dissipation copper 11 supports the central point of NULL, when supporting and carry out the conduction evacuation with a large amount of heats that the NULL produced, the radiating effect of this support has been improved greatly, through being provided with function through-hole 9, make the support inside link up from top to bottom, increase the mobility of support inside air, the radiating effect of this support has further been improved, through being provided with dustproof sleeve 12, when carrying out the heat dissipation, stop external dust, reduce dust NULL's influence, the practicality of this support has been improved greatly.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (8)
1. The utility model provides an integrated high-power LED thermoelectric separation support, includes basic supporting baseplate (1), its characterized in that: the top of the foundation support base plate (1) is fixedly connected with a foundation support frame (2), the inside of the foundation support frame (2) is fixedly connected with a corner support plate (3), the top of the foundation support frame (2) is provided with a functional groove (4), one side of the foundation support frame (2) is fixedly connected with a limiting clamping block (5), the inside of the limiting clamping block (5) is provided with a limiting groove (6), one side of the foundation support frame (2) far away from the limiting clamping block (5) is fixedly connected with a limiting clamping strip (7), two ends of the limiting clamping strip (7) are both fixedly connected with limiting convex blocks (8), the bottom of the foundation support base plate (1) is provided with a functional through hole (9), the top of the foundation support base plate (1) is fixedly connected with a central support column (10), and the top of the central support column (10) is fixedly connected with a high-efficiency heat dissipation copper, the top of the foundation support bottom plate (1) is fixedly connected with a dustproof sleeve (12).
2. The integrated high-power LED thermoelectric separation bracket according to claim 1, characterized in that: the limiting clamping block (5) is matched with the limiting clamping strip (7), and the limiting groove (6) is matched with the limiting convex block (8).
3. The integrated high-power LED thermoelectric separation bracket according to claim 1, characterized in that: the heat dissipation support column is characterized in that heat dissipation through holes (13) are formed in the central support column (10), and the number of the heat dissipation through holes (13) is a plurality.
4. The integrated high-power LED thermoelectric separation bracket according to claim 1, characterized in that: the foundation support base plate is characterized in that a mounting through hole (14) is formed in the foundation support base plate (1), and a fixing bolt (15) is arranged in the mounting through hole (14).
5. The integrated high-power LED thermoelectric separation bracket according to claim 4, characterized in that: the inner wall of the mounting through hole (14) is provided with forward threads, the inner wall of the fixing bolt (15) is provided with reverse threads, and the forward threads are matched with the reverse threads.
6. The integrated high-power LED thermoelectric separation bracket according to claim 1, characterized in that: and a heat dissipation channel (16) is formed at the bottom of the basic supporting bottom plate (1).
7. The integrated high-power LED thermoelectric separation bracket according to claim 1, characterized in that: the functional through hole (9) is positioned in the center of the foundation support bottom plate (1).
8. The integrated high-power LED thermoelectric separation bracket according to claim 1, characterized in that: the diameter of the central support column (10) is larger than that of the dustproof sleeve (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921672733.4U CN211629133U (en) | 2019-10-08 | 2019-10-08 | Integrated high-power LED thermoelectric separation support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921672733.4U CN211629133U (en) | 2019-10-08 | 2019-10-08 | Integrated high-power LED thermoelectric separation support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211629133U true CN211629133U (en) | 2020-10-02 |
Family
ID=72617994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921672733.4U Expired - Fee Related CN211629133U (en) | 2019-10-08 | 2019-10-08 | Integrated high-power LED thermoelectric separation support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211629133U (en) |
-
2019
- 2019-10-08 CN CN201921672733.4U patent/CN211629133U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201002 Termination date: 20211008 |
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| CF01 | Termination of patent right due to non-payment of annual fee |